2.4 Semiconductor
2.4 Semiconductor
2.4 Semiconductor
n=3
n=1
n=2
2. Valence Band :This energy band contains valence electrons. This band may be
PartIally or completely filled with electrons but never be empty. The electrons in this
band are not capable of gaining energy from external electric field to take part in
conduction of current.
3. Conduction Band: This band contains conduction electrons. This band is either
empty or Partially filled with electrons. Electrons present in this band take part in the
conduction of current.
4. Forbidden Band This band is completely empty. The minimum energy required to
shift an electron from valence band to conduction band is called band gap (Eg).
Electron volt: The kinetic energy gained by an electron when accelerated trough
potential difference of one volt is called as one electron volt. Energy gained by
charged particle = magnitude of charge * potential difference 1eV = charge on
electron * 1 volt =1.6*10-19 *1V = 1.6*10-19 J
(i) Conductor Conductors are those substances through which electricity can
pass easily, e.g., all metals are conductors.
In conductor Valence band and conduction band are overlapped to each
other.
It has positive temperature coefficient of resistance.
(ii) Insulator Insulators are those substances through which electricity cannot
pass, e.g., wood. rubber, mica etc.
In Insulator forbidden energy gap is very wide or large.
It has negative temperature coefficient of resistance.
(iii) Semiconductor Semiconductors are those substances whose conductivity
lies between conductors and insulators. e.g., germanium, silicon, carbon etc.
In Semiconductor forbidden energy gap is very small.
It has negative temperature coefficient of resistance.
Fig. Classification of Solid (Courtesy: https://www.miniphysics.com/)
Types of Semiconductor
Extrinsic semiconductor
Defination:The conductivity of semiconductor is increased by adding a small amount
of suitable impurity to pure semiconductor such materials are known as extrinsic
semiconductor.
The process of adding impurities to a semiconductor is known as doping and the
impurity atoms are called dopants. These materials are also called as doped
semiconductor.
There are two types of dopants used in doping the tetravalent silicon of germanium 1)
Pentavalent (valency5) like Arsenic, Antimony, Phosphorus etc.
2) Trivalent (Valence 3) like Indian, Boron, Aluminum. etc 2.4.8.3:
N type semiconductor A semiconductor in which number of free electron is much
greater than hole, is called N type semiconductor.
When a trivalent material is added to a pure semiconductor three covalent bonds are
formed with the silicon atom. While a fourth bond is incomplete as it contains a hole.
An atom like Indium or Gallium having three valance electron is outer most shell
when added to Germanium or Silicon atom, the three electron of Indium are shared by
three electron of Silicon to form covalent bond fourth bond is incomplete and contains
hole. Many holes are produced by addition of trivalent impurity. The trivalent
impurity accepts electrons form surrounding atom hence it is known as acceptor
impurity. The majority charge carriers are holes which are positively charge and
electrons re minority. At room temperature thermal energy generates few electron
holes. The majority charge carriers are holes which are positively charged hence these
semiconductors are called P types semiconductors.
P-N junction
Two important process occur during formation of P-N junction diffusion current and
drift current.
In N type semiconductor the concentration of electron is more than concentration of
holes. Similarly, in P type concentration of holes is more than concentration of
electrons.
During formation of P-N Junction concentration difference across the P sides and N
sides, holes from P side diffuse into N side and electrons from N side diffuse into P
side. This motion of charge carries gives rise to diffusion current across the junction.
When an electron diffuses from N side to P side it leaves behind an ionized donor on
N side. The ionized donor which is positively charged and cannot move as it is
bounded with surrounding atom. As electron continue to diffuse from N to P, a layer
of positive change is formed on N side of junction Similarly, when hole diffuses form
P side to N side due to concentration difference it leaves behind an ionized acceptor
which is negativity charged it cannot move as it is bounded with surrounding atom. As
holes continue to diffuse a layer of negative charge is formed on P side of junction
Semiconductor diode:
The semiconductor diode I basically a P-N junction with metallic contact provided at
the ends for application of external voltage. The depletion region I 0.3 V and 0.7v for
germanium 4 silicon, above this voltage current increases very rapidly with slight
increase in forward voltage across the diode. In reverse bios connection conduction is
very small, reverse saturation current floods through the diode.
Actual appearance
of Diode
PN Junction Diode under forward bias
When an external voltage is applied across the semiconductor diode, such that positive
terminal of battery is connected to P region and negative terminal of battery is
connected to N region, the junction is said to be forward biased. The direction of
applied voltage (V) is opposite to the barrier potential (V0), as a result the depletion
layer width decreases (V- V0). The +ve of battery pushes (repels) holes of ‘P’ side and
holes cross the junction, similarly − ve of battery pushes (repels) electrons of ‘N’ side
and electron crosses the junction. Thus majority charge carries cross the junction and
reaches other end of battery, current flows through the junction.
I – V characteristics :
Applications of Semiconductors
1. NP junction diodes are commonly used for rectification (where AC is
converted into DC)
2. Used as clipper for clipping AC portion
3. Used as clamper i.e. to change reference voltage
4. Used as switches in most electronic circuits.
5. Used as switches in digital logic circuits
6. Used in demodulator circuit 7. Used in detector circuit 8. Used in voltage
multipliers