HMC 576 Chips
HMC 576 Chips
v00.0506
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 18 - 29 GHz OUTPUT
Electrical Specifi cations, TA = +25° C, Vdd1, Vdd2 = 5.0V, 3 dBm Drive Level
Parameter Min. Typ. Max. Units
Frequency Range, Input 9.0 - 14.5 GHz
Frequency Range, Output 18 - 29 GHz
Output Power 11 17 dBm
Fo Isolation (with respect to output level) 20 dBc
3Fo Isolation (with respect to output level) 17 dBc
Input Return Loss 10 dB
Output Return Loss 9 dB
SSB Phase Noise (100 kHz Offset) -132 dBc/Hz
Supply Current (Idd1 & Idd2) 82 mA
0 -30
17 18 19 20 21 22 23 24 25 26 27 28 29 30 17 18 19 20 21 22 23 24 25 26 27 28 29 30
OUTPUT FREQUENCY (GHz) OUTPUT FREQUENCY (GHz)
14
12 0
10 4.5V
5.0V
8 5.5V -10
6
Fo
4 -20 2Fo
3Fo
2
0 -30
17 18 19 20 21 22 23 24 25 26 27 28 29 30 17 18 19 20 21 22 23 24 25 26 27 28 29 30
OUTPUT FREQUENCY (GHz) OUTPUT FREQUENCY (GHz)
15
OUTPUT POWER (dBm)
10
-5 18GHz
24GHz
-10 29GHz
-15
-20
-10 -8 -6 -4 -2 0 2 4 6 8 10
INPUT POWER (dBm)
For price,
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders, please contact delivery,
Hittite and to place
Microwave orders: Analog Devices, Inc.,
Corporation:
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
20 Alpha Road, Chelmsford, MA 01824 Phone: Phone: 978-250-3343
781-329-4700Fax:
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. 978-250-3373
• Order online at www.analog.com 2 - 45
Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 1-800-ANALOG-D
Order On-line at www.hittite.com
HMC576
v00.0506
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 18 - 29 GHz OUTPUT
Input Return Loss vs. Temperature Output Return Loss vs. Temperature
2 0
+25C
0
-2
+85C
-55C -4
-6
-10
FREQUENCY MULTIPLIERS - ACTIVE - CHIP
-8
-15 -10
-12
-20
-14
-16 +25C
-25 +85C
-18 -55C
-30 -20
8 9 10 11 12 13 14 15 17 18 19 20 21 22 23 24 25 26 27 28 29
FREQUENCY (GHz) FREQUENCY (GHz)
For price,
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, delivery, and to place orders, please contact delivery,
Hittite and to place
Microwave orders: Analog Devices, Inc.,
Corporation:
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
2 - 46 20 Alpha Road, Chelmsford, MA 01824 Phone: Phone: 978-250-3343
781-329-4700Fax:
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. 978-250-3373
• Order online at www.analog.com
Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 1-800-ANALOG-D
Order On-line at www.hittite.com
HMC576
v00.0506
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 18 - 29 GHz OUTPUT
Outline Drawing
Pad Description
Assembly Diagram
Storage: All bare die are placed in either Waffle or Gel based ESD protective
containers, and then sealed in an ESD protective bag for shipment. Once the 0.150mm (0.005”) Thick
sealed ESD protective bag has been opened, all die should be stored in a dry Moly Tab
nitrogen environment. 0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD Figure 2.
strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The
mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a tool temperature
of 265 deg. C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 deg. C. DO NOT expose the
chip to a temperature greater than 320 deg. C for more than 20 seconds. No more than 3 seconds of scrubbing should be required
for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).