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    Special Unit in Back-End Design - What Is The Role of Fill in Chip Design-CSDN Blog

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    Agnathavasi
    The document discusses various special physical units used in integrated circuit backend design, including: 1. FILLER units which connect diffusion layers and form tracks for power lines and wires. 2. Voltage clamping, diode, decoupling, clock buffer, delay buffer, well connection, voltage conversion, and isolation units which serve functions like maintaining signal integrity, preventing device failures, stabilizing power/ground voltages, distributing clock signals, adjusting timing, and isolating different voltage domains. 3. The document also briefly introduces the digital backend design process and concepts like filler cells, as well as the role of the innovus tool in layout design.

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    Special Unit in Back-End Design - What Is The Role of Fill in Chip Design-CSDN Blog

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    Agnathavasi
    17 views1 page
    The document discusses various special physical units used in integrated circuit backend design, including: 1. FILLER units which connect diffusion layers and form tracks for power lines and wires. 2. Voltage clamping, diode, decoupling, clock buffer, delay buffer, well connection, voltage conversion, and isolation units which serve functions like maintaining signal integrity, preventing device failures, stabilizing power/ground voltages, distributing clock signals, adjusting timing, and isolating different voltage domains. 3. The document also briefly introduces the digital backend design process and concepts like filler cells, as well as the role of the innovus tool in layout design.

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    Special Unit in Back-End Design_What is the Role of Fill in Chip Design-CSDN Blog

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    The document discusses various special physical units used in integrated circuit backend design, including: 1. FILLER units which connect diffusion layers and form tracks for power lines and wires. 2. Voltage clamping, diode, decoupling, clock buffer, delay buffer, well connection, voltage conversion, and isolation units which serve functions like maintaining signal integrity, preventing device failures, stabilizing power/ground voltages, distributing clock signals, adjusting timing, and isolating different voltage domains. 3. The document also briefly introduces the digital backend design process and concepts like filler cells, as well as the role of the innovus tool in layout design.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    17 views1 page

    Special Unit in Back-End Design - What Is The Role of Fill in Chip Design-CSDN Blog

    Uploaded by

    Agnathavasi
    The document discusses various special physical units used in integrated circuit backend design, including: 1. FILLER units which connect diffusion layers and form tracks for power lines and wires. 2. Voltage clamping, diode, decoupling, clock buffer, delay buffer, well connection, voltage conversion, and isolation units which serve functions like maintaining signal integrity, preventing device failures, stabilizing power/ground voltages, distributing clock signals, adjusting timing, and isolating different voltage domains. 3. The document also briefly introduces the digital backend design process and concepts like filler cells, as well as the role of the innovus tool in layout design.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    16/11/2023, 12:04 Special unit in back-end design_What is the role of fill in chip design-CSDN Blog

    Special units in back-end design


    VIP articles Zhang Jiaqi Published on 2015-06-07 16:41:44 1k reads Collection 6 Number of likes

    Special physical units:

    (1) The FILLER unit mainly connects the diffusion layers to meet DRC rules and physical design requirements, and forms a track for power lines an
    wires.

    (2) Some signal ports in the digital circuit of the voltage clamping unit, or ports of idle signals, need to be clamped at a fixed logic level. It can also p
    isolating ordinary signals and special signals.

    (3) In order to prevent the antenna effect of the chip from causing gate oxygen breakdown of the device during the processing of the diode unit, it is
    necessary to add reverse-biased diodes to the gate input end that violates the antenna rules after the wiring is completed. These diodes can accum
    layers during processing. The charge is released to the ground to avoid device failure. Diodes are additional units that have nothing to do with logic

    (4) Decoupling unit When a large number of units in the circuit flip over at the same time, the instantaneous charging and discharging current will inc
    causing the circuit's dynamic power supply voltage to decrease or the ground voltage to increase. Usually, a capacitor composed of a MOS tube is
    between the power line and the ground line. Its function is to supplement the current to the circuit when the transient current increases and the volta
    ensure the voltage stability between the power supply and the ground line, preventing the power line from voltage drop and increase in ground volta

    (5) A key issue in the design of the clock buffer unit sequential circuit is the design of the clock tree. The clock signal in the chip needs to be transmi
    sequential units in the circuit. In order to ensure that the time deviation of the clock edge arriving at each flip-flop is as small as possible, a clock buf
    be inserted to reduce the load and balance the delay.

    (6) The delay buffer unit functions similarly to the clock buffer unit. It is designed to adjust the delays of some paths in the circuit to meet the require
    sequential circuit. For example, in synchronous circuits, the method of adding a delay buffer unit is usually used to ensure that the reset signal reac
    flip-flop at the same time, so as to avoid confusion in the logical state of the system due to inconsistent reset signals.

    (7) The well connection unit is a purely physical unit without any logical functions and timing constraints. It is mainly used to limit the resistance betw
    power supply or ground and the substrate to reduce the latch-up effect.

    (8) Voltage conversion unit The voltage conversion unit is used to convert signal voltages between different voltage threshold modules of the chip in
    consumption, multi-supply and multi-voltage designs. Including three types of voltage conversion from low to high, high to low and bidirectional volta
    conversion. The unit should be placed at the boundary of the voltage domain.

    (9) The isolation unit is specially used for low power consumption design and is combined with the level conversion unit to form a unit with dual func

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