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    MVLD507L - Ic-Technology - TH - 1.0 - 73 - MVLD507L - 67 Acp

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    Mahesh N 22MVD0090
    This document outlines a course on IC Technology. The course aims to introduce students to semiconductor manufacturing processes like lithography and fabrication. It also aims to teach students how to model oxidation growth rates and understand processes like diffusion and ion implantation. The course has 6 modules that cover topics like crystal growth, lithography, thermal oxidation, diffusion, thin film deposition and MOS/bipolar process integration. The course assessments include continuous tests, assignments, quizzes and a final exam. The course was recommended by the Board of Studies on July 28th, 2022 and approved by the Academic Council on August 8th, 2022.

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    MVLD507L - Ic-Technology - TH - 1.0 - 73 - MVLD507L - 67 Acp

    Uploaded by

    Mahesh N 22MVD0090
    21 views2 pages
    This document outlines a course on IC Technology. The course aims to introduce students to semiconductor manufacturing processes like lithography and fabrication. It also aims to teach students how to model oxidation growth rates and understand processes like diffusion and ion implantation. The course has 6 modules that cover topics like crystal growth, lithography, thermal oxidation, diffusion, thin film deposition and MOS/bipolar process integration. The course assessments include continuous tests, assignments, quizzes and a final exam. The course was recommended by the Board of Studies on July 28th, 2022 and approved by the Academic Council on August 8th, 2022.

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    MVLD507L_IC-TECHNOLOGY_TH_1.0_73_MVLD507L_67 ACP

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    This document outlines a course on IC Technology. The course aims to introduce students to semiconductor manufacturing processes like lithography and fabrication. It also aims to teach students how to model oxidation growth rates and understand processes like diffusion and ion implantation. The course has 6 modules that cover topics like crystal growth, lithography, thermal oxidation, diffusion, thin film deposition and MOS/bipolar process integration. The course assessments include continuous tests, assignments, quizzes and a final exam. The course was recommended by the Board of Studies on July 28th, 2022 and approved by the Academic Council on August 8th, 2022.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    21 views2 pages

    MVLD507L - Ic-Technology - TH - 1.0 - 73 - MVLD507L - 67 Acp

    Uploaded by

    Mahesh N 22MVD0090
    This document outlines a course on IC Technology. The course aims to introduce students to semiconductor manufacturing processes like lithography and fabrication. It also aims to teach students how to model oxidation growth rates and understand processes like diffusion and ion implantation. The course has 6 modules that cover topics like crystal growth, lithography, thermal oxidation, diffusion, thin film deposition and MOS/bipolar process integration. The course assessments include continuous tests, assignments, quizzes and a final exam. The course was recommended by the Board of Studies on July 28th, 2022 and approved by the Academic Council on August 8th, 2022.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    Item 67/21 - Annexure - 25

    Course Code Course Title L T P C


    MVLD507L IC Technology 3 0 0 3
    Pre-requisite NIL Syllabus version
    1.0
    Course Objectives
    The course intended to
    1. Introduce the process involved in semiconductor manufacturing, lithography and
    fabrication.
    2. Model the oxidation growth rate & to understand oxidation process and the process
    of diffusion and to expound the Ion Implantation process.
    3. Explain the thin film deposition process and review the difference between MOS and
    Bipolar Process Integration.

    Course Outcome
    At the end of the course the student will be able to
    1. Understand the process involved in semiconductor manufacturing, lithography and
    fabrication.
    2. Understand the various lithography techniques used for pattern transfer.
    3. Apply models for understanding the oxidation growth.
    4. Understand the diffusion mechanism in semiconductors.
    5. Understand the process involved in thin film deposition.
    6. Analyse the difference between MOS and Biploar Process

    Module:1 Crystal Growth 5 hours


    Introduction to Semiconductor Manufacturing and fabrication, Clean Room types and
    Standards, Physics of the Crystal growth, wafer fabrication and basic properties of silicon
    wafers.
    Module:2 Lithography 7 hours
    The Photolithographic Process, Photomask Fabrication, Comparison between positive and
    negative photoresists, Exposure Systems, Characteristics of Exposure Systems, E-beam
    Lithography, X- ray lithography
    Module:3 Thermal Oxidation of Silicon 6 hours
    The Oxidation Process, Modeling Oxidation, Masking Properties of Silicon Dioxide,
    Technology of Oxidation, Si-SiO2 Interface
    Module:4 Diffusion and Ion Implantation 7 hours
    The Diffusion Process, Mathematical Model for Diffusion, Constant-, The Diffusion
    Coefficient, Successive Diffusions, Diffusion Systems, Implantation Technology,
    Mathematical Model for Ion Implantation, Selective Implantation, Channeling, Lattice
    Damage and Annealing, Shallow Implantations.
    Module:5 Thin film deposition, contacts, packaging 7 hours
    and yield
    Chemical Vapor Deposition, Physical Vapor Deposition, Epitaxy, Metal Interconnections and
    Contact Technology, Silicides and Multilayer-Contact Technology, Copper Interconnects and
    Damascene Processes, Wafer Thinning and Die Separation, Die Attachment, Wire Bonding,
    Packages, Yield
    Module:6 MOS Process Integration 5 hours
    Basic MOS Device Considerations, MOS Transistor Layout and Design Rules,
    Complementary MOS (CMOS) Technology
    Module:7 Bipolar Process Integration 6 hours
    Isolation Techniques in BJT fabrication, Advanced Bipolar Structures, Other Bipolar Isolation
    Techniques. Deep Submicron Processes, Low-Voltage/Low-Power CMOS/BiCMOS
    Processes. Future Trends and Directions of CMOS/BiCMOS Processes
    Module:8 Contemporary Issues 2 hours

    Proceedings of the 67th Academic Council (08.08.2022) 1355


    Item 67/21 - Annexure - 25

    Total Lecture hours: 45 hours

    Text Book(s)
    1. S.M. Sze, VLSI technology, 2017, Second Edition, Tata McGraw-Hill.
    2. R.C. Jaeger, Introduction to microelectronic fabrication, 2013, Second Edition, Prentice
    Hall.
    Reference Books
    1. S.A. Campbell, The science and engineering of microelectronics fabrication, 2012,
    Second Edition, Oxford University Press, UK.
    2. Simon M. Sze, Gary S. May, Fundamentals of Semiconductor Fabrication, 2011,Wiley.

    Mode of Evaluation: Continuous Assessment Test, Digital Assignment, Quiz and Final
    Assessment Test
    Recommended by Board of Studies 28-07-2022
    Approved by Academic Council No. 67 Date 08-08-2022

    Proceedings of the 67th Academic Council (08.08.2022) 1356

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