311-3-097453-MCR16
311-3-097453-MCR16
311-3-097453-MCR16
*Motorola preferred devices
K
A
G
CASE 221A–06
(TO-220AB)
Style 3
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Case RθJC 1.5 °C/W
Thermal Resistance — Junction to Ambient RθJA 62.5
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds TL 260 °C
(1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
OFF CHARACTERISTICS
Peak Forward Blocking Current TJ = 25°C IDRM — — 0.01 mA
Peak Reverse Blocking Current TJ = 125°C IRRM — — 2.0
(VAK = Rated VDRM or VRRM, Gate Open)
ON CHARACTERISTICS
Peak On-State Voltage* (ITM = 32 A) VTM — — 1.7 Volts
Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 Ω) IGT 2.0 8.0 20 mA
Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 Ω) VGT 0.5 0.65 1.0 Volts
Hold Current (Anode Voltage =12 V) IH 4.0 25 40 mA
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off–State Voltage dv/dt 50 200 — V/µs
(VD = Rated VDRM, Exponential Waveform, Gate Open, TJ = 25°C)
*Indicates Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
125
TC, MAXIMUM ALLOWABLE CASE TEMPERATURE ( °C)
105 10 a=30°
8
100
6
a=30° 60° 90° 120° 180° dc 4
95
2
90 0
0 2 4 6 8 10 12 14 16 0 2 4 6 8 10 12 14 16
IT(AV), AVERAGE ON–STATE CURRENT (AMP) IT(AV), AVERAGE ON–STATE CURRENT (AMP)
100 1
I T , INSTANTANEOUS ON-STATE CURRENT (AMPS)
Typical @ TJ=25 °C
R(t) TRANSIENT THERMAL R (NORMALIZED)
Maximum @ TJ=125 °C
10
Z qJC(t) + RqJC(t) @ r(t)
0.1
Maximum @ TJ=25 °C
1
0.1
0.5 1 1.5 2 2.5 3 3.5
0.01
0.1 1 10 100 1000 @
1 10 4
VT, INSTANTANEOUS ON–STATE VOLTAGE (VOLTS) t, TIME (ms)
10 10
–40 –25 –10 5 20 35 50 65 80 95 110 125 –40 –25 –10 5 20 35 50 65 80 95 110 125
TJ, JUNCTION TEMPERATURE (_C) TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Typical Holding Current Versus Figure 6. Typical Latching Current Versus
Junction Temperature Junction Temperature
100 0.85
0.75
0.70
0.65
10
0.60
0.55
0.50
0.45
1 0.40
–40 –25 –10 5 20 35 50 65 80 95 110 125 –40 –25 –10 5 20 35 50 65 80 95 110 125
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Typical Gate Trigger Current Versus Figure 8. Typical Gate Trigger Voltage Versus
Junction Temperature Junction Temperature
1400 160
1 Cycle
ITSM , PEAK SURGE CURRENT (AMP)
150
1200
TJ + 125°C +
V PK 800 V 140
STATIC dv/dt (V/uS)
1000 130
120
800
110
600 TJ + 125°C f + 60Hz
100
400
10 100 1000 @
1 10 4
90
1 2 3 4 5 6 7 8 9 10
RGK, GATE CATHODE RESISTANCE (OHMS) NUMBER OF CYCLES
Figure 9. Typical Exponential Static dv/dt Versus Figure 10. Maximum Non–Repetitive
Gate Cathode Resistance. Surge Current
NOTES:
SEATING 1. DIMENSIONING AND TOLERANCING PER ANSI
–T– PLANE
Y14.5M, 1982.
B F C 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
T S BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
4
INCHES MILLIMETERS
A DIM MIN MAX MIN MAX
Q A 0.570 0.620 14.48 15.75
1 2 3 B 0.380 0.405 9.66 10.28
U C 0.160 0.190 4.07 4.82
H D 0.025 0.035 0.64 0.88
F 0.142 0.147 3.61 3.73
K STYLE 3: G 0.095 0.105 2.42 2.66
Z PIN 1. CATHODE H 0.110 0.155 2.80 3.93
2. ANODE J 0.018 0.025 0.46 0.64
3. GATE K 0.500 0.562 12.70 14.27
4. ANODE L 0.045 0.060 1.15 1.52
L R N 0.190 0.210 4.83 5.33
V J Q 0.100 0.120 2.54 3.04
R 0.080 0.110 2.04 2.79
G S 0.045 0.055 1.15 1.39
T 0.235 0.255 5.97 6.47
D U 0.000 0.050 0.00 1.27
N CASE 221A–06 V 0.045 ––– 1.15 –––
(TO-220AB) Z ––– 0.080 ––– 2.04
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*MCR16/D*
◊ MCR16/D