XB8608A

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One Cell Lithium-ion/Polymer Battery Protection IC

· Protection of Battery Cell Reverse
GENERAL DESCRIPTION Connection
The XB8608A Series product is a high · Integrate Advanced Power MOSFET
integration solution for lithium- with Equivalent of 19mΩ RSS(ON)
ion/polymer battery protection. · SOP8 Package
XB8608A contains advanced power
· Only One External Capacitor
MOSFET, high-accuracy voltage
Required
detection circuits and delay circuits.
XB8608A is put into an SOP8 package · Over-temperature Protection
and only one external component · Overcharge Current Protection
makes it an ideal solution in limited · Two-step Overcurrent Detection:
space of battery pack. -Overdischarge Current
XB8608A has all the protection functions -Load Short Circuiting
required in the battery application including · Charger Detection Function
overcharging, overdischarging, overcurrent · 0V Battery Charging Function
and load short circuiting protection etc. The - Delay Times are generated inside
accurate overcharging detection voltage · High-accuracy Voltage Detection
ensures safe and full utilization charging.
· Low Current Consumption
The low standby current drains little current
from the cell while in storage. - Operation Mode:3.9μ A typ.
The device is not only targeted for digital - Power-down Mode: 2.2μ A typ.
cellular phones, but also for any other · RoHS Compliant and Lead (Pb) Free
Li-Ion and Li-Poly battery-powered
information appliances requiring long-
term battery life. APPLICATIONS
One-Cell Lithium-ion Battery Pack
Lithium-Polymer Battery Pack
FEATURES
· Protection of Charger Reverse
Connection

Figure 1. Typical Application Circuit

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ORDERING INFORMATION
Overcharg Overcharge Overdischarge Overdischarge Overcurrent
PART Pack e Detection Release Detection Release Detection
Voltage Voltage Voltage Voltage Top Mark
NUMBER age Current
[VCU] (V) [VCL] (V) [VDL] (V) [VDR] (V) [IOV1] (A)
SOP
XB8608A 4.30 4.10 2.40 3.0 9
8 XB8608AYW (note)
Note: “YW” is manufacture date code, “Y” means the year, “W” means the week

PIN CONFIGURATION

Figure 2. PIN Configuration

PIN DESCRIPTION
XB8608A PIN
NUMBER PIN NAME PIN DESCRIPTION

The negative terminal of the battery pack. The internal FET switch
1,2,3 VM
connects this terminal to GND
4 NC No Connect
5,7,8 GND Ground, connect the negative terminal of the battery to this pin
6 VDD Power Supply

ABSOLUTE MAXIMUM RATINGS

(Note: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating
conditions for long periods may affect device reliability.)
PARAMETER VALUE UNIT
VDD input pin voltage -0.3 to 6 V
VM input pin voltage -6 to 10 V
Operating Ambient Temperature -40 to 85 °C

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Maximum Junction Temperature 125 °C
Storage Temperature -55 to 150 °C
Lead Temperature ( Soldering, 10 sec) 300 °C
Power Dissipation at T=25°C 0.625 W
Package Thermal Resistance (Junction to Ambient) θJA 250 °C/W
Package Thermal Resistance (Junction to Case) θJC 130 °C/W
ESD 2000 V

ELECTRICAL CHARACTERISTICS
Typicals and limits appearing in normal type apply for TA = 25oC, unless otherwise specified

Parameter Symbol Test Condition Min Typ Max Unit

Detection Voltage
4.25 4.30 4.35 V
Overcharge Detection Voltage VCU
4.05 4.10 4.15
Overcharge Release Voltage VCL V

2.3 2.4 2.5

Overdischarge Detection Voltage VDL V

2.9 3.0 3.1

Overdischarge Release Voltage VDR V

Detection Current
Overdischarge Current1 Detection *IIOV1 VDD=3.6V 9 A

Load Short-Circuiting *ISHORT VDD=3.6V 45 A

Detection
Current Consumption
Current Consumption in Normal IOPE VDD=3.6V 3.9 6 μA
Operation VM =0V
Current Consumption in power IPDN VDD=2.0V 2.2 3 μA
Down VM pin floating
VM Internal Resistance
Internal Resistance between *RVMD VDD=2.0V 300
VM and VDD VM pin floating kΩ
Internal Resistance between VM *RVMS VDD=3.6V 25
and GND VM=1.0V kΩ
FET on Resistance

Equivalent FET on Resistance *RSS(ON) VDD=3.6V IVM =1.0A 19 mΩ

Over Temperature Protection

Over Temperature Protection *TSHD+ 120
oC
Over Temperature Recovery Degree *TSHD- 100

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Detection Delay Time
Overcharge Voltage Detection *tCU 130 180 mS
Delay Time
Overdischarge Voltage Detection *tDL 40 60 mS
Delay Time
Overdischarge Current 1 Detection *tIOV1 VDD=3.6V 6 10 mS
Delay Time
Load Short-Circuiting Detection *tSHOR VDD=3.6V 140 240 uS
Delay Time T
Note:* ---The parameter is guaranteed by design.

Figure 3. Functional Block Diagram

FUNCTIONAL DESCRIPTION
The XB8608A monitors the voltage and Normal operating mode
current of a battery and protects it from If no exception condition is detected,
being damaged due to overcharge voltage, charging and discharging can be carried
overdischarge voltage, overdischarge out freely. This condition is called the
current, and short circuit conditions by normal operating mode.
disconnecting the battery from the load
Overcharge Condition
or charger. These functions are required in
order to operate the battery cell within When the battery voltage becomes higher
specified limits. than the overcharge detection voltage (VCU)
The device requires only one external during charging under normal condition
capacitor. The MOSFET is integrated and and the state continues for the overcharge
its RSS(ON) is as low as 19mΩ typical. detection delay time (tCU) or longer, the
XB8608A turns the charging control FET

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off to stop charging. This condition is called short-circuiting works regardless of the battery
the overcharge condition. The overcharge voltage.
condition is released in the following two
cases: Overdischarge Condition
1, When the battery voltage drops below When the battery voltage drops below the
the overcharge release voltage (VCL), the overdischarge detection voltage (VDL)
XB8608A turns the charging control FET during discharging under normal condition
on and returns to the normal condition. and it continues for the overdischarge
2, When a load is connected and detection delay time (tDL) or longer, the
discharging starts, the XB8608A turns the XB8608A turns the discharging control
charging control FET on and returns to the FET off and stops discharging. This
normal condition. The release mechanism condition is called overdischarge condition.
is as follows: the discharging current flows After the discharging control FET is turned
through an internal parasitic diode of the off, the VM pin is pulled up by the RVMD
charging FET immediately after a load is resistor
connected and discharging starts, and the between VM and VDD in XB8608A.
VM pin voltage increases about 0.7 V Meanwhile when VM is bigger than 1.5
(forward voltage of the diode) from the V (typ.) (the load short-circuiting detection
GND pin voltage momentarily. The voltage), the current of the chip is reduced
XB8608A detects this voltage and releases to the power-down current (IPDN). This
the overcharge condition. Consequently, in condition is called power-down condition.
the case that the battery voltage is equal to The VM and VDD pins are shorted by the
or lower than the overcharge detection RVMD resistor in the IC under the
voltage (VCU), the XB8608A returns to the overdischarge and power-down conditions.
normal condition immediately, but in the The power-down condition is released
case the battery voltage is higher than the when a charger is connected and the
overcharge detection voltage (VCU),the chip potential difference between VM and VDD
does not return to the normal condition becomes 1.3 V (typ.) or higher (load short-
until the battery voltage drops below the circuiting detection voltage). At this time,
overcharge detection voltage (VCU) even if the FET is still off. When the battery
the load is connected. In addition, if the VM voltage becomes the overdischarge
pin voltage is equal to or lower than the detection voltage (VDL) or higher (see note),
overcurrent detection voltage when a load the XB8608A turns the FET on and
is connected and discharging starts, the changes to the normal condition from the
chip does not return to the normal overdischarge condition.
condition. Remark If the VM pin voltage is no less than the
Remark If the battery is charged to a voltage higher charger detection voltage (VCHA), when the battery
than the overcharge detection voltage (VCU) and under overdischarge condition is connected to a
the battery voltage does not drops below the charger, the overdischarge condition is released
overcharge detection voltage (VCU) even when a (the discharging control FET is turned on) as usual,
heavy load, which causes an overcurrent, is provided that the battery voltage reaches the
connected, the overcurrent do not work until the overdischarge release voltage (VDU) or higher.
battery voltage drops below the overcharge
detection voltage (VCU). Since an actual battery has, Overcurrent Condition
however, an internal impedance of several dozens
When the discharging current becomes
of mΩ , and the battery voltage drops immediately
after a heavy load which causes an overcurrent is equal to or higher than a specified value
connected, the overcurrent work. Detection of load (the VM pin voltage is equal to or higher
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than the overcurrent detection voltage) overdischarge detection voltage and the
during discharging under normal condition overcharge detection delay time (tCU)
and the state continues for the overcurrent elapses.
detection delay time or longer, the Abnormal charge current detection is
XB8608A turns off the discharging control released when the voltage difference
FET to stop discharging. This condition is between VM pin and GND pin becomes
called overcurrent condition. (The lower than the charger detection voltage
overcurrent (VCHA) by separating the charger. Since the
includes overcurrent, or load short- 0 V battery charging function has higher
circuiting.) priority than the abnormal charge current
The VM and GND pins are shorted detection function, abnormal charge
internally by the RVMS resistor under the current may not be detected by the product
overcurrent condition. When a load is with the 0 V battery charging function while
connected, the VM pin voltage equals the the battery voltage is low.
VDD voltage due to the load.
The overcurrent condition returns to the Load Short-circuiting condition
normal condition when the load is released If voltage of VM pin is equal or below
and the impedance between the B+ and B- short circuiting protection voltage (VSHORT),
pins becomes higher than the automatic the XB8608A will stop discharging and
recoverable impedance. When the load is battery is disconnected from load. The
removed, the VM pin goes back to the maximum delay time to switch current off is
GND potential since the VM pin is shorted tSHORT. This status is released when voltage
the GND pin with the RVMS resistor. of VM pin is higher than short protection
Detecting that the VM pin potential is lower voltage (VSHORT), such as when
than the overcurrent detection voltage disconnecting the load.
(VIOV1), the IC returns to the normal
condition. Delay Circuits
The detection delay time for overdischarge
Abnormal Charge Current Detection
current 2 and load short-circuiting starts
If the VM pin voltage drops below the
when overdischarge current 1 is detected.
charger detection voltage (VCHA) during
charging under the normal condition and it As soon as overdischarge current 2 or load
continues for the overcharge detection short-circuiting is detected over detection
delay time (tCU) or longer, the XB8608A delay time for overdischarge current 2 or
turns the charging control FET off and load short- circuiting, the XB8608A stops
stops charging. This action is called discharging. When battery voltage falls
abnormal charge current detection. below overdischarge detection voltage due
Abnormal charge current detection works to overdischarge current, the XB8608A stop
when the discharging control FET is on discharging by overdischarge current
and the VM pin voltage drops below the detection. In this case the recovery of battery
charger detection voltage (VCHA). When an voltage is so slow that if battery voltage
abnormal charge current flows into a after overdischarge voltage detection delay
battery in the overdischarge condition, the time is still lower than overdischarge
XB8608A consequently turns the charging detection voltage, the XB8608A shifts to
control FET off and stops charging after
power-down.
the battery voltage becomes the
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is turned on to start charging. At this time,
the discharging control FET is off and the
charging current flows through the internal
parasitic diode in the discharging control
FET. If the battery voltage becomes equal
to or higher than the overdischarge release
voltage (VDU), the normal condition returns.

Note
(1) Some battery providers do not recommend
charging of completely discharged batteries. Please
Figure 4. Overcurrent delay time refer to battery providers before the selection of 0 V
battery charging function.
0V Battery Charging Function (1) (2) (3) (2) The 0V battery charging function has higher
priority than the abnormal charge current detection
This function enables the charging of a function. Consequently, a product with the 0 V
connected battery whose voltage is 0 V by battery charging function charges a battery and
self-discharge. When a charger having 0 V abnormal charge current cannot be detected during
battery start charging charger voltage the battery voltage is low (at most 1.8 V or lower).
(V0CHA) or higher is connected between B+ (3) When a battery is connected to the IC for the
first time, the IC may not enter the normal condition
and B- pins, the charging control FET gate in which discharging is possible. In this case, set
is fixed to VDD potential. When the voltage the VM pin voltage equal to the GND voltage (short
between the gate and the source of the the VM and GND pins or connect a charger) to
charging control FET becomes equal to or enter the normal condition.
higher than the turn-on voltage by the
charger voltage, the charging control FET

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TIMING CHART
1． Overcharge and overdischarge detection
VCU
VCU-VHC

Battery
voltage
VDL+VDH
VDL
ON

DISCHARGE

OFF
ON
CHARGE

OFF

VDD

VMVov1
VSS
VCHA

Charger connection
Load connection tCL
tCU

(1) (2) (1) (3) (1)

Figure5-1 Overcharge and Overdischarge Voltage Detection

2． Overdischarge current detection

VCU Battery
voltage
VCU-VHC

VDL+VDH
VDL

ON
DISCHARGE

OFF

VDD VM
VSHORT

Vov2
Vov1
VSS
Charger connection
Load connection

tIOV1 tIOV2 tSHORT

(1) (4) (1) (4) (1) (4) (1)

Figure5-2 Overdischarge Current Detection

Remark: (1) Normal condition (2) Overcharge voltage condition (3) Overdischarge voltage condition (4)
Overcurrent condition

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3． Charger Detection

VCU
VCU-VHC

Battery
voltage
VDL+VDH
VDL

ON

DISCHARGE

OFF

VDD

VM
VSS
VCHA
Charger connection
Load connection

tDL

(1) (3) (1)

Figure5-3 Charger Detection

4． Abnormal Charger Detection

VCU
VCU-VHC

Battery
voltage
VDL+VDH
VDL

ON
DISCHARGE

OFF
ON
CHARGE

OFF

VDD

VM
VSS
VCHA

Charger connection
Load connection
tCU
tDL
(1) (3) (1) (2) (1)

Figure5-4 Abnormal Charger Detection

Remark: (1) Normal condition (2) Overcharge voltage condition (3) Overdischarge voltage condition (4)
Overcurrent condition)

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TYPICAL APPLICATION
As shown in Figure 6, the bold line is the high density current path which must be kept as
short as possible. For thermal management, ensure that these trace widths are adequate. C1
is a decoupling capacitor which should be placed as close as possible to XB8608A.

Fig 6 XB8608A in a Typical Battery Protection Circuit

Precautions
• Pay attention to the operating conditions for input/output voltage and load current so that the
power loss in XB8608A does not exceed the power dissipation of the package.
• Do not apply an electrostatic discharge to this XB8608A that exceeds the performance
ratings of the built-in electrostatic protection circuit.

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PACKAGE OUTLINE(SOP8)

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DISCLAIMER

The information described herein is subject to change without notice.

Xysemi Inc. is not responsible for any problems caused by circuits or

diagrams described herein whose ralated industial properties,patents,or
other rights belong to third parties. The application circuit examples
explain typical applications of the products, and do not guarantee the
success of any specific mass-production design.

When the products described herein are regulated products subject to the
Wassenaar Arrangement or other arrangements, they may not be exported
without authorization from the appropriate governmental authority.

Use of the information described herein for other purposes and/or

reproduction or copying without express permission of Xysemi Inc. is
strictly prohibited.

The products described herein cannot be used as part of any device or

equipment affecting the human body,such as exercise equipment ,medical
equipment, security systems, gas equipment,or any aparatus installed in
airplanes and other vehicles,without prior written pemission of Xysemi Inc.

Although Xysemi Inc. exerts the greatest possible effort to ensure high
quality and reliability, the failure or malfunction of semiconductor may
occur. The use of these products should therefore give thorough
consideration to safty design,including redundancy, fire-prevention
measure and malfunction prevention, to prevent any accidents,fires,or
community damage that may ensue.

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