Development of Temperature Measurement Setup For M
Development of Temperature Measurement Setup For M
Development of Temperature Measurement Setup For M
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Vishwakarma Institute Of Information Technology, Pune
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1Department of Mechanical Engineering, Vishwakarma Institute of Information Technology, Kondhwa (Bk.) Pune, M.S. India
Abstract
In modern industry, the trend towards using dry and high speed machining has caused much greater heat dissipation in the
chip formation zone and for this reason thermal phenomena play a key role in tool wear and machinability of the materials.
For the improvement of cutting performance, the knowledge of temperature at the tool-work interface with good accuracy is
essential. In this paper, calibration set-up was designed and developed in order to establish a relationship between obtained
e.m.f. during machining and the cutting temperature. Also, the most simplest and economical technique of temperature
measurement i.e. tool-work thermocouple set-up was developed for the measurement of the cutting temperature in machining.
The performance of the setup is evaluated for the different material like EN19, EN31, mild steel, SS 304 and SAE 8620. The
results obtained experimentally confirmed that the set-up is having better accuracy and good repeatability.
Regression analysis is used for establishing the relationship between temperature and the generated voltage. Machining
tests are carried out for SAE 8620 material for various cutting speed and feed using uncoated tungsten carbide tool. Cutting
temperatures are predicted.
INTRODUCTION
WORKING PRINCIPLE
In manufacturing process, temperature has critical influence
on machining. It accelerates tool wear, shortening tool life. It causes It works on a principle of Seebeck effect. According to
the thermal deformation of the work-piece, cutting tool and machine Seebeck, when two different metals are heated at a common
tool, which degrades the machining accuracy; it affects the junction voltage exist between two ends of metals.
subsurface layers of machined parts through phase transformation,
thermally induced residual stresses an increase in thermally TECHNIQUES FOR ASSESING CUTTING TEMPERATURE
activated defects[1]. Abhang et al. [2] measured the tool-chip
interface temperature experimentally during turning of EN-31 steel
alloy with tungsten carbide inserts using a tool-work thermocouple
technique. Grzesik [4] dealt with experimental investigation into the
different factors which Influence the temperature which occur
at the coating/substrate–chip interface during machining of
medium carbon steel (AISI 1045) and an austenitic stainless steel
(AISI304). O'Sullivan et al. [6] demonstrated the use of embedded
thermocouples (in the work-piece) and the infrared thermal camera
to monitor the temperature during the process. To reduce
these defects, we developed a calibration setup on the basis of
Seebeck effect with the help of k-type thermocouple and
microcontroller. This setup helped us during calibration, resulted in
measuring the temperature during machining.
Materials used during testing for calibration setup
EN-19, EN-31, mild steel, SS 304, and SAE 8620.
*Corresponding Author Workpiece used
Srihari Prasad A The workpiece used during the experimentation is SAE 8620
Department of Mechanical Engineering, K.L.University, Vaddeswaram, Guntur, steel. The dimensions used are 80 mm in diameter and 300mm in
A.P., 522502., India length. The alloying elements of SAE 8620 steel are shown in table 1.
Email: srihari.anne@gmail.com
16 Srihari Prasad A et al.,
b)
Fig 2. Photographic view of work tool thermocouple. Fig 4.Block diagram of data acquisition system
World Journal of Science and Technology 2012, 2(4):15-19 17
The block diagram of the system is shown above. The system 2) After maintaining the proper contact, one end of the copper wire is
consist of the following elements, connected to the tool and chip material and other end was connected
• Temperature Sensor to the milli-voltmeter terminals. Then electric air heater was brought
• Microcontroller in contact with the junction point for heating the junction point.
• Display
• Real time clock 3) A standard alumel-chromel thermocouple wire was mounted at the
• Data storage Block junction of chip and insert. And it is connected to the temperature
indicator calibrated for the Type-K thermocouple wire.
i. Temperature Sensor
The temperature sensor is the device which is responsible to 4) After this, whole assembly was kept in the container insulated with
sense the temperature at the junction of machine tool and job. glass wool in order to reduce heat losses and electric heater is
turned on and junction point was heated gradually up to
ii. Microcontroller 750 °c and corresponding e.m.f. is recorded.
Microcontroller is the heart of the system that is controlling all
the processes. The controller PIC 18f4620 is used due to its 5) Graph of temperature v/s generated e.m.f. was plotted and
numerous advantages such as huge memory size, built in ADC, can calibration constant is found out by using regression analysis.
source high current, more power handling capacity, DIP package,
low cost etc. RESULTS AND DISCUSSIONS
EXPERIMENTAL PROCEDURE
SAE-8620
Table 3. Equations of lines for respective materials