HMC 527
HMC 527
HMC 527
v03.0514
30
-10
+25C
20 +85C
-40C
+25 C
-15 +85 C
-40 C 10
-20 0
8 9 10 11 12 13 14 8 9 10 11 12 13 14
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
-5
CONVERSION GAIN (dB)
-5
RETURN LOSS (dB)
-10
-10
-15
+17dBm
-15 +19dBm
-20 RF
+21dBm LO
-20 -25
8 9 10 11 12 13 14 8 9 10 11 12 13 14
RF FREQUENCY (GHz) FREQUENCY (GHz)
22 30
20
25
P1dB (dBm)
IP3 (dBm)
18
20
16
+25C
+85C 15
-55C LO = +17 dBm
14
LO = +19 dBm
LO = +21 dBm
12 10
10 5
8 9 10 11 12 13 14 8 9 10 11 12 13 14
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
Isolations IF Bandwidth*
-10 0
MIXERS - I/Q, IRMS & RECEIVERS - SMT
RETURN LOSS
CONVERSION GAIN
-20
LO/IF2 -5
ISOLATION (dB)
RESPONSE (dB)
-30
LO/IF1 -10
RF/IF1
-40
LO/RF
-15
-50 RF/IF2
-60 -20
8 9 10 11 12 13 14 0.5 1 1.5 2 2.5 3 3.5
RF FREQUENCY (GHz) IF FREQUENCY (GHz)
10
PHASE BALANCE (degrees)
AMPLITUDE BALANCE (dB)
LO = +17dBm LO = +17dBm
2 LO = +19dBm LO = +19dBm
LO = +21dBm LO = +21dBm
5
0 0
-5
-2
-10
-4 -15
8 9 10 11 12 13 14 8 9 10 11 12 13 14
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
-10
SIDEBAND REJECTION (dBc)
LO = +17 dBm
CONVERSION GAIN (dB)
-5 LO = +19 dBm
LO = +21 dBm
-20
-10 -30
-40
+17 dBm
-15 +19 dBm
+21 dBm -50
-20 -60
8 9 10 11 12 13 14 8 9 10 11 12 13 14
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
Outline Drawing
MIXERS - I/Q, IRMS & RECEIVERS - SMT
NOTES:
1.. PACKAGE BODY MATERIAL: ALUMINA
2.. LEAD AND GROUND PADDLE PLATING: 30 - 80 MICROINCHES
GOLD OVER 50 MICROINCHES MINIMUM NICKLE
3.. DIMENSIONS ARE IN INCHES [MILLIMETERS]
4.. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5.. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM
6.. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2]
[1] H527
HMC527LC4 Alumina, White Gold over Nickel MSL3
XXXX
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Pin Descriptions
Pin Number Function Description Interface Schematic
Evaluation PCB
MIXERS - I/Q, IRMS & RECEIVERS - SMT
Item Description The circuit board used in the application should use
J1, J2 PCB Mount K RF Connector, SRI RF circuit design techniques. Signal lines should
J3 - J4 PCB Mount SMA Connector, Johnson have 50 Ohm impedance while the package ground
U1 HMC527LC4 leads and exposed paddle should be connected
PCB [2] 109996 Evaluation Board directly to the ground plane similar to that shown.
[1] Reference this number when ordering complete evaluation PCB
A sufficient number of via holes should be used to
[2] Circuit Board Material: Rogers 4350
connect the top and bottom ground planes. The
evaluation circuit board shown is available from Hit-
tite upon request.