SM-N960F Pspec 2
SM-N960F Pspec 2
COM
1. Safety Precautions
Before attempting any repair or detailed tuning, shield the device from RF noise or static
electricity discharges.
Use only demagnetized tools that are specifically designed for small electronic repairs,
as most electronic parts are sensitive to electromagnetic forces.
Use only high quality screwdrivers when servicing products. Low quality screwdrivers can
easily damage the heads of screws.
Use only conductor wire of the properly gauge and insulation for low resistance, because of the low margin
of error of most testing equipment.
We recommend 22-gauge twisted copper wire.
Hand-soldering is not recommended, because printed circuit boards (PCBs) can be easily
damaged, even with relatively low heat. Never use a soldering iron with a power rating of
more than 100 watts and use only lead-free solder with a melting point below 250°C (482°F).
Prior to disassembling the battery charger for repair, ensure that the AC power is disconnected.
Always use the replacement parts that are registered in the SEC system. Third-party replacement parts
may not function properly.
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1. Safety Precautions
Many semiconductors and ESDs in electronic devices are particularly sensitive to static discharge and can
be easily damaged by it. We recommend protecting these components with conductive anti-static bags
when you store or transport them.
Always use an anti-static strap or wristband and remove electrostatic buildup or dissipate
static electricity from your body before repairing ESDs.
Ensure that soldering irons have AC adapter with ground wires and that the ground wires are properly
connected.
Use only desoldering tools with plastic tips to prevent static discharge.
Properly shield the work environment from accidental electrostatic discharge before opening
packages containing ESDs.
The potential for static electricity discharge may be increased in low humidity environments,
such as air-conditioned rooms. Increase the airflow to the working area to decrease the
chance of accidental static electricity discharges.
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2. Specification
TDMA Mux 8 8 8 8
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2. Specification
MS Power
25.7 ~ -49(↓) 25.7 ~ -49(↓) 25.7 ~ -49(↓) 25.7 ~ -49(↓) 25.7 ~ -49(↓)
(dBm)
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2. Specification
Item LTE Band1 LTE Band2 LTE Band3 LTE Band4 LTE Band5 LTE Band7
Tx/Rx spacing
190 80 95 400 45 120
(MHz)
Channel
Bandwidth 5/10/15/20 1.4/3/5/10/15/20 1.4/3/5/10/15/20 1.4/3/5/10/15/20 1.4/3/5/10 5/10/15/20
(MHz)
MS Power
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)
Sensitivity
(QPSK, BW
-96.3 -94.3 -93.3 -96.3 -94.3 -94.3
10MHz)
(dBm)
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2. Specification
Item LTE Band8 LTE Band12 LTE Band13 LTE Band17 LTE Band18 LTE Band19
Tx/Rx spacing
45 30 -31 30 45 45
(MHz)
Channel
Bandwidth 1.4/3/5/10 1.4/3/5/10 1.4/3/5/10 5/10 5/10/15 5/10/15
(MHz)
MS Power
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)
Sensitivity
(QPSK, BW
-93.3 -93.3 -93.3 -93.3 -96.3 -96.3
10MHz)
(dBm)
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2. Specification
Item LTE Band20 LTE Band25 LTE Band26 LTE Band28 LTE Band32 LTE Band38
Tx/Rx spacing
-41 80 45 55 N/A 0
(MHz)
Channel
1.4/3/5/10/15/2
Bandwidth 5/10/15/20 1.4/3/5/10/15 3/5/10/15/20 5/10/15/20 5/10/15/20
0
(MHz)
MS Power
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)
Sensitivity
(QPSK, BW
-93.3 -92.8 -93.8 -94.8 -96.3 -96.3
10MHz)
(dBm))
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2. Specification
Item LTE Band39 LTE Band40 LTE Band41 LTE Band46 LTE Band66
Tx/Rx spacing
0 0 0 0 400
(MHz)
Channel Bandwidth
5/10/15/20 5/10/15/20 5/10/15/20 10/20 1.4/3/5/10/15/20
(MHz)
MS Power
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)
Sensitivity
(QPSK, BW 10MHz) -96.3 -96.3 -94.3 -92.3 -95.8
(dBm)
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2. Specification
Freq. Band[MHz]
2010~2025 1880~1920
Uplink/Downlink
Tx/Rx spacing
0 0
(MHz)
MS Power
25.7 ~ -48(↓) 25.7 ~ -48(↓)
(dBm)
Sensitivity
-107.3 -107.3
(dBm /1.28 MHz)
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2. Specification
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3. Product Function
Main Function
Item Description
OS Android V8.1
Battery 4,000mAh
A-GPS, Glonass, BEIDOU, Galileo, BT5.0, USB 3.1 Type-C, WIFI 802.11 a/b/g/n/ac MIMO,
Other RF
NFC,MST
Dual Camera : 12M 1/2.55” F1.5-2.4(Wide), 12M 1/3.42 F2.4(Tele) with LED Flash,
Camera Front : 8MP A/F 1/3.6” F1.7
IRIS : 5.8MP F2.2
LCD 6.4” Quad HD+, 2960 x 1440, dual edge Super AMOLED
Accelerometer, Barometer, Fingerprint Sensor, Gyro Sensor, Geomagnetic Sensor, Hall Sensor,
Sensor
HR Sensor, Iris Sensor, Pressure Sensor, Proximity Sensor, RGB Light Sensor
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6. Level 1 Repair
6-1-1. Preparation
※ Settings
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6. Level 1 Repair
- SVH (Fenrir_Home) : It uses Home binary which does not have user data area in the memory when
flashed to a device. (Keep user data)
- SVC (Fenrir_Factory) : It uses Factory binary which erases all user data in the memory when flashed to a
device. (Clear user data)
- SVA (Fenrir_All) : It uses Factory and Home binaries. you can download Home and Factory binary in a
PC(but requires double HDD storage and NW traffic)
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6. Level 1 Repair
3) Ensure device has sufficient charge (at least 20%) to start firmware update.
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6. Level 1 Repair
6) Once device is detected, you will be presented with below screen. To update S/W, select “S/W Update”
or to exit select “SVC Connection”. If you select “SVC Connection”, only Fenrir connection history (record)
will be s tored in the FUS server to support warranty validation. (This is known as “Service Connection”
history)
7) Once Fenrir starts, application will display the below screen. And select the Start button & Agree button.
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6. Level 1 Repair
8) The status circle increases as the update installs. The update process takes approximately 5-10 minutes
to complete. Do not disconnect the device from USB during processing.
9) Once complete, application will present the below screen indicating update complete.
Click Ok and detach device from USB.
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6. Level 1 Repair
6-2-1. Preparation
※ Settings
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6. Level 1 Repair
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6. Level 1 Repair
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6. Level 1 Repair
VOL DOWN
Intelligence Key
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6. Level 1 Repair
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6. Level 1 Repair
4. Start downloading the binary files into the device by clicking Start button on the screen.
The green colored "PASS!" sign will appear on the upper-left box if the binary files have been successfully
downloaded into the device.
6. Once the device boots up, you can check the version of the binary file or name by pressing the following
code in sequence; *#1234#
You can perform Factory data Reset by Settings → General Management → Reset
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6. Level 1 Repair
6-3-1. Preparation
- New IMEI writing Program has been released.
- Supported Model : Models which CAB files are uploaded on HHPsvc INI File category, instead of ini file.
- Refer to below IMEI writing procedure.
- H/W
- S/W
④Model File Copy Model File under the ‘Model Name’ folder
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6. Level 1 Repair
1. Run DASEUL_SVC_Launcher_v3.0.12.exe
Model name
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6. Level 1 Repair
4. Select Model
Model name
※Once you setup the setting, you don t have to do it again, unless there is change.
From second run of the IMEI program, check IMEI and click Extract & Run.
Model name
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6. Level 1 Repair
6. Check IMEI Write / IMEI Check and click IMEI SVC & Repair Option.
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6. Level 1 Repair
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6. Level 1 Repair
11.Click OK to proceed
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6. Level 1 Repair
13. Click OK
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6. Level 1 Repair
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6. Level 1 Repair
16. ① Click Start → ②Input IMEI writing ID and Password & OTP → ③Input Ticket No
Model name
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6. Level 1 Repair
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6. Level 1 Repair
6-4. RF Calibration
GH81-11962M GH81-11962U
(2ea) (2ea)
RF Cable
1.2T, 102mm 1.2T, 102mm
(Manual)
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6. Level 1 Repair
Setting
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6. Level 1 Repair
Model Name
Model Name
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6. Level 1 Repair
3. Check the 'CAL' and open the model file, then select 'Start' button.
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6. Level 1 Repair
4. Change the Line Type to 'Block Cell' and disable 'Smart Cloud Cell'.
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6. Level 1 Repair
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6. Level 1 Repair
Model name
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9. Reference Abbreviation
Reference Abbreviation
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