TA8409S
TA8409S
TA8409S
TA8409S/SG, TA8409F/FG
Bridge Driver
Features
z Modes available (CW/CCW/STOP/BRAKE)
z Output current up to 0.4 A (AVE) and 1.0 A (PEAK)
z Wide range of operating voltages
VCC (opr.) = 4.5 to 20 V
VS (opr.) = 0 to 20 V
Vref (opr.) = 0 to 20 V (Vref ≤ VS) TA8409F/FG
z Built-in thermal shutdown
z Standby mode available (STOP MODE)
z Hysteresis for all inputs.
Weight
SIP9−P−2.54A: 0.92 g (typ.)
SSOP10−P−225−1.00: 0.09 g (typ.)
TA8409FG/SG:
The TA8409FG/SG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-63Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0 Ag-0.5 Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
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TA8409S/SG, F/FG
Block Diagram
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TA8409S/SG, F/FG
Pin Function
TA8409S/SG
TA8409F/FG
Function
Input Output Mode
IN 1 IN 2 OUT1 OUT2 MB
0 0 ∞ ∞ STOP
1 0 H L CW/CCW
0 1 L H CCW/CW
1 1 L L BRAKE
∞: High impedance
Note: Inputs are all high active type.
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TA8409S/SG, F/FG
Maximum Ratings (Ta = 25°C)
Note: This rating is obtained when the device is mounted on a 50 × 50 × 1.6 mm PCB with a Cu area of 30% or
more.
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TA8409S/SG, F/FG
Test Circuit 1
ICC1, ICC2, ICC3
TA8409S/SG, F/FG
Test Circuit 2
VIN1, VIN2, IIN, ∆VT, Iref
TA8409S/SG, F/FG
TA8409S/SG, TA8409F/FG
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TA8409S/SG, F/FG
Test Circuit 3
VSAT U−1, 2, VSAT L−1, 2, VSAT U−1’, 2’
TA8409S/SG, F/FG
Test Circuit 4
IL U, L
TA8409S/SG, F/FG
TA8409S/SG, TA8409F/FG
Test Circuit 5
VF U−1, 2, VF L−1, 2
TA8409S/SG, F/FG
TA8409S/SG, TA8409F/FG
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TA8409S/SG, F/FG
TA8409S/SG
TA8409S/SG
TA8409F/FG
TA8409F/FG
TA8409S/SG, TA8409S/SG,
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TA8409S/SG, F/FG
Application Circuit
R
VS
(Note)
VCC
10 µF
VCC VS Vref
2/2 6/7 8/9
OUT1
IN1 9/10 7/8
TA8409S/SG,F/FG
M
OUT2
IN2 1/1 3/3
5/5
GND TA8409S/SG, TA8409F/FG
Note 3: Switching the inputs may allow a pass-through current to flow. Keep the IC device in STOP mode (for at
least 100 µs) during the switching. Alternatively, insert a current-limiting resistor R.
Note 4: Use a current-limiting resistor R or fuse for overcurrent protection.
Note 5: When turning on the power for the IC device, apply VS after VCC (or VCC and VS simultaneously).
When shutting off the power, drop VS before VCC (or Vs and VCC simultaneously).
When turning on the power (VCC), keep both inputs (IN1 and IN2) on a low level.
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TA8409S/SG, F/FG
Package Dimensions
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TA8409S/SG, F/FG
Package Dimensions
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TA8409S/SG, F/FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagrams may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values which must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the device electrical characteristics may be irreparably
altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, these operations with exceeded ratings may cause breakdown, damage and/or degradation to other
equipment. Applications using the device should be designed so that each maximum rating will never be
exceeded in any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
6. Test Circuits
Components in the test circuits are only used to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application
equipment.
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TA8409S/SG, F/FG
Counter-electromotive force
When the motor reverses or stops, counter-electromotive force in the motor may influence the current to flow
to the power source. If the power source lacks sink capability, the IC power and output pins may exceed the
rating. The counter-electromotive force of the motor varies depending on the conditions of use and the features
of the motor.
Therefore ensure that there is no damage to the IC or problem in operation, and no error in or damage to
peripheral circuits resulting from counter-electromotive force.
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