IPC-4552A

Performance Specification
for Electroless Nickel/
Immersion Gold (ENIG)
Plating for Printed Boards

Developed by the Plating Processes Subcommittee (4-14) of the

Fabrication Processes Committee (4-10) of IPC

Supersedes: Users of this publication are encouraged to participate in the

IPC-4552 with Amendments development of future revisions.
1 & 2 – December 2012
IPC-4552 – October 2002 Contact:

IPC
August 2017 IPC-4552A

Table of Contents
1 SCOPE ...................................................................... 1 3.1.5.2.1 Instrument Calibration for Phosphorus
1.1 Statement of Scope ............................................... 1 Content ............................................................ 13
3.1.6 Gold Stripping of Plated Deposits for
1.1.1 Feature Size for Thickness Measurement ............ 1
Evaluation of Hyper-Corrosion .......................... 13
1.2 Description ............................................................ 1
3.1.6.1 Recognized Methods for Gold Stripping ....... 14
1.2.1 Electroless Nickel Reducing Agents – 3.1.6.1.1 Chemical Stripping Solution Dwell
Phosphorus Content .............................................. 1 Times and Process Steps ............................ 14
1.3 Objective ............................................................... 1 3.1.6.1.2 Evaluation Using SEM ............................... 14
1.3.1 Order of Precedence ............................................. 2 3.1.6.1.3 Grain Boundary Enhancement vs.
1.3.1.1 Appendices ........................................................ 2 Hyper-Corrosion .......................................... 14
3.1.6.1.4 Verification of Hyper-Corrosion ................. 14
2 APPLICABLE DOCUMENTS .................................... 2
3.2 Performance Functions ....................................... 16
2.1 IPC ......................................................................... 2
3.2.1 Shelf Life ............................................................ 16
2.2 ASTM International (ASTM) ............................... 2
3.2.1.1 Solderability .................................................... 16
2.3 JEDEC ................................................................... 2
3.2.1.2 Gold Embrittlement ........................................ 16
2.4 Defense Standardization Program ........................ 2
3.2.2 Aluminum and Copper Wire (Wedge)
2.5 Telcordia Technologies, Inc. ................................. 3 Bonding ............................................................... 17
2.6 International Organization for 3.2.2.1 Gold Wire Bonding ......................................... 17
Standardization (ISO) ........................................... 3
3.2.3 Contact Surface ................................................... 17
2.7 Terms, Definitions and Acronyms ........................ 3
3.2.3.1 Soft Membrane Switches ................................ 17
2.7.1 Metal Turnover (MTO) ......................................... 3 3.2.3.2 Metallic Dome Contacts ................................. 17
2.7.2 Hyperactive Corrosion Deposit ............................ 3 3.2.4 EMI Shielding ..................................................... 17
2.7.3 Selective Annular Ring Dewetting (SAD) ........... 3 3.2.5 Conductive and/or Anisotropic Adhesive
Interface (Replacement for Solder) .................... 17
3 REQUIREMENTS OF ENIG DEPOSIT ..................... 4
3.2.6 Connectors ........................................................... 17
3.1 Printed Board Fabrication Supplier Process
Requirements ......................................................... 5 3.2.6.1 Press Fit Connectors ....................................... 17
3.1.1 General Plating Line Requirements ..................... 5 3.2.6.2 Edge Tab ......................................................... 17
3.1.1.1 ENIG Deposit Thickness Measurement ........... 5 3.2.7 Limitations of ENIG ........................................... 17
3.1.1.2 Gauge Capability – Gauge R&R 3.2.7.1 Creep Corrosion/Chemical Resistance ........... 17
Type 1 Study ..................................................... 5 3.2.7.2 High Frequency Signal Loss .......................... 18
3.1.1.3 Collimator Size and Measurement Times ...... 10 3.3 Visual ................................................................... 18
3.1.1.4 Guard Bands and Lot Conformance 3.4 Selective Annular Ring Dewetting (SAD) ......... 19
Testing ............................................................. 10 3.5 Finish Thickness ................................................. 20
3.1.2 ENIG XRF Calibration Standards ...................... 10 3.5.1 Electroless Nickel Thickness .............................. 20
3.1.3 XRF Zero Offset Acceptability .......................... 10 3.5.1.1 Electroless Nickel for Rigid Printed
3.1.4 Process Qualification Measurement Boards .............................................................. 20
Requirements ....................................................... 11 3.5.1.2 Deposits More Than the Upper Limit ............ 20
3.1.5 Measuring Phosphorus Content in an 3.5.1.3 Deposits Less Than the Minimum
ENIG Deposit ...................................................... 12 Thickness Limit .............................................. 20
3.1.5.1 Measurement of % Phosphorous (P) 3.5.1.4 Electroless Nickel for Flexible Circuits ......... 20
Content in Electroless Nickel (EN)
Layers with Energy Dispersive X-Ray 3.5.1.5 Modifications to the Base Structure of the
Spectroscopy (EDS) ........................................ 12 Electroless Nickel Deposits with Flexible
Circuits ............................................................ 20
3.1.5.2 Measurement of % Phosphorous (P)
Content in Electroless Nickel (EN) 3.5.2 Immersion Gold Thickness ................................. 21
Layers with Energy Dispersive X-Ray 3.5.2.1 ENIG – Category B Coating Durability
Fluorescence (EDXRF) ................................... 13 per IPC J-STD-003 ......................................... 21

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IPC-4552A August 2017

3.5.3 Exceptions to the Required Thickness APPENDIX 3 XRF Thickness Measurements of

Ranges ................................................................. 23 Thin Au (ENIG): Recommendations
for Instrumentation (Detectors)
3.5.3.1 Immersion Gold Thicker Than Specification and Their Limitations ......................... 35
by Design ........................................................ 23
3.5.3.2 Production Conformance Testing ................... 23 APPENDIX 4 ENIG PWB Surface Finish Wetting
Balance Testing ................................ 37
3.5.3.3 Production Measurement Exceptions ............. 23
3.5.3.4 Statistical Process Control .............................. 23 APPENDIX 5 IPC 4-14 SC ENIG Round Robin
Solder Spread Testing ..................... 55
3.5.3.5 Lot Sizes of Ten Printed Boards or Less ....... 23
3.5.3.6 Production Overruns and/or Inventory APPENDIX 6 Wire Bonding to ENIG ....................... 61
Items ................................................................ 24
3.5.3.7 Reworking/Repair of ENIG ............................ 24 APPENDIX 7 Through Hole Solderability
Testing ................................................. 62
3.6 Nickel Hyper-Corrosion ...................................... 24
3.6.1 Evaluation of the ENIG Deposit by APPENDIX 8 Evaluation of Electroless Nickel
Cross Section ...................................................... 24 Corrosion Due to Immersion Gold
Plating, Using 3000X Magnification
3.6.1.1 ......................................................................... 25 After Gold Stripping ........................ 77
3.6.1.1.1 Normal ENIG Free of Hyper-Corrosion
Defects ......................................................... 25 APPENDIX 9-A Cyanide Gold Stripping for
ENIG ............................................... 82
3.6.1.1.2 Acceptable Conditions with Some
Evidence of Hyper-Corrosion ..................... 25 APPENDIX 9-B Test Method for Potassium Iodide/
3.6.1.1.3 Acceptable Conditions with End User Iodine (Non-Cyanide) ENIG Gold
Sign-Off/Acceptance ................................... 25 Stripping Procedure ....................... 83
3.6.1.1.4 Rejectable Conditions ................................. 26
APPENDIX 9-C Method for Stripping Gold Plating
3.6.1.2 Hyper-Corrosion Rating Level Table ............. 26 from ENIG Finished PCBs by
Broad Beam Argon Ion Milling ..... 85
3.6.2 Additional Non-Failure Analysis Testing
to Determine Acceptance or Rejection for APPENDIX 10 Determination of Thickness
Level 2 Hyper-Corrosion .................................... 27 and Phosphorus Content In
3.7 Porosity ................................................................ 28 Electroless Nickel (EN) Layers
X-Ray Fluorescence (XRF)
3.8 Adhesion .............................................................. 28 Spectrometry [IPC-TM-650,
3.9 Solderability ........................................................ 29 Method 2.3.44] .................................. 90
APPENDIX 11 Phosphorus Content Measure-
3.9.1 Stressing of the Deposit Prior to Solderability ment in ENIG Using Electron
Testing ................................................................. 29 Dispersive Spectroscopy EDS –
3.9.2 Force Measurement Testing (Wetting Balance Initial Testing .................................... 97
Testing) ................................................................ 29
APPENDIX 12 Standard Developments Efforts
3.10 Cleanliness .......................................................... 29 of Electroless Nickel Immersion
3.11 Gold ................................................. 102
Electrolytic Corrosion ......................................... 29
3.12 Chemical Resistance ........................................... 29 APPENDIX 13 Using Guard Bands or a Gauge
Correction Factor to Accommodate
4 QUALITY ASSURANCE PROVISIONS .................. 30 Type 1 Gauge Study Measurement
Uncertainty ...................................... 102
4.1 General Quality Assurance Provisions ............... 30
4.1.1 Qualification Recommendations ......................... 30 Figures
4.1.2 Sample Test Coupons ......................................... 30 Figure A Example of Repeat Measurement Data from
4.2 Three Different XRF Tools ............................... 6
Quality Conformance Testing ............................. 30
Figure B Graphical and Statistical Evaluation of Data
4.2.1 Frequency of Thickness Measurements ............. 30 from XRF Tool # 1 ........................................... 7
4.2.2 Established Qualified Process ............................. 30 Figure C Graphical and Statistical Evaluation of Data
from XRF Tool # 2 ........................................... 8
APPENDIX 1 Terms and Definitions Not
Currently in IPC-T-50 ......................... 33 Figure D Graphical and Statistical Evaluation of Data
from XRF Tool # 3 ........................................... 9
APPENDIX 2 ENIG Process Sequence ................... 34 Figure 3-1 Potassium Iodide/Iodine (KI / I2) at 15 sec.
dwell (left) vs. 60 sec. dwell (right) ............... 14

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August 2017 IPC-4552A

Figure 3-2 Cyanide-Based Stripping at 15 sec. dwell Figure A4-6 Example of Excellent and Consistent Wetting
(left) vs. 60 sec. dwell (right) ......................... 15 From Sample Group # 4 Tested as Received
Figure 3-3 Cyanide Stripping (left) vs. KI/I2 Stripping with SAC305 and Test Flux # 2 (this is a
(right) Using Focused Ion Beam (FIB) .......... 15 1.6 µin at - 4σ IAu thickness sample) ........... 41

Figure 3-4 25,000X FIB Images – Cyanide (left) vs. Figure A4-7 Wetting Curves From Sample # 8 Tested as
KI / I2 (right) – Same Dwell Time .................. 15 Received Showing Again Excellent Wetting
Consistency Intra Group (this is one of the
Figure 3-5 Ion Mill Stripping of Defect-Free Nickel (left)
control thickness samples) ............................ 41
vs. Hyper-Corroded Nickel (right) ................. 16
Figure A4-8 Example of Some Very Inconsistent Wetting
Figure 3-6 Uniform Plating .............................................. 18
Seen with Sample Group 11, Again Tested
Figure 3-7 Extraneous Plating or Nickel Foot ................ 18 As Received with No Stressing (this group
Figure 3-8 Skip Plating (No Ni plating) ........................... 18 was later identified to have had a plating
issue and was withdrawn from further
Figure 3-9 Edge Pull Back .............................................. 19 consideration for this specification
Figure 3-10 Example of SAD (Selective Annular ring revision effort) ................................................ 42
Dewetting) ..................................................... 20
Figure A4-9 Post 2X Reflows Using a SnPb Profile and
Figure 3-11 Another Example of the SAD Defect ............ 20 SnPb Solder for Testing (good robustness) .. 42
Figure 3-12 Selective Annular Ring Dewetting Defect ..... 20 Figure A4-10 Post 2X Reflows Using a Hotter Pb-Free
Figure 3-13 Grain Structure of Conventional Nickel Profile but Testing with SnPb Solder
Deposit .......................................................... 21 (FAIL) ............................................................. 43
Figure 3-14 Grain Structure of Nickel Deposit Modified Figure A4-11 Post 8 Hours Exposure to 72 °C/85% R.H.
for Dynamic Flex Applications ....................... 21 (excellent robustness) ................................... 43
Figure 3-15 Example of Fracture in Conventional Nickel Figure A4-12 Post 2X Exposures to a SnPb Profile Then
Deposit .......................................................... 21 Tested With SnPb (excellent robustness) ..... 44
Figure 3-16 Modified Nickel Deposit of Cycles Showing Figure A4-13 Post 2X Exposures to a Pb-Free Profile and
No Fracture with Same Number ................... 21 Tested with SnPb (shows some increased
Figure 3-17 Defect Free ENIG Deposit – Knee of Hole ... 25 spread in the data but overall, very good
robustness compared to the failures seen
Figure 3-18 Defect Free ENIG Deposit – SMT Feature ... 25 in Figure A4-7) ............................................... 44
Figure 3-19 Level 1 Hyper-Corrosion – SMT Feature ...... 25 Figure A4-14 Post 8 hours @ 72 °C/85% R.H. (excellent
Figure 3-20 Level 1 Hyper-Corrosion – Knee of Hole ...... 25 robustness) .................................................... 45
Figure 3-21 Level 2 Hyper-Corrosion – Knee of Hole ...... 25 Figure A4-15 Another Sample Group Post 2X Exposures
to a SnPb Profile Then Tested with
Figure 3-22 Level 2 Hyper-Corrosion – SMT Feature ...... 25
SnPb (slower rate of rise indicating
Figure 3-23 Level 3 Hyper-Corrosion – Knee of Hole ...... 26 some reducible oxide layers present
Figure 3-24 Level 3 Hyper-Corrosion – SMT Feature ...... 26 with good robustness) ................................... 45

Figure 3-25 Example of a Crack in the Nickel Deposit .... 26 Figure A4-16 Post 2X Pb-Free Reflow Profile Exposure
(good robustness) ......................................... 46
Figure 3-26 Decision Tree to Assist in Setting Rating
Level of Hyper-Corrosion .............................. 27 Figure A4-17 Post 8 hours @ 72 °C/85% R.H. (excellent
robustness) .................................................... 46
Figure 3-27 Example of an Acceptable Contiguous
IMC Layer 1000X .......................................... 28 Figure A4-18 Post 2X SnPb Profile Exposure (good
wetting times, increased spread in the
Figure 3-28 Example of a Rejectable Non-Contiguous
data) .............................................................. 47
IMC Layer 1000X .......................................... 28
Figure A4-19 Post 2X Pb-Free Profile Exposure
Figure 3-29 Example – Rejectable with Little-to-No IMC
(increasing spread in the data and
Formation 1000X ........................................... 28
some failures) ................................................ 47
Figure 3-30 Example – Rejectable with Little-to-No IMC
Formation 1000X ........................................... 28 Figure A4-20 Post 8 Hours @ 72 °C/85% R.H. (excellent
robustness) .................................................... 48
Figure 3-31 Standard IPC Force Measurement Coupon . 29
Figure A4-21 Post 2X SnPb Reflow Exposures (excellent
Figure A4-1 Example of the Wetting Balance Coupon
robustness) .................................................... 48
Used for the Testing of ENIG ........................ 38
Figure A4-22 Post 2X Pb-Free Reflow Exposures (one
Figure A4-2 Box Plot of the 1 µin Samples From All
outlier but overall, excellent robustness) ...... 49
Suppliers ........................................................ 39
Figure A4-3 Box Plot of the 1.5 µin Samples From All Figure A4-23 Post 8 Hours @ 72 °C/85% R.H. (excellent
Suppliers ........................................................ 39 robustness) .................................................... 49

Figure A4-4 Box Plot of the 2.0 µin Samples From All Figure A4-24 Post 2X SnPb Reflow Exposures From
Suppliers ........................................................ 40 Another Supplier (excellent robustness) ....... 50
Figure A4-5 The Metronelec ST88 Wetting Balance Figure A4-25 Post 2X Pb-Free Reflow Exposures From
Used for the Testing ...................................... 40 Another Supplier (excellent robustness) ....... 50

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IPC-4552A August 2017

Figure A4-26 Post 8 Hours @ 72 °C/85% R.H. Figure A7-5 Hole Fill Evaluation of the Non-Stressed
(some increased wetting times but Samples Tested Using Eutectic SnPb
overall excellent robustness) ......................... 51 Solder ............................................................ 65
Figure A4-27 Post 2X SnPb Reflow Exposures From Figure A7-6 The Impact of 2X Reflows on Samples
Another Supplier (excellent robustness) ....... 51 Tested Subsequently with Eutectic SnPb
Figure A4-28 Post 2X Pb-Free Reflow Exposures From Solder ............................................................ 66
Another Supplier (excellent robustness) ....... 52 Figure A7-7 Impact on Hole Fill Defects When Samples
Figure A4-29 Post 8 Hours @ 72 °C/85% R.H. (excellent Experience 2X Reflows + 8 Hours of 72 °C
robustness) .................................................... 52 85% R.H. ....................................................... 67
Figure A4-30 Post 2X SnPb Reflow Exposures From Figure A7-8 Example of Complete Hole Fill and the Level
Another Supplier (increase in rate of rise of Inner Layer Interconnects from One Row
time but overall excellent robustness) .......... 53 of a Single Test Coupon from a Sample
Figure A4-31 Post 2X Pb-Free Reflow Exposures Tested with No Stressing with SnPb
From Another Supplier (increase in rate Solder ............................................................ 68
of rise time but again overall excellent Figure A7-9 Example of the Impact of Stressing on the
robustness) .................................................... 53 Hole Fill Using 2X SnPb Reflows and Tested
Figure A4-32 Post 8 Hours @ 72 °C/85% R.H. (increased With SnPb Solder, the I Au Thickness
spread in the data but overall excellent was 1.71 µm″ ................................................ 69
robustness) .................................................... 54 Figure A7-10 Example of the Impact of Stressing on the
Figure A5-F-1 Flowchart for Process ................................... 56 Hole Fill Using 2X SnPb Reflows + 8 Hours
of 72 °C/85% R.H. and Tested with SnPb
Figure A5-1 Image of the Solder Spread Test Vehicle
Solder, the I Au Thickness was 2.96 µm″ ..... 70
Used by IPC for This Testing ........................ 56
Figure A5-2 Description of the Solder Spread Figure A7-11 The Hole Fill Defects Seen with SAC305
Measurement Using the IPC Solder Solder on Non-Stressed Samples ................. 71
Spread Coupon ............................................. 56 Figure A7-12 The Impact of 2X Reflow Stressing on
Figure A5-3 PCB Solder Spread Versus Au Thickness Samples Subsequently Soldered with
for 4 ENIG Suppliers Using Pb-Free SAC SAC305 Solder .............................................. 72
Solder Paste .................................................. 57 Figure A7-13 The Impact on Hole Fill Defects When the
Figure A5-4 Interaction Plot and Regression Analysis Samples Experience 2X Reflows + 8 Hours
for Parameters Influencing Solder Spread of 72 °C 85% R.H. ........................................ 73
on ENIG-Finished Pcbs in This Study .......... 58 Figure A7-14 Example of the Impact of Stressing on the
Figure A5-5 Back-Scattered SEM Image of a Solder Hole Fill Using 2X Pb-Free Reflows and
Spread Dot From an OSP Board With a Tested with SAC305 Solder; the I Au
Solder Spread Value of 21%. ........................ 58 Thickness was 1.77 µm″ ............................... 74
Figure A5-6 Solder Spread Coupons Soldered With Figure A7-15 Example of the Impact of Stressing on the
Pb-Free SAC Solder After 8 Hours Exposure Hole Fill Using 2X Pb-Free Reflows + 8
to 72 °C, 85% R.H. Hours of 72 °C / 85% R.H. and Tested
Left - thinnest gold sample from supplier #2 with SAC305 Solder; the I Au Thickness
with 34% average spread, Right - thinnest was 2.37 µm″ ................................................ 75
gold sample from supplier #3 with 21%
Figure A7-16 Summary Graph on Hole Fill Defects as a
average spread. ............................................ 59
Function of Stressing Pre-Testing ................. 76
Figure A5-7 Maximum Solder Deposit Line Count (1-18)
for all Boards [4 ENIG Suppliers] in the DOE Figure A8-1 SEM/EDS/FIB Equipment Photo ................... 77
Soldered With Pb-Free SAC Solder (left) and Figure A8-2 Sample VI (3000X) ........................................ 78
SnPb Eutectic Solder (right) Pastes. Data
in the red region indicate areas with almost Figure A8-3 Potassium Iodide/iodine Gold Stripped
no spread and would likely show dewetting EDAX Spectrum ............................................ 78
under inspection. Dewetting is a concern in Figure A8-4 FIB-SEM Cross Section 10,000X .................. 79
the yellow region. .......................................... 59
Figure 8A-5 Sample VI, 3000X ......................................... 79
Figure A7-1 An Example of a Test Vehicle and an
Individual 20 – Hole Coupon That Is Figure A8-6 Cyanide Gold Stripped EDAX Spectrum ...... 79
Showing Various Degrees of Hole Fill .......... 63
Figure A8-7 Cyanide Gold Stripped EDAX Spectrum ...... 80
Figure A7-2 Example of the Coupon Internal Construction,
Figure A8-8 FIB-SEM Cross Section (10,000X) ............... 80
Copper Weight and Interconnect Method to
Inner Layers as Applicable – This is for the Figure A8-9 Sample VI, 10,000X ...................................... 80
J1 Coupon ..................................................... 63
Figure A8-10 Sample VI, 10,000X ...................................... 81
Figure A7-3 XRF Measurements From the Fiducials
of the 30 Test Vehicles and the Stressing Figure A9-C-A Broad Beam Argon Ion Mill ....................... 85
Methods for Each Sample ............................. 64 Figure A9-C-1 SEM Micrograph (BEI) of As-Finished
Figure A7-4 The Wave Soldering Parameters Used at ENIG Surface Prior to Broad Beam
Adtran for Processing of the Test Vehicles ... 65 Ion Milling. ..................................................... 89

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Figure A9-C-2 SEM Micrograph (BEI) of ENIG Surface After Figure A11-6 The Most Consistent Wt.% Reported
30 Seconds of Ion Milling. Some Residual Regardless of Accelerating Voltage
Gold Still Evident Indicating the Sample is Being Used for Sample C Foil Group. The
Under-Milled. ................................................. 89 Same Two Test Sites Produced the Most
Consistent Results for Sample B as Well. .. 101
Figure A9-C-3 SEM Micrograph (BEI) of ENIG Surface
After 1 Minute of Ion Milling. The Nodular Figure A12-1 Results from Gold Thickness Survey .......... 103
Morphology is Intact and No Residual Figure A12-2 Results from Nickel Thickness Survey ....... 104
Gold is Evident Indicating That the
Figure A12-3 Comparison of Gold Thickness Values
Sample is Properly Milled. ............................ 89
by XRF Machine Type ................................. 106
Figure A9-C-4 SEM Micrograph (BEI) of ENIG Surface After Figure A12-4 Comparison of Gold Plating Thickness
15 Minutes of Ion Milling. No Residual Gold Variation by Vendor for Similar Bath Life
is Evident, but the Enhanced Grain Structure Conditions .................................................... 108
and Some Ditching Indicate the Sample is
Over-Milled. ................................................... 89 Figure A12-5 Comparison of Nickel Plating Thickness
Variation by Vendor for Similar Bath Life
Figure A9-C-5 SEM Micrograph (BEI) of ENIG Surface Conditions .................................................... 109
After 15 Minutes of Ion Milling. Hyper-
Corrosion is Still Evident, but not Figure A12-6 Wetting Times as a Function of Plating
Dwell Times for Vendor D, 90 Days Old ..... 110
Significantly Exaggerated. ............................. 89
Figure A12-7 Wetting Times as a Function of Plating
Figure A10-1 XRF Instrument Layout ................................. 91 Dwell Times for Vendor D, 90 Days Old ..... 111
Figure A10-2 Sample Placement with Respect to Figure A12-8 Test Board for Wetting Balance
Detector ......................................................... 93 Measurements ............................................. 112
Figure A10-3 Positioning of a 1 mm φ Collimator on a Figure A12-9 Wetting Balance Data for Vendor D Post
1.5 mm x 1.5 mm [0.060 in x 0.060 in] 18 Hours 85/85 Conditioning ....................... 113
Pad ................................................................ 93 Figure A12-10 Comparison of One Microinch Gold
Figure A10-4 Scheme of Interaction ................................... 94 Deposit Tested at 8 Months Shelf Life
vs as Received and 85/85 ........................... 114
Figure A10-5 Spectrum of an EN layer on Cu (PCB),
Figure A12-11 Comparison of One Microinch Gold Deposit
Showing IP–K and INi–K . ................................. 95
after Various Storage Times/Conditions ...... 115
Figure A10-6 Spectra of Samples NiP12/Cu/PCB (blue) Figure A12-12 Contact Resistance Data for Vendor D for
and 50 nm Au/96 nm Pd/3.2 µm NiP9.3/Cu/ Interlocking Square Contacts ...................... 117
PCB (yellow), Showing Peak Overlap of
P-K and Au-M Energy Lines ......................... 96 Figure A12-13 Contact Resistance Data for Vendor C for
Interlocking Square Contacts ...................... 118
Figure A11-1 Reported Phosphorus Content From Seven
Figure A12-14 Comparison of Gold Thickness by Vendor
Test Sites for Sample A. The range in reported
for the Interlocking Square Contact Test ..... 119
content is from a low of 3.85 wt.% to a high
of 48.09 wt.%. Generally the higher reported Figure A12-15 Interlocking Square Contact Test Coupon .. 120
values were from the lower kV values Figure A13-1a Part Misclassifications ................................. 121
which is typically recommended by the
EDS suppliers for evaluating Phosphorus. ... 98 Figure A13-1b Part Misclassifications ................................. 121
Figure A13-2 Guard Bands ............................................... 122
Figure A11-2 Reported Phosphorus Content From Eight
Test Sites for Sample B. The range in Figure A13-3 Type 1 Gauge Study Results ...................... 123
reported content is from a low of 3.36 wt.%
to a high of 58.09 wt.%. It is noted that
the same test site did not produce these Tables
extreme values or was the same location
Table 3-1 Requirements of Electroless Nickel/
for the data reported for Sample A. .............. 99
Immersion Gold Plating ................................... 4
Figure A11-3 Reported Phosphorus Content From Eight Table 3-2 Twelve (12) Repeat Au Measurements
Test Sites for Sample C. The range in reported and the Mean Value ...................................... 11
content is from a low of 3.92 wt.% to a high
of 61.24 wt.%. The same two locations that Table 3-3 Three Examples of XRF Data Sets [=µin] .... 22
produced the extreme values for Sample B also Table 3-4 One More Example of XRF Data [=µin] ........ 22
produced them for Sample C. It is further noted
that the low wt.% was produced at the highest Table 3-5 Three Levels of Hyper-Corrosion Observed
accelerating voltage for test site # 2 and the Using Optical Microscopy .............................. 26
lowest accelerating voltage for test site 8 ..... 99 Table 4-1 Suggested Fabricator Qualification Plan ....... 31
Figure A11-4 The Most Consistent Wt.% Reported Table 4-2 C=0 Sampling Plan (Sample Size for
Regardless of Accelerating Voltage Specific Index Value1) ................................... 32
Being Used for Sample A Foil Group .......... 100 Table A3-1 XRF Detectors and Their Limitations at
Figure A11-5 The Most Consistent Wt.% Reported Typical Count Rates ...................................... 35
Regardless of Accelerating Voltage Table A4-1 1.0 µin Minimum at -4 σ From the Mean
Being Used for Sample B Foil Group ......... 100 Sample (all suppliers are below the target) .. 38

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IPC-4552A August 2017

Table A4-2 1.5 µin Minimum at -4 σ From the Mean

Sample (only one supplier met the goal) ...... 38
Table A4-3 2.0 µin Minimum at -4 σ From the Mean
(Control Sample) (only one supplier met
goal) ............................................................... 38
Table A5-1 Au Thicknesses Measured by XRF for the
PCBs Used for Solder Spread Testing From
Appendix G3 .................................................. 55
Table A5-2 Description of Test Matrix for Solder
Spread Evaluation ......................................... 55
Table A5-3 Average Solder Spread Result for Each
Combination of Solder Paste, Au Thickness
and PCB Conditioning ................................... 57
Table A6-1 Average Thicknesses of Immersion Gold ..... 61
Table A6-2 Pull Values for 1 mil Aluminum Wire
Bonds ............................................................ 61
Table A6-3 Pull Values for 10 mil Aluminum Wire
Bonds ............................................................ 61
Table A6-4 Pull Values for 1 mil Copper Wire Bonds ..... 61
Table A10-1 Typical Achievable Results for NiP/Cu/PCB
Samples (1mm Collimator; Measuring Time
120 s) ............................................................ 92
Table A10-2 Evaluation of 5 Readings (Repeatability
Conditions) of the Sample in Figure A10-6 ... 93
Table A13-1 Guard Band Sigma Recommendation ........ 121
Table A13-2 Guard Band Sigma Recommendation ........ 124

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Performance Specification for Electroless Nickel/

Immersion Gold (ENIG) Plating for Printed Boards

1 SCOPE

1.1 Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG)
deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by
chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manu-
facturers (OEM). This standard may be used to specify acceptance criteria to meet performance requirements in addition to
those found in the IPC-6010-FAM: Printed Board Performance Specifications. The ENIG deposit specified by using this
document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability
specification.
This specification is based on three critical factors:
1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness
range specified.
3. That the ENIG plating process results in uniform deposit characteristics.
If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined
herein.

1.1.1 Feature Size for Thickness Measurement This performance specification has been generated based on a deposit
thickness measured ONLY on feature sizes of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area (± 10%). Measure-
ment of non-standard feature sizes and/or a combination of different feature sizes will prevent compliance to the statistical
requirements of this specification. Requirements to measure non-standard sized features is AABUS and the supplier of the
printed board is not responsible for the performance of the deposit as specified in this document.

1.2 Description ENIG is an electroless nickel layer capped with a thin layer of immersion gold. It is a multifunctional
surface finish, applicable to soldering, aluminum and copper wedge wire bonding, press fit connections, and as a contact
surface. The immersion gold layer protects the underlying nickel from oxidation/passivation over its intended life. However,
this layer is not impervious and it will not pass the requirements of a “classic” porosity test as defined in ASTM B 735 &
IPC-TM-650, Methods 2.3.24, 2.3.24.1 and 2.3.24.2).

1.2.1 Electroless Nickel Reducing Agents – Phosphorus Content Phosphorus-containing, reducing agents are used for
the reduction of the electroless nickel during the deposition process and phosphorus is incorporated in the nickel deposit.
Currently there are two levels of phosphorus found in electroless nickel deposits used for ENIG:
1. A mid-phosphorus nickel with phosphorus levels ranging from 5 wt. % to 10 wt. %
2. A high phosphorus nickel with phosphorus levels greater than 10.0 wt. %.
The level of this co-deposited element should be controlled within the supplier’s specified process limits. Variation of
phosphorus levels outside the specified process limits may have adverse effects on the performance of the finish and/or
potentially increase the occurrence and/or severity of hyper-corrosion.
The phosphorus content within the interfacial region between the electroless nickel and immersion gold layers is higher than
that found in the bulk deposit. After soldering, the phosphorus levels at the interface between solder and the electroless
nickel will always be higher than that found on a non-soldered pad, as the tin in the solder preferentially reacts with the
nickel, leaving a phosphorus-rich layer behind. This is a NORMAL and expected occurrence.

1.3 Objective This specification sets the requirements specific to ENIG as a surface finish (see Table 3-1 for a summary
of these requirements). As other finishes require specifications, they will be addressed by the IPC Plating Processes Sub-
committee as part of the IPC-455X specification family. As this and other applicable specifications are under continuous
review, the subcommittee will add appropriate amendments and make necessary revisions to these documents. The 4-14