Introduction to TI Embedded Processing

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Processor Find and Fit Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Introduction to TI ARM

-Based Embedded Processors . . . . . . . . . . . . . . . . . . . . . . . . . .4

TMS320C5000 DSP Platform
TMS320C55x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
TMS320C54x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Power Management Products for the C5000 DSP Platform . . . . . . . . . . . . . . . . . . .10
TMS320C6000 DSP Platform
TMS320C64x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
TMS320C645x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
TMS320C647x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
TMS320C67x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Power Management Products for the C6000 DSP Platform . . . . . . . . . . . . . . . . . . .23
Digital Media Processors with DaVinci Technology
Digital Media Processors with DaVinci Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
TMS320DM646x Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
TMS320DM644x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
TMS320DM643x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
TMS320DM64x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
TMS320DM3x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Compatible Analog Products for DaVinci-Based Digital Video Applications . . . . . . . . . .37
OMAP Applications Processors
OMAP35x Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
OMAP-L1x Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Power Management Products for OMAP35x and OMAP-L1x Applications Processors . . .45
Software and Development Tools
eXpressDSP Software and Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Code Composer Studio IDE and TI Developer Network Development Tools . . . . . . . .47
JTAG Debug and eXpressDSP Data Visualization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Operating Systems Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Algorithm Standards and Frameworks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Digital Media Software Portfolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
DaVinci Development Tools and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
OMAP Development Tools and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
TI DSP Developer Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Embedded Processing Development Tools Feature Matrix . . . . . . . . . . . . . . . . . . . . . .59
Embedded Processing Support Resources
Embedded Processing Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Training Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
TI Embedded Processor Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
Complementary Products for the TMS320 DSP Family
Linear and Logic Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Data Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
Audio Converters and Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Interface Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
TMS320C2000 Microcontrollers for Real-Time Control
TMS320C2000 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
TMS320C2000 New Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
TMS320C2000 New Technology Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Power Management Products for the C2000 Microcontroller Platform . . . . . . . . . . .85
MSP430 Ultra-Low Power Microcontrollers
MSP430 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Flash-Based F2xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Flash/ROM-Based x1xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90
Flash/ROM-Based x4xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
Flash-Based F5xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92
Complementary Analog Products for the MSP430 Family . . . . . . . . . . . . . . . . . . . . . . .95
Stellaris

Family of Microcontrollers
Stellaris 32-Bit ARM

Cortex-M3 MCUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99

System Solutions
Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
HiRel DSPs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
Medical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Medical Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
Portable Medical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
Smart Metering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Telecom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114
Video and Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
Texas Instruments 3Q 2009 Embedded Processing Guide
ii

Embedded Processing Selection Guide

Table of Contents
2009 Texas Instruments Incorporated
Printed in U.S.A. by Southwest Precision Printers, Houston, TX
ARM

References
Introduction to TI ARM-Based Embedded Processors . . . . . . . . . . . . . . . . . . . . . . . . . . .4
ARM + DSP:
TMS320DM6467 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
TMS320DM6446 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
TMS320DM6443 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
TMS320DM6441 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
OMAP3530 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
OMAP3525 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
ARM Only:
TMS320DM365 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
TMS320DM357 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
TMS320DM355 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
TMS320DM335 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
OMAP3515 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
OMAP3503 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
ARM + MCU:
Stellaris 32-Bit ARM

Cortex-M3 MCUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99

TI Worldwide Technical Support
Internet
TI Semiconductor Product Information Center Home Page
support.ti.com
TI Semiconductor KnowledgeBase Home Page
support.ti.com/sc/knowledgebase
Product Information Centers
Americas Phone +1(972) 644-5580
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Fax +1(972) 927-6377
Internet/Email support.ti.com/sc/pic/americas.htm
Europe, Middle East, and Africa
Phone
European Free Call 00800-ASK-TEXAS
(00800 275 83927)
International +49 (0) 8161 80 2121
Russian Support +7 (4) 95 98 10 701
Note: The European Free Call (Toll Free) number is not active in all countries. If you have tech-
nical difficulty calling the free call number, please use the international number above.
Fax +(49) (0) 8161 80 2045
Internet support.ti.com/sc/pic/euro.htm
Japan
Fax
International +81-3-3344-5317 Domestic 0120-81-0036
Internet/Email
International support.ti.com/sc/pic/japan.htm
Domestic www.tij.co.jp/pic
Asia
Phone
International +91-80-41381665
Domestic Toll-Free Number Toll-Free Number
Australia 1-800-999-084 Malaysia 1-800-80-3973
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Fax +886-2-2378-6808 Email tiasia@ti.com
Internet support.ti.com/sc/pic/asia.htm ti-china@ti.com
C093008
Embedded Processing Overview
Texas Instruments has the broadest portfolio of scaleable DSP, MCU, differentiated ARM and complementary analog products offering
complete system solutions for electronics manufacturers. This portfolio offers the full range of power/performance requirements ensuring
the right combination of attributes serving the smallest portable devices to the largest multi-channel systems and everything in between.
In addition, TI offers design resources including extensive software (including open source), tools, technical training, in-person and online
tech support and engineer-to-engineer forums at e2e.ti.com. Visit www.ti.com for technical literature, systems block diagrams and more.
Texas Instruments 3Q 2009 Embedded Processing Guide
Introduction to TI Embedded Processing
Overview
1

Digital Media
Processors
OMAP
Applications
Processors
C6000
Digital Signal
Processors
C5000
Digital Signal
Processors
C2000
Microcontrollers
MSP430
Microcontrollers
Stellaris 32-Bit
ARM Cortex-M3
MCUs
Audio
Automotive
Communications
Industrial
Medical
Security
Video
Wireless
Key Feature Complete tailored
video solution
Low power and
high performance
High
performance
Power-efficient
performance
Performance,
integration for
greener industrial
applications
Ultra-low power Open architecture
software, rich
communications
options
DaVinci Digital Media Processors:
Optimized for Digital Video
DaVinci technology consists of scalable,
programmable signal processing system
on chips (SoCs), accelerators and periph-
erals, optimized to match the price, per-
formance and feature requirements for a
broad spectrum of video end equipments.
OMAPApplications Processors:
Best General-Purpose, Multimedia
and Graphics
TIs OMAP platform delivers high-perform-
ance applications processors and a robust
support network allowing for rapid devel-
opment of multimedia-enhanced devices to
general-purpose computer applications
that require Linux OS or Windows

CE OS.
OMAP35x devices target portable naviga-
tion devices and media players, Internet
appliances and personal medical equip-
ment. OMAP-L1x devices include ARM9
and ARM9 + DSP architectures and offer a
variety of peripherals for networking, target-
ing consumer and industrial applications.
Highest Performance:
TMS320C6000 DSP Platform
The C6000 DSP platform offers the
industrys highest-performance single-core
and multi-core DSPs ideal for networking,
telecommunication, video, imaging, infra-
structure, test and equipment, military and
industrial applications. The platform
includes the C64x high-performance
DSPs, C67x floating-point DSPs and
the C674x fixed-/floating-point DSPs.
Power-Efficient Performance:
TMS320C5000 DSP Platform
The C5000 DSP platform offers the
industrys lowest standby power and
advanced automatic power management
for portable products like digital music
players, VoIP, hands-free accessories, GPS
receivers and portable medical equipment.
TMS320C2000 32-Bit Micro-
controller for Real-Time Control
The C2000 Microcontroller family com-
bines advanced control peripherals with the
processing power of a 32-bit core. From
the low-cost, high-integration Piccolo to
the powerful Delfino floating-point MCU,
C2000 MCUs offer a broad range of options,
and are ideal for embedded industrial control
applications such as digital motor control,
digital power supplies, intelligent sensors.
MSP430 Ultra-Low Power
Microcontroller Platform
The MSP430 family of ultra-low power
16-bit RISC mixed-signal processors from
TI provides the ultimate solution for battery-
powered measurement applications. Using
leadership in both mixed-signal and digital
technologies, TI has created the MSP430,
enabling system designers to simultane-
ously interface to analog signals, sensors
and digital components while maintaining
unmatched low power.
Stellaris

32-Bit ARM

Cortex-M3 MCUs
Stellaris 32-bit MCUs combine advanced
connectivity options with the general-
purpose processing performance of the
industry-standard ARM Cortex-M3 core for
cost-conscious applications.
Software and Development Tools
TMS320 DSPs are supported by
eXpressDSP Software and Development
Tools including Code Composer Studio
IDE, DSP/BIOS kernel, TMS320 DSP
Algorithm Standard and numerous
reusable, modular software from the
largest Developer Network in the industry.
Complementary Analog Products
TI offers a range of complementary data
converter, power management, amplifiers,
interface and logic products to complete
your design.
Applications Matrix Guideline
Texas Instruments 3Q 2009 Embedded Processing Guide
Introduction to TI Embedded Processing
Processor Find and Fit Guide
2

Step 1: Do you Need a

Processor for Your
Application?
Count up Yes answers and see the
score at the bottom for whether a
processor is right for your application.
1. Does your applciation need to run
algorithms to interpret, filter, and/or
adjust data of real-world signals?
Yes No
2. Does your application need to make
multiple control decisions based on
feedback from sensors?
Yes No
3. Does your application need to play
or record music and/or video in
multiple formats?
Yes No
4. Does your application need to
process any networking, wireless or
WiMAX communications protocols?
Yes No
5. Does your application have a GUI
(Graphical User Interface)?
Yes No
6. Does your application need to
access the Internet?
Yes No
7. Does your application need to run
Linux, Windows

CE, other operating

system or real-time kernel?
Yes No
Simple Scoring:
0 Yes = You most likely do not
need a processor
1 or 2 Yes = You may need a
processor
3 or 4 Yes = You most likely need a
processor
5+ Yes = You definitely need a
processor
Step 2: Finding the Right TI Processor for Your Application.
Seven simple but important questions with checkbox answer simplicity that will help
identify the most appropriate TI processor family or product to meet your requirements.
1. What is the primary function of your product using this processor?
a. Control b. Sensing and measurement
c. Audio d. General processing
e. Video/image processing f. Communications processing
g. 3-D graphics h. Real-time signal processing
2. What is your ranked priority order of your first, second and third most impor-
tant processor requirement to address? (Write 1, 2 or 3 in three boxes)
a. Lowest processor cost b. Fast time to market
c. Performance d. Software reuse
e. Low power dissipation f. Run Linux or Windows OS
g. Low system BOM cost
3. What processor types have you used prior to or are you considering to use for
this project?
a. General-purpose 32-bit b. DSP 16 or 32 (ADI, C5000, C6000)
c. MCU 8/16 (e.g., MSP430, PIC) d. Video processors (DM64x, IMX)
e. MCU 16/32 (e.g., ARM7, C2000) f. FPGA soft cores
g. Floating point
4. What classification would most closely fit your processor application?
a. Battery powered b. Plug-in (line) powered
c. Infrastructure or backbone d. Stand alone
e. Gateway or in between f. Other
5. What example I/O would be important for your processor to support?
a. Audio input/output b. Control I/O and PWMs
c. Video input/output d. Ethernet
e. USB f. SATA or SDIO
g. PCI, PCI Express

, sRIO h. Wi-Fi or WiMAX

i. On-chip ADC or analog I/O j. RF (e.g., ZigBee

)
6. In what language/level do you expect/desire to do most of your
programming?
a. C or C++ b. Graphical programming (e.g., Simulink)
c. Assembly d. Not me Will buy software
e. Java or open source f. Other
7. What price range do you expect to pay for your processor?
a. Up to U.S. $2 b. U.S. $2 to $5
c. > U.S. $5 to $10 d. > U.S. $10 to $25
e. > U.S. $25 to $50 f. > U.S. $50
Want to find the right processor even faster?
Check out the new interactive selection tools
online with all the features and functions that
you need.
MCU
Selection
Tool
Select
DSP
Selection
Tool
Select
www.ti.com/mcutool www.ti.com/dsptool
Continued on the following page.
Texas Instruments 3Q 2009 Embedded Processing Guide
Introduction to TI Embedded Processing
Processor Find and Fit Guide
3

MSP430
MCU
TMS320C2000
MCU
Stellaris 32-Bit ARM

Cortex-M3 MCU
TMS320C5000
DSP
TMS320C6000
DSP
OMAP Applications
Processor
TMS320DM64x, DM3x
Digital Media Processor
1. Primary function?
a. Control
b. Sensing/Measurement
c. Audio
d. General processing
e. Video/Image processing
f. Communications processing
g. 3-D graphics
h. Real-time signal processing
2. Priority requirement?
a. Lowest processor cost
b. Fast time to market
c. Performance
d. Software reuse
e. Low power dissipation
f. Run Linux or Windows
g. Low system BOM cost
3. Processor types?
a. General-purpose, 32-bit
b. DSP 16-/32-bit
c. MCU 8-/16-bit
d. Video processor
e. MCU 16-/32-bit
f. FPGA soft cores
g. Floating point
4. Application classification?
a. Battery powered
b. Plug-in (line) powered
c. Infrastructure of backbone
d. Stand alone
e. Gateway or in between
f. Other
5. What I/O is important?
a. Audio input/output
b. Control I/O and PWMs
c. Video input/output
d. Ethernet
e. USB
f. SATA or SDIO
g. PCI, PCI Express

or sRIO
h. Wi-Fi or WiMAX
i. On-chip ADC or analog I/O
j. RF (e.g., ZigBee

)
6. Programming language?
a. C or C++
b. Graphical programming
c. Assembly
d. Not me Will buy software
e. Java or open source
f. Other
7. Price expectation?
a. Up to U.S. $2
b. U.S. $2 to $5
c. > U.S. $5 to $10
d. > U.S. $10 to $25
e. > U.S. $25 to $50
f. > U.S. $50
Step 3: Processor Platform Fit: The More Blue = Better Fit
Texas Instruments 3Q 2009 Embedded Processing Guide
Introduction to TI Embedded Processing
Introduction to TI ARM

-Based Embedded Processors

4

TI offers a broad range of ARM-based products that address a wide variety of applications while delivering optimum performance, power
consumption and system cost. These ARM-based products span a variety of TIs product lines. See the chart below for how these
products map to the ARM offerings.
Target Applications for TIs
ARM-Based Devices
ARM processors cover a wide range of
performance and features enabling
system designers to create solutions
that meet their precise requirements.
Target applications include:
Data processing
POS
Handheld computing
Wired communications
Networking
Broadcast equipment
Wireless communications
Handsets
LAN/WAN routers
Consumer electronics
Portable A/V players
Digital set-top
Digital cameras
Network appliances
HVAC
Gaming equipment
Automotive
Infotainment
Safety and control
Body electronics
Industrial
Medical
Automation and drives
Metering
Power supplies
Remote monitoring
Building controls
Factory automation
Test and measurement equipment
ARM

-Based TI Offerings Overview

TIs ARM-Based Devices
TI Processor CPU MHz Operating System Key Peripherals
OMAP3503 ARM Cortex-A8 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port,
USB 2.0 HS OTG
OMAP3515 ARM Cortex-A8 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port,
USB 2.0 HS OTG
OMAP3525 ARM Cortex-A8 + 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port,
C64x DSP USB 2.0 HS OTG
OMAP3530 ARM Cortex-A8 + 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port,
C64x DSP USB 2.0 HS OTG
OMAP-L137 ARM926 + C674x DSP 300/300 Linux, Windows CE, MMC/SD, SDRAM/NAND, EMAC, UART,
VxWorks USB 2.0 HS OTG, USB 1.1
OMAP-L138 ARM926 + C674x DSP 300/300 Linux, Windows CE, mDDR/DDR2, SDRAM/NAND, SATA, uPP,
VxWorks EMAC, USB 2.0 HS OTG, USB 1.1
TMS320DM355 ARM926 135, 216, 270 Linux mDDR/DDR2, USB 2.0 H/OTG
TMS320DM335 ARM926 135, 216 Linux mDDR/DDR2, USB 2.0 H/OTG
TMS320DM357 ARM926 270 Linux EMAC, DDR2, JTAG, USB 2.0 OTG
TMS320DM365 ARM926 216, 270, 300 Linux EMAC, mDDR/DDR2, HPI, voice codec,
USB 2.0 H/OTG
TMS320DM6467 ARM926 + 594, 729/ Linux, Windows CE EMAC, DDR2, USB 2.0, HPI, PCI, ATA
C64x+ DSP 297, 365
TMS320DM6446 ARM926 + C64x+ DSP 300/600 Linux, Windows CE EMAC, DDR2, USB 2.0, HPI, ATA,
Flash card I/F
TMS320DM6443 ARM926 + C64x+ DSP 300/600 Linux, Windows CE EMAC, DDR2, USB 2.0, HPI, ATA,
Flash card I/F
TMS320DM6441 ARM926 + C64x+ DSP 256/512 Linux, Windows CE EMAC, DDR2, USB2.0, HPI, ATA,
Flash card I/F
Stellaris

LM3S: ARM Cortex-M3 2050 Schedulers and General purpose

1/3/6/800, 1000 various RTOS
Stellaris LM3S: ARM Cortex-M3 50100 Schedulers and ENET 1588 MAC+PHY
6/8/9000 various RTOS
Stellaris LM3S: ARM Cortex-M3 50100 Schedulers and USB OTG/H/D
3/5/9000 various RTOS
Stellaris LM3S: ARM Cortex-M3 50100 Schedulers and CAN
2/5/8/9000 various RTOS
DM3x
DM644x
DM646x
OMAP-L1x
ARM9
32-bit
Up o 500 MHz
P
ARM
Cortex-A8/9

32-bit
Up to 1 GHz
P
OMAP35x
ARM
Cortex-M3
32-bit
Up to 100 MHz
MCU
Stellaris
LM3Sxx

Applications Processors
Microcontrollers
C
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ARM to TI device capability overlay
Specifications
TI has extended its popular
TMS320C5000 low-power platform to
provide a broader portfolio of the indus-
trys most power-efficient DSPs with
standby power as low as 0.12 mW and
performance up to 600 MIPs
Extremely low power consumption and
more power modes extend battery life
Higher integration with large on-chip
memory and a variety of peripheral
offerings on a smaller form factor
Software compatible with all C5000 DSPs
Easy-to-use development tools and
more value-added third-party solutions
speed time to market
Applications
Feature-rich portable voice/audio products,
hands-free car kit, noise cancellation
headset, low-cost VoIP system and acces-
sories, DECT/USB phone, software-defined
radio, portable medical devices (ECG, digi-
tal stethoscope, pulse oximeter), fingerprint
pattern recognition, metering, measure-
ment and embedded signal processing
applications in general
TMS320C5504 / C5505 DSPs
Best-in-Class Standby and Dynamic Power
As low as 18 mW active power
10-mm 10-mm small form factor
Four pin-to-pin compatible devices with
incremental features and price
Richest feature sets as shown in the
block diagram
TMS320C5507 / C5509A DSPs
Optimized for Portable Media / Industrial
Applications
Dual MAC / 216400 MIPs
Integrated multi-channel ADC, USB 2.0
full-speed and large on-chip RAM
Very low standby power of 0.12 mW
TMS320C5501 / C5502 DSPs
Price and Performance Leaders
Up to 300-MHz clock rate
Two/Three multi-channel buffered serial
ports (McBSPs),UART, I
2
C
TMS320C5510 DSP Ideal for
Memory-Intensive Applications
Ultra low power 69 A in deep-sleep
Up to 320-KB on-chip memory
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C5000

DSP Platform
Silicon
5

TMS320C55x Power-Efficient DSP Generation, Fixed Point

Industrys Best Combination of Standby and Dynamic Power
Get samples, data sheets, tools and app reports at: www.ti.com/c5000
2
7
60
4
4 16 2
4 7
4 4
8
13
ROM
128 KB
EMIF/
NAND
32-KHz
PLL
Memory
R
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3

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B
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C55x
DSP Core
FFT
Memory
DARAM
64 KB
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2
SARAM
192/256
KB
4-Ch.
DMA
4-Ch.
DMA
4-Ch.
DMA
8
8
4-Ch.
DMA
TMS320C5505 DSP Block Diagram
The C5505 DSP is one of the latest TI C5000 DSPs with the best-in-class combination of standby
and active power and an integration level optimized for portable audio/voice, medical and many
other applications.
C5000 DSP Platform Roadmap
The C5000 DSPs span the applications spectrum with core performance extended to 300 MHz.
Embedded Signal Processing, Measurement
Telephony, VoIP/Accessories, Com
m
unication
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Software Compatible
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P
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D
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s
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y
C54x, C55x
Devices
C54x, C55x
Devices
C55x
Devices
C55x
Devices
C5000
Multicore
Devices
Largest installed DSP
customer base
Broad product portfolio
Power and cost efficient
TMS320C5000 DSP
P
o
rta
b
le
M
e
d
ic
a
l, B
io
m
e
tric
s
A
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, V
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, H
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d
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-
F
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K
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t
, R
a
d
i
o
C5000
Devices
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C5000

DSP Platform
Silicon
6

TMS320C55x DSP Generation

DAT/PRO
RAM ROM I-Cache EMIF DMA (ADDR) MMC/ Voltage (V) 1-KU
Part Number (Bytes) (Bytes) (Bytes) (Bits) (ch) (Words) USB
2
ADC
3
UART I
2
C RTC McBSP
4
SD LCD Core I/O COM Timers
5
MHz MIPS Packaging Price
1
TMS320VC5501GZZ300
6
32 K 32 K 16 32 6 8 M Y Y 2 1.26 3.3 HPI8 3
7
300 600 201 BGA
8
4.50
TMS320VC5501PGF300
6
32 K 32 K 16 32 6 8 M Y Y 2 1.26 3.3 HPI8 3
7
300 600 176 LQFP 4.50
TMS320VC5501ZZZ300
6
32 K 32 K 16 32 6 8 M Y Y 2 1.26 3.3 HPI8 3
7
300 600 201 BGA
8
4.50
TMS320VC5502GZZ200
6
64 K 32 K 6 8 M Y Y 3 1.26 3.3 HPI16/8 3
7
200 400 201 BGA
8
6.26
TMS320VC5502PGF200
6
64 K 32 K 6 8 M Y Y 3 1.26 3.3 HPI16/8 3
7
200 400 176 LQFP 6.26
TMS320VC5502ZZZ200
6
64 K 32 K 16 32 6 8 M Y Y 3 1.26 3.3 HPI16/8 3
7
200 400 201 BGA
8
6.26
TMS320VC5502PGF300
6
64 K 32 K 6 8 M Y Y 3 1.26 3.3 HPI16/8 3
7
300 600 176 LQFP 8.08
TMS320VC5502GZZ300
6
64 K 32 K 6 8 M Y Y 3 1.26 3.3 HPI16/8 3
7
300 600 201 BGA
8
8.08
TMS320VC5502ZZZ300
6
64 K 32 K 16 32 6 8 M Y Y 3 1.26 3.3 HPI16/8 3
7
300 600 201 BGA
8
8.08
TMS320VC5503GHH
6
64 K 64 K 16 6 8 M Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA 6.75
1.6 200 (max)
TMS320VC5503PGE
6
64 K 64 K 16 6 8 M Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 144 LQFP 6.75
1.6 200 (max)
TMS320VC5503ZHH
6
64 K 64 K 16 6 8 M Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA
8
6.75
1.6 200 (max)
TMS320VC5506GHH108
6
128 K 16 6 8 M Y1 Y Y 3 1.2 2.73.6 2
7
108 216 179 BGA 6.50
TMS320VC5506GHHR108
6
128 K 16 6 8 M Y1 Y Y 3 1.2 2.73.6 2
7
108 216 179 BGA 6.50
TMS320VC5506PGE108
6
128 K 16 6 8 M Y1 Y Y 3 1.2 2.73.6 2
7
108 216 144 LQFP 6.50
TMS320VC5506ZHH108
6
128 K 16 6 8 M Y1 Y Y 3 1.2 2.73.6 2
7
108 216 179 BGA
8
6.50
TMS320VC5506ZHHR108
6
128 K 16 6 8 M Y1 Y Y 3 1.2 2.73.6 2
7
108 216 179 BGA
8
6.50
TMS320VC5507GHH
6
128 K 64 K 16 6 8 M Y1 Y1 Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA 9.41
1.6 200 (max)
TMS320VC5507PGE
6
128 K 64 K 16 6 8 M Y1 Y2 Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 144 LQFP 9.41
1.6 200 (max)
TMS320VC5507ZHH
6
128 K 64 K 16 6 8 M Y1 Y1 Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA
8
9.41
1.6 200 (max)
TMS320VC5507ZHHR
6
128 K 64 K 16 6 8 M Y1 Y1 Y Y 3 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA
8
9.41
1.6 200 (max)
TMS320VC5509AGHH
6
256 K 64 K 16 6 8 M Y1 Y1 Y Y 3 2 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA 14.40
1.6 200 (max)
TMS320VC5509AGHHR
6
256 K 64 K 16 6 8 M Y1 Y1 Y Y 3 2 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA 14.83
1.6 200 (max)
TMS320VC5509APGE
6
256 K 64 K 16 6 8 M Y1 Y2 Y Y 3 2 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 144 LQFP 14.40
1.6 200 (max)
TMS320VC5509AZHH
6
256 K 64 K 16 6 8 M Y1 Y1 Y Y 3 2 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA
8
14.40
1.6 200 (max)
TMS320VC5509AZHHR
6
256 K 64 K 16 6 8 M Y1 Y1 Y Y 3 2 1.2/1.35/ 2.73.6 HPI16 2
7
108/144/ 400 179 BGA
8
14.83
1.6 200 (max)
TMS320VC5510AGGW1 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
14.40
TMS320VC5510AGGW2 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
16.85
TMS320VC5510AGGWA1 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
17.28
TMS320VC5510AGGWA2 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
19.87
TMS320VC5510AZGW1 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
14.40
TMS320VC5510AZGW2 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
16.85
TMS320VC5510AZGWA1 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
17.28
TMS320VC5510AZGWA2 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
19.73
TMS320VC5510AGPHA2 320 K 32 K 24 32 6 8 M 3 1.6 3.3 HPI16 2 160, 200 320, 400 240 BGA
8
20.20
TMS320VC5504ZCH 256 K 128 K 16 16 2 M Y2 1 Y Y 2 1.05/1.3 1.8/2.5/ 2
7
60/100 120/200 196 BGA
8
5.60
(Muxed 2.8/3.3
w/ I
2
S
& GPIO)
TMS320VC5505ZCH 320 K 128 K 16 16 2 M Y2 Y1 1 Y Y 2 Muxed 1.05/1.3 1.8/2.5/ 2
7
60/100 120/200 196 BGA
8
6.75
(Muxed w/ I
2
S, 2.8/3.3
w/ I
2
S SPI,
& GPIO) UART
& GPIO
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order..
2
1 = Full speed 2.0; 2 = High speed 2.0
3
1 = 4-ch 10-bit ADC; 2 = 2-ch 10-bit ADC
4
Multi-channel buffered serial port (McBSP).
5
3 = Two general-purpose timers and one 32-bit DSP/BIOS kernel counter, 2 = Two general-purpose timers.
6
Extended temperature device, 40 to 85C case temperature operation.
7
Plus 1 additional programmable watchdog timer.
8
MicroStar BGA package.
Note: All devices include software PLL. Note: Enhanced plastic and HiRel DSP versions are available for selected DSPs.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C5000

DSP Platform
Silicon
7

TMS320C54x DSP Generation, Fixed Point

Power-Efficient Performance DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/c5000
Specifications
16-bit fixed-point DSPs
Power dissipation as low as 40 mW
Single- and multi-core products
delivering 30532 MIPS performance
1.2-, 1.8-, 2.5-, 3.3- and 5-V
versions available
Three power-down modes
Integrated RAM and ROM
configurations
Auto-buffered serial port
Multi-channel buffered serial port
Host port interface
Ultra-thin packaging (100-, 128-,
144- and 176-pin LQFPs; 143-,
144-, 176- and 169-pin MicroStar
BGAs)
6-channel DMA controller per core
Applications
Digital cellular communications,
personal communications systems,
pagers, personal digital assistants,
digital cordless communications, wire-
less data communications, hands-free
car kit, computer telephony, voice over
packet, portable Internet audio,
modems
Features
Integrated VITERBI accelerator
40-bit adder and two 40-bit
accumulators to support parallel
instructions
40-bit ALU with a dual 16-bit
configuration capability for dual
one-cycle operations
17 17 multiplier allowing 16-bit
signed or unsigned multiplication
Four internal buses and dual
address generators enable multiple
program and data fetches and
reduce memory bottleneck
Single-cycle normalization and
exponential encoding
Eight auxiliary registers and a
software stack enable advanced
fixed-point DSP C compiler
Power-down modes for battery-
powered applications
C54x DSP Generation Block Diagram
This block diagram of the C54x DSP is a comprehensive diagram showing all peripheral options.
C54x DSPs are optimized to meet the performance, cost and low-power needs of wireless and wire-
line communications systems as well as emerging applications like IP phones, VoP and portable
applications.
MicroStar BGA Package Comparison
The ultra-small physical size (12 mm 12 mm 1.4 mm) of the C5000
DSP MicroStar BGA (ball grid array) packaging can also help increase the
performance per square inch for MIPS-intensive or space-constrained applica-
tions. The C5509A DSP is also pictured in a 144-pin LQFP.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C5000

DSP Platform
Silicon
8

TMS320C54x DSP Generation

RAM ROM DAT/PRO EMIF Voltage (V) 1-KU
Part Number (Bytes) (Bytes) (ADDR) (Bytes) (Bits) UART McBSP Core I/O COM Timers DMA MHz MIPS Packaging Price
1
TMS320VC5401PGE50 16 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 50 50 144 LQFP 3.50
TMS320VC5401GGU50 16 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 50 50 144 BGA
2
3.50
TMS320VC5401ZGU50 16 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 50 50 144 BGA 3.50
TMS320UC5402PGE80 32 K 8 K 128 K/2 M 16 2 1.8 1.83.6 HPI 8 2 6 80 80 144 LQFP 5.50
TMS320UC5402GGU80 32 K 8 K 128 K/2 M 16 2 1.8 1.83.6 HPI 8 2 6 80 80 144 BGA
2
5.50
TMS320UC5402ZGU80 32 K 8 K 128 K/2 M 16 2 1.8 1.83.6 HPI 8 2 6 80 80 144 BGA
2
5.50
TMS320VC5402GGU100 32 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 100 100 144 BGA 5.50
TMS320VC5402GGUR10 32 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 100 100 144 BGA 5.90
TMS320VC5402PGE100 32 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 100 100 144 LQFP 5.50
TMS320VC5402PGER10 32 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 100 100 144 LQFP 5.90
TMS320VC5402ZGU100 32 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 100 100 144 BGA 5.50
TMS320VC5402ZGUR10 32 K 8 K 128 K/2 M 16 2 1.8 3.3 HPI 8 2 6 100 100 144 BGA 5.90
TMS320VC5402APGE16 32 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8 1 6 160 160 144 LQFP 10.86
TMS320VC5402AGGU16 32 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8 1 6 160 160 144 BGA
2
10.86
TMS320VC5402AZGU16 32 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA 10.86
TMS320VC5404PGE 32 K 128 K 128 K/16 M 1 3 1.5 3.3 HPI 8/16 2 6 120 120 144 LQFP 7.96
TMS320VC5404GGU 32 K 128 K 128 K/16 M 1 3 1.5 3.3 HPI 8/16 2 6 120 120 144 BGA
2
7.96
TMS320VC5407PGE 80 K 256 K 128 K/16 M 1 3 1.6 3.3 HPI 8/16 2 6 120 120 144 LQFP 8.93
TMS320VC5407GGU 80 K 256 K 128 K/16 M 1 3 1.6 3.3 HPI 8/16 2 6 120 120 144 BGA
2
8.93
TMS320VC5407ZGU 80 K 256 K 128 K/16 M 16 1 3 1.5 3.3 HPI 8/16 2 6 120 120 144 BGA 8.93
TMS320VC5409PGE-80 64 K 32 K 128 K/16 M 16 3 1.8 3.3 HPI 8/16 1 6 80 80 144 LQFP 8.47
TMS320VC5409GGU-80 64 K 32 K 128 K/16 M 16 3 1.8 3.3 HPI 8/16 1 6 80 80 144 BGA
2
8.47
TMS320VC5409ZGU-80 64 K 32 K 128 K/16 M 16 3 1.8 3.3 HPI 8/16 1 6 80 80 144 BGA 8.47
TMS320VC5409PGE100 64 K 32 K 128 K/16 M 16 3 1.8 3.3 HPI 8/16 1 6 100 100 144 LQFP 10.42
TMS320VC5409GGU100 64 K 32 K 128 K/16 M 16 3 1.8 3.3 HPI 8/16 1 6 100 100 144 BGA
2
10.42
TMS320VC5409ZGU-100 64 K 32 K 128 K/16 M 16 3 1.8 3.3 HPI 8/16 1 6 100 100 144 BGA 10.42
TMS320VC5409APGE12 64 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 LQFP 12.29
TMS320VC5409AGGU12 64 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 BGA
2
12.29
TMS320VC5409AZGU12 64 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 BGA 12.29
TMS320VC5409APGE16 64 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 LQFP 13.64
TMS320VC5409AGGU16 64 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA
2
13.64
TMS320VC5409AZGU16 64 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA 13.64
TMS320VC5410PGE100 128 K 32 K 128 K/16 M 16 3 2.5 3.3 HPI 8 1 6 100 100 144 LQFP 29.43
TMS320VC5410GGW100 128 K 32 K 128 K/16 M 16 3 2.5 3.3 HPI 8 1 6 100 100 176 BGA
2
29.43
TMS320VC5410ZGW100 128 K 32 K 128 K/16 M 16 3 2.5 3.3 HPI 8 1 6 100 100 176 BGA 29.43
TMS320VC5410APGE12 128 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 LQFP 14.79
TMS320VC5410AGGU12 128 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 BGA
2
14.79
TMS320VC5410AZGU12 128 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 BGA 14.79
TMS320VC5410APGE16 128 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 LQFP 16.42
TMS320VC5410AGGU16 128 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA
2
16.42
TMS320VC5410AZGU16 128 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA 16.42
TMS320VC5416PGE120 256 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 LQFP 24.68
TMS320VC5416GGU120 256 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 BGA
2
24.68
TMS320VC5416ZGU120 256 K 32 K 128 K/16 M 16 3 1.5 3.3 HPI 8/16 1 6 120 120 144 BGA 24.68
TMS320VC5416PGE160 256 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 LQFP 27.39
TMS320VC5416GGU160 256 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA
2
27.39
TMS320VC5416ZGU160 256 K 32 K 128 K/16 M 16 3 1.6 3.3 HPI 8/16 1 6 160 160 144 BGA 27.39
TMS320VC549PGE80 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 80 80 144 LQFP 23.94
TMS320VC549GGU80 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 80 80 144 BGA 23.94
TMS320VC549ZGU80 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 80 80 144 BGA 23.94
TMS320VC549PGE100 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 100 100 144 LQFP 26.36
TMS320VC549GGU100 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 100 100 144 BGA 26.36
TMS320VC549ZGU100 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 100 100 144 BGA 26.36
TMS320VC549PGE120 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 120 120 144 LQFP 31.64
TMS320VC549GGU120 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 120 120 144 BGA 31.64
TMS320VC549ZGU120 64 K 32 K 128 K/16 M 16 2.5 3.3 HPI 8 1 120 120 144 BGA 31.64
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing
information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
MicroStar BGA package.
Note: All devices include software PLL.
Note: Enhanced plastic and HiRel DSP versions are available for selected DSPs.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C5000

DSP Platform
Tools, Software and Support
9

TMS320C55x and TMS320C54x DSP Generation Hardware and Software Development Tools
Description Part # $U.S.
1
C5000 DSP Starter Kits (DSKs)
TMS320C55x Low-Power Optimization DSP Starter Kit (DSK) TMDSDSK5509 (U.S. part number) 495
TMS320C54x DSP Starter Kit (DSK), TMS320C5416 DSP based
2
TMDSDSK5416 (U.S. part number) 395
TMS320C55x DSP Starter Kit (DSK), TMS320C5510 DSP based
2
TMDSDSK5510 (U.S. part number) 395
Evaluation Module
TMS320VC5505 Evaluation Module TMDXEVM5505 395
Medical Development Kit Electrocardiogram Analog Front End Module (AFE) TMDXMDKEK1258 449
Medical Development Kit Pulse Oximeter AFE TMDXMDKPO8328 395
Medical Development Kit Digital Stethoscope AFE TMDXMDKDS3254 325
JTAG Emulators
Spectrum Digital XDS510PP-Plus Emulator TMDSEMUPP (U.S. part number) 1,095
Spectrum Digital XDS510PP-Plus Emulator with European Cords TMDSEMUPP-0E (European part number) 1,095
Spectrum Digital XDS510 USB Emulator TMDSEMUUSB 1,495
Blackhawk XDS560 JTAG PCI Emulator TMDSEMU560PCI 2,995
Blackhawk XDS560 USB High-Performance JTAG Emulator TMDSEMU560U 2,999
All available Emulators/Analyzers for C5000 DSP Platform www.ti.com/c5000toolssftwr
Software Development Tools
Code Composer Studio Platinum Edition v3.3 Development Tools Bundled with Annual Software Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
C6000, C5000, OMAP, DaVinci, C2000 DSP Code Composer Studio Development Tools Annual Software TMDSSUBALL 600
Subscription for Version 3.1 and higher
Essential Guide to Getting Started with DSP CD-ROM SPRC119 Free
Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools
3
www.ti.com/freetools
C54x DSP Software Library SPRC099 Free
C55x DSP Software Library SPRC100 Free
C55x DSP Imaging Software Library SPRC101 Free
C54x DSP Chip Support Library SPRC132 Free
C55x DSP Chip Support Library SPRC133 Free
C5000 DSP Software Provider/List www.ti.com/c5000sftwrprov
C5000 DSP Development Tool Provider/List www.ti.com/c5000devtoolprov
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New tools are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Includes a DSK version of Code Composer Studio Development Tools restricted for use only with the DSP target board included in the kit, power supply and cables.
3
Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker), emulator and simulator configurations all limited to 120 days.
Please see the tools features matrix on page 59 for more details.
C5000 DSP Literature and Related Technical Documentation
All documentation and associated literature, users guides, application notes and software can be found by clicking on the specific device
in the parametric table found on the URLs below.
TMS320C54x DSP Generation www.ti.com/c54x TMS320C55x DSP Generation www.ti.com/c55x
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C5000

DSP Platform
Power Management Products
10

Suggested Texas Instruments Power Management Solutions for the C5000 DSP Platform
Core and I/O Voltages
Non-Synchronous Controller Synchronous Dual-Output
Input Voltage LDO (External FET and Diode) Integrated FET Converter Converter
3.3 V TPS736xx TPS64200 TPS62300 TPS62400
5 V TPS736xx TPS64200 TPS62300 TPS62400
TPS54386
12 V TLV1117 TPS40190 TPS62110 TPS54386
TPS5124
24 V TPS5124 TPS54386
I/O supply 3.3 V, current up to 250 mA
Core supply down to 1.2 V, current up to 250 mA
Power Management Products for the C5000 DSP Platform
Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com
L1
R1
R2
V
IN
RESET
V
IO
V
CORE EN
C2
Sequencing Circuit
Q1
2SC2412K
C3
C1
R3 R7
R4
R7
U2
TPS76933DBV
1
2
3
5
4
IN
GND
EN
OUT
NC/FB
U3
TPS3103K33DBV
6
5
4
1
2
3
VDD
PFO
PFI
RESET
GND
MR
U1
TPS6230XYZD
A2
B2
C2
D2
A1
B1
C1
D1
VIN
EN
ADJ
FB
GND
SW
M/S
VOUT
+
C4
Example C5000 DSP Power Supply Design
For additional power supply designs for TI DSPs, please visit www.ti.com/processorpower.
Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level
power requirements to ensure an adequate power supply design is used.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
11

Specifications
Broadest portfolio of high-performance
DSPs ranging from sub U.S. $10.10 to
3 GHz of raw DSP horsepower
Shipping the industrys first 1.2-GHz
single-core DSPs
Enabling more channels and function-
ality with high-performance, single-
core and multi-core DSPs
Upward 100% object code compatibil-
ity within C6000 DSP platform
The easiest-to-use integrated develop-
ment environment with the industrys
best optimizing C compiler
Applications
Wireless infrastructure (adaptive anten-
nas, basestations, gateways), telecom
infrastructure (RAS, PBX, VoIP), digital
video (conferencing, surveillance, en-
coders, statistical remultiplexor/broad-
band routers, network projector, digital
signage), imaging (medical, machine
vision/inspection, defense/radar/sonar)
Features
VelociTI.2 architecture extensions with
new instructions to accelerate per-
formance in key applications
Improved orthogonality with frequently
used instructions available in more
functional units
Double the bandwidth resulting from
more registers, wider load/store data
paths and enlarged two-level cache
Peripherals
Enhanced direct memory access
controller
Peripheral component interconnect
Universal test and operation PHY
interface for ATM (UTOPIA)
Viterbi and Turbo coprocessors
External memory interfaces
Multi-channel buffered serial ports
Host port interfaces
Serial RapidIO

Gigabit Ethernet MAC (SGMII)

TMS320C64x DSP Generation, Fixed Point
Highest-Performance and Performance Value DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/c6000
Please check user guide for MUXing options.
McBSP
McBSP
McASP
or
PWM 3
UART 2
OSC PLL JTAG
DDR
PLL
Timer
WDT
EDMA 3.0
DDR2 32
TMS320C6424
DSP Subsystem
L2
128-KB
Cache
L1D 80 KB
GPIO
Timer 2
I C
2
EMIF 16
HPI
RMII
PCI 33
or
C64x+
Core
L1P 32 KB
VLYNQ
RMII/MII
or
The C642x DSPs come in two flavors the C6421 and C6424 DSPs. These DSPs are pin-for-pin
compatible, start from U.S. $10.10 (1-KU volumes) and are completely scalable in speed and/or
feature set. Both new DSPs are available in 400, 500 and 600 MHz speeds, and have the same raw
processing power, but differ in on-chip memory and peripherals.
Software Compatible
I
n
c
r
e
a
s
i
n
g

P
e
r
f
o
r
m
a
n
c
e
,

M
e
m
o
r
y

&

P
e
r
i
p
h
e
r
a
l
s
C6421/4
DSP
C64x
Multi-Core
Next
High-Performance
Multi-Core
High-Performance
Single-Core
Performance
Value DSP
C6474
DSP
Ranging from sub U.S. $10.10 to 3.0 GHz
30K+ programmers
Millions shipped to date
C64x
DSP
C64x
Next
C64x
Next
C6452/4/5/7
DSP
C6414/5/6
DSP
C6410/2/3/8
DSP
C6000 DSP Platform Roadmap
The C6000 DSP platform includes a wide range of devices that raise the bar in performance, set
new levels of cost efficiency and offer on-chip peripheral integration to enable developers of high-
performance systems to choose the device that best suits their specific application.
Note: Information on DaVinci processor products can be found beginning on page 24.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
12

TMS320C64x DSP Generation Performance Value Fixed-Point DSPs

Internal RAM (Bytes)
L1 Program Cache/ Enhanced Power (W)
2
L1 Data Cache/ DMA CPU Voltage (V) 1-KU
Part Number L2 Unified RAM/Cache McBSP (Channels) COM Timers MHz MIPS and L1 Total Core I/O Packaging Price
1
Performance Value
TMS320C6410GTS400 16 K/16 K/128 K 2 64 HPI 32/16
3
3 400 3200 0.58 1.0 1.2 3.3 288 BGA, 23 mm 17.24
TMS320C6413GTS500 16 K/16 K/256 K 2 64 HPI 32/16
3
3 500 4000 0.58 1.1 1.2 3.3 288 BGA, 23 mm 23.67
TMS320C6412AGDK5 16 K/16 K/256 K 2 64 PCI/HPI/EMAC
4
3 500 4000 0.66 1.3 1.2 3.3 548 BGA, 23 mm 34.92
TMS320C6412AGDK6 16 K/16 K/256 K 2 64 PCI/HPI/EMAC
4
3 600 4800 0.93 1.9 1.4 3.3 548 BGA, 23 mm 38.41
TMS320C6412AGDK7 16 K/16 K/256 K 2 64 PCI/HPI/EMAC
4
3 720 5760 0.93 2.15 1.4 3.3 548 BGA, 23 mm 60.06
TMS320C6418GTS600 16 K/16 K/512 K 2 64 HPI 32/16
3
3 600 4800
5
0.82 1.7 1.4 3.3 288 BGA, 23 mm 44.11
TMS320C6418ZTSA500 16 K/16 K/512 K 2 64 HPI 32/16
3
3 500 4000
5
0.58 1.1 1.4 3.3 288 BGA, 23 mm 44.11
TMS320C6424ZWT4 32 K/80 K/128 K 2 64 PCI/HPI/EMAC
6
3 400 3200 0.372 0.543 1.05/1.2 1.8/3.3 361 PBGA, 16 mm 17.50
TMS320C6424ZWT5 32 K/80 K/128 K 2 64 PCI/HPI/EMAC
6
3 500 4000 0.397 0.87 1.2 1.8/3.3 361 PBGA, 16 mm 21.88
TMS320C6424ZWTQ5
7
32 K/80 K/128 K 2 64 PCI/HPI/EMAC
6
3 500 4000 0.397 0.87 1.2 1.8/3.3 361 PBGA, 16 mm 26.25
TMS320C6424ZDUQ5
7
32 K/80 K/128 K 2 64 PCI/HPI/EMAC
6
3 500 4000 0.397 0.87 1.2 1.8/3.3 376 PBGA, 23 mm 26.25
TMS320C6424ZWT6 32 K/80 K/128 K 2 64 PCI/HPI/EMAC
6
3 600 4800 0.628 0.838 1.2 1.8/3.3 361 PBGA, 16 mm 27.48
TMS320C6421ZWT4 48 K/16 K/64 K 1 64 HPI/EMAC
6
3 400 3200 0.372 0.543 1.05/1.2 1.8/3.3 361 PBGA, 16 mm 10.10
TMS320C6421ZWT5 48 K/16 K/64 K 1 64 HPI/EMAC
6
3 500 4000 0.397 0.87 1.2 1.8/3.3 361 PBGA, 16 mm 13.53
TMS320C6421ZWTQ5
7
48 K/16 K/64 K 1 64 HPI/EMAC6 3 500 4000 0.397 0.87 1.2 1.8/3.3 361 PBGA, 16 mm 16.20
TMS320C6421ZDUQ5 48 K/16 K/64 K 1 64 HPI/EMAC6 3 500 4000 0.397 0.87 1.2 1.8/3.3 376 PBGA, 23 mm 16.20
TMS320C6421ZWT6 48 K/16 K/64 K 1 64 HPI/EMAC
6
3 600 4800 0.628 0.838 1.2 1.8/3.3 361 PBGA, 16 mm 19.19
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Assumes 60% CPU utilization, 50% EMIF utilization (133 MHz for 1.4 V, 100 MHz for 1.2 V), 50% writes, 64-bits, 50% bit switching, 2 2-MHz McBSP at 100% utilization, and 2 75-MHz timers at 100% utilization.
See SPRAA59 for the TMS320C6410 and TMS320C6413 DSPs. See SPRA967 for the TMS320C6412A DSP. See SPRAA60 for the TMS320C6418 DSP. See SPRAAO9 for the TMS320C6421 and TMS320C6424 DSPs.
3
HPI is selectable, 32 bit or 16 bit.
4
The C6412 can be configured to have either a 32-bit PCI or 32-bit HPI, or a 16-bit HPI with Ethernet MAC.
5
Plus on-chip Viterbi (VCP) coprocessor.
6
HPI interface is 16 bit.
7
Q designates Q100 automotive reliability.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
TMS320C64x DSP Generation Highest-Performance Fixed-Point DSPs
Internal RAM (Bytes)
L1 Program Cache/ Enhanced Power (W)
2
L1 Data Cache/ DMA CPU Voltage (V) 1-KU
Part Number L2 Unified RAM/Cache McBSP (Channels) COM
3
Timers MHz MIPS and L1 Total Core I/O Packaging Price
1
Highest Performance
TMS320C6416TBGLZ1 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 1000 8000
5
0.44 1.65 1.2 3.3 532 BGA, 23 mm 205.80
TMS320C6416TGLZ8 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 850 6800
5
0.44 1.46 1.2 3.3 532 BGA, 23 mm 165.15
TMS320C6416TBGLZ7 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 720 5760
5
0.44 1.36 1.2 3.3 532 BGA, 23 mm 103.30
TMS320C6416TGLZ6 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 600 4800
5
0.39 1.1 1.1 3.3 532 BGA, 23 mm 82.65
TMS320C6415TBGLZ1 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 1000 8000 0.44 1.65 1.2 3.3 532 BGA, 23 mm 183.25
TMS320C6415TBGLZ8 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 850 6800 0.44 1.46 1.2 3.3 532 BGA, 23 mm 138.25
TMS320C6415TBGLZ7 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 720 5760 0.44 1.36 1.2 3.3 532 BGA, 23 mm 93.95
TMS320C6415TBGLZ6 16K/16K/1M 2+Utopia
4
64 PCI/HPI 32/16 3 600 4800 0.39 1.1 1.1 3.3 532 BGA, 23 mm 75.15
TMS320C6414TBGLZ1 16K/16K/1M 3 64 HPI 32/16 3 1000 8000 0.44 1.65 1.2 3.3 532 BGA, 23 mm 173.50
TMS320C6414TBGLZ8 16K/16K/1M 3 64 HPI 32/16 3 850 6800 0.44 1.46 1.2 3.3 532 BGA, 23 mm 131.40
TMS320C6414TBGLZ7 16K/16K/1M 3 64 HPI 32/16 3 720 5760 0.44 1.36 1.2 3.3 532 BGA, 23 mm 89.25
TMS320C6414TBGLZ6 16K/16K/1M 3 64 HPI 32/16 3 600 4800 0.39 1.1 1.1 3.3 532 BGA, 23 mm 71.40
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior
to placing orders. TI may verify final pricing prior to accepting any order.
2
Assumes 60% CPU utilization, 50% EMIF utilization (133 MHz for 1.4 V, 100 MHz for 1.2 V), 50% writes, 64-bits, 50% bit switching, 2 2-MHz McBSP at 100% utilization, and 2 75-MHz timers at 100% utilization.
See SPRAA45 for TMS320C6414T, TMS320C6415T and TMS320C6416T DSPs.
3
HPI is selectable, 32 bit or 16 bit.
4
UTOPIA pins muxed with a second McBSP.
5
Plus on-chip Turbo (TCP) and Viterbi (VCP) coprocessors.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Tools and Resources
13

TMS320C64x DSP Hardware and Software Development Tools

Description Part Number $U.S.
1
Hardware Development Tool
TMS320C6416 DSP Starter Kit (DSK) TMDSDSK6416-T (U.S. part number) 495
TMDSDSK6416-TE (European part number)
Evaluation Module (EVM)
TMS320C6424 Evaluation Module (EVM) TMDXEVM6424 495
JTAG Emulators
Spectrum Digital XDS510PP-Plus Emulator TMDSEMUPP (U.S. part number) 1,095
Spectrum Digital XDS510PP-Plus Emulator with European Cords TMDSEMUPP-0E (European part number) 1,095
Spectrum Digital XDS510 USB Emulator TMDSEMUUSB 1,495
Blackhawk XDS560 JTAG PCI Emulator TMDSEMU560PCI 2,995
Blackhawk XDS560 USB High-Performance JTAG Emulator TMDSEMU560U 2,999
XDS560 USB Trace Emulator
2
TMDSEMU560T 9,995
Software Development Tools
Code Composer Studio Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
VLIB Software Library www.ti.com/vlib Free
VICP Signal Processing Library SPRC847/831 Free
C6000, C5000, C2000, DaVinci and OMAP processor CCStudio Development Tools Annual Software TMDSSUBALL 600
Subscription for Version 3.10 and higher
Code Composer Studio IDE Free Evaluation Tools SPRC119 (www.ti.com/freetools) Free
Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools
3
TMS320C6000 DSP Chip Support Library SPRC090 Free
TMS320C64x DSP Library SPRC092 Free
TMS320C64x DSP Image Library SPRC094 Free
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers New tools are listed in bold red.
are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
The XDS560 Trace is designed for use with trace-enabled digital signal processors. Currently the following processors are fully supported by trace: TMS320C6418, TMS320C6416T,
TMS320C6415T, TMS320C6414T, TMS320C6413, TMS320C6412, TMS320C6411 and TMS320C6410 processors.
3
Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days.
Please see the tools features matrix on page 59 for more details.
C64x Literature and Related Technical Documentation
All documentation and associated literature, users guides, application notes and software can be found by clicking on the specific device
in the parametric table found on the URL below.
TMS320C64x DSP Generation www.ti.com/c64x
Specifications
TMS320C6457 DSP offers superior
memory and cache performance,
dual-TCP2 accelerators, and Serial
RapidIO

for DSP-to-DSP, switch

and FPGA interconnectivity
TMS320C6455 DSP offers Serial
RapidIO for DSP-to-DSP, switch and
FPGA interconnectivity
TMS320C6452 DSP offers Gigabit
Ethernet switch with two EMAC
ports for ease of scalability
Enhanced core enables 20 percent
higher cycle performance
2030 percent smaller code size
from 16-bit compact instructions
and SPLOOP buffer
Applications
Video and voice transcoding, video
conferencing servers, high-definition
(HD) video encoding and mixer
systems, wireless basestation trans-
ceivers, HD Radio, medical imaging,
photo labs, industrial vision, military,
printing and VoIP infrastructure
Features
TMS320C64x+ core
720 MHz, 850 MHz, 900 MHz,
1 GHz and 1.2 GHz
Memory
32-KB L1D, 32-KB L1P
cache/SRAM
Up to 2 MB L2
Up to 1-MB cacheable L2 memory
Acceleration
Viterbi coprocessor (VCP2)
Turbo-decoder coprocessor (TCP2)
Peripherals
Serial RapidIO
Gigabit Ethernet MAC
Telecom serial interface port (TSIP)
Other high-bandwidth peripherals:
UTOPIA, PCI-66, HPI
Up to two EMIFs: 32-bit DDR2,
64-bit EMIF
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
14

TMS320C645x DSP Generation, Fixed Point

Highest-Performance DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/c6000
Timers PLL
Boot ROM
VCP2 TCP2
TCP2
L2 MEM
TMS320C6457
C64x+
Core
L1 P MEM
L1 D MEM
M
c
B
S
P
S
G
M
I
U
T
O
P
I
A
H
P
I
S
R
I
O
D
D
R
2
G
P
I
O
I
C
2
EDMA 3.0 with Switch Fabric
E
M
I
F

6
4
TMS320C6457 DSP Block Diagram
C6457 DSPs offer superior memory and cache performance, dual-TCP2 accelerators and faster
DDR2 interface over C6455 DSPs.
TMS320C64x+ DSP Core Benefits and Features
Benefits Supporting Architecture Features
20% higher cycle performance improves overall Doubled multiplication bandwidth
system performance Instruction set enhancements for FFT, FIR and DCT
EDMA 3.0 engine
2030% smaller code size reduces system cost 16-bit compact instructions
SPLOOP buffer
Enhanced development Real-time bandwidth management
Memory protection
Better debug Exception handling
Cache coherency visibility
McASP
TSIP (2)
or
SPI
UART UART
PLL JTAG
DDR
PLL
Switch Fabric/EDMA 3.0
DDR2 32b
DSP Subsystem
L2
1.4 MB
Cache
L1D 32 KB
GPIO
Timer 4
I
VLYNQ
C64x+
Core
L1P 32 KB
SGMII SGMII
UHPI
PCI66
or
EMIF 16b
SGMII SGMII
G
i
g
S
w
i
t
c
h
I C
2
TMS320C6452
The C6452 DSP provides customers lower system cost by offering a greater channel density and
more peripheral integration. The C6452 DSP will be offered at both 900 MHz and 720 MHz.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
15

TMS320C645x DSP Generation Highest-Performance Fixed-Point DSPs

Internal RAM (Bytes)
L1 Program Cache/ Enhanced Power (W)
2
L1 Data Cache/ DMA Internal Voltage (V) 1-KU
Part Number Cores L2 Unified RAM/Cache McASP McBSP TSIP (Channels) COM
3
Timers MHz MIPS Logic Total Core I/O Packaging Price
1
Highest-Performance DSPs
TMS320C6457CMH 1 32 K/32 K/2 M 2+Utopia
4
64 Serial RapidIO/HPI/ 2
5
1000 8000 1.85 2.33 1.1 3.3, 1.8, 688 BGA, 23 mm 111.85
Gigabit EMAC 1.1
TMS320C6457CMH2 1 32 K/32 K/2 M 2+Utopia
4
64 Serial RapidIO/HPI/ 2
5
1200 9600 2.79 3.27 1.2 3.3, 1.8, 688 BGA, 23 mm 145.41
Gigabit EMAC 1.2
TMS320C6455BZTZ2 1 32 K/32 K/2 M 2+Utopia
4
64 Serial RapidIO/HPI/ 2
5
1200 9600
6
1.76 2.30 1.25 3.3, 1.8, 697 BGA, 24 mm 215.72
PCI/Gigabit EMAC 1.5, 1.25
TMS320C6455BZTZ
1
32 K/32 K/2 M 2+Utopia
4
64 Serial RapidIO/HPI/ 2
5
1000 8000
6
1.66 2.19 1.25 3.3, 1.8, 697 BGA, 24 mm 171.36
PCI/Gigabit EMAC 1.5, 1.25
TMS320C6455BZTZ8 1 32 K/32 K/2 M 2+Utopia
4
64 Serial RapidIO/HPI/ 2
5
850 6800
6
1.41 1.94 1.2 3.3, 1.8, 697 BGA, 24 mm 148.86
PCI/Gigabit EMAC 1.5, 1.2
TMS320C6455BZTZ7
1
32 K/32 K/2 M 2+Utopia
4
64 Serial RapidIO/HPI/ 2
5
720 5760
6
1.29 1.81 1.2 3.3, 1.8, 697 BGA, 24 mm 126.15
PCI/Gigabit EMAC 1.5, 1.2
TMS320C6454BZTZ2 1 32 K/32 K/1 M 2 64 HPI/PCI/ 2
5
1200 9600 1.76 2.30 1.25 3.3, 1.8, 687 BGA, 24 mm 175.07
Gigabit EMAC 1.5, 1.25
TMS320C6454BZTZ 1 32 K/32 K/1 M 2 64 HPI/PCI/ 2
5
1000 8000 1.66 2.19 1.25 3.3, 1.8, 687 BGA, 24 mm 134.13
Gigabit EMAC 1.5, 1.25
TMS320C6454BZTZ8 1 32 K/32 K/1 M 2 64 HPI/PCI/ 2
5
850 6800 1.41 1.94 1.2 3.3, 1.8, 687 BGA, 24 mm 106.26
Gigabit EMAC 1.5, 1.2
TMS320C6454BZTZ7 1 32 K/32 K/1 M 2 64 HPI/PCI/ 2
5
720 5760 1.29 1.81 1.2 3.3, 1.8, 687 BGA, 24 mm 87.10
Gigabit EMAC 1.5, 1.2
TMS320C6452ZUT9 1 32 K/32 K/1.4 M 1 2 64 2SGMII/Gigabit EMAC 4
5
900 7200 2.173 3.373 1.2 3.3, 1.8 529 BGA, 19 mm 91.31
Switch/UHPI/PCI/VLYNQ
TMS320C6452ZUT7 1 32 K/32 K/1.4 M 1 2 64 2SGMII/Gigabit EMAC 4
5
720 5760 1.92 3.116 1.2 3.3, 1.8 529 BGA, 19 mm 80.10
Switch/UHPI/PCI/VLYNQ
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Assumes the following conditions: 60% CPU utilization; DDR2 at 50% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching; two 2-MHz McBSPs at 100% utilization, 50% switching; two 75-MHz timers at
100% utilization; device configured for HPI32 mode with pull-up resistors on HPI pins; room temperature (25C). See SPRAAE8 for TMS320C6455 and TMS320C6454 DSPs. See SPRAAR5 for TMS320C6452 DSPs.
3
HPI is selectable, 32 bit or 16 bit.
4
UTOPIA pins muxed with a second McBSP.
5
64-bit configurable timers.
6
Plus on-chip Turbo (TCP) and Viterbi (VCP) coprocessors.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
Tools available for the TMS320C645x DSP generation are listed on page 17.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
16

Specifications
Three 1-GHz cores:
48,000 (8-bit) MMACS / 24,000
(16-bit) MMACS peak performance
Software backward compatibility
allows for easier porting to new DSP
Fast core-to-core communications,
less cycles/lower latency
VCP2 and TCP2 accelerators for
significantly speeding up channel
decoding operations on-chip, off-
loading the DSP for other processing
Access memory faster with 667-
MHz high-performance DDR2
High-speed interconnect enabled by
EMAC, AIF and sRIO SERDES
interfaces
Applications
Communication infrastructure, video
infrastructure, high-performance imag-
ing, server blade, military, aerospace
and avionics systems, test and meas-
urement solutions, advanced network-
ing equipments, oil exploration and
modeling equipments, training and
simulation applications
Features
3 1.0-GHz TMS320C64x+ cores
Memory
32-KB L1D, 32-KB L1P cache
per core
3 MB total L2 memory
Configurable allocation per core
Acceleration
Viterbi coprocessor (VCP2)
Turbo-decoder coprocessor (TCP2)
Peripherals
Gigabit Ethernet MAC (EMAC)
Antenna Interface (AIF)6 lanes total
Serial RapidIO

(sRIO) 2 lanes
total
667-MHz, high-performance
DDR2 interface
McBSP (TDM)
TMS320C647x DSP Generation, Fixed Point
Highest-Performance Multi-Core DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/c6000
TMS320C6474
GPIO PLL I C
2
Timers Others Boot
ROM
McBSP
Antenna
Interface
L1 Data
L1 Prog
10/100/
1G
Ethernet
Serial
RapidIO

T
C
P
2
C64x+
Core
L1 Data
L1 Prog
DDR-2
I/F
L1 Data
L1 Prog
L2 Memory L2 Memory L2 Memory
C64x+
Core
C64x+
Core
V
C
P
2
EDMA3.0 with Switch Fabric
TMS320C6474 DSP Block Diagram
The highly integrated C6474 DSP integrates three of TIs flagship TMS320C64x+ cores per chip.
A large amount on-chip memory and fast speed I/O interface enable high-density and high-
performance applications. Software compatibility allows a straightforward code porting from
C64x+-core DSPs system.
More
performance
for same
power
budget
5
10
0
Power consumption
W
a
t
t
s
Three 1-GHz
C6455 DSPs
One C6474
Multi-Core DSP
8-GHz raw performance
Same performance,
1/3 less power
50%more performance,
same power budget
50%more
performance
per Watt
12-GHz raw performance
Board
with
25-Watt
power
limit
reached
Ex: 25-WDSP power budget
~9W
~6W
1-GHz
DSP
1-GHz
DSP
1-GHz
DSP
1-GHz
DSP
C6474
Multi-Core
1-GHz
DSP
1-GHz
DSP
1-GHz
DSP
1-GHz
DSP
C6474
Multi-Core
C6474
Multi-Core
C6474
Multi-Core
Integrated Solution Improves Power Efficiency
Smaller process node, TI-patented SmartReflex technology and eliminating I/O switch with highly
integrated architecture improve power efficiency of C6474 DSP systems.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon, Tools and Software
17

TMS320C647x DSP Generation Multi-Core Highest-Performance Fixed-Point DSP

Internal RAM (Bytes)
L1 Program Cache/ Enhanced Power (W)
2
L1 Data Cache/ DMA Internal Voltage (V) 1-KU
Part Number Cores L2 Unified RAM/Cache McASP McBSP TSIP (Channels) COM
3
Timers MHz MIPS Logic Total Core I/O Packaging Price
1
Highest-Performance Multi-Core DSPs
TMS320C6474ZUN 3 96 K/96 K/3.072 M 2 64 Serial RapidIO

/ 6
4
1000 24000 5.04 5.43 0.9 to1.2 1.8, 1.1 561 BGA, 23 mm 224.81
SGMII/Gigabit EMAC Smart-
Reflex
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Assumes the following conditions: 60% CPU utilization; DDR2 at 50% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching; two 2-MHz McBSPs at 100% utilization, 50% switching; two 75-MHz timers at
100% utilization; room temperature (25C). See SPRAAX3 for TMS320C6474 DSPs.
3
HPI is selectable, 32 bit or 16 bit.
4
64-bit configurable timers.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
TMS320C645x and TMS320C647x DSP Generations Hardware and Software Development Tools
Description Part Number $U.S.
1
Hardware Development Tool
TMS320C6455 DSP Starter Kit (DSK) TMDSDSK6455 595
Evaluation Modules (EVM)
TMS320C6474 DSP Evaluation Module TMDXEVM6474 1,995
TMS320C6457 DSP Evaluation Module TMDXEVM6457 1,995
TMS320C6455 DSP Evaluation Module with sRIO TMDXEVM6455 (U.S. part number) 1,795
TMS320C6452 DSP Evaluation Module TMDXEVM6452 1,295
JTAG Emulators
Spectrum Digital XDS510PP-Plus Emulator TMDSEMUPP (U.S. part number) 1,095
Spectrum Digital XDS510PP-Plus Emulator with European Cords TMDSEMUPP-0E (European part number) 1,095
Spectrum Digital XDS510 USB Emulator TMDSEMUUSB 1,495
Blackhawk XDS560 JTAG PCI Emulator TMDSEMU560PCI 2,995
Blackhawk XDS560 USB High-Performance JTAG Emulator TMDSEMU560U 2,999
XDS560 USB Trace Emulator
2
TMDSEMU560T 9,995
Software Development Tools
Code Composer Studio (CCStudio) Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
C6000, C5000, C2000, DaVinci and OMAP processor CCStudio Development Tools Annual Software TMDSSUBALL 600
Subscription for Version 3.10 and higher
Code Composer Studio IDE Free Evaluation Tools SPRC119 (www.ti.com/freetools) Free
Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools
3
TMS320C6000 DSP Chip Support Library SPRC090 Free
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New tools are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
The XDS560 Trace is designed for use with trace-enabled digital signal processors. The following processors are fully supported by trace: TMS320C6452, TMS320C6454 and TMS320C6455 DSPs.
3
Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days.
Please see the tools features matrix on page 59 for more details.
Applications
Vehicle diagnostics, Software-Defined
Radio (SDR), industrial monitoring, test
and measurement equipment (oscillo-
scopes, seismic analyzers etc.), audio
(digital mixers, teleconference sys-
tems), medical monitoring, biometrics,
music effects, speech recognition,
voice over packet, conference/IP
phones, and more
C674x DSP
Supports both fixed point and
floating point
Fully code compatible with all previ-
ous TMS320C6000 devices
Lowest-power floating-point DSP
(2 lower than nearest competitor)
Lowest-cost fixed- or floating-point
networking DSP
Networking simplified with advanced
peripherals including 10/100 Ether-
net MAC, USB 2.0 HS OTG, SATA
Scalable architecture; pin-for-pin
compatible with select devices in
the OMAP-L1x embedded processor
generation
Up to 448 KB of on-chip memory for
system cost reduction and lower
power consumption
Low power consumption ranging
from 7 mW* deep-sleep power to
452 mW

total power
Smaller, ergonomic products with
1313-mm packaging
C672x DSP
Lowest price floating-point device in
the market
Sixty-four 32-bit registers
Flexible boot options
dMAX DMA engine tuned for audio
performance
C671x DSP
L1/L2 cache architecture
Thirty-two 32-bit registers
EDMA DMA engine
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
18

EMIFA
NAND/
SDRAM
(16-Bit)
EMIFB
SDRAM
(32-Bit)
MMC/SD
Switch Fabric/EDMA
TMS320C6747
10/100
Ethernet
MAC
128-KB
RAM
SPI (2)
UART (3)
McASP (3)
RTC
PWM (3)
GPIO
LCD Ctl
I C (2)
2
DSP Subsystem
USB 2.0
USB 1.1
HPI
Timers
(2)
L1D
32 KB
L1P
32 KB
C674x
Core
L2
256 KB
TMS320C674x DSP Roadmap
TMS320C674x DSP core is a low-power, scalable, highly integrated connected device which com-
bines the TMS320C64x+ and TMS320C67x+ DSP cores, and is capable of performing both
fixed- and floating-point operations in a single core.
TMS320C67x DSP Generation, Fixed/Floating Point
Low-Power DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/c6000
Time
300 MHz
60470 mW*
300 MHz
7440 mW*
SATA
USB 2.0 HS PHY
USB 1.1 FS PHY
Up to 448-KB on-chip memory
10/100 Ethernet MAC
mDDR/DDR/SDRAM
Video port (VPIF)
Universal parallel port (uPP)
PWMs
LCD controller
TMS320C674x devices include:
Production
Sampling
In Development
C67x DSP
C64x DSP
C62x DSP
C6747 DSP
C6745 DSP
C6743 DSP
C6748 DSP
C6746 DSP
C6742 DSP
C674x
Future
F
ix
e
d
+
F
lo
a
tin
g
P
o
in
t
300 MHz
60470 mW*
Future
*For typical use case scenarios.
TMS320C6747 Block Diagram
The C6747 is a low-power processor
based on the C674x DSP core. It pro-
vides significantly lower power than
other members of the TMS320C6000
platform of DSPs.
Switch Fabric/EDMA
DSP Subsystem
EMIF1
SDR
PLL
64b Timer
(2)
WD
Timer
uPP
or
Video In
EMIF2
I C (2)
2
SPI (2)
UART (3)
McASP (1)
McBSP (2)
RTC
PWM (2)
GPIO
LCD Ctl
MMC/SD
(2)
USB 2.0
USB 1.1
EMAC
UHPI
SATA
TMS320C6748
128-KB
RAM
L1D
32 KB
L1P
32 KB
C674x
Core
L2
256 KB
TMS320C6748 Block Diagram
The TMS320C6748 DSP provides
unmatched connectivity options with
fixed- and floating-point capabilities.
* Power-use scenario deep sleep: 1.0-V core, idle ARM

DSP clock OFF, all peripherals clock OFF, RTC ON, PLL disabled, 25C.
Power-use scenario active: 70% max load of CPU running at 300 MHz at 1.2 V, mDDR 133 MHz/16 bit accessed 50% of the
time, McBSP, SPI and GPIOs peripherals are active, 25C
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
19

Connectivity, Portability and Low Cost

with TMS320C674x Digital Signal
Processors
The C674x DSP generation provides the
lowest power and a low-cost entry point
into the TMS320C6000 DSP platform.
With pricing starting under U.S. $8 in
1,000-unit quantities and pin-for-pin com-
patibility with the OMAP-L137 processor,
designers are easily able to choose the
right processor to fit their application needs.
The high-precision TMS320CC67x+ DSP
and high-performance TMS320C64x+
cores combine to create this C674x
processor core which enables designers
to develop software using both floating-
and fixed-point instructions in a single
device. Boasting the lowest power of any
floating-point DSP in the industry, the
C674x core eliminates barriers that once
prohibited designers from developing
portable products in the floating-point
environment. For current C67x and
C64x customers, through full code
compatibility with all existing C6000
DSP code, the C674x DSP generation
allows designers to reduce their time to
market through re-use of their code. With
the best of both worlds (floating-point and
fixed-point) in a single core, designers
now have more flexibility than ever.
Increase the Battery Life of
Applications Through TI Process
Technology
Combining industry-leading, cutting-edge
65-nm process technology with low-
leakage transistor technology, C674x DSPs
offer high performance and scalability with
power consumption as low as 7 mW* in
deep sleep mode. The high-performance
and low-power silicon architecture and
power-management software technology
used for C674x DSPs give designers not
only granularity for frequency and voltage,
but also the ability to manipulate the indi-
vidual peripherals to further optimize
power consumption.
Chip-level integration includes, but is not
limited to:
10/100 Ethernet MAC
USB 1.1 Host/2.0 Host/Device/OTG
MMC/SD controllers
Universal parallel port (uPP) for interfac-
ing with FPGAs, high-speed data
converters (C6748 DSP and C6746
DSP only)
Universal Host Port Interface (UHPI) for
interfacing with other processors
LCD controller
Serial ATA Interface (C6748 DSP only)
448-KB on-chip memory
Video port interface (C6748 DSP and
C6746 DSP only)
C674x Core
The TMS320C674x DSP core couples the
high precision and wide dynamic range of
TIs floating-point TMS320C67x+ core
with the higher system performance of TIs
fixed-point TMS320C64x+ core. C674x-
based DSPs are object code compatible
with all TMS320C6000 devices so devel-
opers can easily design a broad range of
energy-efficient products by leveraging
existing software code.
Get Started Quickly
As the C6747, C6745 and C6743 DSPs
are pin-for-pin compatible with the
OMAP-L137 processor, designers can
start today on their C674x development
with the TMDXOSKL137 Starter Kit. This
development kit is priced at U.S. $395
and is available through all standard TI
sales channels. This board includes built-
in emulation and Code Composer
Studio Integrated Development
Environment support. DSP/BIOS operat-
ing system and device drivers and the
associated debugging environment are
also included. For more information on
C674x processors, visit
www.ti.com/c674x.
C674x Videos
Want to hear more about the exciting new
C674x processors? Hear about both the
hardware and software that supports
these platforms here:
www.ti.com/c674x_comm.
* Power-use scenario deep sleep: 1.0-V core, idle ARM

DSP clock OFF, all peripherals clock OFF, RTC ON, PLL
disabled, 25C.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
20

TMS320C67x DSP Generation Floating-Point DSPs

Total
Part Frequency L1P L1D L2 RAM External Voltage (V) Power 1-KU
Number CPU (MHz) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers Serial Ports Misc Core I/O (mW) Packaging Price
1
TMS320C6748ZCE C674x 300 32 K 32 K 256 K 128 K DDR2/mDDR 64 Ch 3 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2/ 1.8/ 442
2
0.65-mm 361-pin 15.20
3
SDRAM 1 GP/WD USB 1.1, SATA 2 MMC/SD, 2 PWMs, 1.1/ 3.3 1313-mm BGA
NAND 1 McASP, 2 McBSP, LCD controller, uHPI, 1.0
NOR 2 SPI, 2 I
2
C, 3 UART 3 eCAP, Video I/O
TMS320C6748ZWT C674x 300 32 K 32 K 256 K 128 K DDR2/mDDR 64 Ch 3 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2/ 1.8/ 442
2
0.8-mm 361-pin 15.20
3
SDRAM 1 GP/WD USB 1.1, SATA 2 MMC/SD, 2 PWMs, 1.1/ 3.3 1616-mm BGA
NAND 1 McASP, 2 McBSP, LCD controller, uHPI, 1.0
NOR 2 SPI, 2 I
2
C, 3 UART 3 eCAP, Video I/O
TMS320C6747ZKB3 C674x 300 32 K 32 K 256 K 128 K SDRAM 32 Ch
5
1 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2 1.8/ 483
6
1.0-mm 256-pin 14.96
4
NAND 1 GP/WD USB 1.1, MMC/SD, 3 PWMs, 3.3 1717-mm BGA
NOR 3 McASP, 2 SPI, LCD controller, uHPI,
2 I
2
C, 3 UART 3 eCAP, 2 eQEP
TMS320C6747ZKB2 C674x 200 32 K 32 K 256 K 128 K SDRAM 32 Ch
5
1 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2 1.8/ 379
7
1.0-mm 256-pin 12.13
4
NAND 1 GP/WD USB 1.1, MMC/SD, 3 PWMs, 3.3 1717-mm BGA
NOR 3 McASP, 2 SPI, LCD controller, uHPI,
2 I
2
C, 3 UART 3 eCAP, 2 eQEP
TMS320C6746ZCE C674x 300 32 K 32 K 256 K DDR2/mDDR 64 Ch 3 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2/ 1.8/ 442
2
0.65-mm 361-pin 13.50
3
SDRAM 1 GP/WD 1 McASP, 2 McBSP, 2 MMC/SD, 2 PWMs, 1.1/ 3.3 1313-mm BGA
NAND 2 SPI, 2 I
2
C, 3 eCAP, uHPI, 1.0
NOR 3 UART Video I/O
TMS320C6746ZWT C674x 300 32 K 32 K 256 K DDR2/mDDR 64 Ch 3 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2/ 1.8/ 442
2
0.8-mm 361-pin 13.50
3
SDRAM 1 GP/WD 1 McASP, 2 McBSP, 2 MMC/SD, 2 PWMs, 1.1/ 3.3 1616-mm BGA
NAND 2 SPI, 2 I
2
C, 3 eCAP, uHPI, 1.0
NOR 3 UART Video I/O
TMS320C6745PTP3 C674x 300 32 K 32 K 256 K SDRAM 32 Ch
5
1 GP, USB 2.0 FS, 10/100 Ethernet MAC, 1.2 1.8/ 483
6
176-pin LQFP 13.02
4
NAND 1 GP/WD 2 McASP, 2 SPI, MMC/SD, 3 PWMs, 3.3 2525 mm
NOR 2 I
2
C, 3 UART 3 eCAP, 2 eQEP
TMS320C6745PTP2 C674x 200 32 K 32 K 256 K SDRAM 32 Ch
5
1 GP, USB 2.0 FS, 10/100 Ethernet MAC, 1.2 1.8/ 379
7
176-pin LQFP 10.78
4
NAND 1 GP/WD 2 McASP, 2 SPI, MMC/SD, 3 PWMs, 3.3 2525 mm
NOR 2 I
2
C, 3 UART 3 eCAP, 2 eQEP
TMS320C6743PTP3 C674x 300 32 K 32 K 128 K SDRAM 32 Ch
5
1 GP, 2 McASP, 1 SPI, 10/100 Ethernet MAC, 1.2 1.8/ 483
6
176-pin LQFP 9.00
4
NAND 1 GP/WD 2 I
2
C, 2 UART MMC/SD, 3 PWMs, 3.3 2525 mm
NOR 3 eCAP, 2 eQEP
TMS320C6743PTP2 C674x 200 32 K 32 K 128 K SDRAM 32 Ch
5
1 GP, 2 McASP, 1 SPI, 10/100 Ethernet MAC, 1.2 1.8/ 379
7
176-pin LQFP 7.85
4
NAND 1 GP/WD 2 I
2
C, 2 UART MMC/SD, 3 PWMs, 3.3 2525 mm
NOR 3 eCAP, 2 eQEP
TMS320C6743ZKB3 C674x 300 32 K 32 K 128 K SDRAM 32 Ch
5
1 GP, 2 McASP, 1 SPI, 10/100 Ethernet MAC, 1.2 1.8/ 483
6
1.0-mm 256-pin 9.00
4
NAND 1 GP/WD 2 I
2
C, 2 UART MMC/SD, 3 PWMs, 3.3 1717-mm BGA
NOR 3 eCAP, 2 eQEP
TMS320C6743ZKB2 C674x 200 32 K 32 K 128 K SDRAM 32 Ch
5
1 GP, 2 McASP, 1 SPI, 10/100 Ethernet MAC, 1.2 1.8/ 379
7
1.0-mm 256-pin 7.85
4
NAND 1 GP/WD 2 I
2
C, 2 UART MMC/SD, 3 PWMs, 3.3 1717-mm BGA
NOR 3 eCAP, 2 eQEP
TMS320C6742ZCE C674x 300 32 K 32 K 64 K DDR2/mDDR 64 Ch 1 GP, 1 McASP, 1 McBSP, 2 PWMs, 1.2 1.8/ 442
2
0.65-mm 361-pin 6.70
3
SDRAM 1 GP/WD 1 SPI, 1 I
2
C, 1 UART 3 eCAP, uHPI 3.3 1313-mm BGA
NAND, NOR
TMS320C6742ZWT C674x 300 32 K 32 K 64 K DDR2/mDDR 64 Ch 1 GP, 1 McASP, 1 McBSP, 2 PWMs, 1.2 1.8/ 442
2
0.8-mm 361-pin 6.70
3
SDRAM 1 GP/WD 1 SPI, 1 I
2
C, 1 UART 3 eCAP, uHPI 3.3 1616-mm BGA
NAND, NOR
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most New devices are listed in red.
current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
70% DSP load (300 MHz), 50% DDR2 EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV
DD
= 1.2 V, @ 25C.
9
Format represents program cache/program or data memory/ROM.
3
TMS pricing will come into effect when the device is fully qualified in 1Q10. TMX pricing will be applied until that time.
10
Extended temperature versions available for C6722, C6726, C6727, C6713, C6711D DSPs.
4
TMS pricing will come into effect when the device is fully qualified in 4Q09. TMX pricing will be applied until that time.
11
Also available in 256-pin BGA, 17-mm (GDH) package.
5
Enhanced DMA.
12
McASP2 DIT only.
6
70% DSP (300 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV
DD
= 1.2 V, @ 25C.
13
The A designation is for industrial temperature range.
7
70% DSP (200 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV
DD
= 1.2 V, @ 25C.
14
Format represents cache memory architecture: [data cache] / [program cache] / [unified cache].
8
RFP and ZDH packages are Pb-Free.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
Continued on the following page.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Silicon
21

TMS320C67x DSP Generation Floating-Point DSPs (Continued)

Total
Part Frequency L1P L1D L2 RAM External Voltage (V) Power 1-KU
Number CPU (MHz) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers Serial Ports Misc Core I/O (mW) Packaging Price
1
TMS320C6727BZDH350
8
C67x+ 350 32 K 256 K 384 K
9
SDRAM dMAX 1 GP 3 McASP, uHPI 1.4 3.3 1400 256-pin 27.13
2 SPI, 2 I
2
C 1717-mm BGA
TMS320C6727BZDH275
8,10
C67x+ 275 32 K 256 K 384 K
9
SDRAM dMAX 1 GP 3 McASP, uHPI 1.2 3.3 962 256-pin 17.53
2 SPI, 2 I
2
C 1717-mm BGA
TMS320C6727BZDHA250
8,11,13
C67x+ 250 32 K 256 K 384 K
9
SDRAM dMAX 1 GP 3 McASP, uHPI 1.2 3.3 909 256-pin 19.85
2 SPI, 2 I
2
C 1717-mm BGA
TMS320C6727BZDH300
8,10,11
C67x+ 300 32 K 256 K 384 K
9
SDRAM dMAX 1 GP 3 McASP, uHPI 1.2 3.3 1041 256-pin 19.85
2 SPI, 2 I
2
C 1717-mm BGA
TMSDC6726BRFPA225
8,10
C67x+ 225 32 K 256 K 384 K
9
SDRAM dMAX 1 GP 3 McASP
12
, 1.2 3.3 778 144 PQFP 14.00
2 SPI, 2 I
2
C 2222 mm
TMS320C6726BRFP266 C67x+ 266 32 K 256 K 384 K
9
SDRAM dMAX 1 GP 3 McASP
12
, 1.2 3.3 943 144-pin PQFP 13.97
2 SPI, 2 I
2
C 2222 mm
TMS320C6722BRFP200
8,10
C67x+ 200 32 K 128 K 384 K
9
SDRAM dMAX 1 GP 2 McASP, 1.2 3.3 750 144-pin PQFP 9.31
2 SPI, 2 I
2
C 2222 mm
TMS320C6722BRFPA225
8,10,13
C67x+ 225 32 K 128 K 384 K
9
SDRAM dMAX 1 GP 2 McASP, 1.2 3.3 803 144-pin PQFP 10.80
2 SPI, 2 I
2
C 2222 mm
TMS320C6722BRFP250
8,10
C67x+ 250 32 K 128 K 384 K
9
SDRAM dMAX 1 GP 2 McASP, 1.2 3.3 857 144-pin PQFP 10.80
2 SPI, 2 I
2
C 2222 mm
TMS320C6720BRFP200
8
C67x+ 200 32 K 64 K 384 K
9
SDRAM dMAX 1 GP 2 McASP, 1.2 3.3 750 144-pin PQFP 6.63
2 SPI, 2 I
2
C 2222 mm
TMS320C6712DGDP150 C67x 150 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP 1.26 3.3 790 272-pin 13.31
2727-mm BGA
TMS320C6711DGDP200 C67x 200 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP HPI/16 1.26 3.3 953 272-pin 14.99
2727-mm BGA
TMS320C6711DZDP200 C67x 200 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP HPI/16 1.26 3.3 953 272-pin 14.99
2727-mm BGA
TMS320C6711DGDP250 C67x 250 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP HPI/16 1.4 3.3 1382 272-pin 16.19
2727-mm BGA
TMS320C6711DZDP250 C67x 250 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP HPI/16 1.4 3.3 1382 272-pin 16.19
2727-mm BGA
TMS320C6711DGDPA167
13
C67x 167 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP HPI/16 1.26 3.3 846 272-pin 18.74
2727-mm BGA
TMS320C6711DZDPA167
13
C67x 167 4 K 4 K 64 K
14
SDRAM 16 ch
5
1 GP 2 McBSP HPI/16 1.26 3.3 846 272-pin 18.74
2727-mm BGA
TMS320C6713BPYP200 C67x 200 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.2 3.3 926 208-pin 17.59
2 McASP, 2 I
2
C 2828-mm TQFP
TMS320C6713BPYPA167
13
C67x 167 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.2 3.3 823 208-pin 17.59
2 McASP, 2 I
2
C 2828-mm TQFP
TMS32C6713BPYPA200 C67x 200 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.2 3.3 926 208-pin 21.03
2 McASP, 2 I
2
C 2828-mm TQFP
TMS320C6713BZDPA200 C67x 200 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.26 3.3 954 208-pin 23.46
2 McASP, 2 I
2
C 2828-mm TQFP
TMS32C6713BGDPA200 C67x 200 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.26 3.3 954 272-pin 23.46
2 McASP, 2 I
2
C 2727-mm BGA
TMS32C6713BGDP225 C67x 225 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.2 3.3 1035 272-pin 23.05
2 McASP, 2 I
2
C 2727-mm BGA
TMS32C6713BGDP300 C67x 300 4 K 4 K 256 K
14
SDRAM 16 ch
5
2 GP 2 McBSP, HPI/16 1.4 3.3 1570 272-pin 30.53
2 McASP, 2 I
2
C 2727-mm BGA
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most New devices are listed in red.
current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
70% DSP load (300 MHz), 50% DDR2 EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV
DD
= 1.2 V, @ 25C.
9
Format represents program cache/program or data memory/ROM.
3
TMS pricing will come into effect when the device is fully qualified in 1Q10. TMX pricing will be applied until that time.
10
Extended temperature versions available for C6722, C6726, C6727, C6713, C6711D DSPs.
4
TMS pricing will come into effect when the device is fully qualified in 4Q09. TMX pricing will be applied until that time.
11
Also available in 256-pin BGA, 17-mm (GDH) package.
5
Enhanced DMA.
12
McASP2 DIT only.
6
70% DSP (300 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV
DD
= 1.2 V, @ 25C.
13
The A designation is for industrial temperature range.
7
70% DSP (200 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV
DD
= 1.2 V, @ 25C.
14
Format represents cache memory architecture: [data cache] / [program cache] / [unified cache].
8
RFP and ZDH packages are Pb-Free.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Tools and Software
22

TMS320C67x DSP Literature and Related Technical Documentation

All documentation and associated literature, users guides, application notes and software can be found by clicking on the specific device
in the parametric table found on the URL below.
TMS320C67x DSP Generation www.ti.com/c67x
TMS320C67x DSP Generation Hardware and Software Development Tools
Description Part Number $U.S.
1
Hardware Development Tools
TMS320C6713 DSP Starter Kit (DSK) TMDSDSK6713 (U.S. part number) 415
TMDSDSK6713-0E (European part number)
OMAP-L137/TMS320C6747 Floating-Point Starter Kit TMDXOSKL137BET 395
Professional Audio Development Kit (PADK) Evaluation Module TMDSPDK6727 1,495
Professional Audio Development Bundle includes PADK + CCStudio IDE and XDS560 USB Emulator TMDXPDB6727 5,995
JTAG Emulators
Spectrum Digital XDS510PP-Plus Emulator TMDSEMUPP (U.S. part number) 1,095
Spectrum Digital XDS510PP-Plus Emulator with European Cords TMDSEMUPP-0E (European part number) 1,095
Spectrum Digital XDS510 USB Emulator TMDSEMUUSB 1,495
Blackhawk XDS560 JTAG PCI Emulator TMDSEMU560PCI 2,995
Blackhawk XDS560 USB High-Performance JTAG Emulator TMDSEMU560U 2,999
Software Development Tools
Code Composer Studio (CCStudio) Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
C6000, C5000, C2000, DaVinci and OMAP processor CCStudio Development Tools Annual Software TMDSSUBALL 600
Subscription for Version 3.10 and higher
Code Composer Studio IDE Free Evaluation Tools SPRC119 (www.ti.com/freetools) Free
Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools
2
TMS320C6000 DSP Chip Support Library SPRC090 Free
TMS320C67x DSP Library SPRC121 Free
TMS320C67x DSP Fast Run-Time Support Library (Fast RTS) SPRC060 Free
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing
information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days.
Please see the features supported by platform matrix on page 59 for more details.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C6000

DSP Platform
Power Management Products
23

Suggested Power Management Solutions for the TMS320C64x/TMS320C67x DSP Generations

Core and I/O Voltages
Synchronous Non-Synchronous Synchronous Non-Synchronous Non-Isolated Isolated Multiple-
Input Output Controller Controller Integrated FET Integrated FET Power Power Output
Voltage Current LDO (External FETs) (External FET and Diode) Converter Converter Module Module Converter
3.3 V 3 A TPS74401 TPS40009 TPS64200 TPS54317 PTH04T260 TPS75003
6 A TPS75901 TPS40009 TPS54610 PTH04T230
5 V 3 A TPS74401 TPS40009 TPS40200 TPS54317 TPS54350 PTH04T260 TPS75003
TPS54386
6 A TPS75901 TPS40009 TPS54610 TPS54550 PTH04T230
12 V 3 A TPS40190 TPS40200 TPS54350 TPS54350 PTH08T260 TPS5124
TPS54386
6 A TPS40190 TPS54550 TPS54550 PTH08T230 TPS5124
24 V 3 A TPS40057 TPS40200 TPS5430* PTN78020* PTB78560* TPS54386
6 A TPS40057 PTB78560*
48 V 3 A TPS40061 TPS40200* PTMA403033*
6 A TPS40061 PTB48560*
*Due to Vout/Vin ratio core voltage may have to be stepped down from 3.3-V I/O.
Power Management Products for the C6000 DSP Platform
Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com
Q1
FDR6674A
1 2 3 6 7
8 5
4
C4
C8 R5
C7
R3
17
R1 R9
TP7
C6
C3
VCC
V
CC
ENA
ENA
V
CC
ON OFF
S1
C9
C13
C10
R6
R7 R5 R17
Open
U2
TPS3808G01
6
5
4
1
2
3
VDD
SNS/NC
CT
RST
GND
MR
C10
R18
R5
R2
DV
DD
DV
DD
DV
DD
DSP_RESET
L1
+
C2
U1
TPS54350PWP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VIN
VIN
UVLO
PWRGD
RT
SYNC
ENA
COMP
BOOT
PH
PH
LSG
VBIAS
PGND
AGND
VSENSE
PwrPd
Q2
FDR6674A
1 2 3 6 7
8 5
4
C16
C11 R16
C12
R15
17
R13 R20
TP8
C10
C14
V
CC
C15
C17
R11
R8 R14 R19
Open
R21
R12
CV
DD
L2
+
C18
U3
TPS54350PWP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VIN
VIN
UVLO
PWRGD
RT
SYNC
ENA
COMP
BOOT
PH
PH
LSG
VBIAS
PGND
AGND
VSENSE
PwrPd
Example C6000 DSP Power Supply Design
For additional power supply designs for TI DSPs, please visit www.ti.com/processorpower.
Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level
power requirements to ensure an adequate power supply design is used.
Texas Instruments 3Q 2009 Embedded Processing Guide
24
Digital Media Processors with DaVinci

Technology
Silicon
Targeted Applications
Automotive infotainment
Automotive video sensing
Automotive vision
Broadcast systems
Cable head-end video equipments
(routers)
Digital camcorders
Digital still cameras
Digital media adapters
Digital photo frames
Digital signage
Digital TV and server head-ends
Digital video recorders
IP network cameras
IP-based video-conferencing
endpoints
IP-based video phones
IP set-top boxes
Hard-copy appliances
Machine vision
Media encoder/decoder appliances
Media gateways
Medical imaging
Network projector
Personal video recorders
Portable media players
Professional-grade video broadcast
equipment
Robotics
Security recording systems
Streaming video appliances
Video broadcast transcoding
Video-conferencing, multi-point con-
ference units (MCUs)/gateways
Video infrastructure
Video jukeboxes
Digital video security recorders
(DVRs)
Video surveillance cameras
Webpads
Wireless cameras
Digital Media Processors with DaVinci Technology
Digital Media Processors
Get samples, data sheets, tools and app reports at: www.ti.com/davinci
Digital Media Processors: Tuned for Digital Video End Equipments
DaVinci Processor CPU MHz Capture/Display
DM335 ARM926 135, 216 Capture/Display
DM355* ARM926** 135, 216, 270 Capture/Display
DM357 ARM926 270 Capture/Display
DM365 ARM926 216, 270, 300 Capture/Display
DM6467

C64x+/ARM926 594, 729 / 297, 364.5 Capture/Display

DM648* C64x+ 720, 800, 900 Capture/Display
DM647* C64x+ 720, 800, 900 Capture/Display
DM6446* C64x+/ARM926 300 / 600 Capture/Display
DM6443 C64x+/ARM926 300 / 600 Display
DM6441* C64x+/ARM926 256 / 512 Capture/Display
DM6437 C64x+ 400, 500, 600, 700 Capture/Display
DM6435 C64x+ 400, 500, 600, 700 Capture
DM6433 C64x+ 400, 500, 600, 700 Display
DM6431 C64x+ 300 Capture
*Includes video imaging coprocessor.
**Includes MPEG-4/JPEG coprocessor.

Includes DaVinci high-definition video/imaging coprocessor.

DM647/8
DM64x
DM64x
DM6467
S
e
g
m
e
n
t
Time
Infrastructure Video
Cable head-end video systems
Multi-channel security DVRs
Professional-grade broadcast-
quality systems
Video-conference MCU/
gateways
Client Video
IP-based video phones
IP set-top boxes
Media encoder/decoder
appliances
Networked PVRs
IP video surveillance
IP video-conferencing
Portable Video
Digital still cameras
Digital camcorders
Gaming
Multimedia jukeboxes
PDAs
Portable medical
DM643x
DM64x+
Next
DM3x+
Next
DM64x+
Next
Production
Future
Device
Sampling
In Development
DM355
DM6441
DM644x
DM648
1.1 GHz
DM6467T
DM Next
DM Next
DM357
DM365
DM647/8
DM6467
DM648
1.1 GHz
DM6467T
Digital Media Processors Roadmap
Digital video customers benefit from TIs DaVinci technology portfolio of digital media processors,
development tools, software and support, enabling them to accelerate development and fuel
innovation.
DaVinci Technology
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon
25

DaVinci technology is a signal processing-

based solution tailored for digital video
applications that provides video equipment
manufacturers with integrated processors,
software, tools and support to simplify the
design process and accelerate innovation.
DaVinci Processors Reduce
System Cost
The portfolio of DaVinci processors con-
sists of scalable, programmable signal-
processing system-on-chips (SoCs), accel-
erators and peripherals, optimized to
match the price, performance and feature
requirements for a broad spectrum of
video end equipments. The DaVinci tech-
nology portfolio includes:
TMS320DM646x digital media
processors DSP-based SoCs specifi-
cally tuned for real-time, multi-format,
HD video transcoding at 10 the per-
formance and 1/10th the price. The
DM6467 consists of an integrated
ARM926EJ-S core, TMS320C64x+
DSP core, High-Definition Video/Imaging
Co-Processors (HD-VICP), video data
conversion engine and targeted video
port interfaces. The DM6467 processor
is specifically designed to address the
HD transcoding challenge for commer-
cial and consumer markets, such as
media gateways, multi-point control
units, digital media adapters, digital
video servers and recorders for the
security market and IP set-top
boxes (STBs).
TMS320DM644x digital media
processors Highly integrated SoCs
based on an ARM926 processor and
the C64x+ DSP core. The
TMS320DM6446, TMS320DM6443
and TMS320DM6441 processors are
ideal for applications and end equip-
ments such as video phones, automo-
tive infotainment and IP STBs.
TMS320DM643x digital media
processors Based on the C64x+
DSP core and priced as low as U.S.
$9.95*. The TMS320DM6437,
TMS320DM6435, TMS320DM6433
and TMS320DM6431 processors are
ideal for cost-sensitive applications and
include special features that make them
suitable for automotive market applica-
tions such as lane departure and
collision avoidance, as well as
machine-vision systems, robotics and
video security.
TMS320DM64x digital media
processors The TMS320DM64x digi-
tal media processors are optimized for
video and include a range of high-
performance and low-cost options. The
TMS320DM64x generation of digital
media processors are fully programmable
and offer industry-leading performance
for the most demanding streaming
multimedia and multi-channel video
security and infrastructure applications,
including digital video recorders (DVRs),
IP video servers, machine-vision sys-
tems and high-performance imaging
applications. In addition, TI offers a wide
range of complementary analog parts,
easy-to-use development tools, exten-
sive video and imaging third-party
algorithms and more.
TMS320DM3x digital media process-
sors Developers can now deliver
cost-effective solutions for crystal clear
video up to HD resolutions, targeted at
both portable and plugged devices. The
DM3x generation features an ARM9
processor, with speeds up to 300 MHz,
some devices with video coprocessing
and bundled codecs to speed develop-
ment efforts, and all with a video-pro-
cessing subsystem adding intelligence
to video processing. The DM3x genera-
tion, including DM335, DM355, DM357
and DM365 processors, is ideal for
camera-driven applications as well as
video-playback devices such as IP
cameras, video doorbells, video confer-
encing, digital signage, portable media
players and more.
DaVinci Technology Overview
*Pricing valid at 10 KU
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon
26

TMS320DM646x Digital Media

Processor
The DM6467 DaVinci processor is a DSP-
based SoC specifically tuned for real-time,
multi-format, high-definition (HD) video
transcoding delivering a 10 performance
improvement over previous-generation
processors to perform simultaneous,
multi-format HD encode, decode and
transcoding up to H.264 HP@L4 (1080p
30 fps, 1080i 60 fps, 720p 60 fps). Key
application areas include media gateways,
multi-point control units, digital media
adapters, digital video servers and
recorders for the security market and IP
set-top boxes (STBs).
L1/ L2/ External Video Ports Program/
Frequency SRAM SRAM ROM Memory (Config- Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA urable) I/F I/F Storage Core I/O Packaging Price
1
TMS320DM6467ZUT C64x+, 594 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 2 McASPs, I
2
C, 32-Bit PCI (33 MHz), Async SRAM, DDR2 1.2 1.8/ 529 BGA 66.82
ARM9 (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, 3 UARTs USB 2.0, PHY, VLYNQ, SDRAM, Smart 3.3 19 19 mm
DaVinci 297 56 K 1 32-/16-Bit (with IrDA and 10/100/1000 EMAC Media / SSFDC/xD,
HD (ARM) (ARM) DDR2 CIR support) (w/ MII, GMII, & MDIO NAND Flash,
Video support), 32-/16-Bit HPI NOR Flash
TMS320DM6467ZUT7 C64x+, 729 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 2 McASPs, I
2
C, 32-Bit PCI (33 MHz), Async SRAM, DDR2 1.2 1.8/ 529 BGA 83.53
ARM9 (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, 3 UARTs USB 2.0, PHY, VLYNQ, SDRAM, Smart 3.3 19 19 mm
DaVinci 364.5 56 K 1 32-/16-Bit (with IrDA and 10/100/1000 EMAC, Media / SSFDC/xD,
HD (ARM) (ARM) DDR2 CIR support) (w/ MII, GMII, & MDIO NAND Flash,
Video support) 32-/16-Bit HPI NOR Flash
TMS320DM6467ZUTA C64x+, 594 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 2 McASPs, I
2
C, 32-Bit PCI (33 MHz), Async SRAM, DDR2 1.2 1.8/ 529 BGA 80.18
ARM9 (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, 3 UARTs USB 2.0, PHY, VLYNQ, SDRAM, Smart 3.3 19 19 mm
DaVinci 297 56 K 1 32-/16-Bit (with IrDA and 10/100/1000 EMAC, Media / SSFDC/xD,
HD (ARM) (ARM) DDR2 CIR support) (w/ MII, GMII, & MDIO NAND Flash,
Video support) 32-/16-Bit HPI NOR Flash
TMS320DM6467ZUTAV C64x+, 594 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 2 McASPs, I
2
C, 32-Bit PCI (33 MHz), Async SRAM, DDR2 1.2/ 1.8/ 529 BGA 80.18
ARM9 (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, 3 UARTs USB 2.0, PHY, VLYNQ, SDRAM, Smart 1.05 3.3 19 19 mm
DaVinci 297 56 K 1 32-/16-Bit (with IrDA and 10/100/1000 EMAC, Media / SSFDC/xD,
HD (ARM) (ARM) DDR2 CIR support) (w/ MII, GMII, & MDIO NAND Flash,
Video support) 32-/16-Bit HPI NOR Flash
TMS320DM6467ZUTD7 C64x+, 729 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 2 McASPs, I
2
C, 32-Bit PCI (33 MHz), Async SRAM, DDR2 1.2 1.8/ 529 BGA 93.55
ARM9 (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, 3 UARTs USB 2.0, PHY, VLYNQ, SDRAM, Smart 1.05 3.3 19 19 mm
DaVinci 364.5 56 K 1 32-/16-Bit (with IrDA and 10/100/1000 EMAC, Media / SSFDC/xD,
HD (ARM) (ARM) DDR2 CIR support) (w/ MII, GMII, & MDIO NAND Flash,
Video support) 32-/16-Bit HPI NOR Flash
TMS320DM6467ZUTV C64x+, 594 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 2 McASPs, I
2
C, 32-Bit PCI (33 MHz), Async SRAM, DDR2 1.2/ 1.8/ 529 BGA 66.82
ARM9 (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, 3 UARTs USB 2.0, PHY, VLYNQ, SDRAM, Smart 1.05 3.3 19 19 mm
DaVinci 297 56 K 1 32-/16-Bit (with IrDA and 10/100/1000 EMAC, Media / SSFDC/xD,
HD (ARM) (ARM) DDR2 CIR support) (w/ MII, GMII, & MDIO NAND Flash,
Video support) 32-/16-Bit HPI NOR Flash
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior
to placing orders. TI may verify final pricing prior to accepting any order.
2
Video port [config. for dual 8-bit SD (BT.565), single 16-bit HD (BT.1120), or single 8-/10-/12-bit raw capture chs]. 1 video port [configured for dual 8-bit SD (BT.565) or single 16-bit HD (BT.1120) display chs],
2 transport stream interface for MPEG transport stream, 1 VDCE for horizontal/vertical downscaling, chroma conversion, edge padding and anti-alias filtering.
ARM
926EJ-S
CPU
364.5 MHz

C64x+
DSP
Core
729 MHz
Video Data
Conversion
Engine
Video
Port
Interfaces
Switched Central Resource
Program/Data
Storage
Serial
Interfaces
System
Control
Standard
Connectivity
High-
Definition
Video/
Imaging
Co-Processors
(HD-VICP)
TMS320DM6467
TMS320DM6467 digital
media processor block
diagram. For more
information, visit
www.ti.com/dm6467.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Tools
27

Development Tools for the TMS320DM646x Processors

Description Part Number $U.S.
1
For Evaluation:
TMS320DM6467 Digital Video Evaluation Module (DVEVM)* TMDSEVM6467 1,995
Code Composer Studio (CCStudio) Integrated Development Environment (IDE)* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
For Production:
Code Composer Studio IDE* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI
prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Free trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet
* Required for digital media software evaluation and/or production
Please see the features supported by platform matrix on page 59 for more details.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon and Tools
28

L1/ L2/ External Program/

Frequency SRAM SRAM ROM Memory Video Ports Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA (Configurable) I/F I/F Storage Core I/O Packaging Price
1
TMS320DM6446AZWT C64x+, 594 112 K 64 K 16 K 1 16-/8-Bit 64 Ch 1 Input, ASP, I
2
C, USB 2.0, Async SRAM, 1.2 1.8/ 361 BGA 35.63
ARM9, (DSP) (DSP) (DSP) (ARM) EMIFA, 1 Output SPI, VLYNQ, DDR2 SDRAM, 3.3 16 16 mm
DaVinci 297 40 K 1 32-/16-Bit 3 UARTs 10/100 EMAC NAND Flash,
Video (ARM) (ARM) DDR2 SmartMedia/xD
TMS320DM6446AZWTA C64x+, 513 112 K 64 K 16 K 1 16-/8-Bit 64 Ch 1 Input, ASP, I
2
C, USB 2.0, Async SRAM, 1.2 1.8/ 361 BGA 35.63
ARM9, (DSP) (DSP) (DSP) (ARM) EMIFA, 1 Output SPI, VLYNQ, DDR2 SDRAM, 3.3 16 16 mm
DaVinci 256.5 40 K 1 32-/16-Bit 3 UARTs 10/100 EMAC NAND Flash,
Video (ARM) (ARM) DDR2 SmartMedia/xD
TMS320DM6443AZWT C64x+, 594 112 K 64 K 16 K 1 16-/8-Bit 64 Ch 1 Output ASP, I
2
C, USB 2.0, Async SRAM, 1.2 1.8/ 361 BGA 30.54
ARM9, (DSP) (DSP) (DSP) (ARM) EMIFA, SPI, VLYNQ, DDR2 SDRAM, 3.3 16 16 mm
DaVinci 297 40 K 1 32-/16-Bit 3 UARTs 10/100 EMAC NAND Flash,
Video (ARM) (ARM) DDR2 SmartMedia/xD
TMS320DM6441AZWT C64x+, 513/405 112 K 64 K 16 K 1 16-/8-Bit 64 Ch 1 Input, ASP, I
2
C, USB 2.0, Async SRAM, 1.2/ 1.8/ 361 BGA 30.35
ARM9, (DSP) (DSP) (DSP) (ARM) EMIFA, 1 Output SPI, VLYNQ, DDR2 SDRAM, 1.05 3.3 16 16 mm
DaVinci 256/202.5 40 K 1 32-/16-Bit 3 UARTs 10/100 EMAC NAND Flash,
Video (ARM) (ARM) DDR2 SmartMedia/xD
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior
to placing orders. TI may verify final pricing prior to accepting any order.
TMS320DM644x digital media processors
are highly integrated SoCs based on an
ARM926 processor and the
TMS320C64x+ DSP core. They are ideal
for applications such as video phones,
automotive infotainment and IP STBs.
Peripherals
ARM926
Subsystem
EDMA
Program/Data Storage
ARM926
926EJ-S
300-MHz
CPU
C64x+
DSP
600-MHz
Core
Switched Central Resource (SCR)
Video-
Imaging
Coprocessor
WD
Timer
System
PWM
3
Timer
2
Connectivity
TMS320DM6446
VLYNQ
Interface
EMAC
with
MDI O
USB
2.0
PHY
Serial Interfaces
ATA/
Compact
Flash
Async EMIF/
NAND/
SmartMedia
MMC/
SD
DDR2
Controller
(16b/32b) SPI
UART
3
CCD Controller
Video Interface
Preview
Histogram/3A
Resizer
On-Screen
Display
(OSD)
Video
Enc
(VENC)
Video Processing Subsystem
Back End
Front End
10b DAC
10b DAC
10b DAC
10b DAC
I C
2
Audio
Serial
Port
DSP
Subsystem
TMS320DM6446 digital media
processor block diagram. For
more information, visit
www.ti.com/dm644x.
TMS320DM644x Digital Media
Processors
Development Tools for TMS320DM644x Processors
Description Part Number $U.S.
1
For Evaluation:
TMS320DM644x Digital Video Evaluation Module (DVEVM)* TMDSEVM6446 (U.S. part number) 2,495
Code Composer Studio (CCStudio) Integrated Development Environment (IDE)* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
For Production:
Code Composer Studio IDE* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI
prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Free trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet
Required for digital media software evaluation and/or production.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon
29

TMS320DM643x Digital Media

Processors
TMS320DM643x digital media processors
are based on the TMS320C64x+ DSP
core. They are ideal for cost-sensitive
digital media applications such as
machine-vision systems, robotics, video
security, video telephony and automotive-
vision applications such as lane departure
and collision avoidance.
L1/ L2/ External Program/
Frequency SRAM SRAM ROM Memory Video Ports Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA (Configurable) I/F I/F Storage Core I/O Packaging Price
1
TMS320DM6431ZWT3 C64x+, 300 64 K 64 K 64 K 1 8-bit 64 Ch 1 Input McASP, I
2
C, 10/100 EMAC Async SRAM, 1.2 1.8/ 361 PBGA 11.25
TMS320DM6431ZWTQ3
2
DaVinci EMIFA, 1 UART, DDR2 SDRAM, 3.3 16 16 mm, 12.38
TMS320DM6431ZDU3 Video 1 16-bit 1 McBSP, NAND Flash 376 BGA 11.25
TMS320DM6431ZDUQ3
2
DDR2 1 HECC 23 23 mm 12.38
TMS320DM6433ZWT4 C64x+, 400 112 K 128 K 64 K 1 8-bit 64 Ch 1 Output McASP, 32-bit PCI, Async SRAM, 1.05/ 1.8/ 361 PBGA 15.28
TMS320DM6433ZWT5 DaVinci 500 EMIFA, 1 McBSP, VLYNQ, DDR2 SDRAM, 1.2 3.3 16 16 mm, 16.20
TMS320DM6433ZWTQ5
2
Video 500 1 16-/32-bit I
2
C, 10/100 EMAC, NAND Flash 18.03
TMS320DM6433ZWT6 600 DDR2 1 UART 16-bit HPI 18.03
TMS320DM6433ZWTQ6
2
660 21.70
TMS320DM6433ZWT7 700 21.70
TMS320DM6433ZWTL 600 21.70
TMS320DM6433ZDU4 400 376 BGA 15.28
TMS320DM6433ZDU5 500 23 23 mm 16.20
TMS320DM6433ZDUQ5
2
500 18.03
TMS320DM6433ZDU6 600 18.03
TMS320DM6433ZDUQ6
2
660 21.70
TMS320DM6433ZDU7 700 21.70
TMS320DM6433ZDUL 600 21.70
TMS320DM6435ZWT4 C64x+, 400 112 K 128 K 64 K 1 8-bit 64 Ch 1 Input McASP, I
2
C, VLYNQ, Async SRAM, 1.05/ 1.8/ 361 PBGA 15.81
TMS320DM6435ZWTQ4
2
DaVinci 400 EMIFA, 1 McBSP, 10/100 EMAC, DDR2 SDRAM, 1.2 3.3 16 16 mm, 16.76
TMS320DM6435ZWT5 Video 500 1 16-/32-bit 2 UARTs, 16-bit HPI NAND Flash 16.76
TMS320DM6435ZWTQ5
2
500 DDR2 1 HECC 18.66
TMS320DM6435ZWT6 600 18.66
TMS320DM6435ZWTQ6
2
660 22.45
TMS320DM6435ZWT7 700 22.45
TMS320DM6435ZWTL 600 22.45
TMS320DM6435ZDU4 400 376 BGA 15.81
TMS320DM6435ZDUQ4
2
400 23 23 mm 16.76
TMS320DM6435ZDU5 500 16.76
TMS320DM6435ZDUQ5
2
500 18.66
TMS320DM6435ZDU6 600 18.66
TMS320DM6435ZDUQ6
2
660 22.45
TMS320DM6435ZDU7 700 22.45
TMS320DM6435ZDUL 600 22.45
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Q designates Q100 automotive reliability.
3
McBSP can be configured as an SPI peripheral.
TMS320DM6437
Video Processing Subsystem
DSP Subsystem
Peripherals
Front End
Connectivity System
Serial Interfaces Program/Data Storage
L1D 80 KB
L2
128 KB
Cache
EDMA
L1P 32 KB
C64x+ DSP
700-MHz
Core
Back End
CCD Controller
Video Interface
Preview
On-Screen
Display
(OSD)
Video
Enc
(VENC)
Resizer
Histogram/3A
Timer
64-bit
2
WD
Timer
PWM
3
PLL
JTAG
DDR
PLL
OSC
PCI
33
HPI
VLYNQ I/F
EMAC
or
or
McBSP 2
UART
2
McASP
I C
2
CAN
DDR2
Controller
(32b)
EMIF
(8b)
or
10b DAC
10b DAC
10b DAC
10b DAC
Switched Central Resource (SCR)
TMS320DM6437 digital media
processor block diagram. For
more information, visit
www.ti.com/dm643x.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon and Tools
30

Development Tools for TMS320DM643x Processors

Description Part Number $U.S.
1
For Evaluation and Production:
TMS320DM6437 Digital Video Development Platform (DVDP)* TMDSVDP6437 495
Code Composer Studio Integrated Development Environment (IDE)* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI
prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Free trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet
* Required for digital media software evaluation and/or production
Please see the features supported by platform matrix on page 59 for more details.
TMS320DM643x Digital Media Processors (Continued)
L1/ L2/ External Program/
Frequency SRAM SRAM ROM Memory Video Ports Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA (Configurable) I/F I/F Storage Core I/O Packaging Price
1
TMS320DM6437ZWT4 C64x+, 400 112 K 128 K 64 K 1 8-bit 64 Ch 1 Input, McASP, I
2
C, 32-bit PCI, Async SRAM, 1.05/ 1.8/ 361 PBGA 20.35
TMS320DM6437ZWTQ4
2
DaVinci 400 EMIFA, 1 Output 1 HECC VLYNQ, DDR2 SDRAM, 1.2 3.3 16 16 mm, 24.00
TMS320DM6437ZWT5 Video 500 1 16-/32-bit 2 McBSPs
3
, 10/100 EMAC, NAND Flash 21.55
TMS320DM6437ZWTQ5
2
500 DDR2 2 UARTs 16-bit HPI 26.50
TMS320DM6437ZWT6 600 24.00
TMS320DM6437ZWTQ6
2
660 31.90
TMS320DM6437ZWT7 700 24.00
TMS320DM6437ZWTL 600 28.85
TMS320DM6437ZDU4 400 376 BGA 20.35
TMS320DM6437ZDUQ4
2
400 23 23 mm 21.55
TMS320DM6437ZDU5 500 21.55
TMS320DM6437ZDUQ5
2
500 24.00
TMS320DM6437ZDU6 600 24.00
TMS320DM6437ZDUQ6
2
660 28.85
TMS320DM6437ZDU7 700 28.85
TMS320DM6437ZDUL 600 28.85
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Q designates Q100 automotive reliability.
3
McBSP can be configured as an SPI peripheral.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon
31

Optimized for multi-channel video security

and infrastructure applications, including
digital video recorders (DVRs), IP video
servers, machine-vision systems and
high-performance imaging applications.
The DM64x digital media processors are
fully programmable and offer industry-
leading performance for the most demand-
ing streaming multimedia applications.
TMS320DM64x Digital Media
Processors
DSP Subsystem
Switched Central Resource
Video
Port
5
Video Acceleration
EDMA 3.0
CC
TC TC TC TC
Peripherals Program/Data Storage System
Timer
64-Bit
2
Serial Interfaces
UHPI
PCI-66
or
L1P 32 KB
L1P 32 KB
L2
512 KB
GEMAC
Gigabit Switch
Connectivity
TMS320DM648
GEMAC
VLYNQ
Interface
DDR2
533
32-Bit
EMIFA
16-Bit
SPI
McASP
10 Ser
UART I C
2
C64x+ DSP
1.1-GHz
Core
TMS320DM648
digital media
processor block
diagram. For more
information, visit
www.ti.com/dm64x.
L1/ L2/ External Program/
Frequency SRAM SRAM ROM Memory EDMA Video Ports Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F (Ch) (Configurable) I/F I/F
2
Storage Core I/O Packaging Price
1
TMS320DM647ZUT7 C64x+, 720 32 K/32 K 256 K 64 K 1 16-/8-bit 64 5 video ports 1 I
2
C, PCI/HPI, Async SRAM, 1.2/ 1.8/ 529 nFBGA 37.05
TMS320DM647ZUT9 DaVinci 900 EMIFA
3
, (each configurable 1 SPI, VLYNQ, DDR2 SDRAM, 1.2 3.3 19 19 mm 46.31
Video 1 32-/16-bit as dual capture, 1 UART, 10/100/1000 NAND Flash,
DDR2 single capture, 1 McASP 3-pt Ethernet NOR Flash
display, TSI Switch Subsys
capture) w/ 1 SGMII Pt
TMS320DM647ZUTD7 720 1.2 44.46
TMS320DM647ZUTD9 900 1.2 53.72
TMS320DM647ZUTA8 800 1.2 46.31
TMS320DM648ZUT7 C64x+, 720 32 K/32 K 512 K 64 K 1 16-/8-bit 64 5 video ports 2 I
2
C, PCI/HPI, Async SRAM, 1.2/ 1.8/ 529 nFBGA 46.35
TMS320DM648ZUT9 DaVinci 900 EMIFA
3
, (each configurable 1 SPI, VLYNQ, DDR2 SDRAM, 1.2 3.3 19 19 mm 57.94
Video 1 32-/16-bit as dual capture, 1 UART, 10/100/1000 NAND Flash,
DDR2 single capture, 1 McASP 3-pt Ethernet NOR Flash
display, TSI 2 TSIP Switch Subsys
capture) w/ 2 SGMII Pts
TMS320DM648ZUTD7 720 1.2 55.62
TMS320DM648ZUTD9 900 1.2 67.21
TMS320DM648ZUTA8 800 1.2 57.94
TMS320DM640AGDK4 C64x, 400 16 K/16 K 128 K 1 32-bit 64 1 8-bit 2 McBSP EMAC
5
SDRAM, SBSRAM, 1.2 3.3 548 BGA, 23 mm 21.88
Video Async SRAM
TMS320DM640AGNZ4 C64x, 400 16 K/16 K 128 K 1 32-bit 64 1 8-bit 2 McBSP EMAC
5
SDRAM, SBSRAM, 1.2 3.3 548 BGA, 27 mm 21.88
Video Async SRAM
TMS320DM641AGDK5 C64x, 500 16 K/16 K 128 K 1 32-bit 64 2 8-bit 2 McBSP HPI/16/EMAC
5
SDRAM, SBSRAM, 1.2 3.3 548 BGA, 23 mm 25.61
Video Async SRAM
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
HPI is selectable, 32-bit or 16-bit.
3
EMIFA does not support SDRAM.
4
The DM642 can be configured to have up to three serial ports in various video/McASP/McBSP combinations.
5
The DM640 has an Ethernet MAC. The DM641 can be configured to have either a 16-bit HPI or Ethernet MAC. The DM643 can be configured to have either a 32-bit HPI or a 16-bit HPI and Ethernet MAC. The
DM642 can be configured to have either a 32-bit PCI or 32-bit HPI or a 16-bit HPI and Ethernet MAC.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
Continued on the following page.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon and Tools
32

L1/ L2/ External Program/

Frequency SRAM SRAM ROM Memory EDMA Video Ports Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F (Ch) (Configurable) I/F I/F
2
Storage Core I/O Packaging Price
1
TMS320DM641AGDK6 C64x, 600 16 K/16 K 128 K 1 32-bit 64 2 8-bit 2 McBSP HPI/16/EMAC
5
SDRAM, SBSRAM, 1.4 3.3 548 BGA, 23 mm 28.17
Video Async SRAM
TMS320DM641AGNZ6 C64x, 600 16 K/16 K 128 K 1 32-bit 64 2 8-bit 2 McBSP HPI/16/EMAC
5
SDRAM, SBSRAM, 1.4 3.3 548 BGA, 27 mm 28.17
Video Async SRAM
TMS320DM643AGDK5 C64x, 500 16 K/16 K 256 K 1 64-bit 64 2 20-bit 1 McBSP HPI 32/EMAC
5
SDRAM, SBSRAM, 1.2 3.3 548 BGA, 23 mm 28.42
Video Async SRAM
TMS320DM643AGNZ5 C64x, 500 16 K/16 K 256 K 1 64-bit 64 2 20-bit 1 McBSP HPI 32/EMAC
5
SDRAM, SBSRAM, 1.2 3.3 548 BGA, 27 mm 28.42
Video Async SRAM
TMS320DM643AGDK6 C64x, 600 16 K/16 K 256 K 1 64-bit 64 2 20-bit 1 McBSP HPI 32/EMAC
5
SDRAM, SBSRAM, 1.4 3.3 548 BGA, 23 mm 30.98
Video Async SRAM
TMS320DM643AGNZ6 C64x, 600 16 K/16 K 256 K 1 64-bit 64 2 20-bit 1 McBSP HPI 32/EMAC
5
SDRAM, SBSRAM, 1.4 3.3 548 BGA, 27 mm 30.98
Video Async SRAM
TMS320DM642AGDK5 C64x, 500 16 K/16 K 256 K 1 64-bit 64 3 20-bit 2
4
McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.2 3.3 548 BGA, 23 mm 33.80
Video EMAC
5
Async SRAM
TMS320DM642AGNZ5 C64x, 500 16 K/16 K 256 K 1 64-bit 64 3 20-bit 2
4
McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.2 3.3 548 BGA, 27 mm 33.80
Video EMAC
5
Async SRAM
TMS320DM642AGDK6 C64x, 600 16 K/16 K 256 K 1 64-bit 64 3 20-bit 2
4
McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 548 BGA, 23 mm 37.18
Video EMAC
5
Async SRAM
TMS320DM642AGNZ6 C64x, 600 16 K/16 K 256 K 1 64-bit 64 3 20-bit 2
4
McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 548 BGA, 27 mm 37.18
Video EMAC
5
Async SRAM
TMS320DM642AGDK7 C64x, 720 16 K/16 K 256 K 1 64-bit 64 3 20-bit 2
4
McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 548 BGA, 23 mm 52.23
Video EMAC
5
Async SRAM
TMS320DM642AGNZ7 C64x, 720 16 K/16 K 256 K 1 64-bit 64 3 20-bit 2
4
McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 548 BGA, 27 mm 52.23
Video EMAC
5
Async SRAM
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red.
the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
HPI is selectable, 32-bit or 16-bit.
3
EMIFA does not support SDRAM.
4
The DM642 can be configured to have up to three serial ports in various video/McASP/McBSP combinations.
5
The DM640 has an Ethernet MAC. The DM641 can be configured to have either a 16-bit HPI or Ethernet MAC. The DM643 can be configured to have either a 32-bit HPI or a 16-bit HPI and Ethernet MAC. The
DM642 can be configured to have either a 32-bit PCI or 32-bit HPI or a 16-bit HPI and Ethernet MAC.
Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.
Development Tools for TMS320DM64x Processors
Description Part Number $U.S.
1
For Evaluation and Production:
TMS320DM642 Digital Media Development Kit (DM642 DMDK) TMDSDMK642 (U.S. part number) 6,495
TMDSDMK642-0E (European part number)
TMS320DM642 Evaluation Module (EVM) TMDSEVM642 (U.S. part number) 1,995
TMDSEVM642-0E (European part number)
TMS320DM648 Digital Video Development Platform (DVDP)* TMDSDVP648 1,295
Code Composer Studio Integrated Development Environment (IDE)* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
XDS560 USB Trace Emulator
3
TMDSEMU560T 9,995
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI
prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Free trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet
3
The XDS560 Trace is designed for use with trace-enabled digital signal processors. Currently the following processors are fully supported by trace: TMS320DM647 and TMS320DM648 processors.
* Required for digital media software evaluation and/or production
Please see the features supported by platform matrix on page 59 for more details.
TMS320DM64x Digital Media Processors (Continued)
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Silicon
33

TMS320DM3x Digital Media

Processors
Peripherals
EDMA Keyscan/ADC
DMA Data & Configuration Bus
WD
Timer
System
PWM
4
Timer
6
Connectivity
TMS320DM365
USB
2.0
HS
OTG
EMAC
10/100
Program/Data Storage
NAND/
ECC
EMIF
MMC/
SDIO
2
mDDR2/
DDR2
EMIF
CCD Controller
Video Interface
Image
Signal
Processing
(ISP)
Histogram/3A
Resizer
Enhanced
On-Screen
Display
(OSD)
Video
Enc
(VENC)
Video Processing Subsystem
Back End
Front End
10b HD/SD DAC
10b HD/SD DAC
10b HD/SD DAC
Serial Interfaces
SPI
3
UART
2
HPI
Voice
Codec
RTC I C
2
ASP
2
ARM
Subsystem

ARM9
CPU
MJCP
Coprocessor
HCP
Coprocessor
MPEG-4
HCP
JPEG
TMS320DM365 digital
media processor block
diagram. For more
information, visit
www.ti.com/dm365.
The TMS320DM3x processors are pow-
ered by an ARM9 core and a video pro-
cessing subsystem (VPSS). The DM335
processor is a low-cost, low-power
processor providing advanced graphical
user interface for display applications that
do not require video compression and
decompression. Optimized for HD video,
the DM355 processor integrates an
MPEG-4/JPEG coprocessor to enable
ultra-low power consumption. The new
DM365 processor includes Image Signal
Processing (ISP), production-ready codec
bundles and integrated peripherals to
provide pixel-perfect 1080p HD video.
L1/ L2/ External Program/
Frequency SRAM SRAM ROM Memory Video Ports Serial Connectivity Data Voltage (V) 1-KU
Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA (Configurable) I/F I/F Storage Core I/O Packaging Price
1
TMX320DM335ZCE135 ARM9, 135 32 K 8 K 1 16-/8-bit 64 Ch 1 Input, 3 SPI, USB 2.0 HS Async SRAM, 1.3 1.8/ 337 BGA 9.05
TMX320DM335ZCE216 DaVinci 216 EMIFA, 1 Output 2 ASP, mDDR/DDR2 3.3 13 13 mm 10.25
Video 1 16-bit 3 UARTs, SDRAM,
mDDR/DDR2 I
2
C OneNAND,
NAND Flash,
SmartMedia/xD
TMX320DM355ZCE216 ARM9, 216 8 K 1 16-/8-bit 64 Ch 1 Input, 3 SPI, USB 2.0 HS Async SRAM, 1.3 1.8/ 329 BGA 13.85
TMX320DM355ZCE270 DaVinci 270 EMIFA, 1 Output 2 ASP, mDDR/DDR2 3.3 13 13 mm 18.55
Video 1 16-bit 3 UARTs, SDRAM,
mDDR/DDR2 I
2
C NAND Flash,
SmartMedia/xD
TMX320DM357ZWT ARM9, 270 8 K 1 16-/8-bit 64 Ch 1 Input, 1 SPI, USB 2.0 HS Async SRAM, 1.2 1.8/ 361 nFBGA 18.30
DaVinci EMIFA, 1 Output 1 ASP, DDR2 SDRAM, 3.3 16 16 mm
Video 1 32-/16-bit 3 UARTs, NAND Flash,
DDR2 1 MMD/SD, SmartMedia/xD
I
2
C
TMX320DM365ZCE270 ARM9, 270 32 K 16 K 1 16-/8-bit 64 Ch 1 Input, 5 SPI, USB 2.0 HS, Async SRAM, 1.2/ 1.8/ 338 BGA 19.25
TMX320DM365ZCE300 DaVinci 300 EMIFA, 3 Outputs 2 ASP, EMAC mDDR/DDR2 1.35 3.3 13 13 mm 25.05
Video 1 16-bit 2 UARTs, SDRAM,
mDDR/DDR2 2 SD MMC, OneNAND,
I
2
C NAND Flash,
SmartMedia/xD
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and New devices are listed in red.
complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Tools
34

Development Tools for TMS320DM3x Processors

Description Part Number $U.S.
1
For Evaluation:
TMS320DM355 Digital Video Evaluation Module (DVEVM)* TMDXEVM355 495
TMS320DM357 Digital Video Evaluation Module (DVEVM) TMDXEVM357 895
TMS320DM365 Digital Video Evaluation Module (DVEVM) TMDXEVM365 595
Code Composer Studio (CCStudio) Integrated Development Environment (IDE)* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
For Production:
Code Composer Studio IDE* TMDSCCSALL-1 3,595
2
Blackhawk XDS560 JTAG PCI Emulator (optional) TMDSEMU560PCI 2,995
Blackhawk XDS560 JTAG USB Emulator (optional) TMDSEMU560U 2,999
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and New tools are listed in red.
complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Free trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet
* Required for digital media software evaluation and/or production
Please see the features supported by platform matrix on page 59 for more details.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Software/Resources
35

Developers can get started today with

DaVinci technology-based software and
development tools tailored to simplify
design in video applications, including:
Digital Video Evaluation Module
(DVEVM) DVEVMs are comprised of
both hardware and software, and enable
developers to start instantaneous evalu-
ation of DaVinci processors. DVEVMs
come complete with a demo version of
MontaVista Linux Pro 4.0, drivers, Codec
Engine, evaluation codecs and an eval-
uation board. While customers develop-
ing on an ARM926 processor can go
into production with a DVEVM, it is not
recommended or supported by TI.
Customers developing on a DSP will
require a DVSPB (see description
below) in order to go into production.
Available DVEVMs:
TMS320DM365 DVEVM
(part number TMDXEVM365)
TMS320DM357 DVEVM
(part number TMDXEVM357)
TMS320DM355 DVEVM
(part number TMDXEVM355)
TMS320DM6467 DVEVM
(part number TMDSEVM6467)
TMS320DM6446 DVEVM
(part number TMDSEVM6446)
Digital Video Development Platform
(DVDP) A DVDP enables immediate
evaluation of DSP-based DaVinci tech-
nology digital media processors. DVDPs
include DSP/BIOS production-ready
kernel, drivers, Codec Engine, evalua-
tion codecs, Code Composer Studio IDE
and an evaluation board. A DVDP
provides developers with a comprehen-
sive platform that can be used through-
out the entire design process. A DVDP
is recommended for TMS320DM6437
and TMS320DM648 processors
customers only. Available DVDPs:
TMS320DM6437 DVDP
(part number TMDSVDP6437)
TMS320DM648 DVDP
(part number TMDSDVP648)
For a complete list of DaVinci develop-
ment tools, see page 119. Or for more
information on DaVinci technology
DVEVMs, DVSPBs and DVDPs, please visit
www.ti.com/davincitools.
eXpressDSP Digital Media Software
Simplifies Development and Reduces
Design Time
eXpressDSP Digital Media Software
To simplify development and reduce cost
in your digital media application, a com-
plete portfolio of eXpressDSP-compliant
digital media software is now widely avail-
able. TI digital media software is:
Production tested for easy integration
into audio, video and voice applications
Optimized to support DaVinci technology-
based digital media processors
Designed to meet the needs of engi-
neers by allowing them to focus on
product differentiation instead of codec
development
Available via free 60-day evaluation
with multiple licensing options
Fully supported by Authorized Software
Providers that give customized technical
support
Customized Technical Support for
eXpressDSP Digital Media Software
Provided by Authorized Software
Providers (ASPs)
To ensure extensive and qualified support,
TI has established a worldwide network of
ASPs that offer support for TI-enabled IP
and customized software and engineering
services. ASPs provide four hours of free
Complete System Tools Get You to Market Faster
Digital Media Software Inventory*
Target Hardware
Codecs TMD320DM646x TMD320DM644x TMD320DM643x TMD320DM648 TMD320DM3x OMAP35x
Video & Imaging
H.264 Video Decoder
H.264 Video Encoder
VICP
JPEG Imaging Decoder
JPEG Imaging Encoder
MPEG-2 Video Decoder
MPEG-2 Video Encoder
MPEG-4 Video Decoder
MPEG-4 Video Encoder
VC1 Video Decoder
Audio
AAC Audio Decoder
AAC Audio Encoder
AC-3 Audio Decoder
MP3 Audio Decoder
MP3 Audio Encoder
WMA Audio Decoder/
Encoder
Voice
G.711 Decoder/Encoder Open Source
G.726 Decoder/Encoder
G.723.1 Decoder/Encoder
G.729 Decoder/Encoder
Other
Network Developer Kit Open Source
(NDK)
* Evaluate at no charge for 60 days with a simple click-wrap license.
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Software/Resources
36

support during the free 60-day evaluation

stage and up to 40 hours during
application development.
For more information on ASPs, please visit
www.ti.com/asp.
Code Composer Studio Integrated
Development Environment
The Code Composer Studio (CCStudio) IDE
offers robust, mature core functions with
easy-to-use configuration and graphical
visualization tools for faster system design.
The CCStudio IDE integrates everything
programmers need for application
development from start to finish. The
CCStudio Platinum Edition (version 3.3)
simplifies this process by offering a fully
merged IDE that supports the DaVinci
processor platform as well as other TI
DSP platforms. Free 120-day evaluation
tools that include the CCStudio IDE are
available.
For more information on the Code Compo-
ser Studio IDE, visit www.ti.com/ccstudio.
VICP Signal Processing Library
Improves Performance Capabilities
Texas Instruments VICP signal processing
library is a collection of highly tuned soft-
ware algorithms that execute on the VICP
hardware accelerator. The library allows
the application developer to effectively uti-
lize the VICP performance without spend-
ing significant time in developing software
for the accelerator. The availability of
well-tested, performance-tuned algorithms
with the VICP signal processing library sig-
nificantly reduces the application develop-
ment time. The freed-up MIPS on the DSP
enable the application developers to
include more differentiation features in the
final application.
The VICP hardware accelerator is a paral-
lel MAC engine. Due to its flexible archi-
tecture, the accelerator is very effective in
enhancing DSP performance by taking
over execution of varied computationally
intensive tasks.
VICP supports various algorithms to
enable additional DSP resource:
Matrix operations/array operations:
Ex: Matrix multiplication/transpose.
Block add/average/variance
Ex: Array multiplication/addition/
fillmem. Array scalar operations
Ex: Look-up table
Digital signal processing operations:
Ex: 1D, 2D FIR filtering
Ex: Convolution, correlation
Digital image and video processing
functions:
Ex: Alpha blending, color space
conversion
Ex: Image rotation, image pack/unpack
Ex: Median filtering
www.ti.com/vicp.
VLIB 2.0: Video Analytics & Vision
Library
TIs Video Analytics & Vision Library (VLIB)
is a collection of software kernels that are
commonly used in automotive-vision and
video-security applications. The kernels
are optimized for both C64x and
C64x+ DSP cores and can accelerate
software development and enable per-
formance improvements up to 10 over
standard C code on TIs DSPs. The VLIB
2.0 now consists of 50+ royalty-free soft-
ware kernels including background model-
ing and subtraction, object feature extrac-
tion, tracking, recognition and low-level
pixel processing as well as Simulink
blocks for each function and the bit-exact
version for PC testing capabilities.
www.ti.com/vlib.
Complete System Tools Get You to Market Faster (Continued)
Valued members of TIs Developer Network
provide integral components and tools that
complement DaVinci technology.
Developers offer various levels of video
system integration, optimization and system
expertise on DaVinci products worldwide.
For a complete list of developers support-
ing DaVinci technology, please visit
the TI Developer Network catalog at
www.ti.com/davincidevelopernetwork.
A Comprehensive Developer Network Makes DaVinci Technology Easy to Implement
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
Resources
37

A Variety of Resources Keep You in the Know

DaVinci Technology Webcasts
View the archive of TI on-demand DaVinci
webcasts to learn how to accelerate and
simplify your video system design.
Designed for 24/7 access, these webcasts
typically last one hour.
Visit www.ti.com/davinciwebcasts.
DaVinci Video Casts: Engineering in
Front of the Camera
Whether you have two minutes or two
hours, a variety of DaVinci technology
videos are available for on-demand view-
ing. These four-minute videos provide
engineers the technical meat on the
TMS320DM355 and TMS320DM6467
DaVinci processor products, tools and
software. Check out the line-up at
www.ti.com/dm355videocasts or
www.ti.com/dm6467videocasts.
DaVinci Technology Training
Get hands-on experience on DaVinci
technology through online training, one-
day and multi-day workshops. Check
www.ti.com/davincitraining for the next
workshop near you, as well as 24/7 online
training and webcasts.
Introduction to DaVinci Technology
Online Training
www.ti.com/davinciolt.
DM6467 DaVinci Processor for HD
Transcoding
www.ti.com/dm6467olt.
DaVinci Technical Seminar
www.ti.com/davinciseminar.
TMS320DM6437 One-Day Workshop
www.ti.com/dm6437odw.
TMS320DM644x Multi-Day Workshop
www.ti.com/dm644xmdw.
DaVinci White Papers and Articles
Download the variety of DaVinci white
papers and articles to see the possibilities
for designing and developing digital video
and audio end equipment devices and
applications using DaVinci technology. Visit
www.ti.com/davinciwhitepaper.
DaVinci Technology FAQs
Have questions about DaVinci technology?
Browse the DaVinci questions and
answers to find out everything you need to
know about DaVinci processors, develop-
ment tools, applications frameworks, train-
ing and support at
www.ti.com/davincifaq.
Delve Into Digital Video with Video360
Podcasts
The Video360 podcasts feature industry
news, technology updates and practical
tips regarding the latest innovations in
digital video. Check out the archive at
www.ti.com/davincipodcast.
Additional Web Links and Community
Resources
gstreamer.ti.com Here engineers
can find open source files related to
DaVinci and join the DaVinci Linux Open
Source mailing list for discussions.
www.ti.com/davinciwikidsg The
Embedded Processors Wiki provides a
collaborative environment for digital
media engineers using Texas
Instruments processors to share techni-
cal tips and open source code. The Wiki
is designed to get you to market faster
by shortening the design knowledge
ramp, assist other developers innovate
and foster a growth of technology
knowledge on hardware and software.
www.ti.com/dspdesignsupport
DSP Design Support provides quick
access to all technical documentation,
tools and software details all from
one page.
DaVinci Technology Literature and Related Technical Documentation
All documentation and associated literature, users guides, application notes and software can be found by clicking on the specific device
in the parametric table found on the URLs below.
TMS320DM3x DSP Generation www.ti.com/dm3x
TMS320DM64x DSP Generation www.ti.com/dm64x
TMS320DM643x DSP Generation www.ti.com/dm643x
TMS320DM644x DSP Generation www.ti.com/dm644x
TMS320DM646x DSP Generation www.ti.com/dm646x
Texas Instruments 3Q 2009 Embedded Processing Guide
Digital Media Processors with DaVinci

Technology
High-Performance Analog and Logic Products
38

TI provides engineers with high-

performance signal chain, interface, clock-
ing and power management solutions to
complete digital video applications based
on DaVinci technology. The following block
diagram represents a few of the many
high-performance analog and logic prod-
ucts that help maximize the performance
and functionality of your application.
Compatible Analog Products for DaVinci-Based Digital Video Applications
I C
2
Power Management*
* Please reference page 120 for Power Management products.
TCA6408A
I C I/O Expander
2
TCA6507
LED Driver
TVP5146M2
Video Decoder
SN75LVDT1422
Serdes for SMCD
TI RS-232 Xceiver
TUSB6020
USB 2.0 High-Speed
LEDs
Serial Port
USB 2.0 High-Speed
Host/Peripheral/OTG
Microphone
PC
Speakers
Smart Media/
xD Card
Processor
Interface
Amplifier
Logic
Power
ADC/DAC
Audio
Video/Imaging
LEGEND
Compact-
Flash
Card
ATA Card
GPIOs
Analog Video
2 SN74AVC1T45
1-Bit Level Translator
PLL1705
Clock Generator
TLV320AIC33
Stereo Codec
OPA361
Video Amplifier
SN74AVC16T245
16-Bit Level Translator
SN74LV4320A
CompactFlash Xceiver
SN74AVC32T245
32-Bit Level Translator
SN74AVCA406
SMC/xD Level Translator
DM644x
DM643x
DaVinci
Digital
Media
Processors
UART
VLYNQ
PWMO
ASP
Video Out
Image In
EMIF
TPA2010D1 (Mono) or
TPA2012D2 (Stereo)
Class-D Audio Amplifier
TI offers a broad range of compatible Analog products to complement the Digital Video Evaluation Module (DVEVM).
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Silicon
39

Applications
Portable media players (PMPs)
Portable navigation devices (PNDs)
Advanced portable consumer
electronics
Digital video cameras
Portable data collection
Point of sale (POS)
Gaming
Web tablets
Medical
Smart white goods
Smart home controllers
Low-cost PCs
And more.
Key Features
Highest-performance ARM

core
Up to 600-MHz Cortex-A8 with
256-KB L2 cache
Low power
Clock gating and integrated sleep
modes reduce power without loss
of performance
SmartReflex technology and
dynamic voltage frequency scaling
Scalable roadmap for enhanced
graphics and video
Cortex-A8 core and multimedia
rich peripherals: USB 2.0, UART,
MMC/SD, display, camera interface
POWERVR SGX graphics
accelerator with software library
for 3-D graphics
TMS320C64x+ DSP and hard-
ware video accelerator with
DaVinci software
OMAP35x Platform
System-Level Applications Processors
Get samples, data sheets, tools and app reports at: www.ti.com/omap35x
OMAP35x application processors are based on the ARM

Cortex-A8 core with more than four

times the processing power of todays 300-MHz ARM9 devices, the superscalar 600-MHz Cortex-A8
core is integrated into four new OMAP35x applications processors.
ARM
Cortex -A8
CPU

L3/L4 Interconnect
Peripherals
Program/Data Storage
System
I C
3
2
Serial Interfaces
Connectivity
USB
Host
Controller 2
USB 2.0 HS
OTG
Controller
MMC/
SD/
SDIO
3
GPMC
SDRC
UART
2
HDQ/1-wire
UART
w/IrDA
McBSP
5
McSPI
4
Timers
GP 12
WDT 2
POWERVR SGX
Graphics Accelerator
(3515/3530 only)
10-bit DAC Video
Enc
Display Subsystem
10-bit DAC
LCD
Cont-
roller
Parallel I/F
Image
Pipe
Camera I/F
C64x+ DSP and
Video Accelerators
(3525/3530 only)
The OMAP applications processors platform delivers a variety of high-performance applications
processors with fast, portable power and a robust support network with a software portfolio that
includes open source. The complete platform allows for differentiation and rapid development of
applications from multimedia-enhanced devices to general-purpose computer applications that
require Linux or Windows

CE class operating systems.

P
e
r
f
o
r
m
a
n
c
e
Time
600-MHz ARM
Cortex-A8
600-MHz Cortex-A8
C64x+ DSP
Video accelerator
POWERVR SGX graphics
ARM

OMAP
Next
Production
Sampling
In Development
Future
Device
OMAP3530
OMAP3525
Cortex-A
8
OMAP3503
OMAP35x
OMAP35x
600-MHz Cortex-A8
C64x+ DSP
Video accelerator
ARM
600-MHz ARM Cortex-A8
POWERVR SGX graphics
EMAC
USB PHY
3.3-V I/O
DDR2
CAN
3-D graphics
EMAC
USB PHY
3.3-V I/O
DDR2
CAN
OMAP3515
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Silicon and Support
40

OMAP Processors Turn Everyday

Products into New Ways to Work,
Socialize and Entertain
Targeting applications such as portable
navigation devices, Internet appliances,
portable media players and personal med-
ical equipment, TIs new scalable OMAP
platform offers four distinct single-chip
processors with a variety of combinations
of the Cortex-A8 core, multimedia rich
peripherals, POWERVR SGX graphics
accelerator and DaVinci technology for
applications wanting to incorporate video.
The OMAP35x applications processors are
pin-for-pin compatible to make it easy for
OEMs to efficiently create a complete
product portfolio based on the single
platform.
Complete Hardware, Software and
Tools Solution
The modular and extensible OMAP35x
Evaluation Module (EVM) provides all the
components needed to begin developing
today on the OMAP35x platform. This EVM
includes a complementary, integrated
power management and analog solution
specifically for OMAP. The modular design
allows you to easily upgrade to future
devices. Included with the EVM is the
OMAP35x Linux board support package
(BSP). The Windows

CE BSP is available
for download from TI and open source
software is available for the OMAP platform.
OMAP35x Evaluation Module (EVM)
available today
Hardware:
OMAP35x processor
128-MB LPDDR
128-MB NAND Flash
Touchscreen LCD display with
landscape/portrait modes
Expansion connector provides flex-
ible interface capability
Emulator support: TI XDS560
Software
OMAP35x Linux BSP:
Peripheral drivers
U-boot for boot loading
Busybox-based root file system
Open source development tools
Reference schematics
Connectivity
Daughter card connectivity
Ethernet, USB 2.0, SDIO, I
2
C, JTAG,
keypad
SD/MMC and DDR
S-Video output via NTSC/PAL and
YPbPr/RGB
www.ti.com/omap35x.
Developer Network Support
Additional applications expertise and sup-
port is available from over 400 members
of the OMAP Developer Network to help
customers take their designs from con-
cept to production as quickly as possible.
www.ti.com/omap35x.
Online Training
Get an inside technical look at the new
OMAP35x processor hardware and soft-
ware. Gain an internal perspective of the
possibilities suited for this uniquely com-
pelling generation of OMAP processors.
www.ti.com/omap35x.
Webcasts
Learn more about TIs OMAP35x proces-
sors that combine high performance and
low power for automotive infotainment,
consumer, medical, industrial and embed-
ded applications.
www.ti.com/omap35x.
OMAP35x Platform
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Silicon and Tools
41

OMAP35x Applications Processors

Part Frequency L1P L1D L2 RAM ROM External Voltage (V) 1-KU
Number CPU Graphics (MHz) (Bytes) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers Serial Ports Misc Core I/O Packaging Price
1
OMAP3530 ARM POWERVR 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, HW video 1.35 1.8
2
0.4-mm PoP, 515-pin 41.70
Cortex-A8, SGX NOR, NAND, 2 WDT 3 I
2
C, 1 HS USB 2.0 accelerator, PBGA (1212 mm),
C64x+ 430 32 K 32 K + 64 K + 64 K oneNAND, 64 Ch OTG, 1 HS USB NEON coprocessor, 0.5-mm PoP, 515-pin
48 K 32 K SRAM Host (3 port), LCD, TV out, PBGA (1414 mm),
SRAM SRAM 1 HDQ/1-Wire, Camera I/F, MMU, 0.65-mm, 423-pin
3 UART 3 MMC/SD/SDIO, PBGA (1616 mm)
(1 IrDA+CSI) 196 GPIO (shared)
OMAP3525 ARM 600 32 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, HW video 1.35 1.8
2
0.4-mm PoP, 515-pin 37.50
Cortex-A8, NOR, NAND, 2 WDT 3 I
2
C, 1 HS USB 2.0 accelerator, PBGA (1212 mm),
C64x+ 430 32 K 32 K + 64 K + 64 K oneNAND, 64 Ch OTG, 1 HS USB NEON coprocessor, 0.5-mm PoP, 515-pin
48 K 32 K SRAM Host (3 port), LCD, TV out, PBGA (1414 mm),
SRAM SRAM 1 HDQ/1-Wire, Camera I/F, MMU, 0.65-mm, 423-pin
3 UART 3 MMC/SD/SDIO, PBGA (1616 mm)
(1 IrDA+CSI) 196 GPIO (shared)
OMAP3515 ARM POWERVR 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, NEON coprocessor, 1.35 1.8
2
0.4-mm PoP, 515-pin 33.85
Cortex-A8 SGX NOR, NAND, 2 WDT 3 I
2
C, 1 HS USB 2.0 LCD, TV out, PBGA (1212 mm),
oneNAND, OTG, 1 HS USB Camera I/F, MMU, 0.5-mm PoP, 515-pin
SRAM Host (3 port), 3 MMC/SD/SDIO, PBGA (1414 mm),
1 HDQ/1-Wire, 196 GPIO (shared) 0.65-mm, 423-pin
3 UART PBGA (1616 mm)
(1 IrDA+CSI)
OMAP3503 ARM 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, NEON coprocessor, 1.35 1.8
2
0.4-mm PoP, 515-pin 22.55
Cortex-A8 NOR, NAND, 2 WDT 3 I
2
C, 1 HS USB 2.0 LCD, TV out, PBGA (1212 mm),
oneNAND, OTG, 1 HS USB Camera I/F, MMU, 0.5-mm PoP, 515-pin
SRAM Host (3 port), 3 MMC/SD/SDIO, PBGA (1414 mm),
1 HDQ/1-Wire, 196 GPIO (shared) 0.65 mm, 423-pin
3 UART PBGA (1616 mm)
(1 IrDA+CSI)
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the New devices are listed in red.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
MMC1 is 3.0 V.
OMAP35x Applications Processor Hardware and Software Development Tools
Description Part # $U.S.
1
Evaluation Module (EVM)
OMAP35x EVM TMDSEVM3530 (U.S. part number) 1,499
JTAG Emulators
XDS560 PCI-Based High-Performance JTAG Emulator TMDSEMU560 3,995
XDS560 Blackhawk USB High-Performance JTAG Emulator TMDSEMU560U (U.S. part number) 2,995
TMDSEMU560U-0E (European part number)
XDS510PP-Plus Parallel Port Emulator for Windows

TMDSEMUPP (U.S. part number) 1,500

TMDSEMUPP-0E (European part number)
XDS510 USB-Based Emulator for Windows TMDSEMUUSB 1,995
Software Development Tools
Code Composer Studio Platinum Edition v3.3 Development Tools Bundled with Annual Software Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
C6000, C5000, OMAP, DaVinci, C2000 DSP Code Composer Studio Development Tools Annual Software TMDSSUBALL 600
Subscription for Version 3.1 and higher
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing
information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
Please see the features supported by platform matrix on page 59 for more details.
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Silicon
42

Applications
Software-Defined Radio (SDR)
Power protection systems
Programmable automation controller
(PAC)
Industrial automation
Industrial control
Test and measurement equipment
Audio (digital mixers, teleconference
systems)
Portable data terminals
Barcode scanners
And more
Key Features
Integrate feature-rich GUIs into
portable designs
Networking simplified with advanced
peripherals including 10/100
Ethernet MAC, USB 2.0 HS OTG,
SATA
Operating system flexibility with
Linux, WinCE, VxWorks or
DSP/BIOS real-time kernel
Scalable architecture; pin-for-pin
compatible with select devices in
the TMS320C674x DSP generation
Low power consumption ranging
from 7 mW* deep-sleep power to
452 mW

total power
Smaller, ergonomic products with
1313-mm packaging
* Power-use scenario deep sleep: 1.0-V core, idle
ARM

DSP clock OFF, all peripherals clock OFF, RTC

ON, PLL disabled, 25C
Power-use scenario active: 70% max load of the
DSP running at 300 MHz at 1.2 V, ARM running at
300 MHz doing typical activity (peripheral configura-
tions, other housekeeping activities); mDDR 133 MHz/
16 bit accessed 50% of the time, McBSP, SPI and
GPIOs peripherals are active, 25C
OMAP-L1x Platform
System-Level Applications Processors
Get samples, data sheets, tools and app reports at: www.omap.com
OMAP-L1x Block Diagram
Providing developers with increased connectivity at a low cost and low power levels, the new
OMAP-L1x product line includes ARM9 and ARM9-plus-DSP architectures. These new devices will
support various high-level operating systems including Linux, WinCE, VxWorks and DSP/BIOS
real-time kernel.
ARM9
Subsystem
Switched Central Resource (SCR) / EDMA
Peripherals
mDDR/
DDR2/
SDRAM
16-bit
Program/Data Storage
I C
(2)
2
Serial Interfaces
Connectivity
WD
Timer
System
PWM
SATA
(L1x8
only)
UHPI
USB 2.0
HS
UART
(3)
McASP
SPI
(2)
MMC/SD
(2)
Video Port
Interface (VPIF)
(L1x8 only)
USB 1.1 EMAC
Async
EMIF
16-bit
LCD
Controller
Universal Parallel
Port (UPP)
(L1x8 only)
McBSP
(L1x8
only)
DSP
Subsystem
C674x DSP
Core
(L137/L138
only)
ARM
926EJ-S
CPU
OMAP-L1x Applications Processors
The OMAP-L1x roadmap offers a variety of scalable architectures including the flexible ARM926EJS
processor, extensive connectivity peripherals and a unique TMS320C674x DSP core, which
combines the TMS320C67x+ and TMS320C64x+ DSP cores, and is capable of performing both
floating- and fixed-point operations in a single core.
I
n
t
e
g
r
a
t
i
o
n
Time
300-MHz
300-MHz
ARM926
C674x DSP
(C67x+/C64x+) DSP
300-MHz
300-MHz
ARM926
C674x DSP
(C67x+/C64x+) DSP
USB 2.0 HS PHY
Ethernet MAC
SDRAM
OMAP-L1x8 devices include:
SATA
mDDR/DDR2/SDRAM
Video Port Interface (VPIF)
McASP, McBSP
10/100 Ethernet MAC
USB 2.0 HS PHY
USB 1.1 FS PHY
Universal parallel port (UPP)
LCD controller

OMAP-L1x
Future
OMAP-L137
OMAP-L138
A
R
M
9
2
6
Sampling
In Development
Future
Device
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Silicon
43

Connectivity, Portability and General-

Purpose Processing Made Easy with
OMAP-L1x Applications Processors
Enabling developers to integrate feature-
rich GUIs into their portable designs, the
OMAP-L1x generation of applications
processors include a variety of scalable
ARM9 and ARM9-plus-DSP architectures.
With pricing starting under U.S. $7 in
1-KU quantities and pin-for-pin compati-
bility with select devices in the
TMS320C674x DSP generation, designers
are easily able to choose the right
processor to fit their application needs.
The high-precision TMS320C67x+ and
high-performance TMS320C64x+ DSP
cores combine to create the C674x
processor core which enables designers
to develop software using both fixed- and
floating-point instructions in a single
device. Boasting the lowest power of any
floating-point DSP in the industry, the
C674x core utilized in the OMAP-L1x
eliminates barriers that once prohibited
designers from developing in the floating-
point environment. With the best of both
worlds (fixed-point and floating-point) in a
single core, designers now have more
flexibility than ever.
Increase the Battery Life of
Applications Through TI
Process Technology
Combining industry-leading, cutting-edge
65-nm process technology with low-
leakage transistor technology, OMAP-L1x
processors offer high performance and
scalability with power consumption as low
as 7 mW* in deep sleep mode. The high-
performance and low-power silicon archi-
tecture and power-management software
technology used for OMAP-L1x processors
give designers not only granularity for fre-
quency and voltage, but also the ability to
manipulate the individual peripherals to
further optimize power consumption.
Chip-level integration includes, but is not
limited to:
10/100 EMAC
USB 1.1 Host/2.0 Host/Device/OTG
MMC/SD controllers
Universal parallel port (uPP) for interfac-
ing with FPGAs, high-speed data
converters
Universal Host Port Interface (UHPI) for
interfacing with other processors
LCD controller
Serial ATA Interface (OMAP-L1x8 only)
448-KB on-chip memory
Video port interface (OMAP-L1x8 only)
Get Started Quickly
To get started quickly, designers can
purchase OMAP-L1x development kits.
Get started today with the OMAP-L137/
TMS320C6747 Floating-Point Starter Kit.
Development kits vary in price and capa-
bility depending on the customer needs.
Most include built-in emulation and Code
Composer Studio Integrated
Development Environment support. All kits
contain Linux board-support packages,
Codec Engine, DSP/BIOS kernel and
device driver and the associated debug-
ging environment. For more information
on OMAP-L1x processors, visit
www.ti.com/omapl1x.
OMAP-L1x Videos
Want to hear more about the exciting new
OMAP-L1x applications processors? Hear
about both the hardware and software
that supports these platforms here:
www.ti.com/omapl1x_comm.
OMAP-L1x Platform
* Power-use scenario deep sleep: 1.0-V core, idle ARM

DSP clock OFF, all peripherals clock OFF, RTC ON, PLL
disabled, 25C.
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Silicon and Tools
44

OMAP-L1x Applications Processor Hardware and Software Development Tools

Description Part # $U.S.
1
Hardware Development Tool
OMAP-L137/TMS320C6747 Floating-Point Starter Kit TMDXOSKL137BET 395
JTAG Emulators
XDS510PP-Plus Parallel Port Emulator for Windows

TMDSEMUPP (U.S. part number) 1,500

TMDSEMUPP-0E (European part number)
XDS510 USB-Based Emulator for Windows TMDSEMUUSB 1,995
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the New tools are shown in red.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
Please see the features supported by platform matrix on page 59 for more details.
OMAP-L1x Applications Processors
Part Frequency L1P L1D L2 RAM External Voltage (V) 1-KU
Number CPU (MHz) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers Serial Ports Misc Core I/O Packaging Price
1
OMAP-L137 ARM926EJS, 300 16 K 16 K 128 K SDRAM, 32 Ch 1 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.2 1.8/3.3 1.0-mm 256-pin 16.35
C674x 300 32 K 32 K 256 K Shared NAND, 1 GP/WD USB 1.1, MMC/SD, 3 PWMs, BGA (1717 mm)
NOR 3 McASP, 2 SPI, LCD controller,
2 I
2
C, 3 UART 3 eCAP, 2 eQEP, UHPI
OMAP-L138 ARM926EJS, 300 16 K 16 K 128 K DDR2, 64 Ch 3 GP, USB 2.0 HS OTG, 10/100 Ethernet MAC, 1.01.2 1.8/3.3 0.8-mm 361-pin 18.60
C674x 300 32 K 32 K 256 K Shared mDDR, 1 GP/WD USB 1.1, 2 MMC/SD, 2 PWMs, BGA (1616 mm),
NAND, 1 McASP, LCD controller, 0.65-mm 361-pin
NOR, 2 McBSP, 2 I
2
C, video interface, BGA (1313 mm
SDRAM 3 UART, 2 SPI UHPI, SATA, 3 eCAP
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the New devices are listed in red.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
Texas Instruments 3Q 2009 Embedded Processing Guide
OMAP

Applications Processors
Power Mangement Products
45

Power Management Products for the OMAP35x, OMAP-L137 and OMAP-L138 Applications Processors
Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com
For additional power supply designs for TI processors, please visit www.ti.com/processorpower.
Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level
power requirements to ensure an adequate power supply design is used.
Power Management Products for OMAP35x Applications Processors
Part Integration SmartReflex USB2.0 Audio Battery Touchscreen Package
Number Level Class DC/DC LDO I
2
C HS OTG Codecs Charger Controller (mm)
TPS65950 Full integration Class 3 3 10 (2 stereo) 77 BGA
TPS65930 Full integration Class 3 3 4 (1) 1010 BGA
TPS65920 Full integration Class 3 3 4 1010 BGA
TPS65073 Full integration Class 3 3 2 66 QFN
TPS65023 Semi integration Class 2 3 3 55 QFN
TPS62350 Discrete Class 3 1 33 QFN
21.5 CSP
Power Management Products for the OMAP-L137 Applications Processor
Voltages
Key Careabouts 1.2-V (PLL) 1.2-V (RTC) 1.2-V (Core) 3.3-V (I/O) 1.8-V (I/O)
Integration TPS79901 TPS65023 TPS65023 TPS65023 TPS65023
Flexibility TPS71712 TPS71712 TPS62353 TPS62200 TPS71718
Simplest TPS74801 TPS74801 TPS74801 TPS73633 TPS71718
Low part count TPS62410 TPS62410 TPS62410 TPS62410 TPS71718
TPS65070
The TPS65070 is a dedicated PMU solution for OMAP-L138/
TMS320C6748 applications. The 1-cell Li-Ion battery charger with
power path management can be supplied either by a USB port or a
wall adapter. Three highly efficient 2.25-MHz buck converters pro-
vide the voltages (core, memory, I/O) for the processor. The voltages
can be changed by I
2
C.
Further, two 200-mA LDOs, one boost converter for LED backlight-
ing, a touchscreen controller and 10-bit A/D converter are integrated
as well. The TPS65070 comes in a small 66-mm QFN package.
1
-
c
e
l
l
L
i
-
l
o
n
Power Management Products for the OMAP-L138 Applications Processor
Texas Instruments 3Q 2009 Embedded Processing Guide
46
Software and Development Tools
eXpressDSP

Software and Development Tools

TIs real-time eXpressDSP Software and Development Tools portfolio includes tightly knit ingredients that will empower developers to tap
the full potential of TIs TMS320 DSPs, DaVinci and OMAP processors. Each element is designed to simplify programming and
move development from a custom-crafted approach to a new paradigm of interoperable software from multiple vendors supported by a
worldwide infrastructure. There has been an explosive growth in real-time applications demanding the real-time processing power of TI
digital signal processing. eXpressDSP tools enable innovators and inventors to speed new products to market and turn ideas into reality.
For more information, visit www.ti.com/expressdsp.
Standardization and Software
Reuse Move Development to a
New Level
Standards enabled for modular,
reusable multi-function applications
Developers of all experience levels
Integrate your own software
Catalog of interoperable software
Focus on adding value/differentiation
Designed to cut development time by
up to 50 percent and increase the
modularity
Tools and Standards to Simplify
Application Development,
Reduce System Cost, Enhance
Product Robustness and
Innovation and Accelerate
Time to Market
Powerful, integrated development envi-
ronment (IDE) (Code Composer
Studio IDE)
Scalable real-time kernel (DSP/BIOS
kernel)
eXpressDSP-compliant algorithms
(written to the eXpressDSP Algorithm
Interface Standard)
Reusable modular software and support
from TIs DSP Developer Network
Available on TMS320C6000 and
TMS320C5000 DSPs,
TMS320C2000 digital signal con-
trollers, OMAP application processors
and digital media processors with
DaVinci technology
Advanced data visualization and real-
time analysis
Powerful code-generation tools
What Are eXpressDSP Software
and Development Tools?
TIs real-time eXpressDSP Software and
Development Tools provide a complete
and open digital signal processing soft-
ware environment to simplify and stream-
line the product development process. It
provides access to a large number of
reusable software components, host tool-
ing and target-side content to reduce
development time.
eXpressDSP Software and Development Tools
Complete, Real-Time Software and Development Tools for TI Processors
Code Composer Studio
and Developer Network
IDEs
See pages 47 and 48
See page 49
See page 49
See pages 50 and 51
See pages 55 57
See pages 53 and 54
See page 52
eXpressDSP
Digital Media Software
Multimedia Framework
Products
eXpressDSP
Data Visualization Tools
Emulators / Analyzers Operating Systems Development Kits and Boards
Device Drivers
Video Codecs
Imaging Codecs
Speech / Voice Codecs
Audio Codecs
Other Algorithms

Framework Components
Codec Engine
xDAIS and xDM

SoC Analyzer
XDS560 Emulator
XDS560 Trace

DSP/BIOS Kernel
DSP/BIOS Link
Network Developers
Kit (NDK)
MontaVista Linux
VirtualLogix Linux
Windows CE

Starter Kits
Development Boards / EVMs
Development Platforms
Daughter Cards

*NDK only applicable to DSP-centric design

Codec Engine Codec Engine Server
Hardware Drivers Device Drivers
Operating Systems DSP/BIOS Kernel; NDK*

eXpressDSP
Development Tools
eXpressDSP Software
SoC (ARM + DSP)

ARM

DSP
Code Composer
Studio IDE
eXpressDSP Data
Visualization
DSP/BIOS
Link
Emulator
Host Computer Target Board
Customer Application
Framework
eXpressDSP
Digital Media Software
eXpressDSP
Digital Media Software
Simulator
Debugger
Editor
Compiler Profiler
Third-
Party
IDEs
eXpressDSP
Learn about TIs offering of develop-
ment boards and kits to get your
design started today (See page 55).
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSP

Development Tools
47

Code Composer Studio

Development Tools Simplify
DSP Development
Code Composer Studio (CCStudio) soft-
ware is a fully integrated development
environment (IDE) supporting Texas
Instruments industry-leading DaVinci,
TMS320C6000, TMS320C5000,
TMS320C2000 and OMAP
processor platforms.
IDE
Integrated IDE and debugger
CodeWright Editor
Project manager
Debugger
Co-debug of ARM

/DSP processors
Data visualization
Cache visibility
Robust host-to-target connection
Real-Time Debug
Non-intrusive memory access
Handle interrupts while halted
Advanced Event Triggering
Watchpoints
Event sequences
Non-intrusive counters
Code-Generation Tools
Industry-leading performance
Program-level optimization
Simulation
Cycle accurate simulation
Rewind back-stepping
Code coverage
Profiling
Profile functions and loops
Measure cache activity
Profile pipeline stalls
Host Operating System
Support
Windows

Linux (compilers only)

Project
Manager
Toolbars
Disassembly
Window
Watch
Window
Output Window Data Visualization GEL
Memory
Window
Data
Visualization
CodeWright Editor DSP/BIOS Kernel Configuration Window
Code Composer Studio Development Tools include the features you need to edit, build, debug and
visualize your applications.
Integrated Development Environment
The Code Composer Studio (CCStudio) IDE
provides a single-user interface taking you
through each step of the application
development flow. Familiar tools and inter-
faces allow users to get started faster
than ever before and add functionality to
their application thanks to sophisticated
productivity tools. The integrated
CodeWright Editor greatly improves the
code creation experience. Easily manage
large multi-user, multi-site projects with
the built-in project manager.
Debugger
Code Composer Studio IDEs integrated
debugger has DSP-specific capabilities
and advanced breakpoints to simplify
development. Conditional or hardware
breakpoints are based on full C expres-
sions, local variables or CPU register sym-
bols. A General Extension Language (GEL)
script file can be executed when a partic-
ular breakpoint hits.
Developers can debug code quickly by
selectively stepping into, over or out of C
function or assembly subroutines.
The memory window allows you to inspect
each level of memory so that you can
debug complex cache coherency issues.
Code Composer Studio IDE supports the
development of complex systems with
multiple boards or multiple processors on
a single target board. Global breakpoints
are also available for multiprocessor sys-
tems. Code Composer Studios Parallel
Debug Manager (PDM) provides synchro-
nized control over multiple processors con-
figured in single- or multiple-scan chains.
It can be used to launch individual parent
windows to control each processor. The
PDM can be used to broadcast commands
to different groups of CPUs in the JTAG
scan path. A global breakpoint command
on one processor can halt other proces-
sors when this breakpoint is encountered.
The PDM lets developers open up sepa-
rate debug windows for any CPU on any
board in the system.
Code Composer Studio IDE also supports
popular external scripting languages such
as Perl and VBA to help developers auto-
mate application testing and validation.
Code Composer Studio IDE, TI Developer Network IDEs and Development Tools
Integrated Development Environment and Debuggers
Get more information about Code Composer Studio IDE and TI Developer Network development tools at: www.ti.com/ccstudio
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSP

Development Tools
48

Real-Time Debug
TI devices include advanced emulation
features which provide simple, inexpensive
and speed-independent access to the CPU
for debugging. Access to registers and
memory can be non-intrusive and real-
time mode provides for the debugging of
code that interacts with interrupts that
must not be disabled. Real-time mode
allows you to suspend background code at
break events while continuing to execute
time-critical interrupt service routines.
Advanced Event Triggering
Advanced Event Triggering (AET) allows a
user to halt the CPU or trigger other
events based on complex events or
sequences. These events include invalid
data memory accesses and invalid pro-
gram accesses. It can also non-intrusively
measure performance and count system
events (for example, cache events).
Code-Generation Tools
In the past, developing high-performance
DSP code has required optimizing assem-
bly code by hand and an intimate knowl-
edge of the particular device architecture.
The TI Code Composer Studio IDE compiler
tools address this need by shifting the
burden of optimization from hand-coded
assembly to the C compiler. With these
tools it is possible to exploit the high per-
formance of TI processors without ever
writing hand-coded assembly.
TI compilers can perform program-level op-
timizations that evaluate code performance
at the application level. With a program-
level view, the compiler is able to generate
the small, fast code an assembly program
developer with a full system view would
generate. This application-level view is
leveraged by the compiler to make trade
offs that significantly increase performance.
Simulation
Simulators provide a way for users to begin
development prior to having access to a
development board. Simulators also have
the benefit of providing enhanced visibility
into application performance and behavior.
Several simulator variants are available
allowing users to trade off cycle accuracy,
speed and peripheral simulation, with
some simulators being ideally suited to
algorithm benchmarking and others for
more detailed system simulation.
The Rewind feature allows you to step and
run backward to trace the source of a
problem. There is no need to restart the
execution of the program. Full reverse
mode visibility is available through watch,
register and memory windows.
Watchpoints allow the user to stop his
code on data read or write to a particular
memory location. Track memory corruption
problems using this feature.
The Interrupt Latency Detector enables
you to measure the worst-case interrupt
latency of the code, including program-
ming interrupt constraints such as dis-
abling GIE/NMIE and architectural behavior
such as non-serviceability of interrupts in
branch delay slots.
Pipeline analysis of a TMS320C55x
DSP shows both the stalls and their caus-
es through a detailed pipeline visibility.
Code Coverage shows which source lines
(both C and assembly) are executed.
The CacheTune tool tracks program, data
cache activities visualized over time most
effective for improving cache utilization.
Real-Time Data Exchange
Real Time Data Exchange (RTDX) and
High-Speed RTDX (HS-RTDX) allow a
developer to exchange data between the
target and the host PC without stopping
the target application, thus providing a
bi-directional data pipe between the
application and the host. This allows
developers to access data from the appli-
cation for real-time visibility, or to simulate
data input to the device, shortening devel-
opment time by giving developers a realis-
tic view of the way their systems operate.
Profiling
Code Composer Studio IDEs interactive
profiler makes it easy to quickly measure
code performance and ensure the efficient
use of the DSP targets resources during
debug and development sessions. The
profiler allows developers to easily profile
all C/C++ functions in their application for
instruction cycles or other events such as
cache misses/hits, pipeline stalls and
branches. Profile ranges can be used to
concentrate efforts on high-usage areas of
code during optimization, helping develop-
ers produce finely-tuned code. Profiling is
available for ranges of assembly, C++ or
C code in any combination. To increase
productivity, all profiling facilities are avail-
able throughout the development cycle.
Developer Network
Development Tools
TI is committed to enabling third-party
development tools partners to support our
ARM

-based SoC devices.

GreenHills MULTI

MULTI is a complete integrated develop-

ment environment for embedded applica-
tions using C, C++ and Embedded C++.
The MULTI debugger offers an excellent
environment for debugging of SoC devices
containing both ARM and the
TMS320C64x+ DSP core. MULTI also
offers OS-aware debugging for several
operating systems including INTEGRITY,
velOSity, u-velOSity, MontaVista Linux and
DSP/BIOS kernel. For more information
on GreenHills MULTI, please contact
sales@ghs.com.
Lauterbach Trace32
Trace32 is an ARM debugger that also
supports debugging of TI DSPs and thus
can provide co-debug support for the ARM
and DSP on TI SoC devices. Lauterbach
also provides OS aware debugging for
most embedded operating systems includ-
ing Linux. For more information please
visit www.lauterbach.com.
Code Composer Studio full-function
evaluation tools are available for a free
120-day evaluation. To order your
CD-ROM, visit
www.ti.com/freetools.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSP

Development Tools
49

Real-time execution visibility is the key to

optimizing and debugging systems.
Emulators provide a connection to a target
for execution control and system visibility.
eXpressDSP Data Visualization Tools-
based solutions graphically simplify com-
plex, interrelated data sets.
XDS560 Emulator
The XDS560 Emulation platform provides
a robust and reliable IEEE 1149.1 JTAG
connection to the target device. It provides
high-speed download speeds, Advanced
Event Triggering (AET), and High-Speed Real-
Time Data Exchange (HS-RTDX) capability.
Non-Intrusive Debugging
TI devices include advanced emulation
features which provide simple, inexpensive
and speed-independent access to the CPU
for debugging. Access to registers and
memory can be non-intrusive and real-
time mode provides for the debugging of
code that interacts with interrupts that
must not be disabled. Real-time mode
allows you to suspend background code
at break events while continuing to exe-
cute time-critical interrupt service routines.
Advanced Event Triggering (AET) allows
a user to halt the CPU or trigger other
events based on complex events or
sequences such as invalid data or pro-
gram memory accesses and invalid
program accesses. It can non-intrusively
measure performance and count sys-
tem events (for example, cache events).
Real-Time Data Exchange (RTDX)
and High-Speed RTDX (HS-RTDX) allow
a developer to exchange data between
the target and the host PC, without
stopping the target application, thus
providing a bi-directional data pipe
between the application and the host.
This allows developers to access data
from the application for real-time visibil-
ity, or to simulate data input to the
device, shortening development time by
giving developers a realistic view of the
way their systems operate.
XDS560 Trace
The XDS560 Trace module helps cus-
tomers find previously invisible complex
real-time bugs. Trace can detect the really
hard to find bugs race conditions
between events, intermittent real-time
glitches, crashes from stack overflows,
runaway code and false interrupts without
stopping the processor. Trace is a com-
pletely non-intrusive debug method that
relies on a debug unit inside the DSP so it
does not interfere or change the applica-
tions real-time behavior.
Trace can fine tune code performance and
cache optimization of complex switch-
intensive multi-channel applications. It
enables real-time code and event profiling
as well as fast and accurate code analysis
with profiling, cache view and code cover-
age for some of the most popular
TMS320devices today used in applica-
tions such as video teleconferencing and
medical imaging.
SoC Analyzer Data
Visualization Tool
eXpressDSP Data Visualization SoC Analy-
zer is TIs high-level system tuning and
visibility tool which enables developers to
visualize SoC streaming data rather than
be limited to post-mortem static data anal-
ysis. By being able to capture and graphi-
cally display system interactions and load
distribution, isolate bottlenecks, identify
unexpected behaviors and benchmark ap-
plication performance, developers are able
to maximize efficiency and overall per-
formance while eliminating tedious manu-
al data collection and comparison. This
tool is non-invasive and aids in analyzing
and identifying problems by capturing and
graphically displaying: system interaction,
load distribution, bottlenecks in data
throughput and other types of behavior.
JTAG Debug and eXpressDSP Data Visualization
Emulators and Analysis Tools
Get more information about JTAG debug and eXpressDSP data visualization tools at: www.ti.com/emulatoranalyzer
Blackhawk XDS560 Trace delivers non-intrusive, real-time data capture to expose the toughest
real-time bugs.
Read more about real-time debug at
www.ti.com/emulatoranalyzer.
Software and Development Tools
Operating Systems
50

Texas Instruments 3Q 2009 Embedded Processing Guide

Complete Operating System
Solutions for Both ARM and
DSP-Based Devices
DSP/BIOS real-time kernel
Available royalty-free with Code
Composer Studio (CCStudio)
integrated development environ-
ment (IDE)
Supports DaVinci, OMAP,
TMS320C6000,
TMS320C5000 and
TMS320C2000 processors
Provides deterministic, preemptive
multithreading
DSP/BIOS Link provides
ARMDSP program loading and
communications services
Network Developers Kit (NDK)
Integrated with DSP/BIOS kernel
Provides standard TCP/IP
networking services
Includes higher-level applications
such as HTTP, TELNET, DNS
and DCHP
MontaVista Linux
Stable, robust, proven
embedded Linux
Fully supported and maintained
by MontaVista
Available for DaVinci and
OMAP processors
Microsoft Windows

CE
Available on select ARM-based
DaVinci and OMAP processors
through TIs Authorized Software
Providers (ASPs)
VirtualLogix Linux
Full-featured embedded Linux
complete with drivers
Co-exists with DSP/BIOS kernel
via real-time VLX virtualization
technology
Available on select
TMS320C64x+ DSP core-
based processors
DSP/BIOS kernel is a robust multithreading
kernel, proven in thousands of embedded
applications, and is augmented by the NDK
embedded networking stack and DSP/BIOS
Link ARMDSP communications and con-
trol software. DSP/BIOS kernel is highly
scalable to minimize footprint requirements.
DSP/BIOS kernel provides preemptive
multithreading, cache and interrupt man-
agement and a selection of interprocessor
communication services, including mail-
boxes, semaphores and variable-length
message passing that works transparently
across single- and multi-core configurations.
To aid debugging of complex applications,
DSP/BIOS kernel includes real-time log-
ging services that are integrated with the
CCStudio IDE graphical real-time analysis
displays. DSP programmers can view the
sequence of thread execution, CPU load,
or use a low-overhead printf for custom
instrumentation.
DSP/BIOS kernel is frequently deployed as
the real-time DSP kernel on multi-core
devices like TIs DaVinci and OMAP SoC
processors. In such applications, the
DSP/BIOS Link inter-processor communi-
cation provides powerful interconnection
service to ARM-side operating systems
like Linux and Windows CE. DSP/BIOS
Link is typically used with TIs Codec
Engine, as shown in the DaVinci software
pages of this guide (see page 52).
Open Source Community Linux
TI provides the latest cutting-edge Linux
release for its devices. Support for TI
devices is provided directly in the main-
stream Linux development tree (GIT tree)
and may be downloaded at no charge.
Development tool support is provided
through Code Sourcerys Sourcery
G++. Sourcery G++ includes the GNU
C and C++ compilers and the Eclipse
IDE. Sourcery G++ for ARM supports TI
processors with an ARM core, including
the OMAP processor family, runs on
GNU/Linux

and Windows

and targets
GNU/Linux, Clinux or EABI (bare board)
systems. Sourcery G++ Professional
Edition features unlimited support from
CodeSourcerys expert engineers, and
Personal Edition is affordably priced for
individual and small development teams.
TI sponsors the OMAP and DaVinci Linux
communities that provide the option to
participate in the latest kernel version
development. An active community sup-
port mailing list is available through the
OMAP Linux Community at
linux.omap.com.
MontaVista Linux
For developers who prefer a Linux OS
backed by a commercial support opera-
tion, TI also partners with MontaVista.
MontaVista Professional Edition Linux pro-
vides tools for build, debug, profiling and
analysis on the host coupled with a full set
of hardened drivers and a rich complement
of target-based software components.
Windows Embedded CE
Windows Embedded CE is a componen-
tized, real-time operating system for a
wide range of small footprint devices.
Developers use Windows Embedded CE
for a variety of smart, connected and
service-oriented devices, ranging from
power-conscious GPS handhelds to real-
time, mission-critical industrial controllers.
DSP/BIOS Software Kernel Foundation
Operating System Solutions
DSP/BIOS Real-Time DSP Kernel and ARM

Operating Systems
Get more information about DSP/BIOS real-time kernel and ARM operating systems at: www.ti.com/expressdspos
DSP/BIOS is available royalty-free with
the Code Composer Studio full-
function evaluation tools. To order your
CD-ROM, visit www.ti.com/freetools.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
Operating Systems
51

TI offers a Windows

CE DVSDK today for

OMAP35x and TMS320DM644x
processors.
OMAP35x support is available on
Windows Embedded CE 6.0, along with
Platform Builder, a Visual Studio 2005
plug-in, that provides an integrated devel-
opment environment (IDE) that enables
you to build both application and Windows
Embedded CE 6.0 operating system soft-
ware in a familiar environment while
improving existing or creating new
embedded devices. Along with a portfolio
of hundreds of carefully tested operating
system components, the innovative tools
and features help Windows Embedded CE
6.0 enhance performance, security fea-
tures, compatibility and flexibility.
The USB-powered Beagle Board is a low-
cost, fan-less single-board computer that
unleashes laptop-like performance and
expandability without the bulk, expense or
noise of typical desktop machines. The
Beagle Board enables you to flesh out
your innovative ideas in conjunction with a
large and growing open source develop-
ment community and utilizes expansion
via a wide range of standard PC peripher-
als. When it becomes necessary to work
with greater hardware customization
capabilities or to utilize off-the-shelf soft-
ware, look to the OMAP35x Evaluation
Module from Texas Instruments
(www.ti.com/omap35x).
Specifications include:
Hardware:
OMAP 3530 processor
ARM

Cortex-A8 CPU
HD-capable C64x+ CPU
3-D graphics acceleration
256-MB LPDDR RAM*
256-MB NAND Flash memory
On-The-Go high-speed USB port
Host-only high-speed USB port*
8-bit SD/MMC 6-in-1 connector
DVI-D out
S-video (TV) out
Stereo audio out/in
JTAG in-circuit emulation header
USB/5-V power options
LCD*/serial expansion headers
Software:
Bootloader
Diagnostic Linux kernel and tests
Library of open source projects**
Applications of BeagleBoard:
Silent digital media center
Web browser (Firefox 3)
3-D and open source gaming
Android-based appliances
Video codec development
Video teleconferencing
Thin clients
Low-power, low-cost desktop
Autonomous robots
Wearable computers
Digital signs or photo frames
Netbook development
Intelligent security cameras
Automotive vision and media
Software-defined radio
Home automation
And many more!
Hardware expansion:
802.11b/g/n networking
3G wireless modems
Web cameras
Analog I/O
HDTVs
DLP

projectors
Much more
BeagleBoard.org
BeagleBoard.org promotes and motivates
Open Source software development on
OMAP processor-based systems, with
over 1,000 developers already participat-
ing. The key objectives are to:
Enable innovators and hobbyists to
explore new domains and experiment
with their ideas on an open platform
Enable such experiments to be con-
ducted cost effectively and thereby
nurture innovation
Provide a community collaboration point
for OMAP processor platform developers
USB-Powered, Desktop-Performance and Community-Supported OMAP Development Platform
You Cannot Afford to Miss
Go to beagleboard.org to order your Beagle
Board (U.S. $149) today!
* New for Rev C.
** See more at beagleboard.org/project
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
Multimedia Framework Products
52

The xDAIS and xDM standards simplify

integration of multiple algorithms into
an application. Framework Compo-
nents enable users to easily develop
frameworks that can use xDAIS-
compliant algorithms. Codec Engine is
a low-level framework that automates
instantiation of xDAIS and xDM-
compliant algorithms.
xDAIS and xDM
eXpressDSP Algorithm
Interface Standard (xDAIS)
xDAIS for Digital Media (xDM)
Well-established standard first
introduced in 1999
Enhanced in 2006 to support
DaVinci digital media API
Framework Components
Off-the-shelf modules for query-
ing and allocating xDAIS algorithm
memory and DMA resources
Codec Engine
Automated instantiation of
xDAIS/xDM algorithms, including
resource allocation
Transparent remote or local
execution
Easily incorporated into higher-
level frameworks
TI's multimedia framework products
include the xDAIS and xDM algorithm
standards and the Codec Engine algorithm
execution framework.
eXpressDSP Algorithm
Interoperabilty Standard (xDAIS)
xDAIS and the eXpressDSP Digital
Multimedia (xDM) standards leverage the
ability of DSPs to perform a wide range of
multimedia functions on a single device.
xDAIS accelerates time-to-revenue by
eliminating integration problems caused
by algorithms having hard-coded access
to system resources that must be shared
with other algorithms. xDAIS forces an
algorithm to let the application framework
decide which resources to allocate.
xDM specifies a standard API for the
application to call a particular algorithm
class, enabling an integrator to quickly
change to an algorithm from a different
source if different functionality or perform-
ance is required. The xDM standard
defines APIs for several classes of codecs,
including video decode/encode and audio
encode/decode.
eXpressDSP Framework
Components
For developers who wish to develop
eXpressDSP-compliant frameworks, TI
provides low-level components (DSKT,
DMAN3) that enable a framework to query
xDAIS-compliant algorithms for their
memory and DMA resources and then
allocate them.
Codec Engine
Codec Engine is an algorithm execution
framework that automates the invocation
and instantiation of eXpressDSP-compliant
algorithms. Codec Engine can execute in
ARM

-only, ARM+DSP or DSP-only envi-

ronments and supports concurrent execu-
tion of multiple channels and algorithms.
Codec Engine is designed to be used in
conjunction with higher layer frameworks
or middleware that provide A/V synchro-
nization, I/O and network services while
calling Codec Engine for algorithm-
processing operations. This approach
enables system providers to easily differ-
entiate their applications. Codec Engine is
currently available for Linux and Windows

CE on ARM-based devices and for

DSP/BIOS kernel on DSPs.
An important feature of Codec Engine is
the consistent APIs that it provides across
TI SoC and DSP devices, enabling scalable
development for multiple TI devices and
easier migration to new TI architectures.
Algorithm Standards and Frameworks
Standards for Algorithm Interoperability and Integration
Get more information on algorithm standards and frameworks at: www.ti.com/frameworks
Embedded OS
MPEG-4 Decode
IALG IDMA3
Application Framework
Drivers
Memory DSP
Query & Grant Memory
and DMA, Resources
H.264 Decode
IALG IDMA3
xDM IVIDDEC APIs
Application Framework
Query & Grant Memory
and DMA, Resources
Codec Engine
eXpressDSP
Framework
Components
Use of xDAIS and xDM APIs enable easy integration of multiple algorithms into an application.
For further technical information or for
no-charge downloads of multimedia
framework products, go to
www.ti.com/frameworks.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSPDigital Media Software
53

Digital Media Software Portfolio

Encoders, Decoders, Codecs and Libraries
Get more information about eXpressDSP Digital Media Software at: www.ti.com/digitalmediasoftware
eXpressDSP Digital Media Software is pro-
duction tested and optimized for TI DSP
and SoC platforms. Instead of investing
time and effort in standardized media en-
coders, decoders and libraries, OEMs are
able to save years of development time
and can focus development efforts on dif-
ferentiating product features. eXpressDSP
Digital Media Software is available for free
evaluation on TI EVMs, and numerous
flexible production licensing options exist
to fit any development need.
Visit www.ti.com/digitalmediasoftware to:
Evaluate or purchase digital media soft-
ware for your TI DVEVM or DVDP board.
Learn more about flexible production
licensing that allows for a range of
pricing options based on project quantity
View published suggested resale pricing
options.
Unlike example software or freeware, digi-
tal media software components all follow
stringent coding guidelines. Each module
includes a re-targetable production library
featuring reentrant code. Each module is
fully documented with a data sheet,
release notes, users guide and usage
examples. All digital media software is unit
tested and system tested with thousands
of test vectors in world-class testing labs.
The encoders and decoders are hardened
with a wide range of test vectors from end
equipments and applications in which TI
digital media software is deployed: wire-
less handsets, wireless networking equip-
ment, video/IP phones, streaming media
appliances, set-top boxes and video infra-
structure to name just a few.
Target Hardware
Codecs DM646x DM644x DM643x DM648 DM3x OMAP35x
Video & Imaging
H.264 Video Dec
H.264 Video Enc
JPEG Imaging Dec
JPEG Imaging Enc
MPEG-2 Video Dec
MPEG-2 Video Enc
MPEG-4 Video Dec
MPEG-4 Video Enc
VC1 Video Dec
Audio
AAC Audio Dec
AAC Audio Enc
MP3 Audio Dec
MP3 Audio Enc
WMA Audio Dec/Enc
Voice
G.711 Dec/Enc Open Source
Other
Network Developer Open Source
Kit (NDK)
Broad eXpressDSP Digital Media Software Portfolio
eXpressDSP Digital Media Software is
a set of production-tested encoders,
decoders, codecs and libraries that
address the most common media-
processing functions required by
embedded product OEMs.
Features and Benefits
High-quality encoding
Tested against PC-based refer-
ence encoders to within 0.5 dB
PSNR at typical bit rates
Robust, error resilient decoding
Tested with ITU standard test
streams and error streams
Application-specific libraries
Video analytics for security
applications
Graphics for 2-D and 3-D video
on DaVinci technology
All TI Digital Media Software is
compliant to the xDM API and inte-
grated with the DaVinci software
infrastructure
TI Digital Media Software is available
through the TI eStore at
www.ti.com/codecbundles or
through TI Authorized Software
Providers (complete list can be
found at www.ti.com/asp)
Request your free evaluation of
TI digital media software at
www.ti.com/requestfreesoftware.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSPDigital Media Software
54

Customers have several entry points to

designing with TI SoC and DSP proces-
sors, ranging from high-level frameworks
and applications to low-level functions.
The concept of multiple development entry
points is also incorporated in eXpressDSP
Digital Media Software, which enables a
low-level entry point at the codec API layer
and also allows higher-level entry points
through Codec Engine and application
software built on it. Because all TI digital
media software components have been
tested and integrated with Codec Engine
and the full DaVinci software infrastructure,
mid-level entry points are fully enabled.
Even higher-level entry points are possible
via applications and operating systems
built on the DaVinci software foundation;
some examples include Windows

CE with
the DirectShow media framework and
GStreamer for Linux.
Authorized Software Providers by Region
Region
ASP Americas Europe China Japan Korea India Asia Other
ATEME
eInfochips
eSOL
Ingenient
Ittiam
LogicPD
MPC Data
NSU
SEED Electronic Tech.
TES Electronic Solutions
Wintech Digital
Authorized Software Providers Support TI Digital Media Software
To request a free software evaluation,
sign up for updates or ask questions,
go to Contact Me at
www.ti.com/requestfreesoftware.
The TI Digital Media Software portfolio is a
collection of optimized encoders,
decoders, codecs and libraries licensed by
TI and by TI Authorized Software Providers
(ASPs) to customers worldwide. Each soft-
ware component was developed by TI or
by TI Developer Network members in
compliance with the xDAIS eXpressDSP
algorithm interface standard and xDM
extension for digital media, and each
component is packaged for easy integra-
tion with DaVinci and eXpressDSP
software framework building blocks. The
entire portfolio is available with support
from highly qualified, trained ASPs, who
can also offer additional software IP
products or custom engineering services
to enable rapid time to market for TI
customers.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSP

Software and Development Tools

55

Code Composer Studio

Integrated Development
Environment Free Evaluation
Tools
Supports TMS320C2000,
TMS320C5000,
TMS320C6000, OMAP and
DaVinci processors
120-day full-featured trial
Online tutorials and multimedia fea-
ture demos show off key capabilities
Order CD-ROM online or download
at www.ti.com/freetools.
Evaluation Codecs
High-quality, production-tested
encoders, decoders, codecs and
other digital media software
modules and algorithms
Free supported 60-day software
evaluation
More information on digital media
software, including a complete
inventory, can be found at
www.ti.com/digitalmediasoftware.
Training
Workshops
Online training
View online at www.ti.com/training.
Development Kits and Boards
DSP starter kits (DSKs) offer complete
low-cost evaluators bundles includ-
ing development tools and hardware
Evaluation modules (EVMs) include a
wide range of TI and third-party
development boards and production
bundles
Development platforms combine
production-ready, application-specific
software and hardware in an easy-
to-use development environment for
rapid prototyping
Daughter cards and plug-on mod-
ules compliment TI or third-party
DSKs and development boards
Getting Started
Integrated Development Environment, Codecs, Training and Kits
TI and members of the TI DSP Developer
Network offer a wide range of hardware
and software getting started kits and
production-ready solutions to jump start
new designs. These bundled solutions are
an excellent way to evaluate TI processors,
digital media codecs and test drive the
eXpressDSP tools offering to begin appli-
cation development. Many production-
ready bundles include full software licens-
es, production-ready software and stand-
alone emulators to take an application into
production. A wide selection of daughter
cards is also available to add capability
and new hardware features. Reference
designs provide developers with hardware
and software ready for rapid product
implementation and deployment, for fully
system tested end equipment applications.
DSP Starter Kits
Starting at just U.S. $395, Digital Signal
Processing Starter Kits (DSKs) and eZdsp
Starter Kits are a low-cost entry-level
means of evaluating TI processor platforms
and eXpressDSP development tools. TI,
partnered with Spectrum Digital Inc., offers
a variety of processor selections in each
platform to let developers test algorithms,
benchmark code and write simple programs
to prove out designs and evaluate the
processor architecture. The DSKs are bun-
dled with a special Code Composer Studio
(CCStudio) IDE that runs exclusively through
the embedded emulation on the target
board, so that developers can explore the
rich feature set that CCStudio IDE has to
offer. Nearly a dozen DSKs are available
today for the TMS320C2000,
TMS320C5000 and TMS320C6000
processor platforms.
DaVinci Development Tools/Kits
Comprehensive ARM

/DSP system-level
tooling helps developers jump start devel-
opment of any digital video application.
The DaVinci kits are designed to simplify
development of digital video applications
such as video phones, automotive info-
tainment, digital still cameras, streaming
media, IP set-top boxes, video security
systems and digital video products that
have yet to be invented.(V&I Solns Tools)
Digital Video Development Platform
(DVDP) includes both hardware and
software to enable immediate evalua-
tion of DaVinci DSP-based processors.
Available today for both the
TMS320DM648 and TMS320DM6437
digital media processors, the DVDP pro-
vides developers with a comprehensive
platform that can be used throughout
the entire design process.
Digital Video Evaluation Module
(DVEVM), comprised of both hardware
and software, enables developers to
start instantaneous evaluation of
DaVinci ARM9-based processors and
begin building digital video applications.
Available today on TMS320DM6446,
TMS320DM355, TMS320DM357,
TMS320DM365 and TMS320DM6467
digital media processors.
Whether you are just starting a project
and need to determine which processor
best suits your application or beginning
product design, TIs Starter Kits,
Development Platforms and Evaluation
Modules offer developers bundled solu-
tions designed to simplify and accelerate
the application design process from
concept through production.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSPSoftware and Development Tools
56

DaVinci Development Tools and Software

Evaluation, Development and Production Kits
Get more information on DaVinci development tools and software at: www.ti.com/davincitools
DaVinci ARM

and ARM+DSP Tools DaVinci DSP

Evaluation and Development Production Evaluation, Development and Production
DM6446 DM355 DM6467 DM6437 DM648
DVEVM DVEVM DVEVM MontaVista Pro DVDP DVDP
U.S. $2,495 U.S. $495 U.S. $1,995 U.S. $8,995 U.S. $495 U.S. $1,295
Hardware
DaVinci target board
Video camera/LCD
Power supply w/ US, EU and UK cables
Connectivity cables
Mass storage 40-GB HDD 2-GB NAND Flash 40-GB HDD
IR remote control
On-board EMU
Software
Linux-based DVSDK
DSP/BIOS kernel-based DVSDK
MontaVista Linux Pro Demo Demo Demo License
Third-party software demos and evals GHS MULTI

Ittiam
C64x+ Linux code-generation tools Eval Eval Eval
Code Composer Studio IDE v3.3 H/W version Eval
VLIB Software Library

VLIB demonstration requires the TMS320DM6437 Digital Video Development Platform (DVDP) based on DaVinci technology. For more information or to request
access, go to www.ti.com/vlib.
TI offers a wide range of development tools specifically for aiding DaVinci technology-based design. For a complete list, visit
www.ti.com/davincitools.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
eXpressDSP

Software and Development Tools

57

Evaluation and Development Production

MontaVista Mobilinux MontaVista Pro
OMAP3503 EVM OMAP-L137 Starter Kit for OMAP35x for OMAP-L1x
OMAP ARM

U.S. $1,495 U.S. $395 U.S. $26,985 U.S. $8,995

Hardware
OMAP target board
Power supply with US, EU, and UK cables
Connectivity cables
Memory 64-MB mobile DDR SDRAM 4-MB serial Flash
128-MB NAND Flash 64-MB SDRAM
Display with touch screen
On-board emulation
Software
TI platform support (SDK)
TI DVSDK * *
Linux BSP (kernel 2.6.22) *
WinCE BSP *
Third-party development tools (evaluation)** *
Code Composer Studio IDE (tied to hardware)
MontaVista Pro 5 Demo License
MontaVista Mobilinux production license
* Available through www.ti.com/omapsoftwareupdates with EVM registration
** Sourcery G++ evaluation tools from CodeSourcery ARM RVDS Evaluation IDE and Microsoft Visual Studio Evaluation tools
OMAP Development Tools and Software
Evaluation, Development and Production Kits
Get more information on OMAP development tools and software at: www.ti.com/omap35xtools
DSP Starter Kits
Part Number Description
TMDSDSK6713 TMS320C6713 DSP Starter Kit (DSK)
TMDSDSK6416-T TMS320C6416 DSP Starter Kit (DSK)
TMDSDSK6455 TMS320C6455 DSP Starter Kit (DSK)
TMDSDSK5416 TMS320C54x DSP Starter Kit (DSK)
TMDSDSK5510 TMS320C55x DSP Starter Kit (DSK)
TMDSDSK5509 TMS320C5509 DSP Starter Kit (DSK)
TMDXEZ28044 TMS320F28044 eZdsp Starter Kit
TMDSEZD2407 TMS320LF2407A eZdsp Starter Kit
TMDSEZD2812 TMS320F2812 eZdsp Starter Kit
TMDSEZS2812 F2812 eZdsp Starter Kit (Socketed)
TMDSEZS2808 F2808 eZdsp Starter Kit (Socketed)
TMDXEZ28335 TMS320F28335 eZdsp Starter Kit
DSP Development Tools
Evaluation and Development Kits
Get more information on DSP development tools and software at: www.ti.com/dspdevkits
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
TI DSP Developer Network
58

A Wide Variety of DSP

Solutions
Utilize the TI DSP Developer Network for:
Complete solutions Members
offer complete solutions for quickly
solving application problems. Most
solutions incorporate TIs data con-
verters, power management devices
and other quality TI devices.
Reduced time to market Time-
consuming programming and
troubleshooting tasks can be elimi-
nated by utilizing proven hardware,
software, algorithms and libraries
from members.
Lower costs Dont spend time
and money recreating something
that has already been produced.
Members enable you to dedicate
your resources to producing value-
added, application-specific products.
Additional expertise Members
provide consulting services, training,
integration, contract engineering,
research and development and
much more. They are an extra
resource to assist you with your
product development efforts.
eXpressDSP-Compliant
Products
Texas Instruments, in conjunction with
its industry-leading DSP Developer
Network, offers an array of eXpressDSP-
compliant algorithms designed to
reduce system integration time and
lower support and development costs
by eliminating custom coding tasks.
DSP Developer Network members also
provide eXpressDSP-compliant plug-in
tools to reduce development time.
More than 200 independent DSP
Developer Network members provide a
vital link between TI silicon and the final
application by providing additional hard-
ware, algorithms and libraries, software
tools and consulting services.
Products/services include:
End-equipment solutions
Production-ready, DSP/SoC application-
specific resources and collateral
bundles, inclusive of block diagrams,
application notes, tools, software and
other full end-equipment solution-
related information
Embedded software Production-
tested, application-targeted software
components, optimized at the processor-
specific level, for popular industry
standards
Engineering services DSP/SoC
generation-specific hardware and soft-
ware design, manufacturing and con-
sulting services, ranging from board-
level designs to full-turnkey support
Development tools DSP/SoC
generation-specific physical develop-
ment of evaluation boards and kits,
application-targeted companion chips
and cards, and other development
resources such as emulation tools,
reference designs, documentation and
users guides
DSP Developer Network Product
Catalog on TIs Website
For information regarding the vast array of
products available from TIs DSP
Developer Network, check out:
www.ti.com/dspdevnetwork. Extensive
information can be found through search-
able listings of members located world-
wide. Search hundreds of listings by com-
pany, device supported, keyword, product
name or product category.
DSP Developer Network Logo
Indicates TMS320
Processor-Based Solution
Registered TI DSP Developer Network
members use a distinctive DSP Developer
Network logo on various printed and elec-
tronic collateral. Look for the logo to iden-
tify companies that are ready to provide a
TMS320
processor-
based solution.
TI DSP Developer Network Overview
Solutions to reduce development time
Embedded Software
Operating systems
Codecs and algorithms
Application-specific libraries
Framework software
Drivers
Signal-processing libraries
Engineering Services
Digital hardware/board design
Software design services
Full turnkey design services
Analog/RF/Power designs
Manufacturing
Consulting
Development Tools
Compilers, assemblers, linkers
Evaluation modules and development
boards
Debuggers
Emulators/Analyzers
Daughter cards
Free evaluation tools
End-Equipment Solutions
Video and imaging
Communications and telecom
Security
Wireless
DSP Developer
Network
Get additional information and search
for Developer Network products and
services at:
www.ti.com/dspdevnetwork.
Texas Instruments 3Q 2009 Embedded Processing Guide
Software and Development Tools
Embedded Processing Development Tools Feature Matrix
59

TMDSCCSALL-1 Code Composer Studio (CCStudio) IDE Development Tools Platinum Edition X X X X X 3,595
TMDSCCS2000-1 C2000 Code Composer Studio IDE Development Tools
2
X X
2
X
2
X X
2
495
SPRC119 Code Composer Studio IDE Free Evaluation Tools L L X L Free
TMDSEVM3530 OMAP35x Evaluation Module (EVM) X X
5
1,495
TMDXOSKL137BET OMAP-L137/TMS320C6747 Floating Point Starter Kit X
3
X
3
X X
3
X X
5
395
TMDSEVM355 TMS320DM355 Digital Video Evaluation Module (DVEVM) X X 495
TMDXEVM357 TMS320DM357 Digital Video Evaluation Module (DVEVM) X X 895
TMDXEVM365 TMS320DM365 Digital Video Evaluation Module (DVEVM) X X 595
TMDSEVM6446 TMS320DM644x Digital Video Evaluation Module (DVEVM) X X 2,495
TMDSEVM6467 TMS320DM6467 Digital Video Evaluation Module (DVEVM) X X 1,995
TMDSVDP6437 TMS320DM6437 Digital Video Development Platform (DVDP) X
3
X
3
X X
3
X X 495
TMDXDVP648 TMS320DM648 Digital Video Development Platform (DVDP) L L X L X X 1,295
TMDXEVM6474 TMS320C6474 Evaluation Module X
3
X
3
X X
3
X 1,995
TMDXEVM6424 TMS320C6424 Evaluation Module X
3
X
3
X X
3
X 495
TMDXEVM6452 TMS320C6452 Evaluation Module X
3
X
3
X X
3
X 1,295
TMDXEVM6457 TMS320C6457 Evaluation Module X
3
X
3
X X
3
X 1,995
TMDSDSK6713 TMS320C6713 DSP Starter Kit (DSK)
4
X
3
X
3
X X
3
X 415
TMDSDSK6416-T TMS320C6416 DSP Starter Kit (DSK)
4
X
3
X
3
X X
3
X 495
TMDSDSK6455 TMS320C6455 DSP Starter Kit (DSK) X
3
X
3
X X
3
X 595
TMDXEVM6455 TMS320C6455 Evaluation Module w/ sRIO
4
X
3
X
3
X X
3
X 1,795
TMDSEVM642 TMS320DM642 Evaluation Module X 1,995
TMDSDMK642 TMS320DM642 Digital Media Development Kit X X X X X X X 6,495
TMDSPDK6727 Pro Audio Development Kit (PADK) X 1,495
TMDSPDB6727 Pro Audio Development Kit (PADK) Bundle X X X X X X X 5,995
TMDSDSK5416 TMS320C54x DSP Starter Kit (DSK)
4
X
3
X
3
X X
3
X 395
TMDSDSK5510 TMS320C55x DSP Starter Kit (DSK)
4
X
3
X
3
X X
3
X 395
TMDSDSK5509 TMS320C5509A DSP Starter Kit (DSK)
4
X
3
X
3
X X
3
X 495
TMDXEVM5505 TMS320VC5505 Evaluation Module X
3
X
3
X
3
X X 395
TMDX28027USB controlSTICK USB Evaluation Tool X
3
X X X X 39
TMDXDOCK28027 TMS320F28027 Experimenters Kit X
3
X X X X 79
TMDSDOCK2808 TMS320F2808 Experimenters Kit X
3
X X X X 89
TMDSDOCK28335 TMS320F28335 Experimenters Kit X
3
X X X X 99
TMDXDOCK28343 TMS320C28343 Experimenters Kit X
3
X X X 159
TMDXDOCK28346-168 TMS320C28346 Experimenters Kit X
3
X X X 189
TMDSPREX28 TMS320F28335 Peripheral Explorer Kit X
3
X X X 179
TMDSDCDC2KIT Digital Power Experimenters Kit X
3
X X X 229
TMDSDCDC8KIT Digital Power Developers Kit X
3
X X X 325
TMDSACDCKIT AC/DC Developers Kit X
3
X X X 695
TMDSRESDCKIT Resonant DC/DC Developers Kit X
3
X X X X 229
TMDSENRGYKIT Renewable Energy Developers Kit X
3
X X X 349
TMDS1MTRPFCKIT Motor Control and PFC Developers Kit X
3
X X X X 369
TMDS2MTRPFCKIT Dual Motor Control and PFC Developers Kit X
3
X X X X 399
TMDSEMU2000U TMS320C2000 Blackhawk USB JTAG Emulator X 299
TMDSEMU560PCI XDS560 Blackhawk PCI-Bus High-Performance JTAG Emulator X 2,995
TMDSEMU560U XDS560 Blackhawk USB High-Performance Emulator X 2,999
TMDSEMU560T XDS560 USB Trace Emulator X 9,995
TMDSEMU510U XDS510-Class USB Plus JTAG Emulator (SDI) X 1,595
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior
to placing orders. TI may verify final pricing prior to accepting any order.
2
C2000 target support only. DSP/BIOS kernel and C++ compiler are supported on C28x platform only.
4
Orderable part number will vary to specify European power cords
3
Code Composer Studio IDE is limited to use with the target hardware board ONLY.
5
Available at www.ti.com/omapsoftwareupdates with EVM registraiton
X = included L = Full featured Limited to 120 days
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Texas Instruments 3Q 2009 Embedded Processing Guide
60
Embedded Processing Support Resources
Support
Publications
eTech Innovations eNewsletter
Receive the latest
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cessing news
from TI including:
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port information.
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MCU NewsFlash
From ultra-low power MSP430 MCUs and
high-performance TMS320C2000 real-
time controllers, to 32-bit general-purpose
ARM7-based
MCUs, TI offers
designers the
broadest range of
embedded control
solutions, and pro-
vides you the lat-
est MCU news
updates via the
MCU NewsFlash,
published quarter-
ly. Subscribe at
www.ti.com/mcunewsflash.
Motor Control Newsletter
Get the latest information on motor-control
solutions from TI from the industrys
highest-performance optimized controllers
to leading analog
solutions designed
specifically for
motor-control
applications. Well
also update you
on the latest hard-
ware and software
tools to help
speed your designs to production.
www.ti.com/mcnews.
Technical Documentation
Find complete and easy-to-use data sheets,
users guides and application reports for
all TI DSP platforms and corresponding
DSP software development tools.
www.ti.com/techdocsdsg.
TI Product Information Center
(PIC)
Worldwide technical support staff are
available to answer questions and trou-
bleshoot problems. Contact the PIC by
e-mail or directly by phone. See the
worldwide contact information inside the
front cover for the e-mail and phone
number appropriate to your area.
www.ti.com/designsupport.
Tech-Working: TI E2E Online
Community
Interact with peers and engineers from TI
to solve design problems via forums, find
and share development tools in communi-
ty groups or network as you might in your
favorite social networking site. You can
also log-in to find/follow friends, add
favorites, comment, rate, change your
avatar and/or receive updates via your
personal feed. All while gaining valuable
knowledge for your current or next design.
e2e.ti.com.
Embedded Processing Support
Design Answers at Your Fingertips
Obtain additional information on training, technical documentation and more at: www.ti.com
Get to market easily and quickly by leveraging TI support. Customers can access fast and accurate support for their embedded applica-
tions. From Getting Started to technical documentation and much more, TI offers expanded technical support for DSP and MCU design
and development 24/7. Online training, webcasts, workshops, MCU Day and TI Technology Days provide convenient training choices.
Texas Instruments 3Q 2009 Embedded Processing Guide
Embedded Processing Support Resources
Support
61

DSP Support
Getting Started with TI DSP
TIs web-based Getting Started DSP
support tool helps engineers get their
designs from inspiration to implementation
quickly and easily. Designers choosing to
use TI DSPs in their real-time applications
get easy-to-access introductory DSP con-
tent, thus decreasing the learning curve
and speeding products to market.
www.ti.com/gettingstarteddsg.
Video Casts: Engineering in Front of
the Camera
TI provides a variety of quick videos, all
under five minutes, showcasing the
OMAP35x and DaVinci processors.
These on-demand video casts feature
complete platform information including
hardware, software, system block
diagrams and much more.
DM355 Video Casts The DM355
video casts give engineers the technical
meat on the DM355 processor and
solutions. Topics include: Codec Engine,
software, tools, an architectural overview
and discussions on the future of video.
www.ti.com/dm355videocasts.
DM6467 Video Casts View one or all
of the DM6467 video casts for a look at
why this DaVinci SoC is ideal for HD
transcoding. TI experts discuss the
future of transcoding, as well as the
DM6467 processor, DVEVM and video
surveillance.
www.ti.com/dm6467videocasts.
OMAP35x Video Casts Download the
newest video casts discussing the bene-
fits of the OMAP35x applications
processor and the Open Source
Community.
www.ti.com/omap35xvideocasts.
Podcasts
The podcasts feature industry news, tech-
nology updates and practical tips regard-
ing the latest innovations from TI in digital
signal processing. Check out the archive
at www.ti.com/podcasts.
Blogs
Check out the latest posts by TI DSP lead-
ers. Interesting, enlightening and opinion-
ated, theyll give you insight into trends at
TI and throughout the industry. See what
theyre saying at
www.ti.com/video360blogdsg.
DSP Webcasts
TI conducts free DSP webcasts to address
topics most critical to designers. A typical
webcast includes a presentation followed
by a question & answer session with the
technical engineering presenter specializ-
ing in the topic. After the live event, DSP,
OMAP and DaVinci technology webcasts
are available via the webcast archives.
www.ti.com/webcasts.
Open Source Software
TI sees open source as a means to drive
innovation, ultimately enabling our cus-
tomers to create market-leading devices
that push the envelope with performance
and advanced capabilities. TI participates
in a number of open source industry ini-
tiatives such as the Open Handset
Alliance, ARM

s Mobile Linux Initiative,

The Linux Foundation, GStreamer, Eclipse
and Helix, among others. This site will
serve to foster collaboration between TI
and the open source community and pro-
vides a list of ongoing open source proj-
ects we support.
opensource.ti.com.
Embedded Processors Wiki
The Embedded Processors Wiki provides a
collaborative environment for digital media
engineers using Texas Instruments
processors to share technical tips and
open source code. The Wiki is designed to
get you to market faster by shortening the
design knowledge ramp, assist other
developers innovate and foster a growth of
technology knowledge on hardware and
software.
www.ti.com/davinciwikidsg.
Microcontroller Support
New Interactive MCU Selection Tool
Try our new device selection tool to find
the right microcontroller with all the fea-
tures and functions you need.
www.ti.com/mcutool.
MCU Development Tools
Learn more about the great selection of
easy-to-use MCU development tools that
add functionality and speed your design
cycle. www.ti.com/msp430tools and
www.ti.com/controlstick.
Texas Instruments 3Q 2009 Embedded Processing Guide
Embedded Processing Support Resources
Support
62

Training Resources
Online Training Webcast Library One-Day Workshops Multi-Day Workshops
Get updated information on TI training resources at: www.ti.com/training
A variety of free online training courses
are available to you at your fingertips
24/7. Learn more about how to design
your signal processing application with
self-paced, online training courses cover-
ing DSP, DaVinci, MSP430, C2000
and analog applications, easy-to-use soft-
ware development tools and more.
Visit www.ti.com/onlinetrainingdsg for
more FREE courses!
Online Training
One-day workshops are introductory
courses designed to offer product or tech-
nology knowledge. These workshops
include a significant hands-on section and
are ideal introductions to get started with
TI DSPs and MCUs. Visit
www.ti.com/1dayworkshopsdsg for a
complete list of courses.
TMS320DM6437 DaVinci Technology
One-Day Workshop
In-depth look at the core device archi-
tecture of TMS320DM643x processors
and an overview of the software
infrastructure
Audio and video driver usage in
DSP/BIOS kernel and Linux-based
systems
Codec Engine framework
Capabilities of the DSP/BIOS kernel
and Linux operating systems
www.ti.com/dm64371dwdsg.
TMS320F2808 eZdsp One-Day
Workshop
Basic DSP controller implementation
TMS320F2808 controller architecture
How to use PC-based development
tools F2808 eZdsp and Code
Composer Studio IDE
System design
www.ti.com/f2808ezdsp1dwdsg.
TMS320F28335 eZdsp One-Day
Workshop
Basic digital signal controller
implementation
TMS320F28335 controller architecture
How to use PC-based development
tools F28335 eZdsp and Code
Composer Studio IDE
Peripheral programming and system
design
www.ti.com/eptraining.
C2000 Piccolo One-Day
Workshop
Overview of Piccolo F2802x devices
Basic system initialization
Peripheral set-up
Programming into Flash memory via
Flash plug-in utility
www.ti.com/eptraining.
MSP430 One-Day Workshop
MSP430 introduction
MSP430 nuts and bolts
Ultra-low power concept
Analog peripherals
Timing and communication
www.ti.com/eptraining.
The library contains a variety of webcasts
ranging from technical How-Tos to sys-
tems solution presentations and product
overviews which address current topics
most critical to designers. Designed for
24/7 access worldwide via the Web, these
webcasts typically last one hour. Each
includes a presentation followed by a
Question & Answer session with the tech-
nical engineering presenter specializing in
the topic. To access the library, visit
www.ti.com/webcastsdsg.
DSP Webcast Library
TI Technology Days include technical
design seminars that focus on the tech-
niques of practical design applications
illustrated along with technology exhibits.
The sessions include topics within multiple
tracks on analog signal chain, digital sig-
nal processing, low-power RF, microcon-
trollers and power management. There are
also representatives available at various
booths for dialog on specific TI products.
www.ti.com/techdays2009.
TI Technology Days
One-Day Workshops
Texas Instruments 3Q 2009 Embedded Processing Guide
Embedded Processing Support Resources
Support
63

Three- or four-day, hands-on, advanced,

educational courses are highly technical
and designed for engineers who want to
sharpen their design and development
skills. Managed by TIs technical training
staff, these workshops include extensive
hands-on labs emphasizing the
demonstration and application of
techniques and skills.
TMS320DM644x DaVinci
Technology Workshop
Introduction to DaVinci technology:
device, software and tools
Application layer programming
Signal-processing layer programming
Advanced system programming details
www.ti.com/dm644xmdwdsg.
TMS320DM64x Video System
Integration Workshop
TMS320DM642 hardware
Code Composer Studio IDE
introduction
DSP/BIOS kernel introduction
Reference frameworks
Video basics
Video peripherals
Using and modifying the FVID driver
Optimizations
Audio
Communications
www.ti.com/dm64xmdwdsg.
TMS320C6000 DSP Optimization
Workshop
C6000 DSP architecture and pipeline
Introduction to Code Composer
Studio IDE using C programs
Optimizing code
Software pipelining techniques
Numerical issues with fixed-point
processors
Writing high-speed interruptible code
Internal memory and cache
www.ti.com/c6000optmdwdsg.
TMS320C645x DSP System
Integration Workshop
Architectural overview
Code Composer Studio IDE basics
Introduction to DSP/BIOS kernel
Basic memory setup, PLL, CSL 3.0
Interrupts
EDMA 3.0
Using the EMAC/NDK
Serial RapidIO

and MSGQ
Optimizing your code/system
System design considerations
www.ti.com/c645xmdwdsg.
TMS320C64x/C67x DSP System
Integration Workshop
Use Code Composer Studio Platinum
Edition 3.1 IDE
Design a real-time double-buffered
system
DSP/BIOS kernel scheduling
McBSP serial ports multi-channel
features
EDMAs advanced features
Evaluate and use C6000 boot loader
Setting up a bootable image in
Flash ROM
www.ti.com/c64xc67xmdwdsg.
DSP/BIOS OS Design Workshop
Real-time system concepts
Work with software development tools
provided by Code Composer Studio IDE
and TMS320C6416 DSP
Software interrupts (SWI)
Multi-tasking
Communicating with tasks
Writing device drivers
Memory management/dynamic object
creation capabilities
www.ti.com/dspbiosmdwdsg.
TMS320C28x DSP Workshop
Architectural overview
Programming development environment
Peripheral register header files
Reset and interrupts system
Initialization analog-to-digital
Converter control peripherals
Numerical concepts and IQMath
Using DSP/BIOS kernel
System design communications
www.ti.com/c28xmdwdsg.
Digital Power Multi-Day Workshop
Introduction to digital power
Digital PSU and controller design using
the C2000 controller
Digital compensator design
Running multiple stand-alone power
supplies from Flash
Registration
To register for these workshops, please
visit www.ti.com/multidayworkshopsdsg.
Multi-Day Workshops
Texas Instruments 3Q 2009 Embedded Processing Guide
TI Embedded Processor Device Nomenclature
64

Texas Instruments embedded processor device nomenclature

includes a prefix (signifying the device qualification status), the
device family number (i.e., 320 or 32 for TI DSPs), a technology
symbol, the device number (typically three to five alpha-numeric
characters), a two- or three-character package type code, an
optional temperature range character, and the device speed des-
ignation. Other variations do exist on a limited basis. See the spe-
cific device data sheet for additional information on device
nomenclature for that device.
For the most updated information, visit www.ti.com
TMS
MSP
X
TMS320
320
430
OMAP3530
F 28027
Prefix
Prefix
Prefix
Device Family
TMX
TMS
MSP
XMS
X
P
null
TMS
F
C
280x/281x/282x
2802x/2803x
283x
= Experimental device
= Qualified device
= Mixed-signal processor
= Experimental silicon
= Experimental device
= Prototype device
= Production device
= TMS320 MCU Family
= Flash EEPROM
= ROM
F
C
P
= Flash
= ROM
= OTP
= Fixed-Point Series
= Piccolo Series
= Delfino Floating-Point Series
Device Speed Range
Optional
Package
Temperature Range (Junction)
Temperature Range
Silicon Revision
Silicon Revision
Temperature Range
Package Type
Package Type
Package Type
4 = 400 MHz
5 = 500 MHz
6 = 600 MHz
R = Tape & Reel
Blank = Revision 1.3
Device Family
Device Family
320 = TMS320 DSP family
430 = 430 MCU platform
Blank
Q
R
S
ZWT
ZDU
CBB
CUS
A
T
S
Q
= 0C to 90C, Commercial Grade
= 40C to 125C, Automotive Grade
= 0C to 90C, Commercial Grade (Tape and Reel)
= 40C to 125C, Automotive Grade (Tape and Reel)
= 361-pin plastic BGA, with Pb-Free soldered balls
= 376-pin plastic BGA, with Pb-Free soldered balls (Green)
= 515-pin PGBA
= 423-pin PBGA
= 40C to 85C
= 40C to 105C
= 40C to 125C
= 40C to 125C (AEC-Q100)
Technology
Memory Type
Device
Technology
Device Number
DM = Digital media
C64x+ DSP:
6437
6435
6433
6431
DM
F G
( )
I
B
ZGM
6437
6 19 4
ZWT
QZW
CBB
A
( )
R
6
Device
Typical Digital Signal Processor Nomenclature
MSP430 Part Number Nomenclature
Typical Applications Processor Nomenclature
TMS320C2000 Microcontroller Nomenclature
I
T
= 40C to 85C
= 40C to 105C
G
E
W
1xx
2xx
3xx
4xx
5xx
= Medical
= E-Meter
= Water Meter
Series of Similar Function
Family Optional: Special Function
Optional: Special Function
Memory size and
Peripherals configuration
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Linear and Logic Products
65

Analog Switch
Provide a high-speed bidirectional
bus interface between DSPs, CPUs,
industry standard buses, memory
and peripherals.
TIs analog switches are designed to
pass (or isolate) analog signals (both
voltage and current) and support
analog applications such as audio
and video data transmission.
TIs TS product family encompasses
a variety of analog switches with dif-
ferent ON resistances, bandwidth,
charge injection and total harmonic
distortion to target any application.
Voltage Level Translation
Interfacing any low-voltage compo-
nent with legacy, high-voltage devices.
Protects a DSP that has non-
over-voltage tolerant inputs.
These dual-supply devices allow for
bidirectional level translation be-
tween different voltage nodes from
1.2 V to 3.6 V and 1.65 V to 5.5 V.
I/O Expansion
TIs I
2
C I/O expanders allow system
layout to be greatly simplified.
Two-wire bus reduces PCB com-
plexity through trace reduction and
routing simplification.
Bus Interface Products
The LVC and ALVC families offer V
CC
fully specified to match the needs of
the TMS320 DSP family:
3.3 V, 2.5 V and 1.8 V.
Broad range of surface mount pack-
aging options from SOIC to BGA.
Propagation delays of 3 ns and
below.
Bus hold on data inputs decreases
system component count by elimi-
nating the need for external pull-up/
pull-down resistors.
Analog Switches for TMS320 DSPs
Ron Ron
Ron Flatness Mismatch V+ (V) V+ (V) ON Time OFF Time
Device (max) (max) (max) (min) (max) (ns) (max) (ns) (max) Pins / Package
SPST
TS5A3166 0.9 0.15 1.65 5.5 7 11.5 5/SC70, SOT-23, WCSP
TS5A3167 0.9 0.15 1.65 5.5 7 11.5 5/SC70, SOT-23, WCSP
TS5A4594 8 1.5 2.7 5.5 17 14 5/SC70, SOT-23
TS5A4595 8 1.5 2.7 5.5 17 14 5/SC70, SOT-23
TS5A4596 8 1.5 2.7 5.5 17 14 5/SC70, SOT-23
TS5A4597 8 1.5 2.7 5.5 17 14 5/SC70, SOT-23
TS5A1066 10 5 1.65 5.5 5.5 4.5 5/SC70, SOT-23, WCSP
SPST x 2
TS5A23166 0.9 0.25 0.1 1.65 5.5 7.5 11 8/US8, WCSP
TS5A23167 0.9 0.25 0.1 1.65 5.5 7.5 11 8/US8, WCSP
TS3A4741 0.9 0.4 0.05 1.65 3.6 14 9 8/MSOP
TS5A2066 10 5 1 1.65 5.5 5.8 3.6 8/SM8, US8, WCSP
SPST x 4
TS3A4751 0.9 0.4 0.05 1.65 3.6 14 9 14/TSSOP
SPDT
TS5A6542 0.75 0.25 0.25 2.25 5.5 25 20 8/WCSP
TS5A4624 0.9 0.25 0.1 1.65 5.5 22 8 6/SC70
TS5A3153 0.9 0.15 0.1 1.65 5.5 16 15 8/US8, WCSP
TS5A3154 0.9 0.15 0.1 1.65 5.5 8 12.5 8/US8, WCSP
SPST x 4
TS3A4751 0.9 0.4 0.05 1.65 3.6 14 9 14/TSSOP
SPDT
TS5A6542 0.75 0.25 0.25 2.25 5.5 25 20 8/WCSP
TS5A4624 0.9 0.25 0.1 1.65 5.5 22 8 6/SC70
TS5A3153 0.9 0.15 0.1 1.65 5.5 16 15 8/US8, WCSP
TS5A3154 0.9 0.15 0.1 1.65 5.5 8 12.5 8/US8, WCSP
TS5A3159A 0.9 0.25 0.1 1.65 5.5 30 20 6/SC70, SOT-23, WCSP
TS5A3159 1.1 0.15 0.1 1.65 5.5 35 20 6/SC70, SOT-23
TS5A3160 0.9 0.25 0.1 1.65 5.5 6 13 6/SC70, SOT-23
TS5A3157 10 5 0.2 1.65 5.5 8.5 6.5 6/SC70, SOT-23, WCSP
TS5A63157 10 2 0.14 1.65 5.5 5 3.4 6/SC70, SOT-23
TS5A2053 13.8 4.5 4.5 1.65 5.5 6.8 4.1 8/SM8, US8
SPDT x 2
TS5A23159 0.9 0.25 0.1 1.65 5.5 13 8 10/MSOP, QFN
TS5A23160 0.9 0.25 0.1 1.65 5.5 5.5 10 10/MSOP
TS5A23157 10 4(typ) 0.15 (typ) 1.65 5.5 5.7 3.8 10/MSOP, QFN
SPDT x 4
TS3A5018 10 7 0.8 1.65 3.6 8 6.5 16/SOIC, SSOP (QSOP), TSSOP, TVSOP, QFN
SP3T
TS5A3359 0.9 0.25 0.1 1.65 5.5 21 10.5 8/US8
TS5A3357 15 6.5 (typ) 0.1 (typ) 1.65 5.5 6.5 3.7 8/SM8, US8
SP4T x 2
TS3A5017 12 9 2 2.3 3.6 9.5 3.5 16/SOIC, SSOP (QSOP), TSSOP, TVSOP, QFN
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Linear and Logic Products
66

Voltage-Level Translation
Single-Supply Translators
Device Bits Trans Low (V) Trans High (V) V
CC
(V) DIR Pins Bus Hold OE Pins t
pd
(max) (ns)
SN74AUP1T57 3 2.5 3.3 2.33.6 No No No 6.2
SN74AUP1T58 3 2.5 3.3 2.33.6 No No No 6.2
SN74AUP1T97 3 2.5 3.3 2.33.6 No No No 6.2
SN74AUP1T98 3 2.5 3.3 2.33.6 No No No 6.2
Dual-Supply Translators
Device Bits Trans Low (V) Trans High (V) V
CCA
(V) V
CCB
(V) DIR Pins Bus Hold OE Pins t
pd
(max) (ns)
TXB0101 1 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 4.5
TXB0102 2 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 4.5
TXB0104 4 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 4
TXB0104-Q1 4 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 7
TXB0106 6 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 4
TXB0108 8 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 4
TXS0101 1 1.8 5 1.65 to 3.6 2.3 to 5.5 Auto No 1 7.5
TXS0102 2 1.8 5 1.65 to 3.6 2.3 to 5.5 Auto No 1 4.6
TXS0104E 4 1.8 5 1.65 to 3.6 2.3 to 5.5 Auto No 1 4.6
TXS0108E 8 1.2 5 1.2 to 3.6 1.65 to 5.5 Auto No 1 4.8
SN74AVC1T45 1 1.2 3.3 1.2 to 3.6 1.2 to 3.6 1 No No 2.8
SN74AVC2T45 2 1.2 3.3 1.2 to 3.6 1.2 to 3.6 1 No No 2.4
SN74AVCH1T45 1 1.2 3.3 1.2 to 3.6 1.2 to 3.6 1 Yes No 2.8
SN74AVCH2T45 2 1.2 3.3 1.2 to 3.6 1.2 to 3.6 1 Yes No 2.4
SN74AVC2T245 2 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 No 1 2.4
SN74AVC4T245 4 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 No 2 2.9
SN74AVC8T245 8 1.2 3.3 1.2 to 3.6 1.2 to 3.6 1 No 1 2.5
SN74AVC16T245 16 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 No 2 2.7
SN74AVC20T245 20 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 No 2 2.9
SN74AVC24T245 24 1.2 3.3 1.2 to 3.6 1.2 to 3.6 6 No 6 2.7
SN74AVC32T245 32 1.2 3.3 1.2 to 3.6 1.2 to 3.6 4 No 4 2.7
SN74AVCH4T245 4 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 Yes 2 2.9
SN74AVCH8T245 8 1.2 3.3 1.2 to 3.6 1.2 to 3.6 1 Yes 1 2.5
SN74AVCH16T245 16 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 Yes 2 2.7
SN74AVCH20T245 20 1.2 3.3 1.2 to 3.6 1.2 to 3.6 2 Yes 2 2.9
SN74AVCH24T245 24 1.2 3.3 1.2 to 3.6 1.2 to 3.6 6 Yes 6 2.7
SN74AVCH32T245 32 1.2 3.3 1.2 to 3.6 1.2 to 3.6 4 Yes 4 2.7
SN74AVC4T774 4 1.2 3.3 1.2 to 3.6 1.2 to 3.6 4 No 1 2.4
SN74LVC1T45 1 1.8 5 1.65 to 5.5 1.65 to 5.5 1 No No 3.9
SN74LVC2T45 2 1.8 5 1.65 to 5.5 1.65 to 5.5 1 No No 3.9
SN74LVC8T245 8 1.8 5 1.65 to 5.5 1.65 to 5.5 1 No 1 4.2
SN74LVCH8T245 8 1.8 5 1.65 to 5.5 1.65 to 5.5 1 Yes 1 4.2
SN74LVC16T245 16 1.8 5 1.65 to 5.5 1.65 to 5.5 2 No 2 4.2
SN74LVCH16T245 16 1.8 5 1.65 to 5.5 1.65 to 5.5 2 Yes 2 4.2
Design Considerations
Supply voltages continue to migrate to
lower nodes to support todays low-power,
high-performance applications. While
some devices are capable of running at
lower supply nodes, others might not have
this capability. To have switching capability
between these devices, the output of each
driver must be compliant with the input of
the receiver that it is driving.
Why use a voltage-level translator?
Easily interface between subsystems
operating with different supply voltages
Provide migration paths from old archi-
tectures to new architectures
For two devices to have switching
capability:
V
OH
of the driver must be greater than
the V
IH
of the receiver
V
OL
of the driver must be less than the
V
IL
of the receiver
The output voltage from the driver must
not exceed the I/O voltage tolerance of
the receiver
ASIC
I/O
Devices
TI Level
Translation
Solution
*VCCA not equal to VCCB
VCCA* VCCB*
Typical situation in which a level translator is
needed.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Linear and Logic Products
67

Low-Voltage I /O Expanders Selection Guide

Max Bit or Additional Features I/O Type
Frequency I
2
C V
CC
Range Channel Low Configuration 5-V-Tolerant Push- Open-
Device (kHz) Address (V) Width Power Interrupt Reset Registers I/O Pull Drain
TCA6408A 400 0100 00x 1.65 to 5.5 8-bit
TCA6416A 400 0100 00x 1.65 to 5.5 16-bit
Preview products are listed in bold blue.
I /O Expanders Selection Guide
Max Bit or Additional Features I/O Type
Frequency I
2
C V
CC
Range Channel Low Configuration 5-V-Tolerant Push- Open-
Device (kHz) Address (V) Width Power Interrupt Reset Registers I/O Pull Drain
PCA9536 400 1000 001 2.3 to 5.5 4-bit
PCA6107 400 0011 xxx 2.3 to 5.5 8-bit
PCA9534 400 0100 xxx 2.3 to 5.5 8-bit
PCA9534A 400 0111 xxx 2.3 to 5.5 8-bit
PCA9538 400 1110 0xx 2.3 to 5.5 8-bit
PCA9554A 400 0111 xxx 2.3 to 5.5 8-bit
PCA9554 400 0100 xxx 2.3 to 5.5 8-bit
PCA9557 400 0011 xxx 2.3 to 5.5 8-bit
PCA9535 400 0100 xxx 2.3 to 5.5 16-bit
PCA9539 400 1110 1xx 2.3 to 5.5 16-bit
PCA9555 400 0100 xxx 2.3 to 5.5 16-bit
PCF8574 100 0100 xxx 2.5 to 6.0 8-bit
PCF8574A 100 0111 xxx 2.5 to 6.0 8-bit
PCF8575 400 0100 xxx 2.5 to 5.5 16-bit
PCF8575C 400 0100 xxx 4.5 to 5.5 16-bit
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Linear and Logic Products
68 68

LED Driver Selection Guide

Max Bit or Additional Features I/O Type
Frequency I
2
C V
CC
Range Channel No. of Enable Dimming and Brightness 5-V Tolerant Push- Open-
Device (kHz) Address (V) Width PWMs Interrupt Pin Control Registers I/O Pull Drain
TCA6507 400 100 0101 1.65 to 3.6 7-channel 2
Little Logic for TMS320 DSPs
Supply t
pd max
Package
Device Description Voltage (ns) (Number of Pins)
SN74AUC1G00 Single 2-input positive-NAND gate 1.8 V 2.5 SOT, DSBGA (5)
SN74AUC1G04 Single inverter gate 1.8 V 2.5 SOT, DSBGA (5)
SN74AUC1G07 Single buffer/driver with open-drain output 1.8 V 2.5 SOT, DSBGA (5)
SN74AUC1G08 Single 2-input positive-AND gate 1.8 V 2.5 SOT, DSBGA (5)
SN74AUC1G14 Single Schmitt-Trigger inverter 1.8 V 2.8 SOT, DSBGA (5)
SN74AUC1G32 Single 2-input positive-OR gate 1.8 V 2.5 SOT, DSBGA (5)
SN74AUC1G79 Single positive-edge-triggered D-type flip-flop 1.8 V 1.9 SOT, DSBGA (5)
SN74AUC1G125 Single bus buffer gate with 3-state output 1.8 V 2.5 SOT (5), DSBGA (5)
SN74AUP1G08 Low-power single 2-input positive-AND gate 3.3 V 4.2 SOT (5), DSBGA (5)
SN74AUP1G57 Low-power configurable multiple-function gate 3.3 V 5.3 SOT (6), DSBGA (6)
SN74AUP1G58 Low-power configurable multiple-function gate 3.3 V 5.3 SOT (6), DSBGA (6)
SN74AUP1G97 Low-power configurable multiple-function gate 3.3 V 5.3 SOT (6), DSBGA (6)
SN74AUP1G98 Low-power configurable multiple-function gate 3.3 V 5.3 SOT (6), DSBGA (6)
Little Logic
Ability to place a single gate in
critical locations provides for simpli-
fied routing and board space savings
Single gates also provide easy state
change for control inputs
The NanoStar package provides
the industrys smallest logic package
Bus Interface for TMS320 DSPs
Supply t
pd max
Package
Device Description Voltage (ns) (Number of Pins)
SN74ALVC16244A 16-bit buffer/driver with 3-state outputs 3.3 V 3 TSSOP, SSOP(48) / VFBGA(56)
SN74ALVCH16244 16-bit buffer/driver with 3-state outputs 3.3 V 3 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74ALVCH16245 16-bit bus transceiver with 3-state outputs 3.3 V 3 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74ALVCH16373 16-bit transparent D-type latch with 3-state outputs 3.3 V 3.6 TSSOP, SSOP(48) / VFBGA(56)
SN74ALVCH16374 16-bit edge-triggered D-type flip-flop with 3-state outputs 3.3 V 4.2 TSSOP, SSOP(48) / VFBGA(56)
SN74ALVC16835 18-bit Universal Bus driver with 3-state outputs 3.3 V 3.6 TSSOP, TVSOP, SSOP, VFBGA(56)
SN74ALVCH16835 18-bit Universal Bus driver with 3-state outputs 3.3 V 3.6 TSSOP, TVSOP, SSOP, VFBGA(56)
SN74ALVCH162244 16-bit buffer/driver with 3-state outputs 3.3 V 4.2 TSSOP, SSOP(48)
SN74ALVCH162374 16-bit edge-triggered D-type flip-flop with 3-state outputs 3.3 V 4.6 TSSOP, SSOP(48)
SN74ALVC162835 18-bit Universal Bus driver with 3-state outputs 3.3 V 4.2 TSSOP, TVSOP, SSOP(56)
SN74ALVCH162835 18-bit Universal Bus driver with 3-state outputs 3.3 V 4.2 TSSOP, TVSOP, SSOP(56)
SN74LVC16244A 16-bit buffer/driver with 3-state outputs 3.3 V 4.1 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVCH16244A 16-bit buffer/driver with 3-state outputs 3.3 V 4.1 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVC16245A 16-bit bus transceiver with 3-state outputs 3.3 V 4 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVCH16245A 16-bit bus transceiver with 3-state outputs 3.3 V 4 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVC16373A 16-bit transparent D-type latch with 3-state outputs 3.3 V 4.2 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVCH16373A 16-bit transparent D-type latch with 3-state outputs 3.3 V 4.2 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVC16374A 16-bit edge-triggered D-type flip-flop with 3-state outputs 3.3 V 4.5 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
SN74LVCH16374A 16-bit edge-triggered D-type flip-flop with 3-state outputs 3.3 V 4.5 TSSOP, TVSOP, SSOP(48) / VFBGA(56)
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Data Converters
69

Device Description C28x DSP C54x DSP C55x DSP C67x DSP C64x DSP
ADCs
ADS1216 24-bit, 8-ch, 0.78kSPS, 5 V X X X
ADS1217 24-bit, 8-ch, 0.78kSPS, 3.3 V X X X
ADS1218 24-bit, 8-ch, 0.78kSPS, with flash X X X
ADS1240 24-bit, 4-ch, 15SPS X X
ADS1241 24-bit, 8-ch, 15SPS X X
ADS1246 24-bit, 1-ch (diff), 2kSPS X
1
X
1
X
1
ADS1247 24-bit, 2-ch (diff), 2kSPS X
1
X
1
X
1
ADS1248 24-bit, 4-ch (diff), 2kSPS X
1
X
1
X
1
ADS1251 24-bit, 1-ch (diff), 20kSPS X X X
ADS1252 24-bit, 1-ch (diff), 40kSPS X X X
ADS1253 24-bit, 4-ch (diff), 20kSPS, 1.83.6 V X X
ADS1254 24-bit, 4-ch (diff), 40kSPS, 5 V X X
ADS1256 24-bit, 8-ch, 30kSPS, very low noise X
1
X
1
X
1
ADS1258 24-bit, 16-ch, 125kSPS, fast channel cycling X
1
X
1
X
1
ADS1271 24-bit, 1-ch, 105kSPS X
1

ADS1274 24-bit, 4-ch, 128kSPS, simultaneous sampling X

1
X
1
X
1
ADS1278 24-bit, 8-ch, 128kSPS, simultaneous sampling X
1
X
1
X
1
ADS1601 16-bit, 1-ch, 1.25MSPS X
1
X
1
X
1
ADS1602 16-bit, 1-ch, 2.5MSPS X
1
X
1
X
1
ADS1605 16-bit, 1-ch (diff), 5MSPS, 3.3-V I/O, 5-V analog X
1
X
1
X
1
ADS1606 16-bit, 1-ch (diff), 5MSPS, 16-word FIFO X
1
X
1
X
1
ADS1610 16-bit, 1-ch (diff), 10MSPS, 3.3-V I/O, 5-V analog X
1
X
1
X
1
ADS1625 18-bit, 1-ch (diff), 1.25MSPS, 3.3-V I/O, 5-V analog X
1
X
1
X
1
ADS1626 18-bit, 1-ch (diff), 1.25MSPS, 16-word FIFO X
1
X
1
X
1
ADS7804 12-bit, 1-ch, 100kSPS, 10-V input range X X
1
X
1
X
1
ADS7805 16-bit, 1-ch, 100kSPS, 10-V input range X X
1
X
1
X
1
ADS7816 12-bit, 1-ch, 200kSPS X
1
X
1
X
1
ADS7817 12-bit, 1-ch, 200kSPS X
1
X
1
X
1
ADS7818 12-bit, 1-ch, 500kSPS X
1
X
1
X
1
ADS7822 12-bit, 1-ch, 200kSPS X
1
X
1
X
1
ADS7826 10-bit, 1-ch, 200kSPS X
1
X
1
X
1
ADS7827 8-bit, 1-ch, 250kSPS X
1
X
1
X
1
ADS7829 12-bit, 1-ch, 125kSPS, 2.7 V, microPower X X
1
X
1
X
1
ADS7834 12-bit, 1-ch, 500kSPS X
1
X
1
X
1
ADS7835 12-bit, 1-ch, 500kSPS X
1
X
1
X
1
ADS7841 12-bit, 4-ch, 200kSPS X
1
X
1
X
1
X
1
ADS7861 12-bit, 2+2-ch, 500kSPS, simultaneous sampling X X X X X
ADS7864 12-bit, 32-chs, 500kSPS, simultaneous sampling X
1
X
1
ADS7881 12-bit, 1-ch, 4MSPS, int. reference X
1
X
1
X
1
ADS7886 12-bit, 1-ch, 1MSPS X X
1
X
1
X
1
ADS7891 14-bit, 1-ch, 3MSPS, int. reference X
1
X
1
X
1
ADS8320 16-bit, 1-ch, 100kSPS, 2.75.25 V X
1
X
1
X
1
ADS8321 16-bit, 1-ch, 100kSPS, 4.755.25 V X
1
X
1
X
1
ADS8322 16-bit, 1-ch (diff), 500kSPS, 5 V X
1
X
1
X
1
ADS8323 16-bit, 1-ch (diff), 500kSPS, 5 V X
1
X
1
X
1
ADS8324 14-bit, 1-ch, 50kSPS, 1.83.6 V X X
1
X
1
X
1
ADS8325 16-bit, 1-ch, 100kSPS , 2.75.5 V X X
1
X
1
X
1
ADS8328 16-bit, 2-ch, 500kSPS X
1
X
1
X
1
ADS8330 16-bit, 2-ch, 1MSPS X
1
X
1
X
1
ADS8361 16-bit, 2+2-ch, 500kSPS, simultaneous sampling X X X X X
ADS8364 16-bit, 6-ch, 250kSPS X
1
X
1
X
1
ADS8370 16-bit, 1-ch, 600kSPS, unipolar pseudo diff, int. ref. X
1
X
1
X
1
ADS8371 16-bit, 1-ch, 750kSPS, unipolar input micro power X
1
X
1
X
1
1
Includes DMA support. New devices are listed in bold red.
NOTE: An X indicates that the data converter plug-in generates the interface software for the specified TMS320 DSP generation, which not only
configures the data converter, but also the DSP peripheral the device is connected to (e.g., the serial port or the memory interface). If no X is
present, only the register settings, but no interface functions, are generated.
Data Converters Plug-In for
Texas Instruments Code
Composer Studio IDE
TIs Data Converter Plug-In (DCP) is a
free development tool that allows the
creation of initialization data and con-
figuration software for TI data convert-
ers from within the Integrated
Development Environment (IDE) of
Code Composer Studio. It provides
easy-to-use windows for point-and-
click data converter configuration
from within the IDE, preventing illegal
combinations of settings. The DCP dia-
log allows the user to select all the dif-
ferent settings for the data converter
from a single screen and to automati-
cally generate the interface software
with a single mouse click. The generat-
ed well-documented C-source files
contain all functions necessary to talk
to the external data converter and to
set up all of the registers internal to
this device. The minimum function set
includes read/write functions (single
words and blocks of data), initialization
functions and data structures and
some device-specific functions like
power down.
The generated code is to a great
extent hardware independent, so it can
be used together with the analog eval-
uation modules (EVMs) from our mod-
ular EVM system, our DSP Starter Kits
(DSKs) or with your own custom board.
To download your free 3.5 version of
the Data Converter Plug-In for Code
Composer Studio IDE, please go to
www.ti.com/dcplug-in.
New devices are added to the tool on a
regular basis.
For More Information
For additional information on TI data
converters, visit
www.ti.com/dataconverters.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Data Converters
70

Device Description C28x DSP C54x DSP C55x DSP C67x DSP C64x DSP
ADCs (Continued)
ADS8372 16-bit, 1-ch (diff), 600kSPS, pseudo bipolar, int. ref. X
1
X
1
X
1
ADS8380 18-bit, 1-ch, 600kSPS, unipolar pseudo diff, int. ref. X
1
X
1
X
1
ADS8381 18-bit, 1-ch, 580kSPS X
1
X
1
X
1
ADS8382 18-bit, 1-ch (diff), 600kSPS, pseudo bipolar, int. ref. X
1
X
1
X
1
ADS8383 18-bit, 1-ch, 500kSPS X
1
X
1
X
1
ADS8401 16-bit, 1-ch, 1.25MSPS, unipolar input X X
1
X
1
X
1
ADS8402 16-bit, 1-ch, 1.25MSPS, bipolar input X X
1
X
1
X
1
ADS8405 16-bit, 1-ch, 1.25MSPS, unipolar input X X
1
X
1
X
1
ADS8406 16-bit, 1-ch, 1.25MSPS, bipolar input X X
1
X
1
X
1
ADS8411 16-bit, 1-ch, 2MSPS, unipolar input X
1
X
1
X
1
ADS8412 16-bit, 1-ch, 2MSPS, bipolar input X
1
X
1
X
1
ADS8422 16-bit, 1-ch, 4MSPS, pseudo-bipolar, differential input X
1
X
1
X
1
ADS8472 16-bit, 1-ch, 1MSPS, pseudo-bipolar, differential input X
1
X
1
X
1
ADS8481 16-bit, 1-ch, 1MSPS, pseudo-differential, unipolar input X
1
X
1
X
1
ADS8482 16-bit, 1-ch, 1MSPS, pseudo-biploar, fully differential input X
1
X
1
X
1
ADS8504 12-bit, 1-ch, 250kSPS, 10-V input range X X
1
X
1
X
1
ADS8505 16-bit, 1-ch, 250kSPS, 10-V input range X X
1
X
1
X
1
PCM1804 24-bit, stereo, 192kHz, audio ADC X X X
1
X
1
PCM4202 24-bit, stereo, 192kHz, audio ADC X X X
1
X
1
PCM4204 24-bit, 4-ch, 216kHz, audio ADC X
1

THS10064 10-bit, 4-ch, 6MSPS, 16-word FIFO X X X

1
X
1
X
1
THS1007 10-bit, 4-ch, 8MSPS
THS10082 10-bit, 2-ch, 8MSPS, 16-word FIFO X X X
1
X
1
X
1
THS1009 10-bit, 2-ch, 8MSPS
THS1206 12-bit, 4-ch, 6MSPS, 16-word FIFO X X X
1
X
1
X
1
THS1207 12-bit, 4-ch, 8MSPS
THS12082 12-bit, 2-ch, 8MSPS, 16-word FIFO X X X
1
X
1
X
1
THS1209 12-bit, 2-ch, 8MSPS
THS1401 14-bit, 1-ch, 1MSPS
THS1403 14-bit, 1-ch, 3MSPS
THS1408 14-bit, 1-ch, 8MSPS
THS14F01 14-bit, 1-ch, 1MSPS, 32-word FIFO
THS14F03 14-bit, 1-ch, 3MSPS, 32-word FIFO
TLC1514 10-bit, 4-ch, 400kSPS
TLC1518 10-bit, 8-ch, 400kSPS
TLC2551 12-bit, 1-ch, 400kSPS, 5 V X
TLC2552 12-bit, 2-ch, 175kSPS, 5 V X
TLC2554 12-bit, 4-ch, 400kSPS
TLC2555 12-bit, 1-ch, 175kSPS, 5 V X
TLC2558 12-bit, 8-ch, 400kSPS
TLC2574 12-bit, 4-ch, 200kSPS, 5 V X
TLC2578 12-bit, 8-ch, 200kSPS, 5 V X
TLC3541 14-bit, 1-ch, 200kSPS, 5V X X
TLC3544 14-bit, 4-ch, 200kSPS, 5 V X
TLC3545 14-bit, 1-ch (diff), 200kSPS, 5 V X X
TLC3548 14-bit, 8-ch, 200kSPS, 5 V X
TLC3574 14-bit, 4-ch, 200kSPS, 5 V X
TLC3578 14-bit, 8-ch, 200kSPS, 5 V X
TLC4541 16-bit, 1-ch, 200kSPS, 5 V X X
TLC4545 16-bit, 1-ch (diff), 200kSPS, 5 V X X
TLV1504 10-bit, 4-ch, 200kSPS X X
TLV1508 10-bit, 8-ch, 200kSPS X X
TLV1570 10-bit, 8-ch, 1.25MSPS X X
1
Includes DMA support. New devices are listed in bold red.
NOTE: An X indicates that the data converter plug-in generates the interface software for the specified TMS320 DSP generation, which not only configures the data converter, but also the DSP
peripheral the device is connected to (e.g., the serial port or the memory interface). If no X is present, only the register settings, but no interface functions, are generated.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Data Converters
71

Device Description C28x DSP C54x DSP C55x DSP C67x DSP C64x DSP
ADCs (Continued)
TLV1571 10-bit, 1-ch, 1.25MSPS X X
1

TLV1572 10-bit, 1-ch, 1.25MSPS, 2.55.5 V X

TLV1578 10-bit, 8-ch, 1.25MSPS X X
1

TLV2541 12-bit, 1-ch, 200kSPS, 2.75.5 V X

TLV2542 12-bit, 2-ch, 140200kSPS, 2.75.5 V X
TLV2544 12-bit, 4-ch, 200kSPS X X
1

TLV2545 12-bit, 1-ch, 140-200kSPS, 2.75.5 V X

TLV2548 12-bit, 8-ch, 200kSPS X X
1

TLV2553 12-bit, 11-ch, 200kSPS , 2.75 V X X X X X

TLV2556 12-bit, 11-ch, 200kSPS, 2.75V, int. reference X X X X X
1
Includes DMA support.
NOTE: An X indicates that the data converter plug-in generates the interface software for the specified TMS320 DSP generation, which not only configures the data converter, but also the DSP
peripheral the device is connected to (e.g., the serial port or the memory interface). If no X is present, only the register settings, but no interface functions, are generated.
Device Description C28x DSP C54x DSP C55x DSP C67x DSP C64x DSP
DACs
DAC1220 16-bit, 1-ch, 2 ms
DAC1221 16-bit, 1-ch, 2 ms
DAC7512 12-bit, 1-ch, 10s, 2.75.5 V, int. reference
DAC7513 12-bit, 1-ch, 10s, 2.75.5 V
DAC7551 12-bit, 1-ch, 5s, ultra-low glitch X X
1
X
1
X
1
DAC7552 12-bit, 2-ch, 5s, ultra-low glitch X X
1
X
1
X
1
DAC7554 12-bit, 4-ch, 5s, 2.75.5 V X X
1
X
1
X
1
X
1
DAC8501 16-bit, 1-ch, 10s, 2.75.5 V, MDAC X X X
1
X
1
X
1
DAC8531 16-bit, 1-ch, 10s, 2.75.5 V X X X
1
X
1
X
1
DAC8532 16-bit, 2-ch, 10s, 2.75.5 V X X X
1
X
1
X
1
DAC8534 16-bit, 4-ch, 10s, 2.75.5 V X X X
1
X
1
X
1
DAC8551 16-bit, 1-ch, 5s, ultra-low glitch X X
1
X
1
X
1
DAC8552 16-bit, 2-ch, 10s, ultra-low glitch X X
1
X
1
X
1
DAC8554 16-bit, 4-ch, 10s, ultra-low glitch X X
1
X
1
X
1
DAC8560 16-bit, 1-ch, 200kSPS X X X
1
X
1
X
1
DAC8580 16-bit, 1-ch, 1s X
1
X
1
X
1
DAC8581 16-bit, 1-ch, 3MSPS, voltage output X X
1
X
1
X
1
DAC8814 16-bit, 4-ch, 2MSPS X
1
X
1
X
1
TLC5618A 12-bit, 2-ch, 2.5s, 5 V X X
2

TLV320DAC23 24-bit, stereo, 96kHz, audio DAC

TLV5604 10-bit, 4-ch, 3s, 2.75.5 V
TLV5606 10-bit, 1-ch, 3s, 2.75.5 V X X
2

TLV5608 10-bit, 8-ch, 1s, 2.75.5 V

TLV5610 12-bit, 8-ch, 1s, 2.75.5 V
TLV5614 12-bit, 4-ch, 3s, 2.75.5 V
TLV5616 12-bit, 1-ch, 3s, 2.75.5 V X X
2

TLV5617A 10-bit, 2-ch, 2.5s, 2.75.5 V X X

2

TLV5618A 12-bit, 2-ch, 2.5s, 2.75.5 V X X

2

TLV5623 8-bit, 1-ch, 3s, 2.75.5 V X X

2

TLV5624 8-bit, 1-ch, 1s, 2.75.5 V, int. reference X X

2

TLV5625 8-bit, 2-ch, 2.5s, 2.75.5 V X X

2

TLV5626 8-bit, 2-ch, 1s, 2.75.5 V, int. reference X X

2

TLV5629 8-bit, 8-ch, 1s, 2.75.5 V

TLV5630 12-bit, 8-ch, 1s, 2.75.5 V, int. reference
TLV5631 10-bit, 8-ch, 1s, 2.75.5 V, int. reference
TLV5632 8-bit, 8-ch, 1s, 2.75.5 V
TLV5636 12-bit, 1-ch, 1s, 2.75.5 V, int. reference X X
2

TLV5637 10-bit, 2-ch, 1s, 2.75.5 V, int. reference X X

2

TLV5638 12-bit, 2-ch, 1s, 2.75.5 V, int. reference X X

2

1
Includes DMA support. New devices are listed in bold red.
2
These DACs share the same driver. Result data may need to be masked.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Audio Converters and Controllers
72

Audio ADCs www.ti.com/adc

No. of
Dynamic Inputs/ Sampling Audio Power
Portable Range No. of Rate Data Supply
Device Description Focus (dB) Outputs (kHz) (max) Format (V) Package(s) Price
1
PCM4222 2-channel, high-performance ADC 124 2/0 216 6-Bit Modulator, +3.3 and +4 TQFP-48 14.95
DSD, Normal,
I
2
S, TDM
PCM4220 2-channel, high-performance ADC 123 2/0 216 Normal, I
2
S, TDM +3.3 and +4 TQFP-48 9.95
PCM4204 4-channel, high-performance ADC, PCM or DSD, high-pass filter 118 4/0 216 Normal, I
2
S, DSD, +3.3 and +5 TQFP-64 7.95
TDM
PCM4202 Stereo, high-performance ADC, PCM or DSD, high-pass filter 118 2/0 216 Normal, I
2
S, DSD +3.3 and +5 SSOP-28 4.95
PCM4201 Mono, high-performance ADC, PCM or DSD, high-pass filter, 112 1/0 108 Normal, DSP +3.3 and +5 TSSOP-16 2.50
wide digital supply range, low power dissipation
PCM1804 Stereo ADC, fully differential, high-pass filter 112 2/0 192 Normal, I
2
S, DSD +3.3 and +5 SSOP-28 3.95
PCM1802 Stereo ADC, SE input 105 2/0 96 Normal, I
2
S +3.3 and +5 SSOP-20 3.35
PCM1803A Stereo ADC, SE input, high-pass filter 103 2/0 96 Normal, I
2
S +3.5 and +5 SSOP-20 1.10
PCM1850/1 Stereo ADC w/ 2 6 input MUX and PGA, SPI (1850) and I
2
C (1851) control 101 2/0 96 Normal, I
2
S +3.3 and +5 TQFP-32 4.80
PCM1807/8 Stereo ADC, SE input, mute w/ fade, SPI control, S/W (1807) H/W 101 2/0 96 I
2
S, L +3.5 and +5 TSSOP-14 1.00
(1808) controlled
PCM1870 Stereo ADC, SE input, digital filter, very low power consumption 90 2/0 50 Normal, I
2
S, DSP +2.4 and +3.6 QFN-24 1.80
Audio DACs www.ti.com/dac
PCM1792A Stereo, optional DSD format, external filter and DSP interface, SPI/I
2
C, 132 0/2 192 Standard, +3.3 and +5 SSOP-28 9.95
differential current output: 7.8 mA p-p I
2
S, L
PCM1796/8 Stereo advanced segment, 123dB dynamic range, TDMCA serial 123 0/2 192 Standard, +3.5 and +5 SSOP-28 2.95
interface (1798) I
2
S, L
PCM4104 4-channel, high-performance, sampling rate up to 216kHz, H/W 118 0/4 216 Normal, I
2
S, +3.3 and +5 TQFP-48 4.95
or S/W controlled TDM
PCM1738/30 Stereo advanced segment DAC, soft mute (1730), 2 optional 117 0/2 192 Normal, I
2
S, +3.3 and +5 SSOP-28 5.25/
operation modes (1738): External filter and DSD decoder for DSD 5.00
SACD playback and digital attenuation
PCM1791A Stereo advanced segment DAC, optional DSD format, external filter 113 0/2 192 Normal, I
2
S, +3.3 and +5 SSOP-28 2.10
and DSP interface, SPI/I
2
C differential current output: 3.2 mA p-p TDMCA
PCM1793 Stereo advanced segment DAC, balanced voltage outputs, improved 113 0/2 192 Normal, I
2
S, +3.3 and +5 SSOP-28 2.10
clock jitter Left Justified
DSD1608 8-channel, enhanced multi-format DAC, supports DSD with TDMCA 108 0/8 192 Normal, I
2
S, +3.3 and +5 TQFP-52 5.96
DSD
PCM1780/81/82 Stereo with volume control, software (1780/82) and hardware (1781), 106 0/2 192 Normal, I
2
S +5 SSOP-16 1.10
open-drain output zero flag (1782), improved jitter performance
PCM1753/54/55 Stereo with volume control, software (1753/55) and hardware (1754), 106 0/2 192 Normal, I
2
S +5 SSOP-16 1.03
open-drain output zero flag (1755)
PCM1608 8-channel, highly integrated DAC, higher SNR 105 0/8 192 Normal, I
2
S +3.3 and +5 LQFP-48 4.29
PCM1606 6-channel, low-cost CMOS, multi-level 103 0/6 192 Normal, I
2
S +5 SSOP-20 2.00
PCM1680 8-channel, low-cost DAC, improved jitter performance, pin compatible 103 0/8 192 Normal, I
2
S +5 SSOP-24 1.50
with PCM1780
TLV320DAC23 I
2
C and SPI control with headphone amp, P
diss
= 23 mW 100 0/2 96 Normal, I
2
S, DSP +1.5 to +3.3 VFBGA-80 2.00
PCM1770/1 Stereo with integrated headphone driver, software (1770) and hardware 98 0/2 48 Normal, I
2
S +1.6 to +3.6 TSSOP-28, 1.25
(1771) controlled QFN-28,
TSSOP-16,
QFN-20
PCM1772/3 Stereo with integrated line out, software (1772) and hardware (1773) 98 0/2 48 Normal, I
2
S +1.6 to +3.6 TSSOP-16, 1.25
controlled QFN-20
TLV320DAC26 Integrated PLL, SPI control, speaker/headphone amp, P
diss
= 11 mW 97 0/2 53 Normal, I
2
S, DSP +2.7 to +3.6 QFN-32 2.95
TLV320DAC32 Low-power stereo DAC with PLL and stereo HP/speaker amplifiers 95 0/2 96 Normal, I
2
S, +2.7 to +3.6 QFN-32 2.75
DSP, TDM
1
Suggested resale price in U.S. dollars in quantities of 1,000.
For additional information on TI audio products, please visit www.ti.com/audio.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Audio Converters and Controllers
73

Audio Codecs www.ti.com/codec

Portable Dynamic Sampling Rate Audio Data Power
Device Description Focus Range (dB) (kHz) (max) Format Supply (V) Package(s) Price
1
PCM3168 High-performance, 6 in/8 out audio codec 112 96 Normal, I
2
S, 3.3 to 5 HTQFP-64 TBD
DSP, TDM
TLV320AIC34 Low-power quad stereo (4-channel) codec, 12 inputs (mic/line), 102 96 Normal, +2.7 to 3.6 BGA-87 5.95
14 outputs (line, headphone/speaker), 2 PLLs and audio serial I
2
S, DSP, TDM
buses allow fully asynchronous simultaneous codec operation
TLV320AIC3101 Low-power stereo codec, integrated PLL, 6 inputs (mic/line), 102 96 Normal, +2.7 to 3.6 QFN-32 3.55
6 outputs (line, headphone/speaker), notch filtering, low-power I
2
S, DSP, TDM
analog bypass
TLV320AIC3104 Low-power stereo codec, integrated PLL, 6 inputs (mic/line), 102 96 Normal, +2.7 to 3.6 QFN-32 3.25
6 outputs (line, headphone), notch filtering, low-power I
2
S, DSP, TDM
analog bypass
TLV320AIC3105 Low-power stereo codec, integrated PLL, 6 SE inputs (mic/line), 102 96 Normal, +2.7 to 3.6 QFN-32 3.25
6 outputs (line, headphone), notch filtering, low-power I
2
S, DSP, TDM
analog bypass
TLV320AIC3106 Low-power stereo codec, integrated PLL, 10 inputs (mic/line), 102 96 Normal, +2.7 to 3.6 QFN-32, 3.85
7 outputs (line, headphone), notch filtering, low-power I
2
S, DSP, TDM BGA-80
analog bypass
TLV320AIC3107 Low-power stereo codec, integrated PLL, 10 inputs (mic/line), 102 96 Normal, +2.7 to 3.6 QFN TBD
7 outputs (line, headphone, mono integrated Class-D amp) I
2
S, DSP, TDM
TLV320AIC3108 Low-power stereo codec, integrated PLL, 10 inputs (mic/line), 102 96 Normal, +2.7 to 3.6 QFN TBD
7 outputs (line, headphone, stereo integrated Class-D amp) I
2
S, DSP, TDM
TLV320AIC33 Low-power stereo codec, integrated PLL, 6 inputs, 102 96 Normal, +2.7 to 3.6 QFN-48, 3.95
3 line out and speaker/HP outputs I
2
S, DSP, TDM BGA-80
TLV320AIC31/32 Low-power stereo codec, integrated PLL, 6 inputs 100 96 Normal, +2.7 to 3.6 QFN-32 3.45
(AIC32-6 single-ended, AIC31-2 differential and 2 single-ended) I
2
S, DSP, TDM
2 line out and speaker/HP outputs
TLV320AIC23B Low-power, lower cost, stereo codec with headphone amps 100 96 I
2
S, L, R +2.7 to 3.3 VFBGA-80, 3.00
TSSOP-28, QFN-28
TLV320AIC28/29 Low-power, stereo DAC, mono ADC, integrated PLL, speaker/HP 95 53 Normal, +2.7 to 3.6 QFN-48 3.95/3.45
amp, additional inputs and outputs (AIC29 differential) I
2
S, DSP
TLV320AIC26 Low-power, lower cost, stereo DAC, mono ADC, 97 53 Normal, +2.7 to 3.6 QFN-32 3.25
integrated PLL, speaker/HP amp I
2
S, DSP
PCM3000 Stereo audio codec 18 bits, 98 48 Normal, I
2
S, +4.5 to 5.5 SSOP-28 3.45
serial interface, software controlled DSP
PCM3001 Stereo audio codec 18 bits, 98 48 Normal, I
2
S, +4.5 to 5.5 SSOP-28 3.45
serial interface, hardware controlled DSP
PCM3006 Low-power, 3-V supply, stereo codec, hardware controlled 93 48 Normal +2.7 to 3.6 SSOP-24 3.45
PCM3008 Low-power, 2.4-V single supply, stereo codec, 88 48 Normal, I
2
S +2.1 to 3.6 TSSOP-16 3.10
low-cost, hardware controlled
PCM3793A Ultra-low power stereo codec, 6 inputs (mic/line), 3 outputs 93 48 Normal, I
2
S, +2.4 to 3.6 QFN-32 4.50
(line/HP/Class-D speaker) DSP
PCM3794A Ultra-low power stereo codec, 6 inputs (mic/line), 93 48 Normal, I
2
S, +2.4 to 3.6 QFN-32 4.25
5 outputs (line/HP) DSP
Preview products are listed in bold blue.
New products are listed in bold red.
1
Suggested resale price in U.S. dollars in quantities of 1,000.
For additional information on TI audio products, please visit www.ti.com/audio.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Audio Converters and Controllers
74

1
Suggested resale price in U.S. dollars in quantities of 1,000.
For additional information on TI audio products, please visit www.ti.com/audio.
Voiceband Codecs www.ti.com/codec
Sample Number of SNR Analog Supply Logic Supply Power Supply
Device Description Rate (kHz) Input Channel(s) (dB) Interface (V) (V) (mW) (typ) Package(s) Price
1
AIC111 Lowest power, 20 bit 40 1 87 SPI, DSP 1.1 to 1.5 1.1 to 3.3 0.46 QFN-32, FlipChip 4.14
TLV320AIC12K Low power, mono codec, 16 bit, 26 1 90 I
2
C, S
2
C, DSP 1.65 to 1.95/2.7 to 3.6 1.1 to 3.6 10 TSSOP-30 1.70
26ksps voiceband codec with 8driver
TLV320AIC14K Low power, mono codec, 16 bit 26 1 90 I
2
C, S
2
C, DSP 1.65 to 1.95/2.7 to 3.6 1.1 to 3.6 10 TSSOP-30 1.50
26ksps voiceband codec
TLV320AIC20K Low power, stereo codec, 16 bit 26 2 90 I
2
C, S
2
C, DSP 1.65 to 1.95/2.7 to 3.6 1.1 to 3.6 20 TQFP-48 2.50
26ksps voiceband codec with 8driver
TLV320AIC24K Low power, stereo codec, 16 bit 26 2 90 I
2
C, S
2
C, DSP 1.65 to 1.95/2.7 to 3.6 1.1 to 3.6 20 TQFP-48 2.30
26ksps voiceband codec
Audio Converters with Integrated Touch-Screen Controller www.ti.com/touchscreencontrollers
Resolution Dynamic Sampling Rate Audio Data Power
Device Description (Bits) (max) Range (dB) (kHz) (max) Configuration Format Supply (V) Package(s) Price
1
TSC2100 4-Wire touch-screen interface, low power, lower cost, stereo DAC, 24 97 53 Mono/Stereo Normal, +2.7 to 3.6 QFN-32, 3.95
mono ADC, integrated PLL, speaker/HP amp I
2
S, DSP TSSOP-32
TSC2111 4-Wire touch-screen interface, low power, stereo DAC, mono ADC, integrated 24 95 53 Mono/Stereo Normal, +2.7 to 3.6 QFN-48 4.95
PLL, speaker/HP amp, additional inputs and outputs (TSC2111 differential) I
2
S, DSP
TSC2102 4-Wire touch-screen interface, low power, stereo DAC, 24 97 53 Stereo Normal, +2.7 to 3.6 TSSOP-32 3.70
integrated PLL, speaker/HP amp, low cost I
2
S, DSP
TSC2300 4-Wire touch-screen interface, low power, stereo DAC, 20 98 48 Mono/Stereo Normal, I
2
S +2.7 to 3.6 TQFP-64 4.75
mono ADC, integrated PLL
TSC2301 4-Wire touch-screen interface, low power, stereo DAC, 20 98 48 Stereo/Stereo Normal, +2.7 to 3.6 TQFP-64, 4.95
stereo ADC, integrated PLL, HP amp, 4 4 keypad interface I
2
S BGA-120
TSC2302 4-Wire touch-screen interface, low power, stereo DAC, 20 98 48 Stereo/Stereo Normal, +2.7 to 3.6 QFN-48 4.50
stereo ADC, integrated PLL, HP amp I
2
S
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Interface Products
75

TUSB3410 USB-to-Serial Bridge

The TUSB3410 provides an easy way to
move a serial-based legacy device to a
fast, flexible USB interface by bridging
between a USB port and an enhanced
UART serial port. The TUSB3410 contains
all the necessary logic to communicate
with the host computer using the USB bus.
Key Features
USB full-speed-compliant:
data rate of 12 Mbps
8052 microcontroller with 16 KBytes of
RAM that can be loaded from the host
or from external on-board memory via
an I
2
C bus
Integrated, enhanced UART features
including:
Programmable software/hardware
flow control
Automatic RS-485 bus transceiver
control, with and without echo
Software-selectable baud rate from
50 to 921.6 kbaud
Built-in, two-channel DMA controller
for USB/UART bulk I/O
Evaluation module to jump-start USB
development or for use as a complete
USB-to-RS-232 converter
XIO2000A PCI Express

Bridge Chip
TIs PCI Express Bridge Chip, the
XIO2000A, is an industry first. It is
designed for seamless migration from the
legacy PCI to the PCI Express interface. It
bridges a 1 PCI Express bus to a 32-bit,
33-/66-MHz PCI bus capable of support-
ing up to six PCI devices downstream. The
XIO2000A fully supports PCI Express rates
of 2.5 Gbps. Its architecture supports the
PCI 2.3 interface. The chips design
enables PC and I/O add-on card manufac-
turers to begin transitioning to native PCI
Express technology while preserving com-
patibility with existing PCI system software
and firmware.
Key Benefits
Lowest power solution available today
323 mW with two PCI cards at 33 MHz
In mass production for over two years
Proven capability and interoperability
with leading PCIe chipsets and
plethora of PCI devices
Built-in adaptive receiver equalizer
Improves jitter tolerance thereby reli-
ably increasing PCB trace, or cable
length, supported by the XIO2000
Seven buffered PCI clock outputs
(33 MHz or 66 MHz)
Reduces external components, costs
and premium board space
TI provides a complete interface prod-
ucts portfolio that empowers cus-
tomers to differentiate their products
and accelerate time to market. TIs
hardware and software portfolios
include 1394a and 1394b, USB full-
speed and USB 2.0 high-speed, PCI-
to-PCI bridges and PCI Express and
interfaces. Our expertise in high-
speed, mixed-signal circuits, system-
on-a-chip integration and advanced
product development ensure that you
receive the silicon, support tools, soft-
ware and technical documentation to
create and deliver the best products on
time and at competitive prices. TIs
Interface Business Unit (IBU) leverages
these technologies and outstanding
customer application support to serve
the broad-based catalog market.
Enabling Faster Time
to Market
Industry leading, high performance
Proven system-level reference
designs
Available development and
evaluation kits
Providing System-Level
Solutions
Extensive industry compatibility and
validation testing
Production test, driver and
application software
Detailed technical applications
documentation
Visit www.ti.com/interface for
additional information.
XIO3130 4-Lane, 4-Port PCIe Switch
TIs XIO3130 is an integrated PCIe fan-out
switch solution with one upstream 1 port
and three downstream 1 ports. This
high-performance, integrated solution pro-
vides the latest in PCIe switch technology.
It features cut-through architecture and
integrated reference clock buffers for
downstream ports. The XIO3130 is fully-
compliant with the PCI Express Base
Specification Rev. 1.1. It supports
Advanced Error Reporting as defined in
the PCIe base specifications and is back-
wards compatible with the PCI Local Bus
Specification, Rev. 2.3.
Key Features
PCIe fan-out switch with 1 upstream
port and three 1 downstream ports
Fully compliant with PCIe Base
Specification, Rev. 1.1
Cut-through architecture
Built-in adaptive equalizer in each of
the four ports
Wake-event and beacon support
Support for D1, D2, D3
hot
, and D3
cold
Active State Power Management (ASPM)
Uses both L0s and L1
Low-power PCIe transmitter mode
(pre-emphasis disabled)
Integrated AUX power switch drains VAUX
power only when main power is off
Integrated hot-plug support
Integrated REFCLK buffers for switch
downstream ports
Advanced error reporting to assist with
system debug tools
3.3-V multi-function I/O pins (e.g., for
hot-plug status-and-control, or general-
purpose I/Os)
Listed in PCI-SIG compliance list
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Interface Products
76

USB Port ProtectionTransient voltage suppressor protects USB 2.0 full-speed and high-speed devices from ESD and electrical noise transients.
Device # # of Channels Application IO Capacitance VBR (Min) Package Price
USB Transient Suppressors
TPD2E001 Dual-Bit/ Single Channel USB HS, USB FS 1.5pF 11 V DRL, DRY, DZD, DRS web
TPD3E001 Three-Bit/Single-Channel USB OTG ESD USB HS OTG, USB FS OTG 1.5pF 11 V DRL, DRY, DRS web
TPD4E001 Four-Bit/Two Channel USB HS, USB FS 1.5pF 11 V DRL, DRS web
TPD4S012 Four-Bit/Two-Channel ESD with VBUS Clamp USB HS with VBUS Clamp 0.9pF 7 V DRY web
TPD4E004 Four-Bit/Two Channel USB HS, USB FS 1.6pF 6 V DRY web
SN65220, SN75220 Dual-Bit/Single Channel USB FS 35pF 7 V DBV, YZP web
SN65240 Four-Bit/Two Channel USB FS 35pF 7 V PW, P web
Voltage Local Bus
Device Speed (V) Package Interface Description Price
USB On-The-Go (OTG) Devices
TUSB6010B High 1.5, 1.8 & 3.3 80 MicroStar BGA 16-Bit Muxed NOR USB 2.0 high-speed On-The-Go to local bus interface controller Call
TUSB6020 High 1.5, 1.8 & 3.3 80 MicroStar BGA VLYNQ USB 2.0 high-speed On-The-Go local bus interface bridge controller Call
Voltage Singled-Ended
Device Speed (V) Package Input Description Price
USB Transceivers
TUSB1105 Full, Low 1.6, 3.6 16 RTZ, 16 RGT Yes USB transceivers Call
TUSB1106 Full, Low 1.6, 3.6 16 RTZ, 16 PW No USB transceivers Call
TUSB2551 Full, Low 1.6, 3.6 14 PW, 16 RGT No USB transceivers Call
1
Suggested resale price in U.S. dollars in quantities of 100. Preview devices appear in bold blue.
Resources For a complete list of resources (evaluation modules, data sheets and application notes), visit interface.ti.com
Literature Number Description
Application Notes
SLLU043 TUSB3410 UART Evaluation Board
SLLA170B USB/Serial Applications Using TUSB3410/5052 and the VCP Software
SLLAA276 MSP430 USB Connectivity Using TUSB3410
TUSB60xx Family of USB High-Speed OTG Devices
The TUSB60xx family of USB high-speed
OTG devices enable application proces-
sors (DSPs and MCUs) that do not have
integrated USB cores to function as either:
1. an USB 2.0 high-speed peripheral
2. an embedded USB 2.0 high-speed host
controller
3. a full USB 2.0 high-speed OTG device
The TUSB6020 enables functionality on
VLYNQ-enabled application processors,
such as DaVinci TMS320DM643x and
TMS320C642x DSPs.
The TUSB6010B bridges to a 16-bit
MUXED-NORFLASH host interface such as
the OMAP2420, OMAP1710 or
OMAP3430 processor.
USB
Voltage
Device Speed Ports I
2
C (V) Package Description Price
1
USB Hub Controllers
TUSB2036 Full (1.1) 2/3 No 3.3 32 LQFP 2/3-port hub for USB with optional serial EEPROM interface 1.45
TUSB2046B Full (1.1) 4 No 3.3 32 LQFP 4-port hub for USB with optional serial EEPROM interface 1.50
TUSB2077A Full (1.1) 7 No 3.3 48 LQFP 7-port USB hub with optional serial EEPROM interface 2.45
TUSB2136 Full (1.1) 1/2 Yes 3.3 64 LQFP 2-port hub with integrated general-purpose function controller 4.10
Voltage Remote
Device Speed (V) Wakeup Package Description Price
1
USB Peripherals
TUSB3210 Full 3.3 Yes 64 LQFP USB full-speed general-purpose device controller 3.15
TUSB3410 Full 3.3 Yes 32 LQFP USB-to-serial converter (RS-232, RS-485) 2.85
TUSB6250 High 3.3 Yes 80 TQFP USB 2.0 high-speed, low-power ATA/ATAPI bridge solution 3.50
TUSB6015 High 1.5, 1.8 & 3.3 Yes 80 MicroStar BGA USB 2.0 high-speed to muxed NOR Flash bridge controller 5.00
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Interface Products
77

System-Level ESD Protection

Devices
Space-saving, low-capacitance solutions
System-level ESD strikes are a constant
threat to device reliability and functionality.
Many low-voltage core chips only offer
device-level, human-body model (HBM)
ESD protection, which doesnt address the
system-level risks. TIs TPD family of
stand-alone ESD devices provides space-
saving and cost-effective solutions to pro-
tect the system interconnects from exter-
nal ESD strikes. For multiple external
interfaces including video, audio and serial
data transfer, the TPD family offers
IEC61000-4-2 level ESD protection.
Features and benefits:
Low I/O capacitance ideal for high-
speed applications
Space-saving package solutions help
reduce board footprint
Operating voltage range
flexibility for low-power
applications
End equipments
Mobile handset
STB
Television
Game console
External HD
Digital camera
SIM cards
Notebook
PDA
Consumer medical
ESD Protection Solutions
Device # # of Channels Supply Voltage (V
DD
) I/O Level (V) I/O Capacitance (pF) VBR (Min) (V) Package Application
TPD2E001 2 0.95.5 0V
DD
1.5 11 SOT-5, SON-6 USB 2.0, RS-232 / RS-485
TPD3E001 3 0.95.5 0V
DD
1.5 11 SOT-5, SON-6 USB OTG
TPD4E001 4 0.95.5 0V
DD
1.5 11 SOT-6, SON-6 USB 2.0, Ethernet, Firewire, e-SATA, RS-232 / RS-485
TPD6E001 6 0.95.5 0V
DD
1.5 11 QFN-10, QFN-12 USB 2.0, Ethernet, Firewire, e-SATA, RS-232 / RS-485
TPD4E004 4 0.95.5 0V
DD
1.6 6 SOT-6, SON-6 USB 2.0, Ethernet, Firewire, e-SATA
TPD6E004 6 0.95.5 0V
DD
1.6 6 QFN-8 USB 2.0, Ethernet, Firewire, e-SATA
TPD4S009 4 0.95.5 0V
DD
0.9 9 SOT23-6, SC70-6, e-SATA, LVDS signaling
SON-6
TPD8S009 8 0.95.5 0V
DD
0.9 9 SON-15 HDMI, display port
TPD12S520 12 0.95.5 0V
DD
0.9 9 TSSOP-38 HDMI receiver port
TPD12S521 12 0.95.5 0V
DD
0.9 9 TSSOP-38 HDMI transmit port
Protected
Circuit
I/O I/O TPDxE001
TPDxE001 application schematics
PCI Bridge Solutions
Intel-Compatible Speed Expansion MicroStar BGA Voltage
Device Part No. (MHz) Interface (bits) Hot Swap Packaging (V) Package(s) Description Price
1
PCI Bridges
PCI2050B 21150bc 66 32 Yes Yes 3.3, 5 208 LQFP, 32-Bit, 66-MHz, 9-master PCI-to-PCI bridge 9.50
208 QFP, 257 BGA
PCI2250 21152ab 33 32 Friendly No 3.3, 5 176 LQFP, 160 QFP 32-Bit, 33-MHz PCI-to-PCI bridge, compact 6.10
PCI hot-swap friendly, 4-master
PCI2060 66 32 Yes Yes 3.3, 5 257 BGA 32-Bit, 66-MHz, 9-master, 9.50
asynchronous PCI-to-PCI bridge
1
Suggested resale price in U.S. dollars in quantities of 1,000.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the TMS320

DSP Family
Interface Products
78

PCI Express Solutions

Supply Parallel Bus Speed (max) MicroStar BGA
Device Voltage (V) PCIe Width (Gbps) Packaging Package Description Price*
PCI Express PHY
XIO1100 3.3, 1.8, 1.5 1 8, 16 2.5 Yes 100 BGA 1 PCI Express PHY, compliant with the 7.00
PCI Express Base Specification Revision 1.1
Supply Parallel Bus Wake/Beacon MicroStar BGA
Device Voltage (V) PCIe Masters Support Packaging Package Description Price
1
PCI Express Bridge
XIO2000A 3.3, 1.5 1 6 Yes Yes 175 BGA, 201 BGA 1 PCI Express-to-PCI bus translation bridge 10.50
Supply Speed (max) MicroStar BGA
Device Voltage (V) PCIe FIFO (KB) (Mbps) Packaging Package Description Price
1
PCI Express Endpoints
XIO2200A 3.3, 1.5 1 9 400 Yes 175 BGA, 176 BGA PCI Express-to-PCI bus translation bridge 7.75
with 1394a OHCI and two ports
XIO2213A 3.3, 1.95, 1.5 1 8 800 No 167 BGA PCI Express-to-1394b OHCI with three-port PHY 8.70
Supply Downstream Wake/Beacon MicroStar BGA
Device Voltage (V) PCIe PCI Ports Support Packaging Package Description Price
1
PCI Express Packet Switch
XIO3130 3.3, 1.5 1 3 Yes Yes 196 BGA 1 PCI Express 4-port fanout packet switch Call
No. of No. of Supply Voltage r
ON
(typ) t
pd
MicroStar BGA
Device Inputs Outputs Range (V) () (typ) (ns) Packaging Package Description Price
1
PCI Express Signal Switches*
TS2PCIE2212 2 1 1.71.9 10 0.25 No 48 BGA 2-channel PCIe 2:1 multiplexer/demultiplexer 1.61
passive FET switch
TS2PCIE412 2 1 1.52.1 12.5 0.25 No 42 QFN 4-channel PCIe 2:1 multiplexer/demultiplexer Preview
passive FET switch
1
Suggested resale price in U.S. dollars in quantities of 1,000. Preview products are listed in bold blue.
*For additional TI switches, visit www.ti.com/switches
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C2000

Microcontrollers for Real-Time Control

Silicon
79

Specifications
32-bit C28x MCU core with
floating-point option
Industrys first floating-point MCUs
Highest performance MCUs at
300 MHz and 600 MFLOPS
Only processors with full software
compatibility between fixed-point and
floating-point
Full software compatibility across all
C28x platform controllers
All C28x controllers are AEC Q-100
qualified for automotive applications
Applications
Green energy (solar, wind, fuel cells),
digital motor control (home appliances,
industrial drives, medical), digital power
supplies (telecom and server rectifiers,
wireless basestations, UPS), automotive
(electric power steering, drivers
assistance radar, wipers, HVAC)
Features
Industrys most efficient C compiler for
32-bit controllers
Up to 300-MHz operation
Single-precision 32-bit floating-point
unit on F283xx generation
Ultra-fast interrupt response time
Integrated real-time debug simplifies
control system development
Single-cycle 3232-bit multiply-
accumulate
32-bit and 16-bit instructions optimize
performance and code efficiency
Peripherals
Up to 512-KB Flash and 68-KB RAM
Code security module with 128-bit
password protection
Ultra-fast 12-bit A/D converter with
80-ns conversion time
High-resolution PWM allows duty-
cycle modulation with down to
65-picosecond accuracy
Flexible PWM generation allows easy
generation of any switching waveform
Quadrature encoder interfaces for
easy motor feedback
Multiple communications interfaces
The C2000 microcontroller platform provides an optimized combination of 32-bit performance and
integration for digital control systems. Not all devices contain all modules shown.
TMS320C2000 Microcontrollers, Fixed Point and Floating Point
MCU Control. 32-Bit Performance
Get samples, data sheets, tools and app reports at: www.ti.com/c2000
P
e
r
f
o
r
m
a
n
c
e
150
128
12.5 MSPS ADC
QEP
MIPS
256 KB Flash

F281x F281x
60100
32
16-ch, 12-bit ADC
HiRes PWM, QEP
MIPS
256 KB Flash

F280x F280x
150
128512 KB Flash
16-ch, 12-bit ADC
HiRes PWM, QEP
MIPS

F282x F282x
150 MIPS/300 MFLOPS
128
16-ch, 12-bit ADC
HiRes PWM, QEP
512 KB Flash

F2833x F2833x
300 MIPS/600 MFLOPS
196
HiRes PWM, QEP
516 KB SRAM

C2834x C2834x
Delfino Floating-Point Series

Delfino Floating-Point Series

F282x
F280x
F281x
F2833x
F2803x
F2802x
C2834x
Code-compatible solutions scaling from 40 MHz to 300 MHz
Next
Generation
Next
Generation
4060 MIPS
3264 KB Flash
13-ch, 12-bit ADC

Single 3.3-V supply

HiRes PWM
F2802x F2802x
Piccolo Series

Piccolo Series

60 MIPS + CLA
64128 KB Flash
16-ch, 12-bit ADC

Single 3.3-V supply

HiRes PWM, QEP
F2803x F2803x
Production
Future
Device
Sampling
In Development
TMS320C2000 Microcontroller Platform Roadmap
The C2000 controller platform provides an optimized combination of DSP performance and MCU
integration for digital control systems.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C2000

Microcontrollers for Real-Time Control

Silicon
80

TMS320C2000 Microcontrollers www.ti.com/c2000

Control Interfaces
12-Bit A/D Communications Ports
Processor Memory Quadra- Chan/ External Core On-Chip
Speed RAM Flash ROM PWM HiRes ture Event Conversion Compa- UART/ Memory Supply GPIO Osc Pins/ 1-KU
Device (MHz) DMA CLA (KB) (KB) (KB) Chan PWM Encoder Captures Timers
2
Time (ns) rators McBSP I
2
C SCI SPI Lin CAN Bus Volt(s) Pins Regulator Packaging Price
1
TMS320F2803x Piccolo MCUs
TMS320F2803x 60 No/ 20 64 Boot 915 7 1 1 912 1316/217 3 1 1 12 1 1 3.3 2644 Yes/Yes 56 QFN, 64 TQFP, TBD
Yes 128 80 LQFP,
80 QFP P-Pad
TMS320F2802x Piccolo MCUs
TMS320F28027 60 12 64 Boot 9 4 0 1 9 713/217 12 1 1 1 3.3 2022 Yes/Yes 38 TSSOP, 48 LQFP 2.85
TMS320F28026 60 12 32 Boot 9 4 0 1 9 713/217 12 1 1 1 3.3 2022 Yes/Yes 38 TSSOP, 48 LQFP 2.65
TMS320F28023 40 12 64 Boot 9 4 0 1 9 713/325 12 1 1 1 3.3 2022 Yes/Yes 38 TSSOP, 48 LQFP 2.45
TMS320F28022 40 12 32 Boot 9 4 0 1 9 713/325 12 1 1 1 3.3 2022 Yes/Yes 38 TSSOP, 48 LQFP 2.25
TMS320F28021 40 10 64 Boot 9 0 1 9 713/500 12 1 1 1 3.3 2022 Yes/Yes 38 TSSOP, 48 LQFP 2.20
TMS320F28020 40 6 32 Boot 9 0 1 9 713/500 12 1 1 1 3.3 2022 Yes/Yes 38 TSSOP, 48 LQFP 1.99
TMS320C2834x Delfino Floating-Point Microcontrollers
TMS320C28346 300 Yes 516 Boot 24 9 3 6 19 2 1 3 2 2 16/32 bit 1.2 88 256 GBA 16.39
TMS320C28345 200 Yes 516 Boot 24 9 3 6 19 2 1 3 2 2 16/32 bit 1.1 88 256 GBA, 179 BGA 14.42
TMS320C28344 300 Yes 260 Boot 24 9 3 6 19 2 1 3 2 2 16/32 bit 1.2 88 256 GBA 12.78
TMS320C28343 200 Yes 260 Boot 24 9 3 6 19 2 1 3 2 2 16/32 bit 1.1 88 256 GBA, 179 BGA 11.25
TMS320C28342 300 Yes 196 Boot 16 6 2 4 14 1 1 3 2 2 16/32 bit 1.2 88 256 GBA 10.17
TMS320C28341 200 Yes 196 Boot 16 6 2 4 14 1 1 3 2 2 16/32 bit 1.1 88 256 GBA, 179 BGA 8.95
TMS320F2833x Delfino Floating-Point Microcontrollers
TMS320F28335 150 Yes 68 512 Boot 18 6 2 6 16 16/80 2 1 3 1 2 16/32 bit 1.9 88 179 BGA, 176 LQFP 15.65
TMS320F28334 150 Yes 68 256 Boot 16 6 2 4 14 16/80 2 1 3 1 2 16/32 bit 1.9 88 179 BGA, 176 LQFP 14.75
TMS320F28332 100 Yes 52 128 Boot 16 4 2 4 14 16/80 1 1 2 1 2 16/32 bit 1.9 88 179 BGA, 176 LQFP 13.85
TMS320F28x Fixed-Point MCUs
TMS320F28235 150 Yes 68 512 Boot 18 6 2 6 16 16/80 2 1 3 1 2 16/32 bit 1.9 88 179 BGA, 176 LQFP 14.55
TMS320F28234 150 Yes 68 256 Boot 16 6 2 4 14 16/80 2 1 3 1 2 16/32 bit 1.9 88 179 BGA, 176 LQFP 13.72
TMS320F28232 100 Yes 52 128 Boot 16 4 2 4 14 16/80 1 1 2 1 2 16/32 bit 1.9 88 179 BGA, 176 LQFP 12.88
TMS320F2812 150 36 256 Boot 16 2 6 8 16/80 1 2 1 1 16 bit 1.9 56 179 BGA, 176 LQFP 15.75
TMS320F2811 150 36 256 Boot 16 2 6 8 16/80 1 2 1 1 1.9 56 128 LQFP 14.75
TMS320F2810 150 36 128 Boot 16 2 6 8 16/80 1 2 1 1 1.9 56 128 LQFP 13.85
TMS320F2809 100 36 256 Boot 16 6 2 4 14 16/80 1 2 4 2 1.8 35 100 BGA, 100 LQFP 12.95
TMS320F2808 100 36 128 Boot 16 4 2 4 14 16/160 1 2 4 2 1.8 35 100 BGA, 100 LQFP 11.60
TMS320F2806 100 20 64 Boot 16 4 2 4 14 16/160 1 2 4 1 1.8 35 100 BGA, 100 LQFP 8.70
TMS320F28044 100 20 128 Boot 16 16 24 16/80 1 1 1 1.8 35 100 LQFP 9.95
TMS320F2802 100 12 64 Boot 8 3 1 2 9 16/160 1 1 2 1 1.8 35 100 BGA, 100 LQFP 7.10
TMS320F2801 100 12 32 Boot 8 3 1 2 9 16/160 1 1 2 1 1.8 35 100 BGA, 100 LQFP 5.80
TMS320F2802-60 60 12 64 Boot 8 3 1 2 9 16/267 1 1 2 1 1.8 35 100 LQFP 4.75
TMS320F2801-60 60 12 32 Boot 8 3 1 2 9 16/267 1 1 2 1 1.8 35 100 LQFP 3.95
TMS320F28016 60 12 32 Boot 10 4 0 2 10 16/267 1 1 1 1 1.8 35 100 LQFP 3.50
TMS320F28015 60 12 32 Boot 10 4 0 2 10 16/267 1 1 1 1.8 35 100 BGA, 100 LQFP 3.25
TMS320C28x ROM MCUs
3
TMS320C2812 150 36 256 16 2 6 8 16/80 1 2 1 1 16 bit 1.9 56 179 BGA, 176 LQFP
TMS320C2811 150 36 256 16 2 6 8 16/80 1 2 1 1 1.9 56 128 LQFP
TMS320C2810 150 36 128 16 2 6 8 16/80 1 2 1 1 1.9 56 128 LQFP
TMS320C2802 100 12 64 8 3 1 2 9 16/160 1 1 2 1 1.8 35 100 BGA, 100 LQFP
TMS320C2801 100 12 32 8 3 1 2 9 16/160 1 1 2 1 1.8 35 100 BGA, 100 LQFP
1
Prices are quoted in U.S. dollars and represent 2009 suggested resale pricing. All prices are subject to change.
2
Timers include CPU timers, PWM timers, eCAP timers and watchdog timers.
3
Minimum quantity order for all ROM devices is 10K units, NRE charge is $11,000 for C28x controllers.
Note: All TMS320C28x devices in LQFP packages are available as AEC Q100 qualified.
Note: All devices available in Pb-Free/Green packaging.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C2000

Microcontrollers for Real-Time Control

Silicon
81

TMS320C2000 New Technology

Better Integration. Easier Development
To learn more about Piccolo technology, visit: www.ti.com/piccolo
To learn more about Delfino technology, visit: www.ti.com/delfino
Key Piccolo Features
Up to 60-MHz, 32-bit TMS320C28x
CPU
32-kB to 128-kB embedded Flash
12-bit ADC, up to 4.6 MSPS
150-ps high-resolution PWM
Control law accelerator (CLA)
Package options starting at
38-pin TSSOP
Key Delfino Features
Up to 300-MHz C28x core
32-bit floating-point precision
Up to 65-ps resolution PWM modules
Multiple capture and 32-bit
QEP modules
Direct Memory Access
(DMA) controller
External memory interface
Code compatibility across
TMS320C2000 controller
platform
The new TMS320F2802x/TMS320F2803x
Piccolo family of C2000 MCUs provides
unparalleled performance with increased
integration to help drive processor-
intensive real-time control into cost-
sensitive applications. Initial F2802x/
F2803x devices will include 40 to 60 MHz
variations, up to 128 kB of Flash memory,
high-speed 12-bit ADC, high-resolution
enhanced PWMs, along with a host of
other modules such as high-precision
on-chip oscillators, analog comparators,
communication interfaces and general-
purpose I/O. Available in multiple package
options starting at 38 pins, the Piccolo
family is the ultimate combination of per-
formance, integration and size. In select
F2803x devices, the CLA brings the ability
to run floating-point based control loops
independent of the CPU.
C2000 Piccolo Family
With Delfino, TI offers two flavors of floating-
point MCUs with unparalleled performance.
F2833x devices operate at 150 MHz with
300 MFLOPS of performance. The F283xx
MCUs offer a 50 percent performance
boost, on average, over current C2000
MCUs while operating at the same
150-MHz clock rate. Built on the standard
C28x architecture, they are 100 percent
software compatible with all current
F28xx MCUs.
The new C2834x Delfino MCUs push the
limits even further, offering 600 MFLOPS
of performance. The C2834x platform
allows up to 52 percent code reduction
and 70 percent reduction in memory
access time over current C2000 MCUs.
New speeds enable greater intelligence
and efficiency in high-end real-time
control applications.
www.ti.com/delfino.
Delfino: Floating-Point Development at Your Finger Tips
IQMath Provides a Bridge
Between Floating Point and
Fixed Point
Control algorithms typically start life in a
floating-point format, often created with
PC-based simulation tools, such as
MATLAB

. With the availability of the

TMS320F283xx floating-point microcon-
trollers, it is easy to port that floating-point
code to the embedded controller. TIs
IQMath library provides seamless portabili-
ty from the F283xx MCUs to fixed-point
members of the C28x generation. The
TMS320F282xx fixed-point MCUs are pin-
to-pin compatible with the F283xx MCUs.
These microcontrollers offer the first set of
processors that provide both hardware
and software compatibility between floating
point and fixed point.
For more information, visit
www.ti.com/iqmath.
Speedy Algorithm Porting
Simulation
Platform
(i.e., MATLAB )

IQMath
Algorithm
(C or C++)
Auto-Code Generation is
Made Simpler
One Source Set Fits All
F28x Fixed-
Point Controllers
F283xx Floating-Point
Controllers
Slash development time and reduce overall costs with TIs IQMath: floating-point development on a
fixed-point machine.
TIs C28x IQMath Library makes code development easier, faster and enables seamless portability of
code between fixed- and floating-point devices.
The Floating-Point Advantage
The Delfino TMS320F2833x series fea-
tures an integrated hardware floating-point
unit. These floating-point MCUs, operating
at 150 MHz, provide 300 MFLOPS of
performance while maintaining pin com-
patibility with their fixed-point counterparts,
the F2823x series. The F2833x floating-
point controllers offer a 50 percent per-
formance boost, on average, over other
C2000 controllers operating at the
same 150-MHz clock rate.
The Delfino TMS320C2834x series adds
even more performance to the C2000
platform by providing up to 600 MFLOPS
at 300 MHz. Built on the standard C28x
core architecture, both Delfino series are
100 percent software compatible with all
current TMS320F28xx controllers.
F28x
F283xx
F28x
F283xx
F28x
F283xx
Math Functions
(2.45 Improvement)
Control Algorithms
(1.57 Improvement)
DSP Performance
(1.38 Improvement)
F2833x floating-point devices boost performance by an average of 50 percent. C2834x devices add
even more processing power.
C2000 Microcontroller Literature and Related Technical Documentation
All documentation and associated literature, users guides, application notes and software can be found by clicking on the specific device
in the parametric table found on the URL below.
TMS320C2000 Microcontrollers www.ti.com/c2000
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C2000

Microcontrollers for Real-Time Control

Silicon
82

Texas Instruments 3Q 2009 Embedded Processing Guide

TMS320C2000

Microcontrollers for Real-Time Control

Tools
83

TMS320C2000 New Technology Tools

Better Integration. Easier Development
To order and learn more about the new C2000 tools, visit: www.ti.com/c2000tools
Key Tool Features
Stand-alone daughter card for rapid
prototyping
Full hardware documentation
[including schematics, Gerbers and
bill of material (BOM)]
Fully documented open source
example software
Full version of Code Composer
Studio Integrated Development
Environment, with 32-KB size limit,
included
Low-cost development kits starting
at just U.S. $89
The C2000 controlCARDs are the latest
tools for C2000 MCUs and feature a
C2000 processor and all necessary
support devices on one daughter card,
requiring only one 5-V supply to be fully
functional. The daughter card plugs into a
simple motherboard connector that gives
access to every pin on the device. Using a
controlCARD, custom prototyping boards
can easily be developed and inexpensively
manufactured. TI offers several C2000
development kits based on the
controlCARD concept, including two
DC/DC power kits and an AC/DC power
conversion kit.
C2000 Development Tools
DC/DC Developers Kit AC/DC Developers Kit
Digital Power
Experimenters Kit
C2000
Experimenter Kits controlCards
C2000 controlCARD-based tools
The C2000 controlCARDs are the latest
tools for TMS320C2000 MCUs. By
detaching the C2000 processor and all
necessary support devices and putting
them on controlCARDs, a designer can
test multiple processors on one board.
Separating the MCU from the base also
decreases replacement costs should
accidents happen. These controlCARDs
require only one 5-V supply and plug into
a simple motherboard connector that
gives access to every pin on the device.
Currently available with five microcon-
trollers and seven base boards, select
your kits today and start exploring what
the C2000 MCU has to offer, right out of
the box.
Visit www.ti.com/c2000tools for
more information.
A low-cost USB-based tool that provides
instant access to peripherals and pins
comes with the Piccolo line of devices.
Start developing for just U.S. $39.
Everything you need to work with the
48-pin Piccolo TMS320F28027
Access to all Piccolo control peripherals
through header pins
On-board USB JTAG emulation (no
external emulator required)
Numerous sample labs to get you
started immediately
Full software and hardware
documentation
Piccolo controlSTICK U.S. $39
C2000 Microcontroller Platform Hardware and Software Development Tools
Name Device Part # Description $U.S.
1
controlSTICK
controlSTICK
2
F28027 (Piccolo) TMDX28027USB controlSTICK USB evaluation tool 39
controlCARDs
DIM100 controlCARDs F28027 (Piccolo) TMDXCNCD28027 F28027 controlCARD 49
F28035 (Piccolo) TMDSCNCD28035 F28035 controlCARD 59
F28044 TMDSCNCD28044 F28044 controlCARD 59
F2808 TMDSCNCD2808 F2808 controlCARD 59
F28335 (Delfino) TMDSCNCD28335 F28335 controlCARD 69
C28343 (Delfino) TMDXCNDC28343 C28343 controlCARD 109
DIM168 controlCARDs C28346 (Delfino) TMDXCNDC28346-168 C28346 168-pin controlCARD 125
Starter Kits
Experimenters Kits
2
F28027 (Piccolo) TMDXDOCK28027 F28027 Experimenters Kit. Includes power supply, Code Composer Studio 79
(with on-board emulation) (CCStudio) IDE, USB cable, controlCARD and docking station
F2808 TMDSDOCK2808 F2808 Experimenters Kit. Includes power supply, CCStudio IDE, controlCARD 89
and docking station
F28335 (Delfino) TMDSDOCK28335 F28335 Experimenters Kit. Includes power supply, CCStudio IDE, controlCARD 99
and docking station
Experimenters Kits
2
C28343 (Delfino) TMDXDOCK28343 C28343 Experimenters Kit. Includes power supply, CCStudio IDE, 159
(external emulator required) DIM100 controlCARD and docking station
C28346 (Delfino) TMDXDOCK28346-168 C28346 Experimenters Kit. Includes power supply, CCStudio IDE, 189
DIM168 controlCARD and docking station
Peripheral Explorer Kit F28335 (Delfino) TMDSPREX28 F28335 Peripheral Explorer Kit. Includes power supply, CCStudio IDE, 179
controlCARD and peripheral explorer baseboard
Digital Power Experimenters Kit
2
F2808 TMDSDCDC2KIT Two independent channels digital power board with F2808 controlCARD* 229
Digital Power Developers Kit
2
F28044 TMDSDCDC8KIT Eight independent channels digital power board with F28044 controlCARD* 325
AC/DC Developers Kit
2
F2808 TMDSACDCKIT Phase-shifted full bridge with power factor correction digitally controlled AC/DC 695
conversion board with F2808 controlCARD*
Resonant DC/DC Developers Kit
2
F2808 TMDSRESDCKIT Single-transformer LLC resonant DC/DC EVM with F2808 controlCARD. 229
This kit does NOT require an external JTAG emulator.
Renewable Energy Developers Kit
2
F2808 TMDSENRGYKIT F2808 controlCARD-based DC/AC inverter EVM with battery charging 349
and management*
Motor Control and PFC Developers Kit F28035 (Piccolo) TMDS1MTRPFCKIT PFC plus dual-motor driver EVM with isolated USB JTAG emulator, includes 1 motor 369
Dual Motor Control and PFC Developers Kit F28035 (Piccolo) TMDS2MTRPFCKIT PFC plus dual-motor driver EVM with isolated USB JTAG emulator, includes 2 motors 399
Description Part # $U.S.
1
JTAG Emulators
JTAGjet-TMS-C2000 USB Emulator for Windows www.signum.com 595
Blackhawk USB2000 Controller TMDSEMU200U 299
XDS510 USB-Based Emulator TMDSEMUUSB 1,995
Spectrum Digital XDS510LC USB JTAG Emulator www.spectrumdigital.com 249
Software Development Tools
C2000 DSP Code Composer Studio Development Tools Bundled with Annual Software Subscription TMDSCCS2000-1 495
Supports TMS320C24x and TMS320C28x MCU products
Code Composer Studio Platinum Edition Development Tools bundled with Annual Software Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
C2000 MCU Code Composer Studio Development Tools Annual Software Subscription TMDSSUB2000 495
Code Composer Studio IDE Free Evaluation Tools SPRC119 Free
Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools
3
www.ti.com/freetools
TMS320C2000 Digital Motor Control Software www.ti.com/c2000appsw Free
TMS320C2000 Digital Power Software www.ti.com/dpslib Free
TMS320C2000 Signal Processing Libraries www.ti.com/c2000sigproclib Free
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the New tools are listed in red.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Includes 32-KB limited Code Composer Studio IDE.
3
Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker), emulator and simulator configurations all limited to 120 days. Alternative
Development Tools are available from third parties such as EWA Blackhawk DSP (www.blackhawk-dsp.com), Spectrum Digital (www.spectrumdigital.com), Technosoft (www.technosoft.ch) and
Softronics (www.softronx.com).
*External emulator required. Please see the tools features matrix on page 59 for more details.
Texas Instruments 3Q 2009 Embedded Processing Guide
TMS320C2000

Microcontrollers for Real-Time Control

Tools/Software
84

Texas Instruments 3Q 2009 Embedded Processing Guide

TMS320C2000

Microcontrollers for Real-Time Control

Complementary Power Management Products
85

Suggested Texas Instruments Power Management Solutions for TMS320C2000* Microcontrollers

Core and I/O Voltages
Synchronous Non-Synchronous Synchronous Non-Synchronous Non-Isolated Isolated Dual-
Input Controller Controller Integrated FET Integrated FET Power Power Output Multiple-Output
Voltage LDO (External FETs) (External FET and Diode) Converter Converter Module Module Controller Converter
3.3 V TPS73701 TPS40041 TPS64200 TPS54110 MC33063 PTH04070 TPS62420
5 V TPS73701 TPS40042 TPS40200 TPS54110 TPS40222 PTH04070 TPS75003 TPS54386
12 V TLV1117 TPS40190 TPS40200 TPS62110 TPS5410 PTH08080 TPS5120 TPS54386
24 V LM317 TPS40057 TPS40200

TPS5410

PTN78000

PTB78560

TPS54386
48 V TPS40061 PTMA403033

Due to Vout/Vin ratio core voltage may have to be stepped down from 3.3-V I/O. *Piccolo only requires a single-rail LDO.
I/O supply 3.3 V, current up to 500 mA. Core supply down to 1.8 V, current up to 1 A.
Power Management Products for the C2000 Microcontroller Platform
Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com
Example C2000 Microcontroller Power Supply Design
For additional power supply designs for TI Microcontrollers, please visit www.ti.com/processorpower.
Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level
power requirements to ensure an adequate power supply design is used.
OUT
OUT
Power Options for TMS320F2802x/3x Microcontrollers
Texas Instruments 3Q 2009 Embedded Processing Guide
86
MSP430 Ultra-Low Power Microcontrollers
Silicon
Key Applications
Low-power wireless applications
Consumer electronics
Utility metering
Intelligent sensing and control
Portable medical and instrumentation
Security systems
Key Features
16-bit RISC CPU enables new appli-
cations at a fraction of the code size
Ultra-low power architecture and
flexible clock system extends
battery life:
0.1A RAM retention
<1A real-time clock mode
Down to 165 A/MIPS
Increased performance
Up to 25 MHz
1.8V ISP Flash erase and write
Fail-safe, flexible clocking system
User-defined bootstrap loader
Up to 1-MB linear memory
addressing
Innovative features
Multi-channel DMA supports data
movement in standby mode
Industry-leading code density
More design options including
USB, RF, LCD interface
Integrated intelligent peripherals
including a wide range of high-
performance analog and digital
peripherals offload the CPU
Easy to get started: Complete
development tools starting at only
U.S. $20 with integrated development
environments available free of charge
Coming Soon: All New CC430
RF System-on-Chip
Integrates MSP430F5xx with CC1101
High analog performance/integration
Ease of development
High RF sensitivity and blocking
Flexible data rate and RF modulation
formats
MSP430 Microcontrollers
Ultra-Low Power, Easy-to-Use, 16-Bit RISC Microcontrollers
Get samples, data sheets, tools and app reports at: www.ti.com/msp430
CC430 high integration reduces complexity, lets designers do more with less.
www.ti.com/cc430
Flash
CPU/
Memory
Clocks, Power
Management
Unied Clock
System
Supply
Supervisors
Supply
Monitors
Brownout
RF
Transceiver
Timing &
Control
High-
Performance
Analog Communication
RAM ADC
General-
Purpose
Timers
Capture/
Compare
PWM
Outputs
Basic Timer
+ RTC
Universal
Serial
Communication
Interfaces
SPI, USART,
I
2
C
I/O &
Display
General-
Purpose I/O
Pull-Up,
Pull-Down,
Drive
Segment
LCD Static,
Muxed
AES
Comparators
Packet
Handler
Digital RSSI
Carrier
Sense
PQI/LQI
CCA
CPU
Interface
Sub-1 GHz
Radio
Frequency
Synthesizer
RF/Analog
TX & RX
Modem
RISC CPU
16-Bit
Enhanced
Eumulation
Module
JTAG
Spy-Bi-Wire
Interface
System
Control/
Watchdog
DMA
Controller
MSP430 roadmap
16 MIPS
120KB Flash
8-KB RAM
500-nA standby
1.83.6 V
100+ devices
2xx
8 MIPS
60KB Flash
10-KB RAM
1.83.6 V
75+ devices
1xx
16 MIPS
120KB Flash
8-KB RAM
LCD Controller,
160 Segments
1.83.6 V
100+ devices
4xx: LCD
25 MIPS
256KB Flash
16-KB RAM
1.83.6 V
USB, RF
6xx: LCD Controller
165-A/MHz
The New Generation
5xx6xx
F51x2
F551x
F541x
F543x
CC430
Analog integration:
Digital peripherals:
Communications:
ADC10/12, 16-bit sigma delta, 12-bit DAC, op amps
1616/3232 multiplier, DMA
USB, UART, I C, SPI, LIN, IrDA
2
P
e
r
f
o
r
m
a
n
c
e
Integration
F/CG461x
F552x
F56xx
F66xx
MSP430x1xx Flash/ROM-based
MCUs offering 1.8V to 3.6V operation,
up to 60 kB, 8 MIPS and a wide range
of peripherals.
MSP430F2xx Flash-based family
featuring even lower power and up to
16 MIPS with 1.8V to 3.6V operation.
Additional enhancements include 1%
on-chip very-low-power oscillator, inter-
nal pull-up/pull-down resistors and low-
pin-count options.
MSP430x4xx Flash/ROM-based
devices offering 1.8V to 3.6V operation,
up to 120-kB Flash/ROM, 16 MIPS with
FLL + SVS along with an integrated
LCD controller. Ideal for low-power
metering and medical applications.
MSP430F5xx/6xx New Flash-based
microcontroller family featuring the low-
est power consumption and perform-
ance up to 25 MIPS. It offers a wide
operating voltage range from 1.8V to
3.6V. Features include an innovative
power management module for optimiz-
ing power consumption, an internally
controlled voltage regulator, integrated
LDC driver on select devices and a wide
range of memory options up to 256 kB.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Ultra-Low Power, 16-Bit RISC
87

Large register file eliminates

accumulator bottleneck
Optimized for C and assembler
programming
Compact core design reduces power
and cost
Up to 16 MIPS of performance available
The MSP430 MCUs orthogonal architec-
ture provides the flexibility of 16 fully
addressable, single-cycle 16-bit CPU
registers and the power of a RISC. The
modern design of the CPU offers versatility
using only 27 easy-to-understand instruc-
tions and seven consistent addressing
modes. This results in a 16-bit low-power
CPU that has more effective processing, is
smaller-sized and more code-efficient
than other microcontrollers. Develop new
ultra-low power, high-performance appli-
cations at a fraction of the code size.
16-Bit RISC CPU
R15
R4 General Purpose
General Purpose
RO/PC Program Counter
R1/SP Stack Pointer
R2/SR/CG1 Status
R3/CG2 Constant Generator
0 15
The MSP430 CPU core with sixteen 16-bit
registers, 27 core instructions and seven
addressing modes results in higher processing
efficiency and code density.
The MSP430 was designed to provide
industry-leading ultra-low power perform-
ance. A flexible clocking system, multiple
operating modes and zero-power always-
on brown-out reset (BOR) are implement-
ed to reduce power consumption and dra-
matically extend battery life. The MSP430
BOR function is always active, even in all
low-power modes to ensure the most reli-
able performance possible. The MSP430
CPU architecture with 16 registers, 16-bit
data and 16-/20-bit address buses mini-
mizes power consuming fetches to memo-
ry and a fast vectored-interrupt structure
reduces the need for wasteful CPU soft-
ware flag polling. Intelligent hardware
peripheral features were also designed to
allow tasks to be completed more effi-
ciently and independent of the CPU. Many
MSP430 customers have developed
battery-based products that will last for
over 10 years from the original battery!
Ultra-Low Power Checklist:
Multiple operating modes
0.1A RAM retention
<1A real-time clock mode
Down to 165 A/MIPS
Instant-on stable high-speed clock
1.8V to 3.6V operation
Zero-power BOR
<50-nA pin leakage
CPU that minimizes CPU cycles per task
Low-power peripheral options
Ultra-Low Power Performance
Low-frequency auxiliary clock for ultra-
low power stand-by mode
High-speed master clock for high-
performance processing
Stability over time and temperature
The MSP430 MCU clock system is
designed specifically for battery-powered
applications. Multiple oscillators are uti-
lized to support event-driven burst activity.
A low-frequency Auxiliary Clock (ACLK) is
driven directly from a common 32-kHz
watch crystal or the internal very-low-
power oscillator (VLO) with no additional
external components.The ACLK can be
used for a background real-time clock self
wake-up function. An integrated high-
speed digitally controlled oscillator (DCO)
can source the master clock (MCLK) used
by the CPU and sub-main clock (SMCLK)
used by the high-speed peripherals. By
design, the DCO is active and stable in
1s (F2xx) or < 6s (x1xx, x4xx, F5xx).
MSP430 device-based solutions efficiently
use 16-bit RISC CPU high performance in
very short burst intervals. This results in
very high performance and ultra-low
power consumption.
Flexible Clock System
32.768 kHz
Control
Crystal
Digitally
Controlled
Oscillator
Very-Low Power
Oscillator (VLO)
Up to 20 kHz
f
ACLK 32 kHz
MCLK 100 kHz 16 MHz
Low-Power Peripherals
CPU and Peripherals
Multiple oscillator clock system
Ultra-Low Power
16-bit RISC MSP430 MCUs are the
industrys lowest-power solution fea-
turing a wide range of integrated
peripherals for 8- to 16-bit battery-
powered measurement applications.
Zero-power Brown Out Reset (BOR)
1s clock startup
<50-nA pin leakage
Device Configuration
1KB to 256KB Flash
Up to 16KB RAM
14- to 100-pin options
Integrated Peripherals
10-/12-bit SAR ADC
16-bit Sigma Delta ADC
12-bit DAC
Comparator
LCD driver
Supply voltage supervisor (SVS)
Op-amps
16-bit and 8-bit timers
Watchdog timer
UART/LIN
I
2
C
SPI
IrDA
Hardware multiplier
DMA controller
Temperature sensor
USB
LDO/PMM
MSP430 Flash Emulation Tools
JTAG-based real-time in-system
debugging and programming
CD-ROM includes IDE, assembler,
linker, simulator and C compiler
The Flash Emulation Tool (FET) supports
complete in-system development and
is available for all MSP430 Flash devices.
Programming, assembler/C source-
level debug, single stepping, multiple
hardware breakpoints, full-speed oper-
ation and peripheral access are all fully
supported in systems using JTAG.
The eZ430-F2013 USB development
tool is available for only U.S. $20 and
includes all the software and hardware
you need to start your MSP430 design.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Silicon
88

Flash-Based F2xx MCU Family Featuring Lower Power and Up to 16 MIPS* with 1.83.6V Operation Enha
Program SRAM 16-Bit Timers
2
(F) Flash (KB) (B) I/O A B Watchdog
F20xx
MSP430F2001 1 128 10 2
MSP430F2011 2 128 10 2
MSP430F2002 1 128 10 2
MSP430F2012 2 128 10 2
MSP430F2003 1 128 10 2
MSP430F2013 2 128 10 2
F21xx
MSP430F2101 1 128 16 3, 2
MSP430F2111 2 128 16 3, 2
MSP430F2121 4 256 16 3, 2
MSP430F2131 8 256 16 3, 2
MSP430F2112 2 256 22 3, 2
MSP430F2122 4 512 22 3, 2
MSP430F2132 8 512 22 3, 2
F22x2
MSP430F2232 8 512 32 3 3
MSP430F2252 16 512 32 3 3
MSP430F2272 32 1024 32 3 3
F22x4
MSP430F2234 8 512 32 3 3
MSP430F2254 16 512 32 3 3
MSP430F2274 32 1024 32 3 3
F23x0
MSP430F2330 8 1024 32 3 3
MSP430F2350 16 2048 32 3 3
MSP430F2370 32 2048 32 3 3
F23x
MSP430F233 8 1024 48 3 3
MSP430F235 16 2048 48 3 3
F24x/2410
MSP430F247 32 4096 48 3 7
MSP430F248 48 4096 48 3 7
MSP430F249 60 2048 48 3 7
MSP430F2410 56 4096 48 3 7
F24x1
MSP430F2471 32 4096 48 3 7
MSP430F2481 48 4096 48 3 7
MSP430F2491 60 2048 48 3 7
F241x
MSP430F2416 92 4096 48/64 3 7
MSP430F2417 92 8192 48/64 3 7
MSP430F2418 116 8192 48/64 3 7
MSP430F2419 120 4096 48/64 3 7
F261x
MSP430F2616 92 4096 48/64 3 7
MSP430F2617 92 8192 48/64 3 7
MSP430F2618 116 8192 48/64 3 7
MSP430F2619 120 4096 48/64 3 7
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers
are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final
pricing prior to accepting any order.
* See www.ti.com/msp430 for additional information.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Silicon
89

ancements Include 1% On-Chip Very-Low-Power Oscillator, Internal Pull-Up/Pull-Down Resistors and Low Pin-Count Options
USCI
3
Ch A:
USI
4
: UART/LIN/ Ch B: MPY Temp ADC Additional 1-KU
BOR SVS I
2
C/SPI IrDA/SPI I
2
C/SPI DMA (1616) Comp_A+ Sensor Ch/Res Features Packages Price
1
slope 14 PW, N, 16 RSA 0.55
slope 14 PW, N, 16 RSA 0.65
8ch, ADC10 14 PW, N, 16 RSA 0.80
8ch, ADC10 14 PW, N, 16 RSA 0.95
4ch, SD16 14 PW, N, 16 RSA 1.20
4ch, SD16 14 PW, N, 16 RSA 1.35
slope 20 DGV, DW, PW, 24 RGE 0.75
slope 20 DGV, DW, PW, 24 RGE 0.80
slope 20 DGV, DW, PW, 24 RGE 1.10
slope 20 DGV, DW, PW, 24 RGE 1.40
1 1 8ch, ADC10 28 PW, 32 RHB 1.55
1 1 8ch, ADC10 28 PW, 32 RHB 1.65
1 1 8ch, ADC10 28 PW, 32 RHB 1.75
1 1 12ch, ADC10 38 DA, 40 RHA 1.95
1 1 12ch, ADC10 38 DA, 40 RHA 2.20
1 1 12ch, ADC10 38 DA, 40 RHA 2.50
1 1 12ch, ADC10 (2) OPAMP 38 DA, 40 RHA 2.15
1 1 12ch, ADC10 (2) OPAMP 38 DA, 40 RHA 2.40
1 1 12ch, ADC10 (2) OPAMP 38 DA, 40 RHA 2.70
1 1 slope 40 RHA 1.85
1 1 slope 40 RHA 2.15
1 1 slope 40 RHA, 49 YFF 2.55
1 1 8ch, ADC12 64 PM, 64 RGC 2.40
1 1 8ch, ADC12 64 PM, 64 RGC 2.90
2 2 8ch, ADC12 64 PM, 64 RGC 4.05
2 2 8ch, ADC12 64 PM, 64 RGC 4.60
2 2 8ch, ADC12 64 PM, 64 RGC 4.75
2 2 8ch, ADC12 64 PM, 64 RGC 4.85
2 2 slope 64 PM, 64 RGC 3.70
2 2 slope 64 PM, 64 RGC 4.25
2 2 slope 64 PM, 64 RGC 4.40
2 2 8ch, ADC12 64 PM, 80 PN, 113 ZQW 5.60
2 2 8ch, ADC12 64 PM, 80 PN, 113 ZQW 6.10
2 2 8ch, ADC12 64 PM, 80 PN, 113 ZQW 6.40
2 2 8ch, ADC12 64 PM, 80 PN, 113 ZQW 6.10
2 2 8ch, ADC12 (2) DAC12 64 PM, 80 PN, 113 ZQW 7.10
2 2 8ch, ADC12 (2) DAC12 64 PM, 80 PN, 113 ZQW 7.60
2 2 8ch, ADC12 (2) DAC12 64 PM, 80 PN, 113 ZQW 7.90
2 2 8ch, ADC12 (2) DAC12 64 PM, 80 PN, 113 ZQW 7.60
2
Represents number of capture/compare registers and PWM output generators per timer. New products are listed in red.
3
USCI channel 1 supports UART/LIN, IrDA and SPI; USCI channel 2 supports I
2
C and SPI.
4
USI supports I
2
C or SPI.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Silicon
90

Flash/ROM-Based x1xx MCU Family Offering 1.83.6V Operation, Up to 60 kB, 8 MIPS* and a Wide Range of Peripherals
USART:
(C) ROM Program SRAM 16-Bit Timers
2
(UART/ MPY Temp ADC Additional 1-KU
(F) Flash (KB) (B) I/O A B Watchdog BOR SVS SPI) DMA (1616) Comp_A Sensor Ch/Res Features Packages Price
1
x11x1
MSP430F1101A 1 128 14 3 slope 20 DGV, DW, PW, 24 RGE 0.99
MSP430C1101 1 128 14 3 slope 20 DW, PW, 24 RGE 1.25
MSP430F1111A 2 128 14 3 slope 20 DGV, DW, PW, 24 RGE 1.35
MSP430C1111 2 128 14 3 slope 20 DW, PW, 24 RGE 1.10
MSP430F1121A 4 256 14 3 slope 20 DGV, DW, PW, 24 RGE 1.70
MSP430C1121 4 256 14 3 slope 20 DW, PW, 24 RGE 2.15
F11x2
MSP430F1122 4 256 14 3 5ch, ADC10 20 DW, PW, 32 RHB 2.00
MSP430F1132 8 256 14 3 5ch, ADC10 20 DW, PW, 32 RHB 2.25
F12x
MSP430F122 4 256 22 3 1 slope 28 DW, PW, 32 RHB 2.15
MSP430F123 8 256 22 3 1 slope 28 DW, PW, 32 RHB 2.30
F12x2
MSP430F1222 4 256 22 3 1 8ch, ADC10 28 DW, PW, 32 RHB 2.40
MSP430F1232 8 256 22 3 1 8ch, ADC10 28 DW, PW, 32 RHB 2.50
F13x
MSP430F133 8 256 48 3 3 1 8ch, ADC12 64 PM, PAG, RTD 3.00
MSP430F135 16 512 48 3 3 1 8ch, ADC12 64 PM, PAG, RTD 3.60
F13x1
MSP430C1331 8 256 48 3 3 1 slope 64 PM, RTD 2.00
MSP430C1351 16 512 48 3 3 1 slope 64 PM, RTD 2.30
F14x
MSP430F147 32 1024 48 3 7 2 8ch, ADC12 64 PM, PAG, RTD 5.05
MSP430F148 48 2048 48 3 7 2 8ch, ADC12 64 PM, PAG, RTD 5.75
MSP430F149 60 2048 48 3 7 2 8ch, ADC12 64 PM, PAG, RTD 6.05
F14x1
MSP430F1471 32 1024 48 3 7 2 slope 64 PM, RTD 4.60
MSP430F1481 48 2048 48 3 7 2 slope 64 PM, RTD 5.30
MSP430F1491 60 2048 48 3 7 2 slope 64 PM, RTD 5.60
F15x
MSP430F155 16 512 48 3 3 1 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 4.95
MSP430F156 24 1024 48 3 3 1 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 5.55
MSP430F157 32 1024 48 3 3 1 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 5.85
F16x1
MSP430F167 32 1024 48 3 7 2 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 6.75
MSP430F168 48 2048 48 3 7 2 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 7.45
MSP430F169 60 2048 48 3 7 2 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 7.95
MSP430F1610 32 5120 48 3 7 2 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 8.25
MSP430F1611 48 10240 48 3 7 2 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 8.65
MSP430F1612 55 5120 48 3 7 2 with I
2
C 8ch, ADC12 (2) DAC12 64 PM, RTD 8.95
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior
to placing orders. TI may verify final pricing prior to accepting any order.
2
Represents number of capture/compare registers and PWM output generators per timer.
*See www.ti.com/msp430 for additional information.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Silicon
91

Flash/ROM-Based x4xx MCU Family Offering 1.83.6V Operation, Up to 120 kB Flash/ROM, 8 MIPS with FLL + SVS and Integrated LCD Controller*
USCI
16-Bit Watchdog Ch A:
(C) ROM Program SRAM Timers
3
and Basic USART: UART/LIN/ Ch B: LCD MPY Temp ADC Additional 1-KU
(F) Flash (KB) (B) I/O A B Timer BOR SVS (UART/SPI) IrDA/SPI I
2
C/SPI Segments DMA (1616) Comp_A Sensor Ch/Res Features Package(s) Price
1
x41x
MSP430F412 4 256 48 3 96 slope 64 PM, RTD 2.60
MSP430C412 4 256 48 3 96 slope 64 PM, RTD 1.90
MSP430F413 8 256 48 3 96 slope 64 PM, RTD 2.95
MSP430C413 8 256 48 3 96 slope 64 PM, RTD 2.10
MSP430F415 16 512 48 3,5 96 slope 64 PM, RTD 3.40
MSP430F417 32 1024 48 3,5 96 slope 64 PM, RTD 3.90
F41x2
MSP430F4152 16 512 56 2 1 1 144 8ch, ADC10 64 PM, 48 RGZ 1.70
MSP430F4132 8 512 56 2 1 1 144 8ch, ADC10 64 PM, 48 RGZ 1.90
F42x
MSP430F423 8 256 14 3 1 128 (3) SD16 64 PM 4.55
MSP430F425 16 512 14 3 1 128 (3) SD16 64 PM 5.05
MSP430F427 32 1024 14 3 1 128 (3) SD16 64 PM 5.45
FW42x
MSP430FW423 8 256 48 3, 5 96 slope Flow-meter 64 PM 3.75
MSP430FW425 16 512 48 3, 5 96 slope Flow-meter 64 PM 4.05
MSP430FW427 32 1024 48 3, 5 96 slope Flow-meter 64 PM 4.45
FE42xx
MSP430FE423 8 256 14 3 1 128 (3) SD16 E-meter 64 PM 4.90
MSP430FE425 16 512 14 3 1 128 (3) SD16 E-meter 64 PM 5.40
MSP430FE427 32 1024 14 3 1 128 (3) SD16 E-meter 64 PM 5.95
MSP430FE4232 8 256 14 3 1 128 (2) SD16 E-meter 64 PM 3.50
MSP430FE4242 12 512 14 3 1 128 (2) SD16 E-meter 64 PM 3.70
F42x0
MSP430F4250 16 256 32 3 56 5ch, SD16 DAC12 48 DL, RGZ 3.10
MSP430F4260 24 256 32 3 56 5ch, SD16 DAC12 48 DL, RGZ 3.45
MSP430F4270 32 256 32 3 56 5ch, SD16 DAC12 48 DL, RGZ 3.80
FG42x0
MSP430FG4250 16 256 32 3 56 5ch, SD16 DAC12, (2) OPAMP 48 DL, RGZ 3.35
MSP430FG4260 24 256 32 3 56 5ch, SD16 DAC12, (2) OPAMP 48 DL, RGZ 3.70
MSP430FG4270 32 256 32 3 56 5ch, SD16 DAC12, (2) OPAMP 48 DL, RGZ 4.05
F43x
MSP430F435 16 512 48 3 3 1 128/160 8ch, ADC12 80 PN, 100 PZ 4.45
MSP430F436 24 1024 48 3 3 1 128/160 8ch, ADC12 80 PN, 100 PZ 4.70
MSP430F437 32 1024 48 3 3 1 128/160 8ch, ADC12 80 PN, 100 PZ 4.90
F43x1
MSP430F4351 16 512 48 3 3 1 128/160 slope 80 PN, 100 PZ 4.05
MSP430F4361 24 1024 48 3 3 1 128/160 slope 80 PN, 100 PZ 4.30
MSP430F4371 32 1024 48 3 3 1 128/160 slope 80 PN, 100 PZ 4.50
FG43x
MSP430FG437 32 1024 48 3 3 1 128 12ch, ADC12 (2) DAC12, (3) OPAMP 80 PN 6.50
MSP430FG438 48 2048 48 3 3 1 128 12ch, ADC12 (2) DAC12, (3) OPAMP 80 PN 7.35
MSP430FG439 60 2048 48 3 3 1 128 12ch, ADC12 (2) DAC12, (3) OPAMP 80 PN 7.95
F44x
MSP430F447 32 1024 48 3 7 2 160 8ch, ADC12 100 PZ 5.75
MSP430F448 48 2048 48 3 7 2 160 8ch, ADC12 100 PZ 6.50
MSP430F449 60 2048 48 3 7 2 160 8ch, ADC12 100 PZ 7.05
xG461x
MSP430FG4616 92 4096 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 9.45
MSP430FG4617 92 8192 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 9.95
MSP430FG4618 116 8192 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 10.35
MSP430FG4619 120 4096 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 9.95
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the Preview products are listed in bold blue.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Up to 16 MIPS.
3
Represents number of capture/compare registers and PWM output generators per timer.
*See www.ti.com/msp430 for additional information. Continued on the following page.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Silicon
92

Flash/ROM-Based x4xx MCU Family Offering 1.83.6V Operation, Up to 120 kB Flash/ROM, 8 MIPS with FLL + SVS and Integrated LCD Controller (Contd)*
USCI
16-Bit Watchdog Ch A:
(C) ROM Program SRAM Timers
3
and Basic USART: UART/LIN/ Ch B: LCD MPY Temp ADC Additional 1-KU
(F) Flash (KB) (B) I/O A B Timer BOR SVS (UART/SPI) IrDA/SPI I
2
C/SPI Segments DMA (1616) Comp_A Sensor Ch/Res Features Package(s) Price
1
xG461x (Continued)
MSP430CG4616 92 4096 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ 7.65
MSP430CG4617 92 8192 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ 8.05
MSP430CG4618 116 8192 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ 8.40
MSP430CG4619 120 4096 80 3 7 1 1 1 160 12ch, ADC12 (2) DAC12, (3) OPAMP 100 PZ 8.05
F47xx
MSP430F4783
2
48 2480 72 3 3 WDT+ 2 2 160 3232 (3) SD16 100 PZ 7.50
MSP430F4793
2
60 2560 72 3 3 WDT+ 2 2 160 3232 (3) SD16 100 PZ 8.05
MSP430F4784
2
48 2048 72 3 3 WDT+ 2 2 160 3232 (4) SD16 100 PZ 8.00
MSP430F4794
2
60 2560 72 3 3 WDT+ 2 2 160 3232 (4) SD16 100 PZ 8.55
F471xx
MSP430F47166
2
92 4096 72 3 3 2 2 160 3232 (6) SD16 RTC 100 PZ TBD
MSP430F47176
2
92 8192 72 3 3 2 2 160 3232 (6) SD16 RTC 100 PZ TBD
MSP430F47186
2
116 8192 72 3 3 2 2 160 3232 (6) SD16 RTC 100 PZ TBD
MSP430F47196
2
120 4096 72 3 3 2 2 160 3232 (6) SD16 RTC 100 PZ TBD
MSP430F47167
2
92 4096 72 3 3 2 2 160 3232 (7) SD16 RTC 100 PZ TBD
MSP430F47177
2
92 8192 72 3 3 2 2 160 3232 (7) SD16 RTC 100 PZ TBD
MSP430F47187
2
116 8192 72 3 3 2 2 160 3232 (7) SD16 RTC 100 PZ TBD
MSP430F47197
2
120 4096 72 3 3 2 2 160 3232 (7) SD16 RTC 100 PZ TBD
FG47x
MSP430FG477 32 2 KB 48 3 3 2 2 128 (1) SD16 DAC12, (2) OPAMP 80 PN, 113 ZQW 5.50
MSP430FG478 48 2 KB 48 3 3 2 2 128 (1) SD16 DAC12, (2) OPAMP 80 PN, 113 ZQW 5.65
MSP430FG479 60 2 KB 48 3 3 2 2 128 (1) SD16 DAC12, (2) OPAMP 80 PN, 113 ZQW 6.25
F47x
MSP430F477 32 2 KB 48 3 3 2 2 128 (1) SD16 DAC12 80 PN, 113 ZQW 4.70
MSP430F478 48 2 KB 48 3 3 2 2 128 (1) SD16 DAC12 80 PN, 113 ZQW 5.20
MSP430F479 60 2 KB 48 3 3 2 2 128 (1) SD16 DAC12 80 PN, 113 ZQW 5.75
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the New products are listed in red.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Up to 16 MIPS.
3
Represents number of capture/compare registers and PWM output generators per timer.
*See www.ti.com/msp430 for additional information.
Flash-Based F5xx MCU Family Features Lowest Power Consumption, Up to 25 MIPS* with 1.83.6V Operation Starting at 12 MIPS
USCI
16-Bit PMM (BOR, Ch A:
Program SRAM Timers
4
Watchdog SVS, SVM, UART/LIN/ Ch B: MPY Temp ADC Additional 1-KU
(F) Flash (KB) (KB) I/O A B and RTC LDO) IrDA/SPI I
2
C/SPI DMA (3232) Comp_B Sensor Ch/Res Features Package(s) Price
1
MSP430F5514 64 4 + 2
2
47 5,3,3 7 2 2 3 ch USB 64 RGC, 80 ZQE 3.55
MSP430F5515 64 4 + 2
2
63 5,3,3 7 2 2 3 ch USB 80 PN 3.65
MSP430F5524 64 4 + 2
2
47 5,3,3 7 2 2 3 ch 12 ch ADC12 A USB 64 RGC, 80 ZQE 3.55
MSP430F5525 64 4 + 2
2
63 5,3,3 7 2 2 3 ch 16 ch ADC12 A USB 80 PN 3.70
MSP430F5526 96 6 + 2
2
47 5,3,3 7 2 2 3 ch 12 ch ADC12 A USB 64 RGC, 80 ZQE 3.80
MSP430F5527 96 6 + 2
2
63 5,3,3 7 2 2 3 ch 16 ch ADC12 A USB 80 PN 3.90
MSP430F5528 128 8 + 2
2
47 5,3,3 7 2 2 3 ch 12 ch ADC12 A USB 64 RGC, 80 ZQE 3.95
MSP430F5529 128 8 + 2
2
63 5,3,3 7 2 2 3 ch 16 ch ADC12 A USB 80 PN 4.00
MSP430F5418
3
128 16 64 5,3 7 2 2 3 ch 16 ch ADC12 A 18 MIPS 80 PN 3.30
MSP430F5419
3
128 16 83 5,3 7 4 4 3 ch 16 ch ADC12 A 18 MIPS 100 PZ, 113 ZQW 3.65
MSP430F5435
3
192 16 64 5,3 7 2 2 3 ch 16 ch ADC12 A 18 MIPS 80 PN 3.90
MSP430F5436
3
192 16 83 5,3 7 4 4 3 ch 16 ch ADC12 A 18 MIPS 100 PZ, 113 ZQW 4.30
MSP430F5437
3
256 16 64 5,3 7 2 2 3 ch 16 ch ADC12 A 18 MIPS 80 PN 4.40
MSP430F5438
3
256 16 83 5,3 7 4 4 3 ch 16 ch ADC12 A 18 MIPS 100 PZ, 113 ZQW 4.85
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the Preview products are listed in blue.
most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
Additional SRAM available if USB is disabled.
3
Revision A with 25 MIPS available in 4Q09.
4
Represents number of capture/compare registers per timer.
*See www.ti.com/msp430 for additional information.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Silicon
93

Intelligent Peripherals
With purely software-driven functions, the
CPU is 100% active and consuming
power. Effectively utilizing peripherals
allows the CPU to be turned off to save
power or work on other activities to
achieve the highest performance. MSP430
device peripherals are designed to require
the least amount of software service.
Additional hardware features allow CPU
resources to focus more on differentiated
application-specific features and less on
basic data handling. Lower-cost systems
can be implemented using less software
and lower power.
Peripheral Overview
ADC10/ADC12The ADC10/12 module sup-
ports fast, >200ksps, 10-bit or 12-bit analog-to-
digital conversions. The module features a 10- or
12-bit SAR core with 5, 8 or 12 input channels,
sample select control, 1.5/2.5V reference gener-
ator and internal temperature sensor. ADC10 fea-
tures a data transfer controller (DTC) and ADC12
features a 16-word conversion-and-control
buffer. These added features allow samples to be
converted and stored without CPU intervention.
BORThe brown-out reset (BOR) circuit detects
low supply voltages and reset circuit resets the
device by triggering a POR signal when power is
applied or removed. MSP430s zero-power BOR
circuit is continuously turned on, including in all
low-power modes.
Comparator_A/Comparator_A+The
Comparator_A/A+ module supports precision
slope analog-to-digital conversions, supply volt-
age supervision and monitoring of external analog
signals for accurate voltage and resistor value
measurement. The module features a selectable
reference voltage generator and input multiplexer.
(Comp A+)
DAC12The DAC12 module is a 12-bit, voltage
output DAC featuring internal or external refer-
ence selection, programmable settling time for
optimal power consumption and can be configured
in 8-bit or 12-bit mode. When multiple DAC12
modules are present, they may be grouped
together for synchronous update operation.
DMAThe direct memory access (DMA)
controller transfers data from one address to
another, without CPU intervention, across the
entire address range. The DMA increases the
throughput of peripheral modules and reduces
system power consumption. The module features
up to three independent transfer channels.
ESP430 (integrated in FE42x devices)The
ESP430CE1 module incorporates the SD16,
hardware multiplier and ESP430 embedded
processor engine for single-phase energy meter-
ing applications. The module performs metering
calculations independent of the CPU.
FLASHThe MSP430 Flash memory is bit-,
byte- and word-addressable and programmable.
The main memory segment size is 512 Bytes.
Each MSP430 also has up to 256 Bytes of Flash
Information Memory for EEPROM emulation.
Flash can be read, erased and written (100,000
cycles) through the JTAG debugging interface, the
Bootstrap Loader and in system.
I/OMSP430 devices have up to 12 digital I/O
ports implemented. Each port has eight I/O pins.
Every I/O pin is configurable for input or output
direction, and can be individually read or written
to. Ports P1 and P2 have interrupt capability.
MSP430F2xx, 5xx and some 4xx devices feature
built-in individually configurable pull-up or pull-
down resistors.
LCD/LCD_AThe LCD/LCD_A controller directly
drives LCD displays with automatic signal gener-
ation for up to 160 segments. The MSP430 LCD
controller can support static, 2-mux, 3-mux and
4-mux LCDs. The LCD_A module includes an
integrated charge pump for contrast control.
MPYThe hardware multiplier module supports
8/16-bit 8/16-bit signed and unsigned multiply
with optional multiply and accumulate function-
ality. It is a peripheral which does not interfere
with CPU activities and can be accessed by the
DMA. The MPY on new F47xx and F5xx devices
features up to 3232-bit operation.
OpAmpThe MSP430 integrated operational
amplifiers feature single-supply, low-current oper-
ation with rail-to-rail outputs and programmable
settling times. Internal, programmable feedback
resistors and connections between multiple op
amps allow for a variety of software-selectable
configuration options including: unity gain mode,
comparator mode, inverting PGA, non-inverting
PGA, differential and instrumentation amplifier.
Real-Time Clock / Basic TimerThe BT has
two independent 8-bit timers which can be cas-
caded to form a 16-bit timer/counter. Both timers
can be read and written by software. The BT is
extended to provide an integrated RTC. An inter-
nal calendar compensates for months with less
than 31 days and includes leap year correction.
SCAN IFThe Scan IF module is a programma-
ble state machine with analog front end used to
automatically measure linear or rotational motion
with the lowest possible power consumption. The
module features support for different types of LC
and resistive sensors and for quadrature encoding.
SD16/SD16_AThe SD16/SD16_A module
features up to three 16-bit sigma-delta A/D con-
verters with an internal 1.2V reference. Each has
up to eight fully differential multiplexed inputs
including a built-in temperature sensor. The con-
verters are second-order oversampling sigma-
delta modulators with selectable oversampling
ratios of up to 1024 (SD16_A) or 256 (SD16).
SVSThe supply voltage supervisor (SVS) is a
configurable module used to monitor the AVCC
supply voltage or an external voltage. The SVS
can be configured to set a flag or generate a POR
reset when the supply voltage or external voltage
drops below a user-selected threshold.
Timer_A/Timer_BTimer_A and Timer_B are
asynchronous 16-bit timer/counters with up to
seven capture/compare registers and four oper-
ating modes. The timers support multiple capture/
compares, PWM outputs and interval timing and
also have extensive interrupt capabilities.
USARTThe universal synchronous/asynchronous
receive/transmit (USART) peripheral interface
supports asynchronous RS-232 and synchronous
SPI communication with one hardware module.
The MSP430F15x and MSP430F16x USART
module also supports I
2
C. The module supports
programmable baud rate and independent inter-
rupt capability for receive and transmit.
USBThe USB module is fully compliant with
the USB 2.0 specification and supports control,
interrupt and bulk transfers at 12-Mbps data rate
(full speed). The module supports USB suspend,
resume and remote wakeup operations and can
be configured for up to eight input and eight out-
put endpoints. The module includes an integrated
physical interface (PHY), a phase locked loop
(PLL) for USB clock generation, and a flexible
power supply system enabling bus-powered and
self-powered devices.
USCIThe universal serial communication inter-
face (USCI) module features two independent
channels which can be used simultaneously. The
asynchronous channel (USCI_A) supports UART
mode, SPI mode, pulse shaping for IrDA and
automatic baud rate detection for LIN communi-
cations. The synchronous channel (USCI_B) sup-
ports I
2
C and SPI modes.
USIThe universal serial interface (USI) module
is a synchronous serial communication interface
with a data length of up to 16 bits and can sup-
port SPI and I
2
C communication with minimal
software.
Watchdog+The WDT+ performs a controlled
system restart after a software problem occurs. If
the selected time interval expires, a system reset
is generated. If the watchdog function is not
needed in an application, the module can be con-
figured as an interval timer and can generate
interrupts at selected time intervals.
Texas Instruments 3Q 2009 Embedded Processing Guide
MSP430 Ultra-Low Power Microcontrollers
Tools
94

Development Kits
Contents Part Number Packages Supported Price
1
USB FET programming tools and target board MSP-FET430U14 14-pin PW (TSSOP) 149
MSP-FET430U28 20-/28-pin PW (TSSOP) 149
MSP-FET430U38 38-pin DA (TSSOP) 149
MSP-FET430U23x0 MSP430F23x0 40-pin DHA (QFN) 149
MSP-FET430U48 48-pin DL (SSOP) 149
MSP-FET430U64 64-pin PM (LQFP) 149
MSP-FET430U80 80-pin PN (LQFP) 149
MSP-FET430U100 100-pin PZ (LQFP) 149
MSP-FET430U5x100 MSP430F5xx 100-pin PZ (TQFP) 149
MSP-FET430U80USB 80-pin PN (LQFP) 149
Target board only MSP-TS430PM64 64-pin PM (LQFP) 75
MSP-TS430PZ5x100 MSP430F5xx 100-pin PZ (TQFP) 75
MSP-TS430PN80USB 80-pin PN (LQFP) 75
eZ430 Tools
Part Number Contents Included Devices Price
1
eZ430-F2013 Programmer and target board MSP430F2013 20
eZ430-F2012 3 target boards MSP430F2012 10
eZ430-RF2500 Interface, (2) target boards, battery board MSP430F2274, CC2500 49
eZ430-RF2500T Target board, battery board MSP430F2274, CC2500 20
eZ430-RF2500-SEH Interface, (2) target boards, battery board, solar energy harvesting board MSP430F2274, CC2500 149
eZ430-RF2480 Interface, (3) target boards, 2 battery boards MSP430F2274, CC2480 99
Experimenter Boards
Part Number Board Features Included Devices Price
1
MSP-EXP430FG4618 Microphone, audio output buzzer, LCD, capacitive touch-pad, 2 push MSP430FG4618, MSP430F2013 99
buttons, prototyping space, RS-232 communication interface, RF connectivity
MSP-EXP430F5438 Socket for MSP430, 3-axis accelerometer, microphone, audio output, dot matrix MSP430F5438 149
LCD, joystick, RF connectivity, USB connectivity
Software Development Tools
Part Number Contents Include Devices Supported Price
1
IAR-KICKSTART IAR Embedded Workbench Kickstart Edition (4 KB limited) All Free
MSP-CCE430 Code Composer Essentials Core Edition (16 KB limited) All Free
MSP-CCE430PRO Code Composer Essentials Professional (Unrestricted) All 499
Debugging and Programming Interfaces
Part Number PC Port Contents Include Devices Supported Price
1
MSP-FET430UIF USB Interface only All 99
MSP-GANG430 Serial Production programmer All (8 devices at one time) 199
MSP-FET430PIF Parallel Interface only All (except MSP430F20xx) 49
1
Suggested resale price per unit in U.S. dollars. New products are listed in bold red.
USB FET programming tools and target board
Target board only
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the MSP430 Family
Complementary Analog Products
95

Amplifiers for MSP430 Microcontrollers

Key Feature Device Device Features
Slow mode (Low frequency signals) Ultra-low power OPA369 1.4-A Iq (Max) RRIO, zero crossover, 12 kHz
Slow mode (Low frequency signals) Ultra-low power OPA349 2-A Iq (Max), RRIO, 10-pA max IB, 70 kHz
Slow mode (Low frequency signals) Ultra-low power OPA379 5.5-A Iq (Max), RRIO, 1.5-mV max offset, 90kHz
Slow mode (Low frequency signals) Ultra-low power OPA333 25-A Iq (Max), zero drift, 1.1-uVPP noise, 350 kHz
Slow mode (Low frequency signals) Ultra-low power TLV276x 28-A Iq (Max), 15-pA max offset, RRIO, 500 kHz
Slow mode (Low frequency signals) Programmable PGA112/113 RRIO, single supply, 2-ch MUX, easy SPI interface. Up to 200 gain with 4-A shutdown
Medium / fast modes High performance OPA37 20 nV/Hz, 25-V Vos, zero drift, RRIO, 0.9 MHz
Medium / fast modes High performance OPA334 5-V Vos, shutdown, RRO, 2 MHz
Medium / fast modes High performance OPA376 25-V Vos, 7.5 nV/Hz, 5 MHz
Medium / fast modes High performance OPA363/4 500-V Vos, zero crossover, RRIO, 7 MHz
Medium / fast modes High performance TLV278x RRIO, shutdown, 8 MHz
Instrumentation amplifiers Measuring very small signals INA321 60 A, 10-pA bias, RRO, shutdown
Instrumentation amplifiers Measuring very small signals INA322 60 A, 10-pA bias, RRO, shutdown
Instrumentation amplifiers Measuring very small signals INA331 500 A, 10-pA bias, RRO, 2 MHz, shutdown
Instrumentation amplifiers Measuring very small signals INA332 100 A, 10-pA bias, RRO, 2 MHz, shutdown
Instrumentation amplifiers Measuring very small signals INA333 75 A, 25-V offset, RRIO, zero drift
Data Converters for MSP430 Microcontrollers
Key Feature Device Device Features
Analog-to-digital converter Higher speed, precision ADS8318 16-bit, 500 kSPS, 1 LSB INL, single supply, 95.2dB SNR @ 10 kHz, 720 A @ 100kSPS. Performance upgrade
MSP430 on-board ADC
Analog-to-digital converter Higher speed, precision ADS8326 16-bit 250 kSPS, single supply, 74 A @ 10kSPS & Vdd= 2.7V, 1.5 LSB max INL, 91 dB SNR
Analog-to-digital converter Higher speed, precision ADS7886/7/8 12-/10-/8-bit, 1 MSPS, 1.5 mA and auto power down, easy speed upgrade
Analog-to-digital converter Higher speed, precision ADS7866/7/8 12-/10-/8-bit, 200 kSPS, 100 A and auto power down, easy power upgrade
Analog-to-digital converter Higher resolution ADS1248 24-bit, dual-matched current sources, 8 GPIO, low-drift internal reference 4 ppm/C (typ), oscillator, sensor,
burnout detect, 50-/60-Hz rejection. Great for MSP430-based temperature solutions.
Analog-to-digital converter Higher resolution ADS1232 24-bit, ultra-low noise (17 nV RMS) bridge sensor ADC, designed for weigh-scale MSP430 systems
Analog-to-digital converter Higher resolution ADS1100 16-bit, internal reference, oscillator, PGA, 90 A (240 with ref), easily add an SD16 to MSP430
Analog-to-digital converter Higher resolution ADS1000 12-bit, low cost, 90 A, easy interface, PGA, OSC, simple Delta Sigma addition to MSP430 systems
Digital-to-analog converter Precision DACx311/8411 Tiny, low-power 8- to 16-bit DACs with wide supply and temp ranges. <100 A/ch., 1 LSB INL, 5 S settling time
Digital-to-analog converter Precision DAC7552 Small, low-power, low-glitch DAC. 1 LSB INL (max), glitch energy: 0.1 nV-s, 200 A/ch, 5 S settling time
Digital-to-analog converter Precision DAC8830 Low-power, high-speed DAC, 1 LSB INL, 6 A typ, 1 s max settling, low noise: 18 nV/Hz; gain drift: 0.1 ppm/C
Temperature Sensors for MSP430 Microcontrollers
Key Feature Device Device Features
Local TMP102 0.5C accuracy, 10 A active current with shutdown
Remote + local TMP400 1C accuracy with N-factor and series resistance
Remote + local TMP421/422 Tiny SOT-23-8 1C accuracy with N-factor and series resistance correction
Voltage References for MSP430 Microcontrollers
Key Feature Device Device Features
Highest accuracy REF32xx 4 ppm/C, 0.2% accuracy, 100 A, SOT23-6 voltage reference
Lowest power REF33xx 3.9 A, 0.15% initial accuracy, SC70-3, 30 ppm/C drift
Interface Products for MSP430 Microcontrollers
Device Type Device Device Features
I/O Expanders TCA64xx 1.8V I/O expander with interrupt and reset. Great for keypad control.
I/O Expanders PCA953x 16-bit low-power bi-directional I/O expander.
Line Drivers TRS3227E 3V5.5V single-channel RS-232 line driver/receiver with 15-kV IEC ESD protection. A must have for remote RS-232 communication.
USB TUSB3410 Add full-speed USB connectivity to the MSP430 using the UART. App note available.
Touch-Screen Controllers TSC2004 800-W operation with auto shutdown. I
2
C interface. Includes noise averaging and zone-detection preprocessing, optimal support for the
MSP430. Includes ESD protection.
Touch-Screen Controllers TSC2006 707-W operation with auto shutdown, SPI interface. Includes noise averaging and zone-detection processing, optimal support for the
MSP430. Includes ESD protection.
Touch-Screen Controllers TSC2007 Lowest power controller, 160 W operation. I
2
C interface, auto power down, 4-wire interface. Optimal for the lowest power demands.
Includes noise-filter preprocessing. Includes ESD protection.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the MSP430 Family
Complementary RF Products
96

Standard-Based Networks
IEEE 802.15.4
ZigBee

Proprietary Networks
SimpliciTI Network Protocol
System-on-Chip Solutions
TI also offers 8051-based System-on-
Chip solutions. For IEEE 802.15.4 and
ZigBee networks, use CC2430/2431;
for sub-1 GHz use CC1110/1111 and
for 2.4 GHz, CC2510/2511 are
recommended.
Getting Started with MSP430
and Low-Power RF Devices
The MSP430 Code Library for TI RF
devices makes communicating to an
RF device simple through a MSP430
SPI, USART, USI, USCI or even bit-
banged I/O port.
For more information, visit
www.ti.com/msp430_lprf.
The Texas Instruments portfolio of
MSP430 microcontrollers and Low-Power
RF devices are an ideal fit for low-power
wireless networks, including standard-
based IEEE 802.15.4 and ZigBee

or
other proprietary networks. The MSP430
product line offers the unique combination
of ultra-low power consumption and
power-saving mechanisms, along with a
high-performance 16-bit CPU and inte-
grated analog. Together, MSP430 and TIs
Low-Power RF devices help wireless
designers achieve low power consump-
tion, long range and reliable performance
at a competitive price.
MSP430 and Low-Power RF Selection Table
Standard-Based Network Proprietary Network
IEEE 802.15.4 ZigBee

ZigBee PRO SimpliciTI

CC2520 CC2520 with TIMAC CC2529 with TIMAC Sub-1 GHz 2.4 GHz
and Z-Stack software CC1101/CC1150, CC102x/ CC2500/CC2550
CC1070
MSP430F261x MSP430F261x MSP430F261x
MSP430F543x MSP430F543x MSP430F543x MSP430 device with >6-KB MSP430 device with >6-KB
Flash and 1-KB RAM Flash and 1-KB RAM
These are recommended devices. Any MSP430 device can be used depending on Flash/RAM requirements of the software
solution.
MSP430 Ultra-Low Power MCUs and Low-Power RF Devices
MSP430 and TI-RFid Selection Table
Applications Access control, digital door lock, Automobile immobilizer, asset Ultra-low power data logger,
medical, POS, ticketing, tracking, access control, wireless battery-less sensor
eMetering prepayment, asset wireless payment, animal interface, multi-purpose LF
tracking, inventory control, tracking, production tracking, interface to a microcontroller,
product authentication medical remote control applications
TI-RFid TRF7960 TMS3705 LF TMS37157
TRF7961 134-KHz reader 134-KHz transponder IC
13.56-MHz reader (RTM: 3Q09)
TI MCU MSP430F2x MSP430F2x MSP430F2x
These are recommended devices. Many MSP430 and TI-RFid devices can be used depending on Flash/RAM requirements of the
software solution.
The TI portfolio of MSP430 microcon-
trollers and TI-RFid devices are an ideal fit
for low-power RFID reader and transpon-
der solutions. Together, MSP430 and
TI-RFid devices help RF designers achieve
low power consumption, best-in-class
read range and reliable performance at a
competitive price.
MSP430 Ultra-Low Power MCUs and TI-RFid Devices
For more information visit www.ti.com/msp430_rfid.
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the MSP430 Family
Complementary RF Products
97

Application-Specific Product Recommendations

Application MSP430 and RF Solution System-on-Chip
Alarm and security (smoke, motion, glass break detector) MSP430F20xx, MSP430F22xx CC1101/CC1150, CC1020/CC1070 CC1110/CC1111, CC251x, CC243x
Automated meter reading (AMR) for utility meters, MSP430FE42x, MSP430FW42x, CC1101/CC1150, CC1020/CC1070, CC1110/CC1111, CC251x,
advanced meter infrastructure (AMI) MSP430F41x, MSP430F2618 CC2480, CC2520 CC243x
Wireless sensor networks (monitoring, asset tracking) MSP430F20xx, MSP430F41x CC1101/CC1150, CC2500/CC2550, CC1110/CC1111, CC251x,
CC2480 CC243x, CC2520
Building automation (light, temperature, process MSP430F20x1, MSP430F21x1, CC1101/CC1150, CC2500/CC2550, CC1110/CC1111, CC251x,
control) MSP430F41x, MSP430 F2618 CC2520, CC2480 CC243x
PC peripherals MSP430F22x2, MSP430F21x1 CC2500/CC2550, CC2520 CC2430, CC251x
Home and leisure equipment MSP430F20xx, MSP430F23/24x, CC1101/CC1150, CC2500/CC2550 CC1110/CC1111, CC251x
(remote controls, gaming, toys, home electronics) MSP430F41x, MSP430F43x
Medical (non-implants) MSP430FG4xxx, MSP430F41x CC1101/CC1150, CC2500/CC2550, CC1110/CC1111, CC243x,
CC2480, CC2520 CC251x
Low-Power RF for MSP430 Microcontrollers
Network Key Feature Device Device Features
Proprietary 2.4 GHz CC2500 Transceiver with easy SPI interface to MSP430. Low power-down (0.4 A) and large FIFO designed to maximize
power-down time.
Proprietary 2.4 GHz CC2550 Lowest-cost transmitter with easy SPI interface to MSP430. Excellent selectivity and very low current consumption.
Proprietary Sub 1 GHz CC1101 Transceiver with easy SPI interface to MSP430. Fast PLL turn on designed for frequency hopping.
Proprietary Sub 1 GHz CC1150 Low-cost transmitter with easy SPI interface to MSP430. Fast PLL turn on designed for frequency hopping.
Zigbee

Z-Accel Network Processor CC2480 Zigbee stack and radio on one chip. Easy-to-use API with 10 calls designed to run on MSP430.
Zigbee SoC CC2430/1 Zigbee SoC with 32-MHz 8051. Use MSP430 for measurement and application processing. Industry-leading
performance and hardware location engine. Easy MSP430 interface.
98
Texas Instruments 3Q 2009 Embedded Processing Guide
Complementary Products for the MSP430 Family
Complementary Power Management Products
98

TPS61221
200 mA
Boost Converter
Fixed 3.3Vout
TPS62111
1500 mA
r
Fixed 3.3Vout
DC/DC Converte
TPS63001
1.2 A
Buck Boost
r DC/DC Converte
TPS78233
150 mA
LDO
Fixed 3.3Vout
TPS62203
300 mA
DC/DC Converter
Fixed 3.3Vout
TPS62300
500 mA
DC/DC Converter
Fixed 3.3Vout
TPS780330220
150 mA
LDO
3.3V / 2.2Vout
Power Management Products for MSP430 Microcontrollers
Key Careabouts Device Description
Simple solution TPS78233 150 mA, ultra-low quiescent current, Iq 1A, low-dropout linear regulator
Simple, long battery life TPS780330220 150 mA, LDO reg, ultra-low power, Iq 500 nA with pin-selectable, dual-level output voltage
High efficiency TPS62203 High efficiency, SOT-23 step-down, DC-DC converters
Tiny, high efficiency TPS62300 500-mA, 3-MHz synchronous step-down converter in chip scale packaging
Ultra-low input voltage TPS61221 Tiny, low-input (down to 0.7V) voltage boost converter
High-input voltage TPS62111 17V, 1.5-A synchronous step-down converter with shutdown current < 2 A
Wide-input voltage range TPS63001 High-efficient single-inductor buck-boost converter with up to 96% efficiency
Texas Instruments 3Q 2009 Embedded Processing Guide
Stellaris

Family of Microcontrollers
Silicon
99

Why Choose Cortex-M3?

Cortex-M3 is the MCU version of ARMs V7
instruction set architecture family of cores:
Optimized for single-cycle flash usage
Deterministic, fast interrupt processing:
always 12 cycles, or just 6 cycles with
tail chaining
Three sleep modes with clock gating for
low power
Single-cycle multiply instruction and
hardware divide
Atomic operations
ARM Thumb2 mixed 16-/32-bit
instruction set
1.25 DMIPS/MHzbetter than ARM7
and ARM9
Extra debug support including data
watchpoints and flash patching
Capabilities beyond ARM7 for the micro-
controller market:
Requires approximately 1/2 the flash
(code space) of ARM7 applications
24 times faster on MCU control
applications
No assembly code required ever!
Why Choose the Stellaris
Family?
Designed for serious microcontroller appli-
cations, the Stellaris family provides the
entry into the industrys strongest ecosys-
tem, with code compatibility ranging from
U.S. $1 to 1 GHz.
Superior integration saves up to
U.S $3.28 in system cost
Over 140 Stellaris family members to
choose from
Real MCU GPIOs all can generate
interrupts, are 5V-tolerant and have
programmable drive strength and slew
rate control
Advanced communication capabilities,
including 10/100 Ethernet MAC/PHY,
USB and USB OTG and CAN controllers
Sophisticated motion-control support in
hardware and software
Both analog comparators and ADC
functionality provide on-chip system
options to balance hardware and soft-
ware performance
Development is easy with the royalty-
free StellarisWare software
Stellaris family block diagram
32
32
32
ARM
Cortex-M3
100 MHz
JTAG
NVIC
SWD
256-KB Flash
96-KB SRAM
ROM
Clocks, Reset
System Control
Systick Timer
4 Timer/PWM/CCP
Each 32-bit or 216-bit
GPIOs
32-ch DMA
Precision
Oscillator
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2 SSI/SPI
10/100 Ethernet
MAC + PHY
USB Full Speed
Host / Device / OTG
3 CAN
2 I C
2
IEEE 1588
2 Quadrature
Encoder Inputs
8 PWM Outputs
PWM
Generator
PWM
Interrupt
32
I S
2
EPI
T
Overview
TIs Stellaris is the industrys leading
family of robust, real-time microcon-
trollers (MCUs) based on the revolu-
tionary Cortex-M3 technology from
ARM

. The award-winning Stellaris

32-bit MCUs combine sophisticated,
flexible mixed-signal system-on-chip
integration with unparalleled real-time
multi-tasking capabilities. Complex
applications previously impossible
with legacy MCUs can now be
accommodated with ease by powerful,
cost-effective and simple-to-program
Stellaris MCUs. With over 140 mem-
bers in its family, the Stellaris family
offers the widest selection of precisely-
compatible MCUs in the industry.
The Stellaris family is positioned for
cost-conscious applications requiring
significant control processing and
connectivity capabilities, including
motion control, monitoring (remote,
fire/security, etc.), HVAC and building
controls, power and energy monitor-
ing and conversion, network appli-
ances and switches, factory automa-
tion, electronic point-of-sale
machines, test and measurement
equipment, medical instrumentation
and gaming equipment.
In addition to MCUs configured for
general-purpose real-time systems,
the Stellaris family offers distinct
solutions for advanced motion control
and energy-conversion applications,
real-time networking and real-time
internetworking and combinations of
these applications including connect-
ed motion control and hard real-time
networking. Welcome to the future of
microcontrollers!
Stellaris 32-Bit ARM

Cortex

-M3 MCUs
Get samples, data sheets, tools and app reports at: www.ti.com/stellaris
Texas Instruments 3Q 2009 Embedded Processing Guide
Stellaris

Family of Microcontrollers
Silicon and Tools
100

Low-Pin-Count, Real-Time MCUs

LM3S100s 2 8 2 20 2 4 1 2 1 1 1 2 18 28-SOIC
LM3S300s 8 16 4 25 3 6 1 6 6 1 2 1 1 8 500 3 36 48-LQFP
LM3S600s 11 32 8 50 3 6 1 6 6 1 1 2 1 1 8 1000 3 36 48-LQFP
LM3S800s 9 64 8 50 3 6 1 6 6 1 1 2 1 1 8 1000 3 36 48-LQFP
High-Pin-Count, Real-Time MCUs
LM3S1000s 29 256 64 50 4 8 1 8 8 3 2 3 2 2 8 1000 3 60 64-LQFP,
100-LQFP,
108-BGA
Ethernet-Connected MCUs
LM3S6000s 19 256 64 50 4 8 1 6 6 1 2 3 2 2 8 1000 3 46 100-LQFP,
108-BGA
USB-Connected MCUs
LM3S3000s 4 128 64 50 4 8 1 8 8 4 1 O/H/D 3 2 2 8 1000 3 61 64-LQFP,
100-LQFP
LM3S5000s 12 256 96 80 4 8 2 8 8 4 2 2 O/H/D 3 2 2 16 1000 3 7 71 64-LQFP,
100-LQFP
CAN-Connected MCUs
LM3S8000s 12 256 64 50 4 8 1 6 6 1 2 3 3 2 2 8 1000 3 46 100-LQFP,
108-BGA
Ethernet + CAN-Connected MCUs
LM3S8000s 12 256 64 50 4 8 1 6 6 1 2 3 3 2 2 8 1000 3 46 100-LQFP,
108-BGA
Ethernet USB + CAN MCUs
LM3S9000s
1
6 256 96 100 4 8 2 8 8 4 2 2 O/H/D 3 2 2 16 1000 3 7 65 100-LQFP
1
Include external 32-bit peripheral interface
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PWM ADC (10-Bit)
General-Purpose
Timer Modules Core
Motion
Control Serial Interfaces Analog Digital
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Product Development
We provide a range of support designed to get your applications to market faster and easier than ever before. Compact, versatile and con-
nected! Our evaluation kits provide a low-cost and effective means of evaluating our microcontrollers and getting a jump start on your design
www.ti.com/stellariskits:
Stellaris LM3S811
Evaluation Kit
Stellaris LM3S1968
Evaluation Kit
Stellaris LM3S2965
Evaluation Kit
Stellaris LM3S3748
Evaluation Kit
Stellaris LM3S6965
Evaluation Kit
Stellaris LM3S8962
Evaluation Kit
Stellaris LM3S9B92
Evaluation Kit
Stellaris LM3S9B90
Evaluation Kit
Stellaris LM3S9B96
Development Kit
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Audio
101

Targeted Applications
Musical instruments
Instrument amplifiers
Multi-track recorders
Synthesizers
Guitar effects
Professional audio
Digital mixers
Signal processors
Broadcast encoders
DSP farms
Home audio
AV receivers
DVD receivers
Home audio jukeboxes
Networked audio players
Portable audio devices
HDD-based MP3 players
Flash/CD-based MP3 players
Wireless audio headphones
Digital radio
Additional Resources
Audio Solutions Guide
TIs complete audio solutions offer
best-in-class silicon, software, applica-
tion knowledge and support and
include a variety of flexible, cost-
efficient, high-performance analog and
DSP products. Design resources like
the Audio Solutions Guide provide valu-
able technical information, including
system block diagrams, detailed prod-
uct specifications, design considera-
tions and more, helping you get to
market fast. Download the Audio
Solutions Guide to see the complete
spectrum of products that meet the
demands of your audio signal chain.
www.ti.com/audioguide.
Audio Systems Overview
Advances in digital audio technologies
offer consumers the ability to enjoy their
audio at anytime, anywhere and on any
device. This new trend in audio is enabled
by DSPs that offer this convenience with-
out any sacrifice in quality. DSP technolo-
gy is also at the forefront of another
amazing trend in consumer audio prod-
ucts, the multichannel listening experi-
ence. Due to the rapid drop in price
points, consumers are enjoying music,
movies and television on high-quality,
DSP-based 5.1 audio systems.
Just as the consumer audio market is
benefiting from advances in audio
technology, the professional and musical
instrument markets are delivering new
products that maintain the highest sonic
quality at affordable price points. By lever-
aging DSP horsepower, these markets are
giving musicians and sound engineers the
ability to create the exact sounds
they want.
In order to enable designers of digital
audio products to leverage advanced
digital audio techniques, TI provides sili-
con, software, systems expertise and sup-
port focused solely on digital audio tech-
nologies. TI currently offers a host of prod-
ucts including DSPs, Class-D amplifiers,
A/Ds, D/As and SRCs that are designed
from the ground up to deliver the most
realistic audio experience possible at cost-
effective price points. Since TI solutions
are based on programmable platforms
and flexible analog components, develop-
ers have maximum flexibility in designing
products that meet the needs of the rapid-
ly changing digital audio landscape.
TI Audio Systems Benefits
Highest performance allows room for
innovation with application-specific
digital entertainment solutions
Programmability and scalability provide
open-audio platforms for better
differentiation
Compact form factor for cool product
designs and great sound
Easy-to-use, application-specific soft-
ware and tools get you to market faster
C55x
300 MHz
C55x
300 MHz
OMAP35x
C55x
300 MHz
C54x
160 MHz
C54x
160 MHz
C67x
300 MHz
C55x
Next
ARM+DSP
Next
Production
Future
Device
OMAP35x
S
e
g
m
e
n
t
Time
High-Performance Audio
Broadcast audio
Commercial audio
High-end consumer audio
Professional audio/digital mixers
Personal Audio
Car audio
Digital amplifiers
Instrument amplifiers
Musical instruments
Multitrack recorders
Streaming audio
Portable Audio
Handheld gaming
MP3 players
Multimedia players/
Jukeboxes
Toy audio
From < $5 to 9 MP3 encoding
From 16-bit fixed point to 32-/64-bit floating point
From portable to multi-channel solution

C55x
Next
ARM +DSP
Next

C67x
Next
C672x
350 MHz
C672x
350 MHz
Audio solutions roadmap
Audio Systems Solutions
Get additional information at: www.ti.com/audio
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Audio
102

Professional Audio Development Kit Bundle (PADB) Based on

the TMS320C672x floating-point DSPs, the new PADK bundle saves
you time and money by combining the PADK with Code Composer
Studio IDE Platinum and a USB Emulator. Instantly start your pro-
audio application with the PADK bundle, which includes real-world
pro-audio algorithms and software examples to demonstrate C672x
DSP performance and exercise the cores special audio-processing
capabilities. Learn more at www.ti.com/padkbundle.
Audio Integrated Solutions
Professional Audio Development Kit (PADK) The PADK is a
hardware/software solution based on the new TMS320C672x
floating-point DSPs. The C672x DSPs are optimized for profes-
sional audio, musical instruments, broadcast audio and
commercial audio applications.
The PADK integrates the TMS320C6727 DSP with Burr-Brown
ADCs and DACs. This board also features a host of different I/O
options and connectors. In addition to the hardware, the PADK
includes real-world audio software example code to demonstrate
C672x DSP performance and provide a good reference for devel-
opers to create customized applications. Further enhancing the
utility board is a convenient expansion slot that can allow daughter-
cards to be used to evaluate other components not featured on
the PADK.
The comprehensive PADK includes the hardware and software
needed to quickly design differentiated pro-audio applications.
For more information, contact your authorized TI distributor or visit
www.ti.com/padk.
PADK includes hardware, software and documentation to get started
immediately.
PADK Bundle for pro-audio applications.
Audio Application Notes
Application Note Web Search Literature #
Initializing the TLC32040 AIC on the TMS320C5x DSK SPRA275
Interfacing TMS320C5x and Parallel Stereo Codec w/ Other SPRA097
TMS320 DSP Considerations
Digital Voice Echo Canceller Implementation on the TMS320C5x SPRA142
Decoding Convolutional and Turbo Codes in 3G Wireless White Paper SPRA878
MP3/AAC Player Implementation in RF3 SPRA779
Using the File Navigation API Function in an IACD System SPRA834
Electronic Shock Protection (ESP) for CD Players That Use a C54x DSP SPRA831
TMS320C6201/6701 EVM: TMS320C6000 McBSP to Multimedia Audio Codec SPRA477
Meeting the Pro Audio Challenge White Paper SPRAAA3
Application Note Web Search Literature #
Using the TMS320C672x Bootloader SPRAA69
TMS320C6000 McBSP to Voice Band Audio Processor (VBAP) Interface SPRA489
AIC27 Example for the TMS320C5510 DSP Prototype Board SPRA813
Implementation of AC-3 Decoder on TMS320C62x DSPs SPRA724
An Audio Example Using DSP/BIOS Kernel SPRA598
Interfacing TLC320AD57 Sigma-Delta Stereo ADC (in Master Mode) SPRA090
with TMS320C5x DSP
TMS320C6713 to TMS320C672x Migration Guide SPRAA78
How to Create Delay-Based Audio Effects on a TMS320C6727 DSP SPRAAA5
Check the TI website for a complete listing of technical documentation including application notes.
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
HiRel DSPs
103

TI HiRel offers a vast portfolio of ICs that

provide extended temperature, enhanced
processing and packaging for aerospace,
defense and high-temperature applications.
TI HiRel supplies a wide range of TI prod-
ucts to meet rugged and extreme environ-
ments. Process capabilities include QML
Class Q and Enhanced Product (EP) for
defense and avionics applications and
QML Class V for space requirements. Pb-
lead finishes are still available for custom-
ers needing continued support for non-
green applications. Pb solder ball replace-
ment for commercial non-Pb parts can
also be provided.
The DSP selection from HiRel includes
ceramic hermetic packaging and QML
versions from all the TI DSP generations.
From the earliest TMS320C1x to the latest
TMS320C6000 DSP devices, we con-
tinue to offer the best parts for defense
and military applications. HiRel can sup-
port long design and production cycles
and help alleviate obsolescence concerns.
TI HiRel Enhanced Product offerings
provide plastic packaging options for
applications that require extended
temperature, enhanced change notifica-
tion and controlled baselines.
Targeted Applications
Defense
Software-defined radio
Secure communications
Radar
Sonar
Smart munitions
Communications
Graphics
Image processing
Aerospace
Motor control
Pumps
Braking systems
Noise cancellation
Sensors
Imaging
Security
Communications
Radar
Space
Satellites
Space-based radar
Critical control systems
Launch vehicles
Data processing
Imaging
Motor control
Harsh environments
High-temperature electronics
Downhole drilling
Jet engines
Undersea communications
HiRel Defense and Aerospace Solutions
Get additional information at: www.ti.com/hirel
TMS320C6000 DSP Platform
Fixed Point
SM320C6201B HiRel Fixed-Point Digital Signal Processor
SMJ320C6201B HiRel Fixed-Point Digital Signal Processor
SMJ320C6203 HiRel Fixed-Point Digital Signal Processor
SMJ320C6415 HiRel Fixed-Point Digital Signal Processor
SM320DM642-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320C6455-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320C6414-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320C6415-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320C6416-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM32C6416T-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320C6201-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320C6202-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
Floating Point
SMJ320C6701 HiRel Floating-Point Digital Signal Processor
SM320C6701-EP HiRel Enhanced Product Floating-Point Digital Signal Processor
SM320C6711D-EP HiRel Enhanced Product Floating-Point Digital Signal Processor
SM320C6712D-EP HiRel Enhanced Product Floating-Point Digital Signal Processor
SM320C6713B-EP HiRel Enhanced Product Floating-Point Digital Signal Processor
TMS320C5000 DSP Platform
SMJ320LC549 HiRel Fixed-Point Digital Signal Processor
SMJ320VC5416 HiRel Fixed-Point Digital Signal Processor
SM320VC5510A-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320VC5416-160-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
SM320VC5409-EP HiRel Enhanced Product Fixed Point Digital Signal Processor
SM320VC5421-EP HiRel Enhanced Product Fixed-Point Digital Signal Processor
TMS320C2000 Microcontrollers
SM320F2812 HiRel Fixed-Point Digital Signal Controller
SMJ320F240 HiRel Fixed-Point Digital Signal Controller
SM320F2812-EP HiRel Enhanced Product Digital Signal Controller
SM320F2801-EP HiRel Enhanced Product Digital Signal Controller
SM320F2808-EP HiRel Enhanced Product Digital Signal Controller
SM320LF2407A-EP HiRel Enhanced Product Digital Signal Controller
Other Platforms Available in QML Ceramic
SMJ320C15, SMJ320C25, SMJ320C3x, SMJ320C40, SMJ320C50, SMJ320C80 DSPs
QML-V Space-Level DSP
SMJ320C6701-SP Rad-Tolerant Class V, Floating-Point Digital Signal Processor
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Industrial
104

Industrial computing solutions roadmap

Targeted Applications
Human-machine interface touch-
screen panels
Operator interface panels
Patient monitors
Networked displays
Self-service kiosks
Electronic cash registers
Portable data terminals
Electronic point of sale
(EPOS) terminals
EPOS accessories
Digital signage
Programmable automation controllers
Programmable logic controllers
Distributed control systems
Industrial communications
Power protection
Power management
Test equipment
Machine vision
For More Information
Please refer to product information for
the OMAP-L1x platform on page 42 or
the OMAP35x platform on page 39.
OMAP-L1x Overview
The OMAP-L1x platform offers single-chip
ARM

+DSP products with a rich set of

peripherals including SPI, UART, I
2
C, USB
2.0, 10/100 Ethernet, parallel port, LCD
display output and many more.
The 300-MHz performance of the ARM9
enables applications requiring either high-
level OS like Linux or Windows Embedded
CE (Win CE) as well as multiple real-time
operating systems from third parties. The
OMAP-L1x SoC devices include the indus-
trys lowest power fixed-/floating-point DSP,
the C674x DSP core. The C674x DSP
combines the TMS320C64x+ fixed-
point and TMS320C67x+ floating-point
DSP cores into a single core, which enables
the use of high-precision signal-processing
algorithms in combination with control
functions running on the ARM9 core. This
high level of integration leads to reduced
board space and overall system cost.
OMAP-L1x products are well suited for
low- to mid-end programmable automa-
tion controllers, test and measurement
equipment, and point-of-service acces-
sories like signature pads, currency
readers and RFID readers.
OMAP35x Overview
For higher-performance applications with
feature-rich GUI requirements, the OMAP35x
applications processors incorporate the
industrys first ARM Cortex-A8 CPU with
the TMS320C64x DSP and POWERVR
SGX graphics acceleration capabilities.
Industrial end equipments like control pan-
els, self-service kiosks, electronic cash reg-
isters, etc. can take advantage of the
OMAP35x processors supporting both
Linux and WinCE operating systems.
Various real-time operating systems are
also supported on OMAP35x and are avail-
able through third-party companies.
The first generation of the OMAP35x plat-
form has four pin-compatible product
options. The next generation of OMAP35x
processors will incorporate 10/100
Ethernet MAC as well as CAN controllers to
address industrial connectivity requirements.
Industrial Computing Solutions
Get additional information at: www.ti.com/industrial
Industrial Computing Solutions Overview
The OMAP-L1x and OMAP35x platforms of processors incorporate low power and
scalable performance enabling many industrial applications including programmable
automation controllers, human-machine interface panels and EPOS terminals.
P
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Cortex-A8 up to 600 MHz
SDRAM/LPDDR EMIF
CAN, 10/100 Ethernet
USB 2.0, SDIO
Cortex-A8 up to 600 MHz
SDRAM/LPDDR EMIF
USB 2.0, SDIO
OMAP3503
Cortex-A8
OMAP3515
A8+3D Graphics
OMAP3525
A8+C64x DSP
OMAP3530
A8+DSP+
Graphics
Production
Future
Device
Sampling
In Development
Cortex-A8 Cortex-A8
OMAP350x
A8+3D Graphics
OMAP351x
ARM9+C674x DSP
OMAP-L138
Cortex-A8
ARM
9
OMAP-L137
ARM9+C674x DSP
Up to 300 MHz
mDDR/DDR2 EMIF
USB 2.0, 10/100 Ethernet
SATA, SDIO, uPP
PWM, eCAP, eQEP
Up to 300 MHz
SDRAM EMIF
USB 2.0, 10/100 Ethernet
PWM, eCAP, eQEP
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Industrial
105

Digital control solutions roadmap

Targeted Applications
Green energy
Solar inverters
Wind turbines
Fuel cells
Digital power supplies
Telecom rectifiers and complex
DC/DC converters
Server rectifiers
Industrial power supplies
HDTV power supplies
DC/DC modules
Uninterruptible power
supplies (UPS)
Lighting
LED billboards
Streetlight control and networking
Home appliances
Washer drives
Compressor motor
Induction cooktops
Industrial control
Variable-speed AC drives
Soft starters
Process control
Servo control
Stepper motor control
Automotive
Radar for blind spot detection,
lane departure warning and auto-
matic cruise control
Electric power steering
Wiper control
HVAC blowers
Medical
CPAP motor control
Patient transport
Blood analysis
Metering
Power line modem for electricity
automated meter infrastructure
Flow meters
Digital Control Overview
TI offers 32-bit performance and
advanced peripherals that allow designers
of digital motor control, digital power sup-
plies and advanced sensing systems to
quickly and easily implement advanced,
cost-efficient control solutions. Our broad
portfolio of control-optimized processors
provides the industrys highest perform-
ance and on-chip integration to drive sys-
tem cost down to unprecedented levels.
The unique combination of processing
power, interrupt handling capability, control-
specific peripheral integration and high C
efficiency deliver substantial benefits to
control systems. These benefits, such as
improved system efficiency and added
performance for innovation, are delivered
with fewer external components and
reduced system costs in amazingly small
packages great for space-constrained
applications.
TI is focused on the digital control sys-
tems designers needs and is continuing
to develop solutions that serve the market.
With more than 20 years of experience in
processor-based control applications and
a worldwide team dedicated to providing
progressive embedded control solutions,
we offer systems expertise, easy-to-use
development tools, an extensive silicon
range and unlimited support to get your
product to market faster.
Digital Control Systems Solutions
Get additional information at: www.ti.com/digitalcontrol
Industrial Solutions Overview
The TMS320C2000 Microcontroller family combines advanced control peripherals with
the processing power of a 32-bit core. C2000 MCUs are ideal for embedded
industrial applications such as digital motor control, digital power supplies and intelligent
sensor applications.
P
e
r
f
o
r
m
a
n
c
e
150
128
12.5 MSPS ADC
QEP
MIPS
256 KB Flash

F281x F281x
60100
32
16-ch, 12-bit ADC
HiRes PWM, QEP
MIPS
256 KB Flash

F280x F280x
150
128512 KB Flash
16-ch, 12-bit ADC
HiRes PWM, QEP
MIPS

F282x F282x
150 MIPS/300 MFLOPS
128
16-ch, 12-bit ADC
HiRes PWM, QEP
512 KB Flash

F2833x F2833x
300 MIPS/600 MFLOPS
196
HiRes PWM, QEP
516 KB SRAM

C2834x C2834x
Delfino Floating-Point Series

Delfino Floating-Point Series

F282x
F280x
F281x
F2833x
F2803x
F2802x
C2834x
Code-compatible solutions scaling from 40 MHz to 300 MHz
Next
Generation
Next
Generation
4060 MIPS
3264 KB Flash
13-ch, 12-bit ADC

Single 3.3-V supply

HiRes PWM
F2802x F2802x
Piccolo Series

Piccolo Series

60 MIPS + CLA
64128 KB Flash
16-ch, 12-bit ADC

Single 3.3-V supply

HiRes PWM, QEP
F2803x F2803x
Production
Future
Device
Sampling
In Development
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Industrial
106

System Motor Type Sensored Sensorless Description C24x Controller C28x Controller
ACI1-1 1 ph AC Induction
Tacho I/P
VHz / sinePWM/ closed loop (CL) speed PID

ACI3-1 3 ph AC Induction
Tacho I/P
VHz / sinePWM / CL speed PID

ACI3-2 3 ph AC Induction
MRAS (speed estimator)
VHz / sinePWM / CL speed PID

ACI3-3 3 ph AC Induction
Tacho I/P
FOC / sinePWM / CL current PID for D, Q /
CL speed PID

ACI3-4 3 ph AC Induction
Direct flux estimator + speed estimator
FOC / sinePWM / CL current PID for D, Q /
CL speed PID

PMSM3-1
3 ph Permanent
Magnet Synch

QEP
FOC / sinePWM / CL current PID for D, Q /
CL speed PID

PMSM3-2
3 ph Permanent
Magnet Synch

SMO (sliding mode observer) position estimator

FOC / sinePWM / CL current PID for D, Q /
CL speed PID

PMSM3-3
3 ph Permanent
Magnet Synch

Resolver / FOC / CL current PID for D, Q /

CL speed PID

PMSM3-4
3 ph Permanent
Magnet Synch
QEP / FOC / position control
BLDC3-1
3 ph Trapezoidal
Brushless DC

3 Hall effect I/P

Trapezoidal / CL loop current PID / CL speed PID

BLDC3-2
3 ph Trapezoidal
Brushless DC

BEMF / Zero crossing detection

Trapezoidal / CL loop current PID / CL speed PID

DCMOTOR Brushed DC

Speed & position / QEP without index

Digital Motor
Control Library
All Motor Types Component modules for motor-specific applications
Motor-specific software downloads available today, free of charge, that allow designers to develop solutions for both sensored and sensorless control
systems.
Motor-Specific Software Solutions www.ti.com/c2000appsw and www.ti.com/c2000sigproclib
Digital Motor Control Systems Solutions
Get additional information at: www.ti.com/motorcontrol
Digital Motor Control Overview
TMS320C2000 microcontrollers reduce
the overall cost of motor control systems
by providing the integration and perform-
ance necessary to implement advanced
control techniques such as sensorless vec-
tor control of three-phase motors. Using
the more processor-intensive sinusoidal
control, for example, allows developers to
reduce the size and cost of the motors
and power electronics required to meet
their needs. To fully capitalize on the
capabilities of the latest advancements in
motor designs and control techniques,
engineers are turning their focus to
C2000 microcontrollers.
TI provides a free library of motor control
software systems that are tailored to vari-
ous control techniques and motor types.
Each of these systems is a complete
project developed for the Code Composer
Studio Integrated Development
Environment. Each is built upon our foun-
dational motor control library software
modules and includes complete documen-
tation with step-by-step instructions to
guide engineers through the process of
bringing up a motor control system. Each
system comes with complete C/C++
source code.
System Solutions
Industrial
Texas Instruments 3Q 2009 Embedded Processing Guide
107

Digital Power Systems Solutions

Get additional information at: www.ti.com/c2000dps
Digital Power Overview
Digital control of power conversion sys-
tems results in lower overall cost due to
the consolidation of functions into a single
programmable controller in place of dedi-
cated discrete components. A single
TMS320C2000 microcontroller can
provide full loop control at over 2-MHz
switching frequencies or control multiple
output levels and simplify the sequencing
of multiple supplies through software
rather than dedicated components. A
software-based solution enables intelligent
monitoring of load conditions in real time
and can lead to improved system reliabili-
ty, efficiency and operating costs.
C2000 microcontrollers provide both
isolated and non-isolated solutions from
AC-line to point-of-load and are suitable
for applications such as uninterruptible
power supplies, servers, telecom-
munications, solar inverters and industrial
equipment. The C2000 controllers connect
easily with TIs UCD7000 series of digital
power drivers to interface with the actual
power stage.
TI provides a free library of power conver-
sion software systems that are tailored to
different power conversion topologies,
including DC/DC buck and phase-shifted
full-bridge, along with power factor
correction modules.
I
PRI
I
PFC
I
phB
I
phA
PWM1
PWM2
T2
PWM
Diode
Clamp
Diode
Clamp
TMS320F28xx
Micro-
controller
Microcontroller
CAN Bus
or PM Bus
A
D
C
F
i
l
t
e
r
I
/
O
C
O
M
M
S
P
W
M
T1
PWM
PWM7
PWM8
V
BOOST
V
AC
V
RECT
V
OUTPUT
V
OUT
Telecom rectifier (DC-DC converter) example
TMS320C280xx Digital Power Software Solutions
System Description Part Number
DC-DC Buck Converter DC-DC buck converter using high-resolution ePWM SPRC229
High-Resolution ePWM Demonstrates HRPWM capabilities for digital power applications SPRC227
Standard ePWM Demonstrates ePWM capabilities for digital power applications SPRC228
Power Factor Correction Power factor correction software SPRC307
DC-AC Single-Phase Inverter DC-AC single-phase inverter software SPRC303
Phase-Shifted Full-Bridge DC/DC Phase-shifted full-bridge DC/DC software SPRC311
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Industrial
108

Power
Line
CAN
I C
UART
SPI
McBSP
GPIO
PWM
ADC
2
TM
C28x Microcontroller
Product
Functionality
PWM
ADC
Power
Stage
Power Line Communications
Overview
Power Line Communications (PLC) trans-
mits data over an existing high-voltage
power line instead of requiring dedicated
cabling. PLC can thus provide an inexpen-
sive solution for transmitting data in a
pre-wired location.
TMS320C2000 microcontrollers are an
ideal platform for power-line networked
applications such as electricity metering,
office lighting automation and factory
automation because their performance of
up to 150 MIPS, large on-chip memory
and integrated peripheral interfaces pro-
vide a single-chip solution for the PLC as
well as additional control functions.
TI has developed a freely-available PLC
software library and hardware reference
design for data throughput speeds up to
5 kbps without crossing an isolation trans-
former (contact your local TI salesperson).
For a higher speed and commercially-
hardened system, we recommend our
partners at Adaptive Networks, Inc.
(www.adaptivenetworks.com). Adaptive
Networks deploys systems that provide up
to 100-kbps throughput and offer a range
of several kilometers.
Power Line Communications Systems Solutions
Get additional information at: www.ti.com/c2000plc
Power Line Communications Technical Documentation
Application Note Web Search Literature #
TMS320C2000 Microcontroller Power Line Communication SPRU714
Users Guide
Check the TI website for a complete listing of technical documentation including
application notes.
Power line communications implementation
System Solutions
Industrial
109

Texas Instruments 3Q 2009 Embedded Processing Guide

Solar Inverter Systems Solutions
Get additional information at: www.ti.com/solar
Solar Inverter Overview
There is an emerging concern for future
access to energy at the worldwide level.
Alternative solutions to fossil fuels have
been investigated and are moving to fully
industrialized production processes in
regions across the globe.
One of the most widespread alternative
energy sources is solar, and many innova-
tive companies have decided to focus
their research and development, as well
as manufacturing activities, on the delivery
of photo-voltaic (PV) systems. This
includes high-performance solar inverters
for electrical utilities, commercial buildings
and individual residences.
The inverter is a critical part of the entire
solar energy system. It performs the con-
version of the variable DC voltage output
of the PV cells into a clean, sinusoidal 50-
or 60-Hz current suitable for supplying the
commercial electrical grid or local
electrical networks.
The TMS320C2000 microcontroller
family is the best response to the real-
time challenges of the many possible
implementations of solar inverters. The
32-bit CPU of the TMS320C28x core
running at a maximum frequency of
150 MHz effectively executes the very
precise algorithms required to operate the
panels at their maximum power point, and
thus ensure the highest efficiency of the
power conversion, even in the most
severe and variable conditions. The drive
of the main bridge of the DC/AC converter
is performed by the highly flexible PWM
modules of the C2000 devices, and is
combined with the use of the on-chip,
high-speed 12-bit ADC, to perform the
current and voltage regulation required to
achieve the most regular sinusoidal
waveform.
AC Grid
Cell voltage
Cell temperature
Ambient temperature
Metering counter
Communications
Power Stage
PWM
C2000 Microcontroller
DC-DC
Conversion
DC-AC
Conversion
CAN /
Serial
Metering
Housekeeping
Control Functions
DC-DC
Conversion
A
/
D

C
o
n
v
e
r
t
e
r
Software
Solar inverter example
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Medical
110

TIs complete end equipment solutions for

medical applications leverage our product
expertise in microcontrollers, Digital Signal
Processors (DSPs), SoCs (System-on-Chip
devices) and high-performance analog for
consumer medical and diagnostic patient
monitoring systems.
Digital signal processing technology enables
medical manufacturers to develop cost-
effective, state-of-the-art diagnostic and
patient-monitoring instruments based on
advanced DSP algorithms and bring these
products to market quickly. Signal-
processing algorithms are used for signal
conditioning, performing measurements,
running analytics on measurements to
determine the health condition and graph-
ical display of this measured data. Being
able to perform such processing at low
power is increasingly important for a vari-
ety of portable and small-factor medical
and consumer devices. Low-power
TMS320C55x DSP-based SoC devices
provide the processing performance and
peripherals to support such low-power
applications. For processing-intensive
applications, TMS320DM644x DSPs pro-
vide the processing performance required.
User control and interaction is becoming
more and more important as medical
devices become increasingly sophisticated.
Low-power ARM

-based general-
purpose processors are extremely useful
in this aspect. TI has several ARM-based
solutions in this area, including members
of the TMS320DM3x, OMAP-L1x and
OMAP35x platforms. Furthermore, DSP-
based solutions, such as C55x DSPs,
have an extensive peripheral set and can
perform significant user control and inter-
action for portable systems without the
need of an ARM-based processor.
The ever-increasing need to minimize
healthcare costs is driving remote patient
monitoring and telemedicine. These com-
plex yet portable systems need both ARM
and DSP processing. For reduced form
factor and lower power, it is desirable to
have a single-chip solution which has
these cores. OMAP and DaVinci
architectures employ this dual-core
architecture enabling optimized system
partitioning and performance.
With TIs extensive portfolio and roadmap,
customers have the freedom to choose an
ARM-only, DSP-only or ARM+DSP solu-
tion. TI also provides an extensive set of
analog, low-power wireless and connectivity
solutions to complement the low-power
medical processors for portable remote
patient-monitoring applications.
Targeted Applications
Diagnostic, patient monitoring and
therapy
Electrocardiogram (ECG/portable
ECG/heart-rate monitor)
Electroencephalogram (EEG)
Fetal monitoring
Remote (wired and wireless)
patient monitoring
Data logging
Blood oxygen (pulse oximetry) and
other blood gas analyzers
Digital stethoscopes
Automated external defibrillator
(AED) and defibrillators
CPAP and BIPAP therapy devices
Ventilation/respiration
Point-of-care testing
TI Medical Solutions Benefits
Programmable solution accommo-
dates customers ever-changing IP
in medical algorithm implementation
and drives faster time to market
High performance at low power
enables portable medical applications
Higher integration and extensive
peripheral support reduces
system cost
Extensive roadmap with ARM

-only,
ARM-based GPP and DSP and DSP-
only architectures creates scalability
and better differentiation
Low-Power Medical Processor Solutions
Get additional information at: www.ti.com/medical
Medical Diagnostics and Patient Monitoring Overview
A
R
M
-B
a
s
e
d
G
P
P
C55x
C6000
ARM
DaVinci
DM644x
OMAP35x
C5000
DM3x
OMAP-L1x
OMAP35x
I
n
c
r
e
a
s
i
n
g

D
S
P

P
e
r
f
o
r
m
a
n
c
e
Up to 600-MHz DSP processor
Up to 300-MHz ARM9 processor
Video acceleration
Up to 600-MHz ARM Cortex-A8
Up to 450-MHz TMS320C64x+ DSP
Extensive power management, vector
floating point, GFX
Patient monitoring systems, AED
270-MHz ARM9 or 600-MHz Cortex-A8
Very low power
Lower cost
Patient monitoring systems, AED
Based on TMS320C55x DSP
Extensive power management
AED, pulse oximetry, digital
stethoscopes, ECG, EEG, patient
monitoring, audiology
H
i
g
h
e
s
t

D
S
P
P
e
r
f
o
r
m
a
n
c
e
w
i
t
h
A
R
M

H
i
g
h
-
P
e
r
f
o
r
m
a
n
c
e

A
R
M

+

D
S
P
Low-Power DSP
Low-power medical processor families
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Medical Imaging
111

Advances in imaging technologies have

led to extraordinarily powerful medical
imaging equipment, yielding faster and
more accurate diagnosis and treatment.
This advancement is aided by high-
performance DSPs. TIs high-performance
DSP cores are ideal for meeting real-time
requirements in imaging modalities such
as ultrasound, while the high-bandwidth
interfaces and ability to connect multiple
DSPs together ensure that there will be
enough processing power available in your
medical-imaging system. As the algo-
rithms continue to advance, TIs program-
mable platforms allow for quick adoption
and speed time to market.
DSP technology is also at the forefront of
another amazing trend in medical imaging
products: the trend to go portable. As doc-
tors and care givers endeavor to reach
more people, creating smaller, more
portable medical equipment is a must. TIs
OMAP and DaVinci architectures are
designed for low-power, portable applica-
tions enabling medical imaging equip-
ment, such as hand-carried ultrasound
units, to be powerful yet power efficient.
TIs SoC solutions utilizing embedded
high-performance DSP and ARM

proces-
sors enable smaller end-product foot
prints and reduce system boot times while
enabling image processing, high-level
operating systems, user interface and
control functions at low power for
extended battery life.
TI provides complete signal chain solu-
tions for your medical imaging needs. In
addition to DSPs, TIs medical product
portfolio includes amplifiers, clocks, data
converters, temperature sensors, interface
logic, microcontrollers, power management
and RF ICs.
TI Medical Imaging Solutions Benefits
High-performance DSPs enable latest
imaging algorithms while allowing room
for product differentiation
Programmable solution and range of
software-compatible processors pro-
vides scaleable imaging platforms,
saving redesign
Broad range of high-performance cores
and highly integrated SoCs
Easy-to-use software and tools get you
to market faster
Targeted Applications
Ultrasound
Digital x-ray
Magnetic resonance imaging (MRI)
Bone densitometer
Endoscopy
Hyperspectral imaging
Optical coherence tomography (OCT)
Medical digital video recorder (DVR)
Computed tomography (CT)
Positron emission tomography (PET)
Additional Information
For more information on TI compo-
nents that might be useful in your
application, download TIs Medical
Applications Guide (SLYB108B) at
www.ti.com/medical.
Medical Imaging Solutions
Get additional information at: www.ti.com/medical
Medical Imaging Systems Overview
Software Compatible
Production
Future
Device
Sampling
In Development
H
i
g
h

P
e
r
f
o
r
m
a
n
c
e
P
o
r
t
a
b
l
e
I
m
a
g
i
n
g

S
e
g
m
e
n
t
Time
C6474
3 1 GHz
C6455
1.2 GHz
DM6437
DM6446
DM648
OMAP3530
C6455
1 GHz
DM64x
Next
C64x
Next
Multi-Core
Next
C6457
1 GHz
M
u
l
t
i
-
C
o
r
e
D
S
P
s
S
in
g
le
-
C
o
r
e
D
S
P
s
S
y
s
te
m
-o
n
-C
h
ip
s
(S
o
C
s
)
Diagnostic ultrasound
Digital x-ray
MRI, CT, PET
Back-end imaging
High-Performance
Imaging
Portable Imaging
System
Performance leadership
Best-in-class development tools
Code compatibility
chnology innovators

Te
Diagnostic imaging
Portable ultrasound
Medical DVR
Endoscope
C6452
900 MHz
Medical imaging processor families
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Portable Medical
112

As portability becomes a growing trend in

medical products, manufacturers are
seeking technologies that reduce the
design complexity and time in developing
the finished product. In most of these
medical equipments, the actual physiolog-
ical signals are analog and require signal
conditioning techniques, such as amplifi-
cation and filtering, before they can be
measured, monitored or displayed. The
MSP430 microcontroller offers a platform
of ultra-low power processors with the
high integration of the complete signal
chain that is required for applications such
as personal blood pressure monitors,
spirometers, pulsoximeters and heart-rate
monitors.
TI Portable Medical Solutions Features
Complete signal chain integrated on chip
16-bit Sigma-Delta ADC for applications
that require high-resolution signal
conversion
128-segment LCD driver with contrast
control for convenient diagnostic display
Flexibility from multiple memory options
Enhanced portability with ultra-low power
consumption of the MSP430 MCUs,
extending battery life to 20+ years
Integrated intelligent peripherals on
MSP430 MCUs provide high perform-
ance and consume no power when not
in operation
Two package options to meet various
printed circuit board (PCB) requirements
Targeted Applications
Blood glucose meter
Digital thermometer
Heart-rate monitor
Pulse oximeters
Environmental sensors
Industrial sensors
Handheld meters
Additional Information
The new MSP430FG47x MCUs provide
ultra-low power, high performance and
analog peripherals for efficient devel-
opment of low-cost medical and sen-
sor applications. The FG47x MCUs
offer on-chip integration of the com-
plete signal chain, reducing design
complexity and resulting in significant
space and cost savings. These devices
will help developers improve the quality
and accessibility of healthcare through
products such as blood glucose
meters, digital thermometers, pulse
oximeters and blood pressure/heart
rate monitors. The F47x MCUs are also
available to support key applications in
the industrial, consumer and other
general-purpose areas.
TIs full range of embedded processing
and analog solutions help designers
create more flexible, affordable and
accessible medical devices. These
solutions offer consumers improved
diagnostics through integration and
increased intelligence, multi-function
devices that simplify treatment, and
enhanced portability for easier
monitoring and treatment of chronic
conditions.
For more information, visit
www.ti.com/430medical.
Portable Medical Solutions
Get additional information at: www.ti.com/medical
Portable Medical Systems Overview
MSP430 Devices Optimized for Portable Medical
Part Number Description
MSP430FG477 16-bit ultra-low power MCU, 32-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (2) 12-bit D/A, OpAmp,
128-seg LCD
MSP430FG478 16-bit ultra-low power MCU, 48-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (2) 12-bit D/A, OpAmp,
128-seg LCD
MSP430FG479 16-bit ultra-low power MCU, 60-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (2) 12-bit D/A, OpAmp,
128-seg LCD
MSP430F477 16-bit, ultra-low power MCU, 32-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (1) 12-bit D/A, 128-seg LCD
MSP430F478 16-bit, ultra-low power MCU, 48-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (1) 12-bit D/A, 128-seg LCD
MSP430F479 16-bit, ultra-low power MCU, 60-KB Flash, 2 KB RAM, 16-bit Sigma-Delta A/D, (1) 12-bit D/A, 128-seg LCD
FG47x MCUs are available and fully compatible with the MSP-FET430U100 and the MSP-FET430UIF flash emulation tool kits,
speeding development and time to market. See all MSP430 Development Tools at www.ti.com/msp430tools.
Peripherals Timers
Connectivity
Serial Interface
Converters
Memory Power and
MSP430FG47x/47x Microcontroller
Clocking
Brownout reset
Supply volt supervisor
Comparator A
JTAG w/2 breakpoints
Embedded emulation
Boot strap loader
16-bit Sigma Delta A/D converter A
2 x USCI_A
( UART/SPI/lrDA)
2 x USCI_B
(I
2
C/SPI)
Up to 2x 12-bit D/A converter
2x Op amps (FG47x only)
RTC
128-segment LCD driver 16-bit timer A3, with
3 CC registers
16-bit timer B3, with
3 CC w/
shadow registers
48 I/Os
32/48/60 kB Flash
2 kB RAM
FLL+:
LFXT1CLK
Debug
XT2CLK
DCO
FLL
15-bit watch dog timer
16-bit basic timer
MSP430FG47x/47x microcontroller block diagram
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Smart Metering
113

Designed specifically for the demands of

utility metering applications, TIs MSP430
ultra-low power microcontroller is the per-
fect combination of ultra-low power and
high-performance analog integration.
MSP430 MCUs offer devices for one- to
three-phase electricity, water and gas
metering, as well as radio frequency
wireless interfaces for automated meter
reading (AMR).
Electricity Metering
An advanced electronic electricity meter
requires an MCU that offers precise volt-
age and current conversion over a wide
dynamic range, programmable Flash, non-
volatile storage, real-time clock function,
flexible display and AMR-enabled commu-
nications features. The MSP430 family of
electricity-metering devices was designed
for these demands. The family offers up to
four 16-bit independent sigma-delta con-
verters and programmable gain amplifiers
along with specific integrated e-metering
modules such as the ESP engine or 3232
hardware multiplier allowing for easy, high-
performance energy-metering calculations.
Low-Cost MSP430FE47x2 MCUs
Reduce Component Count for
Electricity Metering
By integrating an ESP energy calculation
engine with 216-bit sigma-delta ADCs,
128-segment LCD driver, up to 32 KB of
Flash memory and 1 KB of RAM, and a
real-time clock, the MSP430FE47x2
series of ultra-low power MCUs enable a
five-to-one reduction in system compo-
nents. This high integration makes it an
ideal solution for single-phase metering
applications.
Flow Metering Gas or Water
MSP430 devices are ideal for the ultra-
low power consumption required in flow-
metering applications. The scan interface
(SIF) peripheral module available on the
MSP430FW42x series of devices is an
innovative way to measure rotation of a
mechanism. Its advantages lie in its power
efficiency and flexibility, operating while
the CPU sleeps. It can operate with a vari-
ety of sensor types and both rotational
and linear motion also can be measured.
Automated Meter Reading
Essentially like a two-way remote control,
an electronic meter with an AMR solution
reads billing information and performs
meter diagnostics automatically and com-
municates that information either wire-
lessly or over existing power lines back to
the utility. MSP430s versatile portfolio of
integrated communication modules allows
for easy AMR-enabled solutions.
TI Smart Metering Solutions Benefits
Faster time to market
Flexibility
Contactless radio frequency technology
transforming smart meters with secure
pre-payment
TIs comprehensive utility metering
portfolio includes devices targeted at
electricity, water and gas metering, as
well as power line communications
(PLC) and radio frequency (RF) inter-
faces for automated meter reading
(AMR) that allow customers to design
smart metering solutions.
As part of a smart solution, previously
independent systems like meters,
home thermostats and large appli-
ances will communicate wirelessly or
over existing power lines to help con-
sumers make more informed choices
about electricity.
Targeted Applications
Smart electricity meter
Water and gas meter
Programmable communicating
thermostat (PCT)
Demand response unit (DRU)
In-home display (IHD)
Pre-payment systems
Faster Time to Market
Globally deployed metering know-
how and products
Comprehensive end-to-end system-
on-chip (SoC) solutions
Innovation and expertise across a
robust portfolio, covering all the
major functions of the meter
Flexibility
Complete portfolio of hardware, soft-
ware and SoCs tailored to functional
requirements
Future-proof solutions
Upgradeable in-system programma-
ble Flash to support evolving world-
wide standards
Available standards include IEC,
ANSI, ZigBee

, Wireless, M-Bus, PLC

Scaleable families of solutions to
allow optimization of system
requirements
Smart Metering Solutions
Get additional information at: www.ti.com/metering
TIs Broad Portfolio Drives Smarter Metering Solutions
Recommended Embedded Processing Devices for Metering Applications
MSP430 MCUs TMS320C2000 MCUs
MSP430FE427A TMS320F280x
MSP430FW427 TMS320F2802x
MSP430F427A TMS320F2803x
MSP430F4794
MSP430F47187
MSP430F5xx
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Telecom
114

Telecom applications require the process-

ing power to handle a wide variety of data,
voice, telephony and connectivity func-
tions. Using TI programmable DSPs, you
can easily expand product capabilities and
feature sets to match the demands of
your design. In addition, you can cus-
tomize, adapt and scale the DSP-based
design to suit your particular requirements
and focus on end-product differentiation.
TI offers complete DSP-based solutions
for remote data collection, Internet con-
nectivity, telephony co-processing and
voiceband processing client-side telephony
applications. These solutions provide hard-
ware including power-efficient/small
form-factor DSPs as well as analog front
ends. In addition, comprehensive software
is provided supporting industry standards
as well as flexible software building blocks
that accelerate the design process from
concept through production.
These complete solutions significantly cut
power consumption, reduce development
time, minimize board space and enable
multi-function applications, making a new
class of Internet-access devices possible.
When you combine the processing power,
high integration and flexibility with their
low price points and ease of use, TI DSPs
are a perfect fit for telecom applications.
Production
Future
Device
S
e
g
m
e
n
t
Time
Infrastructure Telecom
Wireless infrastructure
Infrastructure telephony
Wireless broadband
Base station backhaul
Public safety mobile system
Client Wireless
Broadband wireless
WiMAX
Digital amateur radios
GPS
Head sets
Military wireless terminals
PHS data modems
Police wireless terminals
Radios
Client Wired
Advanced phones
Faxes
Full-duplex speakerphones
Hands-free kits
Modems
Point of sale
Remote data collection
Telecom: TIs telecom solutions include high-performance and low-power DSPs.
Remote data collection, analog front ends, comprehensive software supporting industry
standards and development tools which significantly cut power consumption, reduce
development time, minimize board space and enable wired and wireless data, voice, telephony and connectivity functions.
C64x
Next
C64x+
Next
C55x
Next
C55x
Next
C6474
3 1 GHz
C6455/57
1.0/1.2 GHz
C6452
700/900 MHz
C641xT
850M/1 GHz
C641xT
600/720 MHz
C55x
300 MHz
C55x
200 MHz
C54x
100 MHz
C54x
200 MHz
C54x
300 MHz
C641x
600/720 MHz
C6454/55
720/850 MHz
Targeted Applications
Wireless infrastructure
Cellular wireless base stations
(Macro, Micro, Pico and Femto
base stations)
Broadband wireless base stations
(WiMax, McWill, others)
BSC, RNC and core network
IMS (video, data, voice)
Public safety mobile system
(TETRA, etc.)
Terminal positioning
Base station backhauls
communication
Wireless repeater
Wired telephony
Infrastructure telephony (enter-
prise, gateway, SOHO)
Client-side telephony for home
networking (voice/data access
points)
Remote data collection
Industrial monitoring systems
Full-duplex speakerphones
SMS/MMS phones
Video phones, video conferencing
Intelligent phones
Wireless terminal (excluding
handsets)
Broadband wireless access boxes
Military/police wireless communi-
cation device
Digital pagers
Mobile Internet Device (MID)
Amateur radios
Telecom accessories
Hands-free kit
Bluetooth

headset
Telecom solutions roadmap
Telecom Systems Solutions
Get additional information at: www.ti.com/telecom
Telecom Systems Overview
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Video and Imaging
115

As the video and imaging markets continue

to evolve with new functionality require-
ments and multiple emerging video stan-
dards, developers need to adapt designs
with the right balance of processing per-
formance, power consumption and system
flexibility. Portable and plugged applica-
tions need different levels of power con-
sumption and support for real-time video
processing such as video coding,
transcoding, transrating and video/imaging
instruction sets. TIs processors provide the
processing performance and programma-
bility other processors are unable to provide.
TI offers a large product portfolio including
hardware, software and integrated system
solutions that are perfect for a variety of
digital video applications. TIs large
processor portfolio for digital video appli-
cations includes:
DaVinci Digital Media Technology
(see page 24)
TMS320C6000 DSP Platform (see
page 11)
TMS320C5000 DSP Platform (see
page 5)
OMAP Platform (see page 39)
Numerous application development kits
are available to get designs off the ground
quickly. These kits provide hardware and
software at a variety of integration levels
and price points to handle real-time per-
formance, channel density, simultaneous
processing of video, audio/voice and data
streams across both wired and wireless
networks.
Targeted Applications
Automotive infotainment
Automotive video sensing
Automotive vision
Broadcast systems
Cable head-end video equipments
(routers)
Digital camcorders
Digital cameras
Digital media adapters
Digital photo frames
Digital signage
Digital TV and server head-ends
Digital video recorders
IP network cameras
IP-based video-conferencing
endpoints
IP-based video phones
IP set-top boxes
Hard-copy appliances
Machine vision
Media encoder/decoder appliances
Media gateways
Medical imaging
Network projector
Personal video recorders
Portable media players
Professional-grade video broadcast
equipment
Robotics
Security recording systems
Streaming video appliances
Video broadcast transcoding
Video-conferencing, multi-point
conference units (MCUs)/gateways
Video infrastructure
Video jukeboxes
Digital video security recorders
(DVRs)
Video surveillance cameras
Webpads
Wireless cameras
Video and Imaging Systems Solutions
Get additional information at: www.ti.com/videoandimaging
Video and Imaging Systems Overview
DM647/8
DM64x
DM64x
DM6467
S
e
g
m
e
n
t
Time
Infrastructure Video
Cable head-end video systems
Multi-channel security DVRs
Professional-grade broadcast-
quality systems
Video-conference MCU/
gateways
Client Video
IP-based video phones
IP set-top boxes
Media encoder/decoder
appliances
Networked PVRs
IP video surveillance
IP video-conferencing
Portable Video
Digital still cameras
Digital camcorders
Gaming
Multimedia jukeboxes
PDAs
Portable medical
DM643x
DM64x+
Next
DM3x+
Next
DM64x+
Next
Production
Future
Device
Sampling
In Development
DM355
DM6441
DM644x
DM648
1.1 GHz
DM6467T
DM Next
DM Next
DM357
DM365
DM647/8
DM6467
DM648
1.1 GHz
DM6467T
Video and imaging solutions roadmap
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Video and Imaging
116

Video/Imaging Online Information

A wealth of video/imaging information
awaits you at www.ti.com/video.
Whether you need details about any of TIs
vast array of devices or block diagrams
regarding various end equipments or
links to selection guides, solutions guides
and application notes, youll find it here.
Youll also find access to:
Development boards and EVMs
Various system block diagrams
White papers
TI device information
Free Digital Media Focus eNewsletter
Video/imaging events around the world
News releases
Check out TIs video/imaging applications
page today. And, bookmark it for the
future.
VICP Signal-Processing Library
Improves Performance Capabilities
Texas Instruments VICP signal-processing
library is a collection of highly tuned soft-
ware algorithms that execute on the VICP
hardware accelerator. The library allows
the application developer to effectively
utilize the VICP performance without
spending significant time in developing
software for the accelerator. The availabili-
ty of well-tested, performance-tuned algo-
rithms with the VICP signal-processing
library significantly reduces the application
development time. The freed-up MIPS on
the DSP enable the application developers
to include more differentiation features in
the final application.
The VICP hardware accelerator is a paral-
lel MAC engine. Due to its flexible archi-
tecture, the accelerator is very effective in
enhancing DSP performance by taking
over execution of varied computationally
intensive tasks.
VICP supports various algorithms to
enable additional DSP resource:
Matrix operations/array operations:
Ex: Matrix multiplication/transpose.
Block add/average/variance
Ex: Array multiplication/addition/
fillmem. Array scalar operations
Ex: Look-up table
Digital signal processing operations:
Ex: 1D, 2D FIR filtering
Ex: Convolution, correlation
Digital image and video processing
functions:
Ex: Alpha blending, color space
conversion
Ex: Image rotation, image pack/
unpack
Ex: Median filtering
www.ti.com/vicp.
Video and Imaging Guide
Explore TIs solutions for a wide variety of
video and imaging applications in this
comprehensive guide. TIs Video and
Imaging Guide contains valuable video
and imaging information for your design
needs. Find out everything you need to
know in this complete guide that includes
system block diagrams, product informa-
tion, development tools, software, support
and various other resources.
www.ti.com/visolutionsguide.
VLIB 2.0: Video Analytics & Vision
Library
TIs Video Analytics & Vision Library (VLIB)
is a collection of software kernels that are
commonly used in automotive-vision and
video-security applications. The kernels
are optimized for both C64x and
C64x+ DSP cores and can accelerate
software development and enable per-
formance improvements up to 10 over
standard C code on TIs DSPs. The VLIB
2.0 now consists of 50+ royalty-free soft-
ware kernels including background model-
ing and subtraction, object feature extrac-
tion, tracking, recognition and low-level
pixel processing as well as Simulink
blocks for each function and the bit-exact
version for PC testing capabilities.
www.ti.com/vlib.
Additional Resources
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Video and Imaging
117

Video and Imaging Development Tools

TI has a number of hardware/software development tools that can
be used for a variety of digital video designs. Digital Video
Evaluation Modules (DVEVMs) are comprised of both hardware
and software, and enable developers to start instantaneous
evaluation of DaVinci processors.
TMS320DM365 Digital Video Evaluation Module (DM365
DVEVM) The TMS320DM365 Digital Video Evaluation Module
(DVEVM) includes both hardware and software enabling developers
to start immediate evaluation of the DM365 processor and begin
TMS320DM357 Digital Video Evaluation Module
For more information, contact your authorized TI distributor or visit
www.ti.com/dm357dvevmdsg.
TMS320DM357 Digital Video Evaluation Module (DM357
DVEVM) The TMS320DM357 processor and DVEVM take advan-
tage of all the tools and support included in the DaVinci technology
portfolio to help product developers save months of time. The
application programming interfaces (APIs) common across DaVinci
offerings also means that developers familiar with DaVinci technol-
ogy or ARM

development can quickly develop their products with

virtually no learning curve.
The TMS320DM357 DVEVM includes both hardware and software
enabling developers to start immediate evaluation of the DM357
processor. DVEVMs come complete with a demo version of
MontaVista Linux Pro 5.0, drivers, evaluation codecs and an evalu-
ation board. Registered DVEVM users may download TIs JPEG and
HD MPEG-4 SP production codecs including JPEG/MPEG-4
SP/H.263/H.264 BP/G.711 and free of charge from the DaVinci
software updates site.
TMS320DM365 Digital Video Evaluation Module
building digital video applications such as IP security cameras,
digital photo frames, digital signage, video doorbells and portable
digital video products that have yet to be invented.
DVEVMs come complete with a demo version of MontaVista Linux
Pro 5.0, drivers, evaluation codecs and an evaluation board.
Registered DVEVM users may download TIs HD H.264, MPEG-4,
JPEG, MP3 and G.711 production codecs free of charge from the
DaVinci software updates site.
The DVEVM allows developers to write production-ready applica-
tion code for the ARM

and provides access to the HMJCP

coprocessor core using DaVinci APIs to begin immediate applica-
tion development for DM365 digital media processors. The Digital
Video Software Production Bundle (DVSPB) MontaVista Linux com-
panion product is recommended for production.
For more information, contact your authorized TI distributor or visit
www.ti.com/dm365dvevmdsg.
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Video and Imaging
118

For a complete listing of all of TIs video/imaging hardware and software development tools, please see the chart on the next page.
TMS320DM6467 Digital Video Evaluation Module
the DM6467 processor. DVEVMs come complete with a demo ver-
sion of MontaVista Linux Pro 4.0, drivers, Codec Engine, evalua-
tion codecs and an evaluation board. The DVEVM can be used for
the development of digital video applications such as surveillance
digital video servers/recorders, media gateways, multi-point con-
trol units digital media adapters, set-top boxes and many other
high-definition video applications.
The DM6467 DVEVM allows developers to write production-ready
application code for the ARM

and provides access to the

TMS320C64x+ DSP and HD-Video/Imaging Coprocessor core
using DaVinci APIs to begin immediate application development
for the DM6467 digital media processor.
The Digital Video Software Production Bundle (DVSPB) MontaVista
Linux companion product is recommended for production.
For more information, contact your authorized TI distributor or visit
www.ti.com/dm6467dvevmdsg.
TMS320DM6467 Digital Video Evaluation Module (DM6467
DVEVM) The TMS320DM6467 DVEVM includes both hardware
and software enabling developers to start immediate evaluation of
TMS320DM355 Digital Video Evaluation Module
TMS320DM355 Digital Video Evaluation Module (DM355
DVEVM) The TMS320DM355 Digital Video Evaluation Module
(DVEVM) includes both hardware and software enabling develop-
ers to start immediate evaluation of the DM355 processor.
DVEVMs come complete with a demo version of MontaVista Linux
Pro 4.0, drivers, Codec Engine, evaluation codecs and an evalua-
tion board. Registered DVEVM users may download TIs JPEG and
HD MPEG-4 SP production codecs and G.711 codec free of
charge from the DaVinci software updates site. The DVEVM can
be used for the development of digital video applications such as
IP security cameras, digital photo frames, digital cameras, video
doorbells, portable medical and portable digital video products
that have yet to be invented.
The DVEVM allows developers to write production-ready applica-
tion code for the ARM and provides access to the MPEG/JPEG
coprocessor core using DaVinci APIs to begin immediate applica-
tion development for DM355 digital media processors.
The Digital Video Software Production Bundle (DVSPB) MontaVista
Linux companion product is recommended for production.
For more information, contact your authorized TI distributor or visit
www.ti.com/dm355dvevmdsg.
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Video and Imaging
119

Video and Imaging Integrated Solutions

For more information on TIs video and imaging solutions, go to www.ti.com/videoandimaging.
Video and Imaging Hardware and Software Development Tools
Description Part Number Price
1
Hardware Development Tool
TMS320DM642 Digital Media Development Kit (DM642 DMDK) TMDSDMK642 (U.S. part number) 6,495
TMDSDMK642-0E (European part number)
Evaluation Modules (EVMs)
TMS320DM644x Digital Video Evaluation Module (DVEVM) TMDSEVM6446 2,495
OMAP35x Evaluation Module TMDSEVM3530 1,499
TMS320DM642 Evaluation Module (EVM) TMDSEVM642 1,995
TMS320DM6437 Digital Video Development Platform (DVDP) TMDSVDP6437 495
TMS320DM648 Digital Video Development Platform (DVDP) TMDSDVP648 1,295
TMS320DM355 Digital Video Evaluation Module (DVEVM) TMDXEVM355 495
TMS320DM357 Digital Video Evaluation Module (DVEVM) TMDXEVM357 895
TMS320DM365 Digital Video Evaluation Module (DVEVM) TMDXEVM365 595
TMS320DM6467 Digital Video Evaluation Module (DVEVM) TMDSEVM6467 1,995
JTAG Emulators
Spectrum Digital XDS510PP-Plus Emulator TMDSEMUPP (U.S. part number) 1,095
Spectrum Digital XDS510PP-Plus Emulator with European Cords TMDSEMUPP-0E (European part number) 1,095
Spectrum Digital XDS510 USB Emulator TMDSEMUUSB 1,495
Blackhawk XDS560 JTAG PCI Emulator TMDSEMU560PCI 2,995
Blackhawk XDS560 USB High-Performance JTAG Emulator TMDSEMU560U 2,999
XDS560 USB Trace Emulator
2
TMDSEMU560T 9,995
Software Development Tools
VICP Signal Processing Library (DM6446, DM6441, DM647 and DM648 processors) SPRC831 Free
Code Composer Studio (CCStudio) IDE Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription TMDSCCSALL-1 3,595
Supports C6000, C5000, C2000, DaVinci and OMAP processor platforms
C6000, C5000, C2000, DaVinci, and OMAP processor CCStudio Development Tools Annual Software TMDSSUBALL 600
Subscription for Version 3.10 and higher
Code Composer Studio IDE Free Evaluation Tools SPRC119 (www.ti.com/freetools) Free
Includes C6000 DSP and DaVinci CCStudio IDE 120-Day Free Evaluation Tools
3
Video Analytics & Vision Library (VLIB) www.ti.com/vlib Free
TMS320C62x DSP Image Library SPRC093 Free
TMS320C64x DSP Image Library SPRC094 Free
1
Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are New tools are listed in bold red.
advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.
2
The XDS560 Trace is designed for use with trace-enabled digital signal processors. Currently the following processors are fully supported by trace: TMS320C6418, TMS320C6416T,
TMS320C6415T, TMS320C6414T, TMS320C6413, TMS320C6412, TMS320C6411, TMS320C6410, TMS320DM648, TMS320DM647, TMS320DM643, TMS320DM642, TMS320DM641 and
TMS320DM640 processors.
3
Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days.
Texas Instruments 3Q 2009 Embedded Processing Guide
System Solutions
Video and Imaging
120

Power Management Products for the TMS320DM3x/DM644x/DM643x/DM64x DSP Generations

Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com
Suggested Texas Instruments Power Management Solutions for Battery-Powered TMS320DM3x/DM644x/DM643x Processors
Core and I/O Voltages
Synchronous Non-Synchronous Synchronous Non-Synchronous
Input Controller Controller Integrated FET Integrated FET Multiple-Output
Voltage LDO (External FETs) (External FET and Diode) Converter Converter Converter
3.3 V TPS75401 TPS40041 TPS64200 TPS62040 TPS65023
5 V TPS75401 TPS40042 TPS64200 TPS62040 TPS54350 TPS65023
TPS54386
12 V TPS40190 TPS40200 TPS5420
TPS5124

TPS54386
24 V TPS5124

TPS40200* TPS5420* TPS54386

Dual-output controller
*Due to Vout/Vin ratio core voltage may have to be stepped down from I/O voltage
I/O supply 3.3 V, current up to 1 A
Core supply down to 1.0 V, current up to 2 A
Suggested Texas Instruments Power Management Solutions for Line-Powered TMS320DM3x/DM644x/DM643x/DM64x Processors
Core and I/O Voltages
Synchronous Non-Synchronous Synchronous Non-Synchronous Non-Isolated Isolated
Input Controller Controller Integrated FET Integrated FET Power Power Multiple-Output
Voltage LDO (External FETs) (External FET and Diode) Converter Converter Module Module Converter
3.3 V TPS75401 TPS40041 TPS64200 TPS54317 PTH04070 TPS65023
5 V TPS75401 TPS40042 TPS40200 TPS54317 TPS54350 PTH04070 TPS65023
TPS54386
12 V TPS40190 TPS40200 TPS54350 TPS54350 PTH08080
TPS5124

TPS54386
24 V TPS40057 TPS40200* TPS5430* PTN78000* PTB78560*
TPS5124

TPS54386
48 V TPS40061 TPS40200* PTMA403033*

Dual-output controller
*Due to Vout/Vin ratio core voltage may have to be stepped down from I/O voltage
I/O supply 3.3 V, current up to 1 A
Core supply down to 1.0 V, current up to 2 A
LDO1
L3
L1
LDO2
TPS65023
L2
SDAT
V
IN
4.7k
LOWBAT_SNS
PWRFAIL_SNS
VINDCDC1
VINDCDC2
VINDCDC3
V
IN
10
TRESPWRON
VSYSIN
DEFLDO2
VDCDC3
SDAT
VDCDC1
VDCDC3
22F
22F
22F
2.2H
2.2H
2.2H
2.2F
2.2F
4.7F
1nF
VDCDC2
LOW_BATT
V
IN
V
CC
HOT_RESET
INT
RESPWRON
4.7k
10F
DVDD33
USB_VDDA3P3
DVD18
DVDDR2
VDDA_1P8V
USB_VDD1P8
PLLVDD18
DDR_VDDDL
M24VDD
MXVDD
1.2-V
Domain
1.8-V
Domain
3.3-V
Domain
VIN_LDO
DEFDCDC1
DEFDCDC2
DEFDCDC3
100k
100k
VDCDC3
SCLK SCLK
DCDC3_EN
DCDC1_EN
DCDC2_EN
VBACKUP
VRTC
PWRFAIL
100k
100k
EN
1F
100k
DaVinci
TMS320DM644x
DEFLDO1 V
IN
LDO_EN
AGND1
AGND2
PGND1
PGND2
PGND3
CVDD
CVDDDSP
USB_VDD1P2LDO
APLLREFV
VDDA_1P1V
DSP_EN
10F
10F
1F
For additional power supply designs for TI DSPs, please visit www.ti.com/processorpower.
Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level
power requirements to ensure an adequate power supply design is used.
Texas Instruments 3Q 2009 Embedded Processing Guide
Appendix
Complementary Analog Products for the TMS320DM335 Digital Media Processor
121

Best Performance Best Value Low Power

Video Amplier THS7315 3 SDTV video ampliers for
CVBS, S-Video, YUV, etc.
5.2-V/V gain (14.3 dB)
OPA361 3-V video amp with internal gain and lter
2-pole reconstruction lter
Integrated level shifter
Input range includes ground DC-coupled input
Rail-to-rail output
Low quiescent current: 5.3 mA
Shutdown current: 1.5 A
SOIC SC70
Class-D Amplier TPA2013D1 Constant output power
1.8-V to 5.5-V operation
2.2-W into an 8- load
from a 3.6-V supply
TPA2010D1 2.5-W mono lter-free
Class-D
Efciency: 88% at 400 mW,
80% at 100 mW
Improved CMRR, PSRR
TPA2006D1 1.45-W mono Class-D
2.8-mA quiescent current
0.5-A shutdown current
DSBGA
QFN
DSBGA SON
Low-Power
Voltage Ref
REF50xx Low-temperature drift
[3 ppm/C (max)]
High accuracy: 0.05% max
Low noise (3 VPP/V)
REF33xx Low supply current: 3.9 A (typ)
Low temperature drift: 30 ppm/C (max)
High initial accuracy: 0.15% (max)
High output current: 5 mA
SOIC
MSOP
SOIC
MSOP
Audio Codecs
Low-Power Stereo
AIC3107 Stereo codec with inte-
grated mono Class-D amp
Audio ADC + Audio DAC
Seven audio input pins
AIC3104 Stereo audio DAC + ADC
Six audio output drivers
Automatic gain control
14-mW stereo 48-kHz PB
AIC3254 4.1-mW stereo 48ksps
DAC playback
6.1-mW stereo 48ksps
ADC record
Low-power bypass
QFN QFN QFN
Video DAC
(Decoder)
TVP5150 Ultra-low power NTSC/PAL video decoder
Two composite inputs or one S-Video input
VBI modes supported include: Teletext, Wide Screen Signaling, etc.
Macrovision copy protection detection
Ultra-low power consumption: 113 mW (typ)
Power-down mode: <1 mW
TQFP
Low-Power Touch
Screen Controller
TSC2008 1.2-V to 3.6-V, 12-bit nanopower, 4-wire micro touch screen controller with SPI
Effective throughput rate: Up to 20 kHz (8 bit) or 10 kHz (12 bit)
Low power (12 bit, 8.2-kHz eq rate): 30.4 mA at 1.2 V, f
SCLK
= 5 MHz
1.5 2 WCSP-12 and 4 4 QFN-16 packages
44.6 mA at 2.7 V, f
SCLK
= 10 MHz
QFN
DSBGA
Low-Power Digital
Temp Sensor
TMP102 Low quiescent current 10 A (max)
10 A (max) shutdown current
Accuracy: 0.5C (25C to +85C)
12-bit resolution
Supply range: 1.4 V to 3.6 V
SOT
Clocks
Programmable PLL
Synthesizer
CDCE913 Programmable 1-PLL VCXO clock synthesizer with 1.8-V and 3.3-V outputs
In-system programmability and EEPROM (serial programmable volatile register and nonvolatile EEPROM)
Flexible input clocking concept (external crystal: 8 MHz to 32 MHz)
Low-noise PLL core [PLL loop lter components integrated and low period jitter (typical 50 ps)]
Flexible clock driver
Separate output supply pins
TSSOP
Low-Power Wireless
2.4-GHz RF
Transceiver
CC2525 Wide supply range (2.0 V 3.8 V)
Low current consumption (27 mA in RX, 31 mA in TX @ 0 dBm)
87 dBm sensitivity (at 2 Mbps)
CC2500 Low current consumption
(13.3 mA in RX, 250 kBaud)
Programmable data rate
from 1.2 to 500 kBaud
QFN QFN
Class A-B Amplier TPA6204A1 1.7 W into 8 from a 5-V
supply at THD = 10% typ
Fast startup
Only three external
components
TPA6205 1.25 W into 8 from a 5-V
supply at THD=1% typ
Shutdown pin has 1.8-V
compatible thresholds
Only 5 ext components
TPA721 250 to 700 mW @ 3.3,
5 V with 8- load
Depop circuitry
Thermal and short-circuit
protection
SON MSOP
SON
BGA
SOIC
MSOP
24-/16-/8-Bit
I/O Expander
TCA6424 24-bit I/O expander
No glitch on power up
5-V tolerant I/O ports
TCA6416 16-bit I/O expander
Internal power-on reset
Noise lter on SCL/SDA
inputs
TCA6408 8-bit I/O expander
Low standby current
consumption of 1 A
QFN TSSOP
QFN
BGA
TSSOP
QFN
BGA
Compact Flash
Interface
CF4320H Compact Flash bus-interface chip with 15-kV ESD protection, translation, and card-detect circuitry
Logic-level translation between 1.8-V, 2.5-V, 3.3-V and 5-V supplies
Floating input conditions allowed
Latch-up performance exceeds 250 mA per JESD 17
LFBGA
ESD Protection
15-kV Array
TPD4E001 4-channel ESD protection
Low 1.5-pF input
capacitance
TPD2E001 2-channel ESD protection
Low 1-nA (max) leakage current
0.9-V to 5.5-V supply-voltage range
DRY, DRL and QFN package options
SOT DRY
DRL
QFN
Please visit ti.com/processorpower for complete power solutions.
Texas Instruments 3Q 2009 Embedded Processing Guide
Appendix
Complementary Analog Products for the TMS320DM355 Digital Media Processor
122

Best Performance Best Value Low Power

Video Amplier THS7315 3 SDTV video ampliers for
CVBS, S-Video, YUV, etc.
5.2-V/V gain (14.3 dB)
OPA361 3-V video amp with internal gain and lter
2-pole reconstruction lter
Integrated level shifter
Input range includes ground DC-coupled input
Rail-to-rail output
Low quiescent current: 5.3 mA
Shutdown current: 1.5 A
SOIC SC70
Class-D Amplier TPA2013D1 Constant output power
1.8-V to 5.5-V operation
2.2-W into an 8- load
from a 3.6-V supply
TPA2010D1 2.5-W mono lter-free
Class-D
Efciency: 88% at 400 mW,
80% at 100 mW
Improved CMRR, PSRR
TPA2006D1 1.45-W mono Class-D
2.8-mA quiescent current
0.5-A shutdown current
DSBGA
QFN
DSBGA SON
Low-Power
Voltage Ref
REF50xx Low-temperature drift
[3 ppm/C (max)]
High accuracy: 0.05% max
Low noise (3 VPP/V)
REF33xx Low supply current: 3.9 A (typ)
Low temperature drift: 30 ppm/C (max)
High initial accuracy: 0.15% (max)
High output current: 5 mA
SOIC
MSOP
SOIC
MSOP
Audio Codecs
Low-Power Stereo
AIC3107 Stereo codec with inte-
grated mono Class-D amp
Audio ADC + Audio DAC
Seven audio input pins
AIC3104 Stereo audio DAC + ADC
Six audio output drivers
Automatic gain control
14-mW stereo 48-kHz PB
AIC3254 4.1-mW stereo 48ksps
DAC playback
6.1-mW stereo 48ksps
ADC record
Low-power bypass
QFN QFN QFN
Video DAC
(Decoder)
TVP5150 Ultra-low power NTSC/PAL video decoder
Two composite inputs or one S-Video input
VBI modes supported include: Teletext, Wide Screen Signaling, etc.
Macrovision copy protection detection
Ultra-low power consumption: 113 mW (typ)
Power-down mode: <1 mW
TQFP
Low-Power Touch
Screen Controller
TSC2008 1.2-V to 3.6-V, 12-bit nanopower, 4-wire micro touch screen controller with SPI
Effective throughput rate: Up to 20 kHz (8 bit) or 10 kHz (12 bit)
Low power (12 bit, 8.2-kHz eq rate): 30.4 mA at 1.2 V, f
SCLK
= 5 MHz
1.5 2 WCSP-12 and 4 4 QFN-16 packages
44.6 mA at 2.7 V, f
SCLK
= 10 MHz
QFN
DSBGA
Low-Power Digital
Temp Sensor
TMP102 Low quiescent current 10 A (max)
10 A (max) shutdown current
Accuracy: 0.5C (25C to +85C)
12-bit resolution
Supply range: 1.4 V to 3.6 V
SOT
Clocks
Programmable PLL
Synthesizer
CDCE913 Programmable 1-PLL VCXO clock synthesizer with 1.8-V and 3.3-V outputs
In-system programmability and EEPROM (serial programmable volatile register and nonvolatile EEPROM)
Flexible input clocking concept (external crystal: 8 MHz to 32 MHz)
Low-noise PLL core [PLL loop lter components integrated and low period jitter (typical 50 ps)]
Flexible clock driver
Separate output supply pins
TSSOP
Low-Power Wireless
2.4-GHz RF
Transceiver
CC2525 Wide supply range (2.0 V 3.8 V)
Low current consumption (27 mA in RX, 31 mA in TX @ 0 dBm)
87 dBm sensitivity (at 2 Mbps)
CC2500 Low current consumption
(13.3 mA in RX, 250 kBaud)
Programmable data rate
from 1.2 to 500 kBaud
QFN QFN
Analog Front End VSP01M01 10-bit resolution
SNR 8 5dB @ 18dB gain
Two-channel 8-bit DAC
VSP2582 CCD signal processing
Programmable gain amp (PGA)
85 mW at 3.0 V and 36 MHz, 1 mW in standby mode
SOIC
MSOP
QFN
24-/16-/8-Bit
I/O Expander
TCA6424 24-bit I/O expander
No glitch on power up
5-V tolerant I/O ports
TCA6416 16-bit I/O expander
Internal power-on reset
Noise lter on SCL/SDA
inputs
TCA6408 8-bit I/O expander
Low standby current
consumption of 1 A
QFN TSSOP
QFN
BGA
TSSOP
QFN
BGA
Compact Flash
Interface
CF4320H Compact Flash bus-interface chip with 15-kV ESD protection, translation, and card-detect circuitry
Logic-level translation between 1.8-V, 2.5-V, 3.3-V and 5-V supplies
Floating input conditions allowed
Latch-up performance exceeds 250 mA per JESD 17
LFBGA
ESD Protection
15-kV Array
TPD4E001 4-channel ESD protection
Low 1.5-pF input
capacitance
TPD2E001 2-channel ESD protection
Low 1-nA (max) leakage current
0.9-V to 5.5-V supply-voltage range
DRY, DRL and QFN package options
SOT DRY
DRL
QFN
Please visit ti.com/processorpower for complete power solutions.
Texas Instruments 3Q 2009 Embedded Processing Guide
Appendix
Complementary Analog Products for the TMS320DM365 Digital Media Processor
123

Best Performance Best Value Low Power

Video Amplier THS7315 3 SDTV video ampliers for
CVBS, S-Video, YUV, etc.
5.2-V/V gain (14.3 dB)
OPA361 3-V video amp with internal gain and lter
2-pole reconstruction lter
Integrated level shifter
Input range includes ground DC-coupled input
Rail-to-rail output
Low quiescent current: 5.3 mA
Shutdown current: 1.5 A
SOIC SC70
Class-D Amplier TPA2013D1 Constant output power
1.8-V to 5.5-V operation
2.2-W into an 8- load
from a 3.6-V supply
TPA2010D1 2.5-W mono lter-free
Class-D
Efciency: 88% at 400 mW,
80% at 100 mW
Improved CMRR, PSRR
TPA2006D1 1.45-W mono Class-D
2.8-mA quiescent current
0.5-A shutdown current
DSBGA
QFN
DSBGA SON
Low-Power
Voltage Ref
REF50xx Low-temperature drift
[3 ppm/C (max)]
High accuracy: 0.05% max
Low noise (3 VPP/V)
REF33xx Low supply current: 3.9 A (typ)
Low temperature drift: 30 ppm/C (max)
High initial accuracy: 0.15% (max)
High output current: 5 mA
SOIC
MSOP
SOIC
MSOP
Audio Codecs
Low-Power Stereo
AIC3107 Stereo codec with inte-
grated mono Class-D amp
Audio ADC + Audio DAC
Seven audio input pins
AIC3104 Stereo audio DAC + ADC
Six audio output drivers
Automatic gain control
14-mW stereo 48-kHz PB
AIC3254 4.1-mW stereo 48ksps
DAC playback
6.1-mW stereo 48ksps
ADC record
Low-power bypass
QFN QFN QFN
Video DAC
(Decoder)
TVP5150 Ultra-low power NTSC/PAL video decoder
Two composite inputs or one S-Video input
VBI modes supported include: Teletext, Wide Screen Signaling, etc.
Macrovision copy protection detection
Ultra-low power consumption: 113 mW (typ)
Power-down mode: <1 mW
TQFP
Low-Power Touch
Screen Controller
TSC2008 1.2-V to 3.6-V, 12-bit nanopower, 4-wire micro touch screen controller with SPI
Effective throughput rate: Up to 20 kHz (8 bit) or 10 kHz (12 bit)
Low power (12 bit, 8.2-kHz eq rate): 30.4 mA at 1.2 V, f
SCLK
= 5 MHz
1.5 2 WCSP-12 and 4 4 QFN-16 packages
44.6 mA at 2.7 V, f
SCLK
= 10 MHz
QFN
DSBGA
Low-Power Digital
Temp Sensor
TMP102 Low quiescent current 10 A (max)
10 A (max) shutdown current
Accuracy: 0.5C (25C to +85C)
12-bit resolution
Supply range: 1.4 V to 3.6 V
SOT
Clocks
Programmable PLL
Synthesizer
CDCE913 Programmable 1-PLL VCXO clock synthesizer with 1.8-V and 3.3-V outputs
In-system programmability and EEPROM (serial programmable volatile register and nonvolatile EEPROM)
Flexible input clocking concept (external crystal: 8 MHz to 32 MHz)
Low-noise PLL core [PLL loop lter components integrated and low period jitter (typical 50 ps)]
Flexible clock driver
Separate output supply pins
TSSOP
Low-Power Wireless
2.4-GHz RF
Transceiver
CC2525 Wide supply range (2.0 V 3.8 V)
Low current consumption (27 mA in RX, 31 mA in TX @ 0 dBm)
87 dBm sensitivity (at 2 Mbps)
CC2500 Low current consumption
(13.3 mA in RX, 250 kBaud)
Programmable data rate
from 1.2 to 500 kBaud
QFN QFN
Analog Front End VSP01M01 10-bit resolution
SNR 8 5dB @ 18dB gain
Two-channel 8-bit DAC
VSP2582 CCD signal processing
Programmable gain amp (PGA)
85 mW at 3.0 V and 36 MHz, 1 mW in standby mode
SOIC
MSOP
QFN
24-/16-/8-Bit
I/O Expander
TCA6424 24-bit I/O expander
No glitch on power up
5-V tolerant I/O ports
TCA6416 16-bit I/O expander
Internal power-on reset
Noise lter on SCL/SDA
inputs
TCA6408 8-bit I/O expander
Low standby current
consumption of 1 A
QFN TSSOP
QFN
BGA
TSSOP
QFN
BGA
Integrated 1394a
PHY and Link
TSB43EA42 Integrated 400/200/100 Mbps 2-port/3-port PHY
Supports bus manager functions and automatic 1394 self-ID verication
DTCP encryption support on IEEE 1394 bus
Support for up to two encrypted/decrypted streams at one time
Two congurable high-speed data ports for video data, one port serial, one serial or parallel
2 4K-Byte isochronous buffers for video data
SRAM-like 16-bit asynchronous interface
BGA
ESD Protection
15-kV Array
TPD4E001 4-channel ESD protection
Low 1.5-pF input
capacitance
TPD2E001 2-channel ESD protection
Low 1-nA (max) leakage current
0.9-V to 5.5-V supply-voltage range
DRY, DRL and QFN package options
SOT DRY
DRL
QFN
Please visit ti.com/processorpower for complete power solutions.
Texas Instruments 3Q 2009 Embedded Processing Guide
Notes
124

Texas Instruments 3Q 2009 Embedded Processing Guide

Notes
125

Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TIs standard terms and conditions of sale. Customers are advised to
obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customers applications or product designs, software
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TMS320C64x, C64x+, TMS320C64x+, C67x, TMS320C67x, DM64x, TMS320DM64x, TMS320C5x, Code Composer, Code Composer Studio, controlCARD, controlSTICK, DSP/BIOS, eXpressDSP, MicroStar BGA, NanoStar,
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Technical
Documentation
Application Report
SPRAAK9May 2007
Implementing DDR2 PCB Layout on the TMS320DM647/8
Michael Shust, Kevin Jones ...................................................................... High Speed HW Productization
ABSTRACT
This document contains implementation instructions for the DDR2 memory controller
interface contained in the TMS320DM647/8 DSP devices. The approach to specifying
interface timing for the DDR2 interface is quite different than on previous devices.
The previous approach specified device timing in terms of data sheet specifications and
simulation models. The customer was required to obtain compatible memory devices,
as well as their data sheets and simulation models. The customer would then take this
information and design their printed circuit board (PCB) using high speed simulation to
close system timing.
For the DM647/8 DDR2 interface, the approach is to specify compatible DDR2 devices
and provide the PCB routing rule solution directly to the customer. TI has performed the
simulation and system design work to ensure DDR2 interface timings are met. The
DDR2 system solution is referred to as the DM647/8 DDR2 collateral. This document
describes the content of this collateral.
The DM647/8 DSK and EVM provide example PCB layouts following these routing
rules that pass FCC EMI requirements. The DSK contains a single DM647/8 device
and the EVM is a DSK with an attached daughter card containing another DM647/8
device. Both DDR2 layouts on the DSK/EVM meet the routing rules detailed in this
document. The customer may copy these DDR2 layouts directly, but the intent is to
allow enough flexibility in the routing rules to meet other PCB requirements and allow
the customer to derive an optimized layout for their specific application.
Contents
1
Prerequisites ........................................................................................ 2
2
DM647/8 DDR2 Supported Devices ............................................................. 2
3
Other Documentation .............................................................................. 3
4
Schematics and Electrical Connections ......................................................... 3
5
Stackup .............................................................................................. 5
6
Placement ........................................................................................... 6
7
Routing ............................................................................................. 11
List of Figures
1
DM647/8 DDR2 High Level Schematic .......................................................... 4
2
DM647/8 and DDR2 Device Placement Specification ......................................... 6
3
Example DDR2 Keep Out Region................................................................ 7
4
PLL and DLL Filter Requirements................................................................ 8
5
Discrete Part Placement ......................................................................... 10
6
VREF Specification ............................................................................... 12
7
General Address, Bank Address, Control and Clock Routing............................... 12
8
General Data Byte 0 Routing.................................................................... 13
9
General Data Byte 1 Routing.................................................................... 13
10
General Data Byte 2 Routing.................................................................... 13
11
General Data Byte 3 Routing.................................................................... 14
SPRAAK9May 2007
Implementing DDR2 PCB on the DM647/8
1
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