DS SG1846 Rev-1.2
DS SG1846 Rev-1.2
DS SG1846 Rev-1.2
RT
OSC
CT U.V.LOCKOUT
VC
Q A OUT
T
-
Q
-CURRENT - SG1846
SENSE Output Stoge
X3 +
+CURRENT + COMP S R
SENSE -
Q
B OUT
S
GND
0.5 V
0.5 mA
CURRENT LIMITADJUST
+ SHUTDOWN
N.I. +
E.A. 6K
- 350 mV
INV. -
COMP
N PLASTIC DIP PDIP N Package: RoHS Complaint / Pb-free Transition DC: 0503
N Package: RoHS / Pb-free 100% Matte Tin Lead Finish
0°C to 70°C PACKAGE SG3846N
C.L./SOFTSTART 1 16 SHUTDOWN
VREF 2 15 +VIN
C.L./SOFTSTART 1 16 SHUTDOWN
16-PIN VREF 2 15 +VIN
14
CERAMIC (-) C.S.
(+) C.S.
3
4 13
OUTPUT B
VC
F SG1846F-DESC FLATPAK (+) ERROR AMP 5 12 GROUND
FLAT PACK (-) ERROR AMP 6 11 OUTPUT A
COMPENSATION 7 10 SYNC
3
PACKAGE CT 8 9 RT
-55°C to 125°C
3 2 1 20 19
1. N.C. 11. N.C.
Notes:
1. Contact factory for DESC part availability.
2. All parts are viewed from the top.
3. Consult factory for product availability.
4. The SG2846 & SG3846 is available shipped as tape & reel with the addition of a –TR suffix.
5. Hermetic Packages J, F, & L use Pb37/Sn63 hot solder lead finish, contact factory for availability of RoHS versions.
2
Thermal Data
Thermal Data
Parameter Value Units
J Package:
Thermal Resistance-Junction to Case, θJC 30 °C/W
Thermal Resistance-Junction to Ambient, θJA 80 °C/W
N Package:
Thermal Resistance-Junction to Case, θJC 40 °C/W
Thermal Resistance-Junction to Ambient, θJA 65 °C/W
DW Package:
Thermal Resistance-Junction to Case, θJC 40 °C/W
Thermal Resistance-Junction to Ambient, θJA 95 °C/W
F Package:
Thermal Resistance-Junction to Case, θJC 70 °C/W
Thermal Resistance-Junction to Ambient, θJA 115 °C/W
L Package:
Thermal Resistance-Junction to Case, θJC 35 °C/W
Thermal Resistance-Junction to Ambient, θJA 120 °C/W
Notes:
1. Junction Temperature Calculation: TJ = TA + (PD x θJA).
2. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting
configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/PCBoard system. All of
the above assume no ambient airflow.
3
Current Mode PWM Controller
Electrical Characteristics
Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1846
with -55°C ≤ TA ≤ 125°C, SG2846 with -25°C ≤ TA ≤ 85°C, SG3846 with 0°C ≤ TA ≤ 70°C, +VIN = 15V. Low
duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the
ambient temperature.
SG1846
SG3846
SG2846
Symbol Parameter Test Condition Units
Min Typ Max Min Typ Max
Reference Section
VREF Output Voltage TJ = 25°C, IO = 1mA 5.05 5.10 5.15 5.00 5.10 5.20 V
4
Electrical Characteristics
SG1846
SG3846
Symbol Parameter Test Condition SG2846 Units
Min Typ Max Min Typ Max
Error AMP Section
5
Current Mode PWM Controller
SG1846
SG3846
Symbol Parameter Test Condition SG2846 Units
Min Typ Max Min Typ Max
Shutdown Terminal Section
Output Section
Collector Emitter
40 40 V
Voltage
Collector Leakage
VC = 40V 200 200 µA
Current
Output Low Level ISINK = 20mA 0.1 0.4 0.1 0.4 V
IQ Supply Current 17 21 17 21 mA
Notes:
1. These parameters, although guaranteed over the recommended operating conditions, are not tested in the production.
2. Parameter measured at trip point of latch with V PIN 5 = VREF , VPIN 6 = 0V.
3. Amplifier gain defined as : VPIN 4 = 0V to 1.0V
4. Current into Pin 1 guaranteed to latch circuit in shutdown state.
5. Current into Pin 1 guaranteed not to latch circuit in shutdown state.
6. RT = 10kΩ, CT = 4.7nF
6
Characteristic Curves
Characteristic Curves
5.15 100
70
5.05 60
1.0
50 O
TJ = 125 C
5.00 40
O
TJ = 55 C
30 0.5
4.95
20
10
0
4.90
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
-55 -25 0 25 50 75 100 125 -55 -25 0 25 50 75 100 125
O
ERROR AMPLIFIER OUTPUT VOLTAGE - (V)
JUNCTION TEMPERATURE - ( C) JUNCTION TEMPERATURE - ( C)
O
1.50
2.82 3.20
CURRENT SENSE GAIN - (V/V)
2.80 1.40
2.78 3.10
2.76 1.30
2.74 3.00
2.72 1.20
2.70 2.90
2.68 1.10
2.80
-55 -25 0 25 50 75 100 125 -55 -25 0 25 50 75 100 125 -55 -25 0 25 50 75 100 125
JUNCTION TEMPERATURE - (OC) JUNCTION TEMPERATURE - ( C)
O
JUNCTION TEMPERATURE - ( C)
O
Figure 5 · Current Sense Gain Vs. Figure 6 · Oscillator Valley Voltage Figure 7 · Oscillator Peak Voltage
Temperature Vs. Temperature Vs. Temperature
220
LATCH CURRENT THRESHOLD - (mA)
2.6
190
VIN = 15 V
(10% ABOVE THRESHOLD) (10% ABOVE THRESHOLD)
2.4
200
CURRENT SENSE DELAY - (ns)
2.2 180
2.0 180
1.8 170
1.6 160
1.4 160
1.2 140
1.0 150
120
-55 -25 0 25 50 75 100 125 -55 -25 0 25 50 75 100 125
-55 -25 0 25 50 75 100 125 O
O
JUNCTION TEMPERATURE - ( C) O
JUNCTION TEMPERATURE - ( C)
JUNCTION TEMPERATURE - ( C)
Figure 8 · Minimum SCR Latch Figure 9 · Current Sense Delay Vs. Figure 10 · Shutdown Delay To
Current Temperature Output Vs. Temperature
7
Current Mode PWM Controller
5.0
12.0
1.60
9.0 3.0
1.50
8.0 C
TJ = -55°
°C
7.0 2.0 TJ = 25
1.40 5°C
TJ = 12
6.0
5.0 1.0
1.30
4.0
0
0 100 200 300 400 500
-55 -25 0 25 50 75 100 125
-55 -25 0 25 50 75 100 125 O OUTPUT CURRENT - (mA)
JUNCTION TEMPERATURE - ( C)
O
JUNCTION TEMPERATURE - ( C)
Figure 13 · Output Transistor
Figure 11 · Error Amplifier Input Figure 12 · Error AMP Sink Current Saturation Voltage Vs. Output
Offset Voltage Vs. Temperature Vs. Temperature Current (Sink Transistor)
6.0
180 2000
RT = 8 kΩ RT = 8 kΩ
5.0 160 1900
SATURATION VOLTAGE - (V)
140 1800
F
4.0
°C 1µ
25 120 00 1700
=1 0.
TJ °C =
5 5 C T
3.0 =- C 100 1600
TJ 25°
T J= µF
. 01
2.0 80 1500 =0
CT
60 1400
1.0
40 1300
0
500 20 1200
0 100 200 300 400
26.5 C = 0.001µF RT = 8 kΩ
OSCILLATOR FREQUENCY - (kHz)
T
45
44
DUTY CYCLE - (%)
26.0
43
2.75
C = 0.1µF 42
C = 0.01µF T
T 41
25.5
40
39
25.0 2.65
38
8
Application Information
Application Information
100k
50k
nF
nF
nF
nF
µF
nF
nF
10
50
20
1
.1
2
5
T =
T =
T =
T =
T =
T =
T =
20k
C
C
C
R (Ω)
10k
T
5k
2k
1k
10µsec 100µsec 1000µsec
5V
3V IR
1.2 V IR 3.7 V
SAWTOOTH(Pin 8)
C R
T T
OSC(Pin 10)
Id
OUTPUT DEADTIME(T )
D
2.2
Oscillator frequency is approximated by the formula: f ~
T R C
T T
9
Current Mode PWM Controller
VREF
VREF
0.5 mA
5
+
6
Zs -
7
COMP
Zf
If < 0.5 mA
Figure 22 · Error Amp Output Configuration (Error amplifier can source up to 0.5 mA)
IS
R
3 +
RS C CURRENT
SENSE
4 -
10
Application Information
15
SG1846 +VIN
VC VIN
SYNC 13
10
RT
9 NOR A OUT
11
OSC F/F
CT
8
VOUT
PWM
VREF LATCH
2 REF B OUT
NOR 14
0.5 mA
COMP + -
7 -
INV 0.5 V COMP
6 + + SENSE
+ 4
EA
NI I/A
5 - SENSE
- 3
SH/DN
16
I LIMIT S/D
FEEDBACK 1
SFT/ST GND 350 mV
12
15
SG1846 +VIN
VC
SYNC VIN
10 13
RT
9 NOR A OUT
11
OSC F/F
CT
8
PWM
VREF LATCH
2 REF B OUT
NOR 14
0.5 mA
COMP + -
7 -
VOUT
INV 0.5 V COMP
6 + SENSE
+ + 4
EA
NI I/A
5 - SENSE
- 3
SH/DN
16
I LIMIT S/D
FEEDBACK 1 350 mV
SFT/ST GND
12
11
Current Mode PWM Controller
15
SG1846 +VIN
VC
SYNC 13
10
RT
9 NOR A OUT
11
OSC F/F
CT
8
VREF
PWM
VREF LATCH
2 REF B OUT
NOR 14
0.5 mA
COMP + -
7 -
INV 0.5 V COMP
6 + SENSE
+ + 4
EA
NI I/A
5 - SENSE
- 3
SH/DN
16
I LIMIT S/D
FEEDBACK 1
GND 350 mV
SFT/ST
12
IS
(+) 4
RS x3
COMP
(-) 3 ISENSE + -
0.5 V
VREF
0.5 mA
R1
E/A
CURRENT
LIMIT 1
R2
7 COMP
R2VREF
-0.5
Peak Current (IS) is determined by the formula: IS = R1+R2
3RS
12
Application Information
VREF
ISENSE +
ʃ S
R1 CURRENT + - - S
LIMIT 1
0.5
ISS
R2 E/A
C
VREF
16
+
SHUT
DOWN - +
-
350 mV
~
CURRENT LIMIT
(PIN 1)
~
0.5 V
0
SHUTDOWN
(PIN 16)
ON
OFF ~
PWM
~
VREF
< 0.8 mA
R1
V
REF
> 3 mA (LATCHED OFF)
R1
13
Current Mode PWM Controller
MILLIMETERS INCHES
Dim
MIN MAX MIN MAX
A 2.06 2.65 0.081 0.104
D
A1 0.10 0.30 0.004 0.012
A2 2.03 2.55 0.080 0.100
16 9
B 0.25 0.51 0.010 0.020
c 0.23 0.32 0.009 0.013
H E
D - 10.67 - 0.420
E 7.40 7.75 0.291 0.305
1 8
e 1.27 BSC 0.05 BSC
H 10.00 10.65 0.394 0.419
e
B L L 0.40 1.27 0.016 0.050
θ 0° 8° 0° 8°
A A2 c *LC - 0.10 - 0.004
SEATING PLANE *Lead co planarity
A1
Note:
Dimensions do not include protrusions; these shall
not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
MILLIMETERS INCHES
Dim
MIN MAX MIN MAX
A - 5.33 - 0.210
D
A1 0.38 - 0.015 -
A2 3.30 Typ. 0.130 Typ.
E1 b 0.36 0.56 0.014 0.022
1
b1 1.14 1.78 0.045 0.070
c 0.20 0.36 0.008 0.014
b1
E
D 18.67 19.69 0.735 0.775
e 2.54 BSC 0.100 BSC
A2
A E 7.62 8.26 0.300 0.325
c
A1
E1 6.10 7.11 0.240 0.280
L
L 2.92 0.381 0.115 0.150
e
SEATING PLANE θ θ - 15° - 15°
b
Note:
Dimensions do not include protrusions; these shall
not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
14
PACKAGE OUTLINE DIMENSIONS
E3
D
MILLIMETERS INCHES
Dim
MIN MAX MIN MAX
D/E 8.64 9.14 0.340 0.360
E E3 - 8.128 - 0.320
e 1.270 BSC 0.050 BSC
B1 0.635 TYP 0.025 TYP
L 1.02 1.52 0.040 0.060
A 1.626 2.286 0.064 0.090
A L2 L h 1.016 TYP 0.040 TYP
A1 8
A1 1.372 1.68 0.054 0.066
A2 - 1.168 - 0.046
3
L2 1.91 2.41 0.075 0.95
B3 0.203R 0.008R
1
Note:
All exposed metalized area shall be gold plated 60
13
micro-inch minimum thickness over nickel plated
unless otherwise specified in purchase order.
h
A2 18
B3
e
B1
Figure 34 · L 20-Pin Ceramic Leadless Chip Carrier (LCC) Package Outline Dimensions
15
Current Mode PWM Controller
MILLIMETERS INCHES
Dim
MIN MAX MIN MAX
L A 1.65 1.91 0.057 0.067
B
b 0.38 0.48 0.010 0.019
69 85
7 4
c 0.102 0.152 0.004 0.006
8 3 D - 11.18 - 0.290
9 2
D E 6.22 6.74 0.238 0.252
10 1
e
E1 - 7.62 - 0.272
e 1.27 BSC 0.050 BSC
16 1 L 6.35 9.40 0.250 0.370
E
S1
Q 0.51 1.02 0.020 0.040
E1 S1 0.20 0.008
L L
Note:
1. Lead No. 1 is identified by tab on lead or dot on cover.
2. Leads are within 0.13mm (.0005”) radius of the true
A Q C position (TP) at maximum material condition.
3. Dimension “e” determines a zone within which all body
and lead irregularities lie.
16
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SG1846.1.2/11.14