ALT M2014 Maghsoodloo
ALT M2014 Maghsoodloo
ALT M2014 Maghsoodloo
In most instances component reliability is so high that placing even n = 100 units on test
may not yield any failures for a test duration, of say, more than 5000 hours. If a new product is
being developed, such long testing times cannot be tolerated because the new product has to get
to the global market in due time, or else lack of market share may occur. In such cases, the
experimenter has no choice but to use accelerated testing procedures to induce failures in order
to estimate component TTF (or reliability).
Accelerated life testing (ALT), in combination with DOE (design of experiments), is
conducted by subjecting n identical units to stresses well beyond what the units on test will
experience under normal operating conditions. Such high stresses for ALT that accelerate
failure mechanism may be applied in many forms: very high, or very low temperatures,
humidity levels well beyond normal operating conditions, excessive usage, very high levels of
voltage, extreme cycling between low and high levels beyond what is considered normal
operating conditions, excessive force, excessive vibrations, ten times more units on test than
needed, etc, etc.
As Elsayed (Reliability Engineering, E.A. Elsayed, Chapter 6, Wiley INC. (2012) points
out in the beginning of section 6.4, the underlying assumption is that the failure mechanism
under ALT conditions is, except for a multiplicative factor, similar to failure mechanism under
normal operating conditions. Put differently, ALT is based on the principle that a unit under
accelerated test will exhibit the same behavioral statistical pattern in a short testing time under
very high stresses as it will exhibit in a much longer time at normal operating stresses. For
example, if the underlying failure distribution is W(, , ), then under ALT the change in the
shape parameter will be much smaller than the changes in minimum life and scale parameter
. That is to say, under ALT the change in (or overall process variability, or CV) will be
negligible compared to changes in and the characteristic life as compared to normal
operating conditions. There are 3 different physical models that have been developed in the past
115 years that can be used to estimate the MTTF under normal operating conditions (o = normal
operating conditions) from ALT data, where subscript “s” will be used to designate statistics
computed under high stressed conditions.
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(1) The Arrhenius Model
This is the most commonly used model relating TTF to high thermal stresses. Thermal
stresses occur in solid state diffusion, chemical reactions, many semiconductor failure
mechanism, battery life, etc. The underlying distribution of TTFo (TTF under normal operating
conditions) in almost all these cases is exponential, Weibull, or lognormal (i.e., all positively
skewed pdfs). The Arrhenius rate law that describes the (failure) rate, r, at which reaction to
temperature of the test unit occurs is given below.
Ea /(k Τ B/ Τ
r = C e = C e (102)
where C is a constant which is characteristic of the failure mechanism of the item under test, Ea
= the activation energy needed to induce failure measured in eV (= electron volts; close to
vaporization energy for metals and chemical bond energies for polymers), k = the Boltzman’s
constant = 8.6171105 eV/Kelvin (Note that Google.com gives k = 8.616105, while L. W.
Condra, p. 232, gives k = 8.617105 ) and T = the temperature in Kelvin = Centigrade +
273.15, and B = Ea/k. In RE engineering, the Arrhenius model is also used to measure the
impact of temperature on reliability because we make the assumption that the TTF is inversely
proportional to the reaction (failure) rate, r, given in equation (102), i.e.,
Ea /(k T ) B/ Τ
TTF = C e = Ce (103)
where C 1/C is the constant of proportionality characteristic of the product under test. The
Arrhenius model is applicable when the product r1TTF1 = r2 TTF2, where r1 and r2 are
reaction rates at testing temperatures T1 and T2, respectively. The relationship Rate1TTF1 =
Rate2 TTF2 implies that r TTF will practically stay constant over the range of temperature
applicability, and as a result roTTFo rsTTFs, where TTFo represents TTFo under normal
operating conditions and TTFs represent component life under (accelerated) stressed conditions.
Thus,
1 1 1 1
TTFo rs C e Ea /(k Ts ) Ea (
To
Ts
)/k Ea (
To Ts
)/k
= =
=e TTFo = TTFs e
TTFs ro C e aE /(k To )
(104a)
Eq. (125a) shows that the acceleration factor for the Arrhenius model is given by
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1 1 1 1
Ea ( )/k B( )
To Ts To Ts
Af = TTFo / TTFs = e =e (104b)
Note that the smaller the required activation energy Ea is, the more rapidly the unit on test will
fail resulting in smaller Af value.
The Example 6.11 on page 405 of E. A. Elsayed. In this example n microelectronic devices
(the value of n not specified by the author) are put on accelerated test at Ts = 200 Celsius = 200
+ 273.15 = 473.15 Kelvin and the MTTfs of the n units was approximately equal to 4000 hours.
The operating temperature To = 50 C = 323.15K, and the required activation energy was 0.191
1 1 1 1
Ea ( )/k 0.191( )/8.6171105
To Ts 323.15 473.15
eV. Thus, the sample MTTfo = MTTfs e = 4000 e =
sample statistics are x s =190, Ss = 40.8248290, and cvs = 21.487% showing that the accelerated
data is obviously not exponentially (i.e., IFR) and if it is Weibull, then the slope 5.0 (see my
Table 1 on p. 10). Most probably, the accelerated data is lognormally distributed. The use of
equation (104a) yields the normal operating sample mean to failure mttfo = 190
1 1
0.90( )/(8.6171105 )
e 298.15 373.15 = 1901142.3450161 = 217045.5531 hours Af =
1142.3450161. If we wish to be more conservative about our estimate of MTTF in normal
1 1
0.90( )105 /8.6171
operating use, we could estimate it as mttfo = 130 e 298.15 373.15 = 148504.8521
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semiconductor failures, for intermetallic diffusion (like in Example 16) it ranges in the interval
0.90 1.1 eV, and for silicon junction defects Ea = 0.80 eV. The question arises how high the
stressed temperature should be for a unit under accelerated test so that the resulting stressed life
can be extrapolated to the expected life under normal operating conditions. Almost all metals
change properties when the testing temperature exceeds 50% of their melting temperature Tm.
Therefore, the accelerated testing temperature, Ts, must not exceed 0.50Tm.
hours, with Ea = 0.85 eV and To = 27C. The use of equation (104b) gives an acceleration
1 1
Ea ( )/k
factor of Af = e 300.15 373.15 = 619.695651 giving an estimated mttfo = Af x s =
619.695651232.2 = 143893.3301 hours 16.42618 years. Since the sample size n > 20, then
we may use the normal approximation to the SMD of x s to obtain an approximate lower 95%
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above two authors involved a new Class-H motor insulation with a design temperature of To
= 180 C = 453.15 Kelvin, where n = 40 units were equally and randomly divided and tested
to failure at the accelerated temperatures 190, 220, 240, and 260 Celsius. The accelerated
times TFs in hours are provided in Table 5.2 of B. Gnedenko and duplicated herein. I used
Minitab to regress y on x, where x = 105/(8.6171T), and its output is provided below.
Analysis of Variance
Source DF SS MS F P
Regression 1 25.073 25.073 383.36 0.000
Residual Error 38 2.485 0.065
Lack of Fit 2 0.368 0.184 3.12 0.056
Pure Error 36 2.118 0.059
Total 39 27.558
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Unusual Observations
Obs x y Fit SE Fit Residual St Resid
11 23.5 7.4753 7.9973 0.0416 -0.5220 -2.07R
39 21.8 7.3827 6.8509 0.0635 0.5319 2.15R
40 21.8 7.5475 6.8509 0.0635 0.6966 2.81R
The above regression output clearly shows that ŷ = 7.28341 + 0.64936 x is an excellent
2
model because R Model = 91% so that ln(C) = 7.28341 C = 0.00068684 and Ea =
0.649358eV. To extrapolate the expected life to the operating temperature of 180C = 453.15
K, we insert xO = 100000/(8.6171453.15) = 25.609251 into our regression model ŷO =
convert the above regression model ŷ = 7.28341 + 0.64936x , ln(TTF) = ln (C) + Ea /(k T) to
the Arrhenius format:
5 / (8.6171T)
mttf o = 0.00068684 e0.64936×10 , (105)
11459.8130 hours. The acceleration factors from 180 to 190C is Af = 11459.8130 /8782.20 =
1.3043. In practice, I would use only the stressed-Temperature that is closest to TO to compute
the AF. Further, I attempted to improve the above model by adding the regressors x2 and x3 to
2
the model, unfortunately the R Model improved by a minute amount to 92.3% but all the
coefficients in the model became highly insignificant (i.e., a worthless model).
Exercise 26. Boris Gnedenko et al mention on their page 172 that the failure data at
260 Celsius in the above experiment looks very suspicious because it exhibits much higher
sample cv than the other 3 accelerated temperatures. That is to say, the failure mechanism at
260 C is different from failure modes at lower temperatures. Repeat my analysis of the above
experiment but remove the data at 260 C. ANS: mttf o (180 C) > 12000 hours.
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(2) The Inverse Power Law (IPL)
This law is generally used when the TTF is inversely proportional to the applied
(accelerated) stress, and the underlying lifetime distribution is almost always Weibull, or
perhaps lognormal. As in the case of Arrhenius model, the IPL model is applicable only when
there is a single type of stress, which in most cases is voltage accelerated stress, alternating
temperature stress, or mechanical vibration in order to induce fatigue failure. The general form
of the IPL is given by
TTFs = C/ Sb (106a)
where C > 0 and the exponent b > 0 are constants characteristics of the items under test, and S
is the applied (accelerated) stress. The value of the exponent b = [2, 3] for metals and
electronic solder joints, b = [4, 10] for microelectronic parts, and b = [4, 7] for intermetallic
fatigue failures.
C/ Sbo
= Sb/ So = (0.0008/0.00005)2.5 = 1024 mttfo = 102410 =
b
= mttfo/ MTTfs =
C/ S b
where Vo is the standard specified (voltage) operating stress, Vs is the accelerated voltage
stress, and the constant C is characteristic of the product under test , fabrication method, etc.
The Example 6.13 on pages 410-411 of Elsayed. In this experiment two samples of 20
CMOS integrated circuits each are put on accelerated life test, where Vs represents accelerated
electric field stresses at 10 and 25 eV. The underlying distribution of TTF is assumed Weibull
and there is only one stress factor, namely electric field, and hence the IPL is a plausible model
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for TTFs. The normal operating stress is at Vo = 5 eV. For your convenience I have duplicated
Table 6.7 of E. A. Elsayed on his page 410 below. I first used the data under the two
accelerated stress levels, V1 = 10 and V2 = 25 eV, to obtain the MLEs of the Weibull
parameters and . Using my equations 111 (a &b) the MLEs are ˆ 1s = 1.836028, ˆ 1s =
hours. These MLEs under stressed conditions are consistent with those of Elsayed’s. It seems
that if the stressed data set is W(0, , ), then a rough value of the Weibull slope is close to
1.910. However, it is not clear what the estimate of the characteristic life at normal operating
obtained under accelerated testing conditions. I will now obtain the least-squares estimate of .
Table 6.7 of Elsayed page 410 (TTF under accelerated testing condition)
10 eV 1037.39 hours, 3218.11, 3407.17, 3520.36, 3879.49, 3946.45, 6635.54, 6941.07, 7849.78, 8452.49
10 eV 9003.08, 9124.50, 9365.93, 9642.53, 10429.50, 10470.60, 11162.90, 12204.50, 12476.90, 23198.30
25 eV 809.10, 1135.93, 1151.03, 1156.17, 1796.53, 1961.23, 2366.54, 2916.91, 3013.68, 3038.61
25 eV 3802.88, 3944.15, 4095.62, 4144.03, 4305.32, 4630.58, 4720.63, 6265.99, 6916.16, 7113.82 hours
In order to obtain a LS estimate of , I first linearized the IPL model, TTFs = C/ Sb, by taking
the natural logarithm of both sides. This leads to y = ln(TTFs) = ln(C) b ln(S) , where S is at
2 levels, 10 and 25 eV. I used Minitab to regress y = ln(TTFs) on x = ln(S), with the following
output.
Analysis of Variance
Source DF SS MS F P
Regression 1 7.4281 7.4281 17.01 0.000
Residual Error 38 16.5968 0.4368
Total 39 24.0248
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Unusual Observations
Obs x y Fit SE Fit Residual St Resid
1 2.30 6.979 8.841 0.148 -1.862 -2.89R
I must caution the reader before using the above Minitab model for extrapolation! You must
2
observe that the value of R Model = 30.9% is woefully too small to be an adequate model due
to the fact that there is too much within (or experimental error) variability in the data. The data
under level 1 of stress (10 eV) ranges from 1037.39 stressed hours to 23198.30 hours, which is
very large, but still the regression is highly significant. The above model cannot be improved
because there are only 2 levels of stress factor and hence regression can have only one df and
any attempt to improve it by adding regressors such as x2, x3 and 1/x to the model will be futile
because the design does not provide but one df for studying effects. Hence, we have to
2
extrapolate with a model whose R Model = 30.9%. The estimate of the constant Ĉ = e11.0065 =
60264.591, and the estimate of the exponent b̂ = 0.9406 is very close to Elsayed’s answer of
0.95318. To estimate the MTTFo at 5 eV, we insert x = ln(5) =1.609438 into the regression
model. This yields ŷ (1.60944) = 11 0.94061.60944 = 9.49266 mttf o = e9.49266 =
13262.06124 hours, which is fairly close to Elsayed’s answer of 12140. Since the Weibull
1 1
mean E(T) = Γ(1 + ) , then θ̂o = 13262.06124 / Γ(1 + ) = 14947.92193 hours. The
β 1.910
two acceleration factors are Af1 = 13262.06124 /8298.3295 = 1.59816036, where 8298.3295 =
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where r is the rate of reaction to the two stresses; r may be thought of the parameter if the
underlying distribution is exponential, but r 1/ if the TTF is W(0, , ), and if TTF is
lognormal, then r = 1/T0.50 (the inverse of median life). Thus, from (107a) we deduce that
Ea /(k Τs
TTFs = C e / Sb = C eEa /(k Τs Sb (107b)
The values of Ea and exponent b can be obtained empirically once accelerated data are available.
For electronic applications, b 2 to 3 and Ea = 0.90 eV, and C is a constant characteristic of the
product and testing conditions. Equation (107b) implies that under normal operating conditions
the TTF is given by
Ea /(k o
TTFo = C e / Sbo (107c)
Combining equations (128 b&c) yields
Note that Af must be directly proportional to Ea because larger activation energy required to
induce failure in the test unit generally implies longer MTTFo.
Example 18. L. W. Condra (RE Improvement with DOE, 2nd edition, Marcel
Dekker) reports (on his p. 239) the results of an accelerated life testing experiment of n
(unspecified) microelectronic circuits conducted at the standard accelerated temperature stress
of 85 C and a standard accelerated relative humidity (RH) of S = 85%. (He refers to this type
reported to be 800 hours and normal operating conditions are To = 40 C and RHo = 60%. The
Model (107b) when the 2nd stress represents S = RH (relative humidity) is referred to as Peck’s
relationship. Peck, D. S. (1986) ”Proc. International RE Physics Symposium, 24, pp. 44-45,
reports an exponent value of b 2.70 and an activation energy of Ea = 0.79 eV, but Condra in
his example uses the rough values of b = 3 and Ea = 0.90 eV. I will use Peck’s values in
equation (129) to estimate the acceleration factor Af.
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(0.79105 /8.6171)(1/313.16 - 1/358.16)
Af = (85/60)2.7 e = 101.3547
which yields mttfO = 101.3547 800 hours = 81083.74783 hours = 9.2561356 years. The above
estimated value of mttfO = 9.2561356 years does not conform well with that of Condra’s 16.6
years. If we use Condra’s values of b = 3 and Ea = 0.90 eV in equation (108), we obtain Af =
187.780224 and an estimated mttfO = 187.780224 800 = 150224.179364 hours = 17.148879
years. I tried to obtain Condra’s answer of Af = 182 by using his values of To = 313 and Ts
= 358 in equation (108) but I still got an answer of Af = 188.5450005 which is not equal to
Condra’s answer of 182. The reader should be careful about interpreting the values of mttfO
because if the underlying distribution is exponential, then mttfO is an estimate of MTTF; if the
underlying distribution is Weibull, then mttfO is an estimate of the characteristic life tc = , and
if the underlying distribution is lognormal, then mttfO is an estimate of the median life.
Furthermore, the farther the operating conditions are from the stressed conditions, the less
accurate the regression estimates of b and Ea become. This problem gets compounded when the
baseline distribution is very highly skewed and /or there are outliers in the data.
Example 6.14 on page 412 of Elsayed. The data listed in Table 6.8 on page 412 of Elsayed
presents the results of an ALT with 8 FLCs (factor level combinations) of Temperature and
Voltage stresses. For your convenience, I am providing Elsayed’s data below. The normal
operating temperature To = 30 C = 303.16 Kelvin and the operating voltage is Vo = 25 volts.
Instead of using Elsayed’s parametric approach to estimate MTTFo, I linearized the Eyring
Model (107b) as follows: y = ln(TTFs) = ln ( C) b ln(Vs) + Ea x, where x = 100000/(8.6171
Ts), and then I regressed y on ln(Vs) and x. The Minitab output is given below
The regression equation is
y = 2.25333 - 0.426737 LV + 0.199714 x, LV = ln(Vs), x = 100000/(8.6171Ts),
Analysis of Variance
Source DF SS MS F P
Regression 2 0.47708 0.23854 70.32 0.000
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Residual Error 5 0.01696 0.00339
Total 7 0.49404
Source DF Seq SS
LV 1 0.39488
x 1 0.08220
Temperature
60 C 1800 hours 1500 1200 1000
70 C 1500 1200 1000 800 hours
In the above Minitab output, LV = ln(Vs) and y = ln(TTFs). Note that the value of Ea from the
above regression output is Ea = 0.199714 which is in agreement with the reported value by
Elsayed on his page 412. In order to estimate the MTTFo, I used extrapolation (which is
generally not a good idea in regression analysis) in the above regression model, which has an
2
excellent R Model , as follows: ŷ(30 oC, 25 volts) = 2.25333 0.426737ln(25) + 0.199714
25 volts) to stress FLC (60 C, 50 volts) is Âf = 5038.8636 /1800 = 2.79937. To verify the
adequacy of the Eyring model to the data, we also need to estimate this last acceleration factor
50 0.426737 (19971.4/8.6171)(1/303.15 1/333.15)
Af from equation (108) as follows: Â f (Model) = ( ) e
25
= 2.6758, which is fairly consistent with the regression-value of 2.7994.
Example 6.7 of Elsayed on pages 388-389. This experiment makes no assumptions about
the underlying distributions of Times TF (i.e., the nonparametric) and uses regression to
estimate the MTTF by extrapolation. I used the data in Table 6.1 of Elsayed on his page 388 to
regress the TTF on stress factor Temperature in Kelvin, and stress factor electric field measured
in units of eV. For your convenience, I am duplicating Elsayed’s Table 6.1 on the next page.
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The resulting Minitab output is given below:
Regression Equation
Coefficients
Term Coef SE Coef T P
Constant 6061.97 3.55841 1703.56 0.000
T -17.85 0.01343 -1329.01 0.000
eV 160.16 0.22473 712.68 0.000
Temperature C 200 200 200 200 200 200 200 200 200 200
Electric Field (eV) 15 15 15 15 15 15 15 15 15 15
Stressed TTF 19 19 19.1 19.2 19.3 19.32 19.38 19.4 19.44 19.49
(TTFs)
Summary of Model
Analysis of Variance
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22 1006 1003.33 0.474824 2.66667 2.51161 R
New Obs T eV
1 298.15 5 X
General Regression Analysis: TTFs versus TempC, eV ; using the centigrade data
Regression Equation
Coefficients
Summary of Model
Analysis of Variance
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1 25 5 X
Regression Equation
Coefficients
Summary of Model
Analysis of Variance
In order to estimate the MTTFo from the above regression models at the normal operating
temperature To = 25C = 298.15 Kelvin, and 5 eV, we insert these values into the first model as
follows: mttfO = 17.8487298.15 + 160.1595 = 1541.19 hours which is consistent with that
of Elsayed’s answer. The value of the acceleration factor from normal operating conditions
(25C, 5 eV) to stress levels (100C, 10 eV) is equal to Âf1 = 1541.19/ mttf(100 o C,10 eV) =
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Chapter Summary
1. The acceleration factor For the Arrhenius Model is given by Af =
1 1
Ea ( )/k
To Ts
e MTTFo = Af MTTFS, where k = Boltzman’s constant =
8.617110 5. Two cases exit: (a) The required activation energy Ea to induce
failure is known, (b) Ea is not known and has to be empirically estimated from
accelerated data. For Semiconductor failure 0.30 Ea 0.60; for intermetallic
diffusion 0.90 Ea 1.10; For silicon junction defects Ea = 0.80.
(b) Ea is unknown.
Identify at least two stressed temperature levels, such as 50C and 75C (<
0.50Tm ) and obtain stressed failure data. Linearize the Arrhenius model TTFS =
E /(k Ts )
Ce a and regress ln(TTFS) on x = 105 /(8.6171T); then the rough estimate
of Ea is given by the slope of the regression line. However, one must be
cognizant of the fact that extrapolation is classical regression violates
regression assumptions and is generally frowned upon. But than when there are
no information about Ea (physical or otherwise), then the regression approach
would be the only way to obtain a statistically unsound manner of obtaining a
rough estimate of the activation energy Ea.
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2. The IPL : TTFs = C/ Sb Larger values of b induce
higher failure rate reaction and smaller TTF. The value of
b = [2, 3] for metals and electronic solder joints, b = [4, 7] for
intermetallic fatigue failure, and b = [4, 10] for microelectronic parts, and very
rarely b lies outside the range [2, 20].
b
(a) b is known Af = Sb/ So . For example, suppose the normal operating
229