AH101
AH101
AH101
Applications
Mobile Infrastructure
1
10
CATV / DBS AH
Defense / Homeland Security
SOT-89 Package
Single +9 V Supply
Lead-free/RoHS-compliant SOT-89 Package
Ordering Information
Specifications
Operation of this device outside the parameter ranges Electrical specifications are measured at specified test
given above may cause permanent damage. conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: VDD=+9 V, TCASE = +25°C, 50 Ω system.
Parameter Conditions Min Typ Max Units
Operational Frequency Range 50 1500 MHz
Test Frequency 800 MHz
Gain 12 13.5 dB
Input Return Loss 20 dB
Output Return Loss 15 dB
Output P1dB +26.5 dBm
Output IP3 Pout= +8 dBm/tone, f= 10 MHz +43 +47 dBm
Noise Figure 3.5 dB
Supply Voltage, VDD +9 V
Operating Current Range 170 200 230 mA
Thermal Resistance, Rth
25 °C/W
(junction to base)
+9V
J4 J3
R1
ID=R1
R=0 Ohm
ID=C3
C=0.018 uF
C3
Q1
L2
C1 L1 C6
ID=L2
L=470 nH
size 0805
ID=C1 ID=L1 NET="AH101" ID=C6
C=0.018 uF R=0 Ohm
C=.018 uF
Notes:
1. The amplifier should be connected directly to a +9 V regulator; no dropping resistor is required.
2. If no DC signal is present at the input (pin 1), C1 can be removed. The gate (input pin) is internally grounded in the amplifier.
3. R1, C2, and L1 are used as placeholders for a different device on the same PCB layout. They are not needed for the AH101.
4. Component sizes are 0603 unless otherwise noted.
5. For higher frequencies of operation, use a lower value L2 inductor.
Pin Description
GND
1 2 3
RF IN GND RF OUT
Mechanical Information
Package Marking and Dimensions
101G
XXXX-X
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Email: sjcapplications.engineering@tqs.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the
information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information
contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the
entire risk associated with such information is entirely with the user. All information contained herein is subject to
change without notice. Customers should obtain and verify the latest relevant information before placing orders for
TriQuint products. The information contained herein or any use of such information does not grant, explicitly or
implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to
such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-
sustaining applications, or other applications where a failure would reasonably be expected to cause severe
personal injury or death.