HMC 514
HMC 514
HMC 514
v03.0811
MMIC VCO w/ HALF FREQUENCY OUTPUT
& DIVIDE-BY-4, 11.17 - 12.02 GHz
Frequency vs. Tuning Voltage, T= 25°C Frequency vs. Tuning Voltage, Vcc= +3V
12.6 12.6
OUTPUT FREQUENCY (GHz)
11.8 11.8
11.4 11.4
Vcc=2.75V
+25 C
11 Vcc=3.0V 11 +85 C
Vcc=3.25V -40 C
10.6 10.6
10.2 10.2
0 1 2 3 4 5 6 7 8 9 10 11 12 13 0 1 2 3 4 5 6 7 8 9 10 11 12 13
TUNING VOLTAGE (VOLTS) TUNING VOLTAGE (VOLTS)
Output Power
Sensitivity vs. Tuning Voltage, Vcc= +3V vs. Tuning Voltage, Vcc= +3V
600 15
500
12
+25 C
8
SENSITIVITY (MHz/VOLT)
+85 C
OUTPUT POWER (dBm)
-40 C
+25 C
400 +85 C
-40 C 9
300
3
100
0 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 0 1 2 3 4 5 6 7 8 9 10 11 12 13
TUNING VOLTAGE (VOLTS) TUNING VOLTAGE (VOLTS)
SSB Phase Noise vs. Tuning Voltage SSB Phase Noise @ Vtune= +5V
-70 0
-20
SSB PHASE NOISE (dBc/Hz)
-80
-40 +25 C
+85 C
-60 -40 C
-90
-80
10kHz offset
-100 100kHz offset -100
-120
-110
-140
-120 -160
3 4 5 6 7
1 2 3 4 5 6 7 8 9 10 11 12 13 10 10 10 10 10
TUNING VOLTAGE (VOLTS) OFFSET FREQUENCY (Hz)
6.1
12
+25 C 6
5.5 +85 C
-40 C
+25 C
3 +85 C
5.3 -40 C
5.1 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 0 1 2 3 4 5 6 7 8 9 10 11 12 13
TUNING VOLTAGE (VOLTS) TUNING VOLTAGE (VOLTS)
8
OUTPUT FREQUENCY (GHz)
3.05 +25 C
-3
OUTPUT POWER (dBm)
+85 C
3 -40 C
2.95
2.9 -6
2.85
VCOS with Fo/2 OUTPUT - SMT
2.8 -9
2.75
+25 C
2.7 +85 C
-40 C -12
2.65
2.6
2.55 -15
0 1 2 3 4 5 6 7 8 9 10 11 12 13 0 1 2 3 4 5 6 7 8 9 10 11 12 13
TUNING VOLTAGE (VOLTS) TUNING VOLTAGE (VOLTS)
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
8
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3]
[1] H514
HMC514LP5 Low Stress Injection Molded Plastic Sn/Pb Solder MSL3
XXXX
[2] H514
HMC514LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Pin Descriptions
Pin Number Function Description Interface Schematic
1 - 3, 7 - 10, 13
No Connection. These pins may be connected to RF/
- 18, 20, N/C
DC ground. Performance will not be affected.
22 - 28, 30 - 32
Pin Descriptions
Pin Number Function Description Interface Schematic
8
dependent on drive source impedance.
Evaluation PCB
Item Description The circuit board used in the application should use
J1 - J4 PCB Mount SMA RF Connector RF circuit design techniques. Signal lines should
J5 - J6 2 mm DC Header have 50 Ohm impedance while the package ground
C1 - C2 100 pF Capacitor, 0402 Pkg. leads and backside ground paddle should be con-
C3 1,000 pF Capacitor, 0402 Pkg. nected directly to the ground plane similar to that
C4 - C5 2.2 µF Tantalum Capacitor
shown. A sufficient number of via holes should be
U1 HMC514LP5 / HMC514LP5E VCO
used to connect the top and bottom ground planes.
PCB [2] 110225 Eval Board
The evaluation circuit board shown is available from
[1] Reference this number when ordering complete evaluation PCB
Hittite upon request.
[2] Circuit Board Material: Rogers 4350