HMC 577
HMC 577
HMC 577
v03.0514
16 5
14 +25C 0
+85C
12 -40C -4 dBm 0 dBm 2 dBm
-5
10 -6 dBm
-2 dBm
8 -10
4 dBm
6 -15
25 26 27 28 29 30 31 32 33 25 26 27 28 29 30 31 32 33
OUTPUT FREQUENCY (GHz) OUTPUT FREQUENCY (GHz)
20
0 Fo
18 2Fo
-10 3Fo
16
-20
14
-30
12 Vdd=4.5V
Vdd=5.0V -40
10 Vdd=5.5V
8 -50
6 -60
25 26 27 28 29 30 31 32 33 25 26 27 28 29 30 31 32 33
OUTPUT FREQUENCY (GHz) FREQUENCY (GHz)
20
OUTPUT POWER (dBm)
15
10
5 13.5GHz
15GHz
0 16.5GHz
-5
-10
-15
-10 -8 -6 -4 -2 0 2 4 6 8 10
INPUT POWER (dBm)
Input Return Loss vs. Temperature Output Return Loss vs. Temperature
0 0
-2
FREQ. MULTIPLIERS - ACTIVE - SMT
-6
+25C
-10 +85C -8
-40C
-10
-15 -12 +25C
+85C
-14 -40C
-20 -16
-18
-25 -20
12.5 13 13.5 14 14.5 15 15.5 16 16.5 25 26 27 28 29 30 31 32 33
FREQUENCY (GHz) FREQUENCY (GHz)
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER
50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2]
[1] H577
HMC577LC4B Alumina, White Gold over Nickel MSL3
XXXX
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Pin Description
Pin Number Function Description Interface Schematic
FREQ. MULTIPLIERS - ACTIVE - SMT
Application Circuit
Component Value
C1 100 pF
C2 1,000 pF
C3 2.2 µF
Evaluation PCB