WP937EGW

T-1(3mm) Bi-Color Indicator Lamp

DESCRIPTIONS PACKAGE DIMENSIONS

z The High Efficiency Red source color devices are
made with Gallium Arsenide Phosphide on Gallium
Phosphide Orange Light Emitting Diode
z The Green source color devices are made with
Gallium Phosphide Green Light Emitting Diode

FEATURES
z Uniform light output
z Low power consumption
z Long life - solid state reliability
z RoHS compliant

APPLICATIONS
z Status indicator
z Illuminator
z Signage applications Red Green
z Decorative and entertainment lighting
z Commercial and residential architectural lighting

Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.

SELECTION GUIDE
Iv (mcd) @ 20mA [2] Viewing Angle [1]
Emitting Color
Part Number Lens Type
(Material)
Min. Typ. 2θ1/2

6 14
■ High Efficiency Red
(GaAsP/GaP) *4 *10
WP937EGW White Diffused 60°
6 14
■ Green (GaP)
*6 *14

Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.

© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1535 / 1101008548 Rev No: V.9A Date: 04/11/2019 Page 1 / 5
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ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Value
Parameter Symbol Emitting Color Unit
Typ. Max.
High Efficiency Red 627
Wavelength at Peak Emission IF = 20mA λpeak - nm
Green 565
High Efficiency Red 617
Dominant Wavelength IF = 20mA λdom [1] - nm
Green 568
Spectral Bandwidth at 50% Φ REL MAX High Efficiency Red 45
Δλ - nm
IF = 20mA Green 30
High Efficiency Red 15
Capacitance C - pF
Green 15
High Efficiency Red 2 2.5
Forward Voltage IF = 20mA VF [2] V
Green 2.2 2.5
Temperature Coefficient of λpeak High Efficiency Red 0.13
TCλpeak - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C Green 0.1
Temperature Coefficient of λdom High Efficiency Red 0.06
TCλdom - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C Green 0.06
Temperature Coefficient of VF High Efficiency Red -1.9
TCV - mV/°C
IF = 20mA, -10°C ≤ T ≤ 85°C Green -2
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Value
Parameter Symbol Unit
High Efficiency Red Green

Power Dissipation PD 75 62.5 mW

Junction Temperature Tj 125 110 °C

Operating Temperature Top -40 to +85 °C

Storage Temperature Tstg -40 to +85 °C

DC Forward Current IF 30 25 mA

Peak Forward Current IFM [1] 160 140 mA

Electrostatic Discharge Threshold (HBM) - 8000 8000 V

Thermal Resistance (Junction / Ambient) Rth JA [2] 600 500 °C/W

Thermal Resistance (Junction / Solder point) Rth JS [2] 350 275 °C/W

Lead Solder Temperature [3] 260°C For 3 Seconds

Lead Solder Temperature [4] 260°C For 5 Seconds

Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1535 / 1101008548 Rev No: V.9A Date: 04/11/2019 Page 2 / 5
 WP937EGW
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION
Green Red
100% -15° 0°
15°
Ta = 25 °C Ta = 25 °C
-30° 30°
Relative Intensity (a. u.)

80%
-45° 45°
60%

-60° 60°
40%

20%
-75° 75°

0%
350 400 450 500 550 600 650 700 750 800 90°
-90°
Wavelength (nm) 1.0 0.5 0.0 0.5 1.0

HIGH EFFICIENCY RED

Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature

50 2.5 50 2.5

Permissible forward current (mA)

Luminous intensity normalised

Luminous intensity normalised

Ta = 25 °C Ta = 25 °C
40 2.0 40 2.0
Forward current (mA)

at Ta = 25 °C
30 1.5 30 1.5
at 20mA

20 1.0 20 1.0

10 0.5 10 0.5

0 0.0 0 0.0
1.5 1.7 1.9 2.1 2.3 2.5 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)

GREEN
Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature

50 2.5 50 2.5
Permissible forward current (mA)
Luminous intensity normalised

Luminous intensity normalised

Ta = 25 °C Ta = 25 °C
40 2.0 40 2.0
Forward current (mA)

at Ta = 25 °C
at 20 mA

30 1.5 30 1.5

20 1.0 20 1.0

10 0.5 10 0.5

0 0.0 0 0.0
1.7 1.9 2.1 2.3 2.5 2.7 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)
RECOMMENDED WAVE SOLDERING PROFILE

Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.

© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1535 / 1101008548 Rev No: V.9A Date: 04/11/2019 Page 3 / 5
 WP937EGW
PACKING & LABEL SPECIFICATIONS

PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

LED Mounting Method

1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
" ○" Correct mounting method "x " Incorrect mounting method

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.

3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend (Fig. 3 ,Fig. 4).
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB. (Fig. 5 )

© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1535 / 1101008548 Rev No: V.9A Date: 04/11/2019 Page 4 / 5
 WP937EGW
Lead Forming Procedures
1. Do not bend the leads more than twice. (Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering. (Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.

PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes

© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1535 / 1101008548 Rev No: V.9A Date: 04/11/2019 Page 5 / 5
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