HMC 190 B
HMC 190 B
v00.0213
DC - 1.0 GHz 23 30 dB
DC - 2.0 GHz 23 30 dB
Isolation
DC - 2.5 GHz 22 30 dB
DC - 3.0 GHz 19 25 dB
DC - 1.0 GHz 24 30 dB
DC - 2.0 GHz 20 24 dB
Return Loss
DC - 2.5 GHz 15 20 dB
DC - 3.0 GHz 10 16 dB
-1
ISOLATION (dB)
-20
-1.5
-30
-2
-40
-2.5
-3 -50
0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3
FREQUENCY (GHz) FREQUENCY (GHz)
Return Loss
0
-10
RETURN LOSS (dB)
-20
-30
-40
-50
0 0.5 1 1.5 2 2.5 3
FREQUENCY (GHz)
60
P1dB & P0.1dB (dBm)
30
IP3 (dBm)
58
25
56
20
54
15 52
3 4 5 6 7 8 9 3 4 5 6 7 8 9
0.1 dB at 900 MHz 0.1 dB at 1900 MHz 900 MHz 1900 MHz
1 dB at 900 MHz 1 dB at 1900 MHz
Truth Table
*Control Input Voltage Tolerances are ± 0.2 Vdc.
Caution: Do not operate in 1 dB compression at power levels above +31 dBm (Vctl = +5 Vdc) and do not “hot switch” power levels
greater than +20dBm (Vctl = +5 Vdc).
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3]
[1] H190B
HMC190BMS8 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1
XXXX
[2] H190B
HMC190BMS8E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Notes:
1. Set logic gate and switch Vdd = +3V to +5V and use HCT series logic to provide a TTL driver interface.
2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd of 5 to 8 Volts applied to the CMOS logic gates.
3. DC blocking capacitors are required for each RF port as shown. Capacitor value determines lowest frequency of operation.
4. Highest RF signal power capability is achieved with Vdd = +8V and A/B set to 0/+8V.