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F23BDSM25 W1
F23BDSM25 W1
Product Specification
IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth v2.1+EDR/Bluetooth 3.0/3.0+HS/4.0
Customer
Customer’s Part NO
CONTENTS
0 REVESION HISTORY....................................................................................................................... 3
0.1 MODEL NO DEFINITION ............................................................................................................... 3
1 INTRODUCTIONS ............................................................................................................................ 4
1.1 OVERVEIW................................................................................................................................ 4
1.2 PRODUCT FEATURES ............................................................................................................. 4
2 GENERAL SPECIFICATION............................................................................................................. 5
2.1 WIFI RF SPECIFICATION ......................................................................................................... 5
2.2 POWER CONSUMPTION ......................................................................................................... 6
3 MECHANICAL SPECIFICATION ...................................................................................................... 6
3.1 OUTLINE DRAWING ................................................................................................................. 6
3.2 RECOMMENDED FOOTPRINT ................................................................................................ 6
3.3 PIN DEFINITION .......................................................................................................................... 7
4 ENVIRONMENTAL REQUIREMENTS ............................................................................................. 9
4.1 OPERATING TEMPRETURE ...................................................................................................... 9
4.2 RECOMMENDED REFLOW PROFILE ....................................................................................... 9
4.3 NOTICE ........................................................................................................................................ 9
5 PACKING INFORMATION .............................................................................................................. 10
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FN-LINK TECHNOLOGY LIMITED
0. Revision History
Example: F23BDSM25-W2
F 23B D S M 2 5-W 2
Control NO: 0, 1, 2E.
IC Version: VD
Manufacturer: FN-LINK
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FN-LINK TECHNOLOGY LIMITED
1. Introduction
F23BDSM25-W1 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array)
footprint, board size is 12mm*12mm with module thickness of 1.8mm. It can be easily manufactured on
SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It
provides SDIO interface for WiFi to connect with host processor and high speed UART interface for BT.
It also has a PCM interface for audio data transmission with direct link to external audio codec via BT
controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO
technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
F23BSSM25-W1 used Realtek RTL8723BS, a highly integrated WiFi/BT single chip based on
advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into a chip, such as
SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components
remained on PCB. The general block diagram for the module is shown in Figure 1
Figure 1
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2. GENERAL SPECIFICATION
2.1 WiFi RF Specifications
Main Chipset Realtek RTL8723BS-VD
Operating Frequency 2.400~2.4835GHz
Standards WiFi:
IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
802.11e, IEEE 802.11h, IEEE 802.11i
BT:
V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0
Modulation WiFi:
802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps),
802.11 g/n: OFDM
BT:
8DPSK, π/4 DQPSK, GFSK
PHY Data rates WiFi:
802.11b: 11,5.5,2,1 Mbps
802.11g: 54,48,36,24,18,12,9,6 Mbps
802.11n: up to 150Mbps
BT:
1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
6,9,12,18,24,36,48,54 Mbps for High Speed
Transmit Output WiFi:
Power 802.11b@11Mbps 16dBm
(Tolerance: ±2.0dBm) 802.11g@6Mbps 15dBm
802.11g@54Mbps 14dBm
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OS Supported Android /Linux/Windows8.1
Host Interface WiFi: SDIO
BT: UART
Operating Voltage 3.5~ 5Vdc I/O supply voltage
Dimension Typical L12.0*W12.0*H1.8mm
2.2 Power Consumption
Power Consumption WiFi only:
(Typical by using TX Mode: (Throughput mode) 170mA (MCS7/BW40/13dBm)
SWR) RX Mode: (Throughput mode) 130mA (MCS7/BW40/-60dBm)
Associated Idle power saving with DTIM=3 2.1mA
Unassociated Idle: 0.1mA
RF disable Mode: 0.1mA
3. Mechanical Specification
3.1 Outline Drawing (Unit: ±0.15mm)
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FN-LINK TECHNOLOGY LIMITED
47
46
45
44
43
42
41
40
39
38
37
36
35
34
CON1
TP3(NC)
TP2(NC)
TP1(NC)
NC
NC
UART_CTS_N
UART_RXD
UART_TXD
GND
NC
UART_RTS_N
BT_XTAL_OUT
BT_XTAL_IN
BT_RST_N
1 33
GND GND
2 32
WL_BT_ANT NC
3 31
GND GND
4 30
NC TCXO_IN
5 29
NC WL_VDD_TXCO
6 28
BT_WAKE PCM_SY NC
7 27
BT_HOST_WAKE PCM_IN
8 26
NC PCM_CLK
9 25
VBAT PCM_OUT
10 24
WL_XTAL_IN LPO
11 23
SDIO_DATA_CMD
WL_XTAL_OUT VIN_LDO
WL_HOST_WAKE
SDIO_DATA_CLK
VIN_LDO_OUT
SDIO_DATA_2
SDIO_DATA_3
SDIO_DATA_0
SDIO_DATA_1
WL_REG_ON
VDDIO
GND
8723BS_TFBGA
12
13
14
15
16
17
18
19
20
21
22
PIN Assignment
Pin # Name Description
1 GND Ground connection
2 WL_BT_ANT RF I/O port
3 GND Ground connection
4 NC Floating (NC)
5 NC Floating (NC)
6 BT_WAKE Wake-up BT
7 BT_HOST_WAKE BT wake-up BT
8 NC Floating (NC)
9 VBAT 3.5V ~ 5V Main power voltage source input
10 WL_XTAL_IN Floating (NC)
11 WL_XTAL_OUT Floating (NC)
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12 WL_REG_ON Internal regulators power enable/disable
13 WL_HOST_WAKE WLAN wake-up HOST
14 SDIO_DATA_2 SDIO data line 2
15 SDIO_DATA_3 SDIO data line 3
16 SDIO_DATA_CMD SDIO command line
17 SDIO_DATA_CLK SDIO clock line
18 SDIO_DATA_0 SDIO data line 0
19 SDIO_DATA_1 SDIO data line 1
20 GND Ground
21 VIN_LDO_OUT Floating(NC)
22 VDDIO 1.8~3.3V I/O Voltage supply input
23 VIN_LDO Floating (NC)
24 LPO External Low Power Clock input
25 PCM_OUT PCM Output
26 PCM_CLK PCM Clock
27 PCM_IN PCM Input
28 PCM_SYNC PCM Sync
29 WL_VDD_TXCO Floating (NC)
30 TCXO_IN Floating (NC)
31 GND Ground
32 NC Floating (NC)
33 GND Ground
34 BT_RST_N BT Reset IN
35 NC Floating (NC)
36 GND Ground
37 BT_XTAL_IN Floating (NC)
38 BT_XTAL_OUT Floating (NC)
39 NC Floating (NC)
40 NC Floating (NC)
41 UART_RTS_N UART RTS
42 UART_TXD UART Output
43 UART_RXD UART Input
44 UART_CTS_N UART CTS
45~47 TP1~TP3 Test point1~3 Floating (NC)
Total 47PINS 12.0*12.0*1.8mm LGA Package
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FN-LINK TECHNOLOGY LIMITED
4. Environmental Requirements
4.1 Conditions
Operating Condition:
Operating Temperature: 0°C to +55 °C
Relative Humidity: 10-90% (non-condensing)
Storage Condition:
Temperature: -40°C to +80°C (non-operating)
Relative Humidity: 5-90% (non-condensing)
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage
environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40%
(pink), or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: ≦ 30% ℃, ≦ 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ℃, 8 hours.
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3.) After baking, put the right amount of desiccant to seal packages.
5. Package
A roll of 2000pcs
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5 4 3 2 1
BT_UART [SDIO]
VIO_SDIO/VIO_IO
HOST_UART_RTS_OUT
HOST_UART_OUT
HOST_UART_CTS
HOST_UART_IN
接芯片io口控制
D D
R21
100K
T7 IC
SD_D2 9
主机与模块连接方式 DAT2
SD_D3 1 DAT3
UART_OUT
UART_CTS
UART_RTS
SD_CMD
UART_IN
2 CMD
3 VSS1
VD33 4 VDD
SD_CLK 5 CLK
47
46
45
44
43
42
41
40
39
38
37
36
35
34
CON3 6 VSS2
ANT1
BT_XTAL_OUT
TP3(NC)
TP2(NC)
TP1(NC)
UART_CTS_N
UART_RXD
UART_TXD
UART_RTS_N
NC
NC
BT_XTAL_IN
GND
NC
BT_RST_N
FPC SD_D0 7 DAT0
SD_D1 8 DAT1
G
1 GND GND 33 主控
L4 C35
2
2.2nH 10pF
2 WL_BT_ANT NC 32
C C
3 GND GND 31
C17 C18
1pF 1.2pF T6
4 30 26MHz_IN 外部时钟输入,默认不接
NC TCXO_IN
5 NC WL_VDD_TXCO 29
T1
BT_HOST_WAKE_DEV 6 28 PCM_SYNC
BT_WAKE PCM_SYNC
T2
BT_DEV_WAKE_HOST 7 27 PCM_IN
BT_HOST_WAKE PCM_IN
PCM_CLK
BT_PCM VDD33
C20 8 26
10uF NC PCM_CLK
R14
3.3v PCM_OUT 330
9 VBAT PCM_OUT 25
T5
“F23BDSM23-xx” 为3.3v供电 10 WL_XTAL_IN LPO 24 SUSCLK_IN 此脚悬空
D1
RED
“F23BDSM25-xx” 为li电池供电 11 23
SDIO_DATA_CMD
WL_XTAL_OUT VIN_LDO
WL_HOST_WAKE
SDIO_DATA_CLK
VIN_LDO_OUT
SDIO_DATA_2
SDIO_DATA_3
SDIO_DATA_0
SDIO_DATA_1
请认准模块型号
WL_REG_ON
B B
VDDIO
GND
R2
8723BS_TFBGA NC
12
13
14
15
16
17
18
19
20
21
22
3.3v VBAT_IN
R3
WL_DEV_WAKE_HOST
VIO_SDIO/VIO_IO
0R 三组电压输入,可选择
R6
WL_DIS#
SD_D2
SD_D3
SD_CMD
SD_CLK
SD_D0
SD_D1
VIO_SDIO/VIO_IO VDD33
T3 0R C19
C30 C31 C32 C27 C28 C29 10uF
R9
5.6pF 5.6pF 5.6pF 5.6pF 5.6pF 5.6pF
R22 VDD18
100K
NP
T4
VIO_SDIO/VIO_IO
SMT 5.6pF to
接芯片io口控制 suppress SDIO
A
Rx spur. A
RTL8723BS_MB
Realtek Confidential
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