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GWF-7M02 Spec V1.0

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150Mbps

IEEE 802.11 b/g/n WiFi Module

Product Specifications

Model: GWF-7M02

Version: 1.0(Draft)
2013-04-09

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1. Introduction
The GWF-7M02 is a WLAN PCB module with 7-pin connector supporting USB2.0 interface, it supports
IEEE 802.11b/g/n standards. This module operates in 2.4GHz ISM frequency band with low power
consumption; it applies a highly integrated MAC/BBP and RF single chip MT7601U with 150Mbps PHY rate
supporting.
The small form factor and low cost design provide excellent performance for the wireless connectivity, it is
ideal for confine space application.

2. Features
z 20MHz/40MHz bandwidth support. 1T1R mode

z 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 24, 36, 48, 54Mbps ;

z 802.11n: Support PHY rate up to 150Mbps.

z Security support for WEP 64/128, WPA,WPA2, TKIP,AES

3. Application
z Portable Smart Device: Mobile, Tablet, Mini-PC, etc.

z Others: TV, Meida player, Setup box, IP cam, Camcorder etc.

4. Product Description
4.1. Block Diagram

Figure 1 With external antenna used

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Figure 2 With onboard PCB antenna used

4.2. Specification:
General
Main Chipset MediaTek MT7601U
Device Interface USB 2.0, 7 PCB Semi-holes
RF output External antenna Via I-PEX MHF receptacle or Built-in On Board
Dimensions 28x14mm
Weight 1.75g
WLAN
Operation Frequency 2412~2483.5MHz, ISM band (Depends on country region)
Operation Channel Ch1~14 (Depends on country region)
Protocol 802.11b: CCK, QPSK, BPSK, 802.11g/n: OFDM
Security 64/128 WEP, WPA/WPA2, WFA, WPS2.0, WAPI
QoS: WFA,WMM,WMM PS;
Others
WiFi Direct
RF Characteristics (Typical)
Antenna External antenna Via I-PEX MHF receptacle
802.11b (CCK) 11Mbps: 18+/-1dBm
802.11g (OFDM) 54Mbps: 16+/-1dBm
Transmit Power
802.11n (HT20@MCS7), 14+/-1dBm
802.11n (HT40@MCS7),14+/-1dBm
Receive Sensitivity 802.11b: -88+/-1dBm;802.11g: -72+/-1dBm

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802.11n (HT20), -70+/-1dBm; 802.11n (HT40), -68+/-1dBm
DC Characteristic (Typical)
Operating Voltage 3.3V or 5.0V DC +/-5%
Normal operation (Average) <80mA
Sleep mode 1.5 mA
Current consumption TX HT40,MCS7@16dBm 210 mA
TX CCK 250 mA
RX Listen 6 mA

4.3. Mechanical Information


4.3.1. OUTLINE (Pictures are for reference only)

4.3.2. Dimensions and Pinout:

A. Semi-holes with 2.0mm pitch (external RF antenna via I-PEX MHF receptacle)

I-PEX
receptacle

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B. Semi-holes with 2.0mm pitch (onboard PCB antenna).

C. Top side 7-pin pin header with 2.0mm pitch

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D. Bottom side 7-pin pin header with 2.0mm pitch

E. 90 degree 7-pin pin header with 2.0mm pitch

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4.3.3. Pin Definition:

Pin Name Description

1 TX RF ON/OFF control; low level activated to OFF


2 VCC 5.0VDC or 3.3VDC, +/-5%
3 UD- USB data-
4 UD+ USB data+
5 GND Ground

6 LED Indicate module working status


External to activate WPS function. Low level
7 WPS
activated
Notes:
1. TX terminal must be pulled up with an external resistor (4.7K ohm) to high level.
2. LED terminal output 3.3V LED blink signal. To limit LED current, a series 330 ohm or
other value resistor should be connected.
3. WPS terminal is internally pulled up with an onboard 4.7K ohm resistor to 3.3VDC.

4.4. Software and system Information

Operation System Driver

Linux 2.4/2.6 Draft

Android 4.1 ready

Windows XP/Vista/7/8 ready

Mac OS X 10.3~10.8 Not ready

5. Agency Approval

Agency Approval

FCC Part15 Not ready

CE Not ready

RoHS √

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6. Environment

6.1. Temperature
z Operating Temperature
Continuous reliable operation in ambient temperature: -10ºC to +60ºC.
z Storage Temperature
The product is not damaged or degraded when keeping in -20ºC to +85ºC.

6.2. Humidity
z Operating Humidity Conditions
The product should be capable of continuous reliable operation when subjected to relative
humidity in the range of 20% to 80% (non-condensing) .
z Non-Operating Humidity Conditions (including warehouse)
The product should not be damaged or degraded when kept in the place (where relative
humidity range is in the range of 20% to 80%) for 36 hours.

7. Design Concerns:

7.1. Power supply:


1) The input power can be 5.0VDC or 3.3VDC, please mentioned it when place an
order.
2) The operation current of 5.0VDC power input will be different with that of 3.3V power
input. The external power shall be well designed with enough capacity.
3) Should 3.3VDC power be selected, please be sure it’s clean with low ripple;
otherwise, the EMI or RF performance might be deteriorated.
7.2. Using pin headers:
1) The pins can be less than 7 pins, but the VCC, UD-, UD+, GND must be applied for
USB interface communication.
2) Should the pin header connection be applied, please still keep enough metallic clear
space around the antenna end of the module, this gives better antenna performance
7.3. Using semi-holes:
1) When the module is designed to be soldered on a main PCB board directly, the area

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under the antenna end of the module should be keep clear of metallic components,
connectors, vias, traces and other materials that can interfere with the radio signal.
2) The module is not recommended using reflow oven process, hand soldering is
suggested.

7.4. Footprint design reference:


The following drawing shows a recommended footprint which can be a reference design for a main
PCB layout.

7.5. Soldering requirement:


The module is not recommended using reflow oven process, hand soldering is suggested.

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If reflow oven process is selected, please keep good control on the soldering process. Otherwise
the flow air might blow components removing. A reference flow chaw likes as following:

Notes: user should adjust setting of reflow oven to get best soldering quality

8. Disclaimer
THESE MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY
KIND, EITHER EXPRESS OR IMPLIED , INCLUDING BUT NOT LIMITED TO, THE IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR
NON-INFRINGEMENT.

We uses reasonable efforts to include accurate and up-to-date information on this document; it does not,
however, make any representations as to its accuracy or completeness of the information, text, graphics,
links or other items contained within these materials. Your use of this Document is at your own risk. Ogemray,
its suppliers, and other parties involved in creating and delivering this Document’s contents shall not be liable
for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or
lost profits.

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