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Class Mat

The document categorizes engineering materials into five broad classes: metals, ceramics, polymers, semiconductors, and composites. Metals consist of electropositive elements that are dense, strong, and ductile but can corrode or lose strength at high temperatures. Ceramics are inorganic compounds that are strong but brittle and can be used up to 2000°C. Polymers are formed from carbon-based molecules and are typically lightweight, ductile, and resistant to corrosion but have low strength and melt below 300°C. Semiconductors like silicon are used for their electrical properties and can be doped to control conductivity. Composites combine materials to leverage strengths and alleviate weaknesses.

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0% found this document useful (0 votes)
30 views

Class Mat

The document categorizes engineering materials into five broad classes: metals, ceramics, polymers, semiconductors, and composites. Metals consist of electropositive elements that are dense, strong, and ductile but can corrode or lose strength at high temperatures. Ceramics are inorganic compounds that are strong but brittle and can be used up to 2000°C. Polymers are formed from carbon-based molecules and are typically lightweight, ductile, and resistant to corrosion but have low strength and melt below 300°C. Semiconductors like silicon are used for their electrical properties and can be doped to control conductivity. Composites combine materials to leverage strengths and alleviate weaknesses.

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Pre Tshuks
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© Attribution Non-Commercial (BY-NC)
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Classes of Materials Engineering materials can be grouped by chemical composition into the following broad categories: Metals Ceramics

amics Polymers Semiconductors Composites

p. 2.1

EMSE 201 Introduction to Materials Science

2003 Mark R. De Guire

rev. 1/13/03

Classes of Materials METALS Definition: Solid materials that consist of Electropositive elements Columns I-III Transition metals Lower elements in columns IIIA-VA Rare earths and actinides

p. 2.2

Alone, or in combination in continuously variable proportions* (* Except intermetallic compounds e.g. Ni3Al, MoSi2 which resemble ceramics in many ways)

Typical properties of metallic solids Dense Strong Ductile High electrical conductivity Moderate - high thermal conductivity

Performance limitations Oxidation Melting points High density


2003 Mark R. De Guire rev. 1/13/03

Corrosion (acid/base) Loss of strength as T

Typical maximum use T < 1000C

EMSE 201 Introduction to Materials Science

Classes of Materials
Periodic table of the elements Callister, Fig. 2.6

p. 2.3

EMSE 201 Introduction to Materials Science

2003 Mark R. De Guire

rev. 1/13/03

Classes of Materials

p. 2.4

CERAMICS Definition Inorganic, nonmetallic solids Compounds of the electropositive elements with Oxygen (Al2O3, ZrO2) Carbon (SiC, WC) Nitrogen (Si3N4,BN) Halides (LiF, KBr) Sulfur (FeS2)

Typical properties Moderate density Strong Brittle Low electrical conductivity Low - moderate thermal conductivity Hard

Performance ~500C < maximum use T < ~2000C Corrosion resistant, even at high temperatures Main limitation: brittle failure

EMSE 201 Introduction to Materials Science

2003 Mark R. De Guire

rev. 1/13/03

Classes of Materials

p. 2.5

POLYMERS Definition Large molecules formed by linking smaller molecules (mers) of Carbon Hydrogen Oxygen Nitrogen Sulfur Fluorine

Typical properties Lightweight Lower strengths Ductile or brittle Corrosion resistance High for acids, bases Sometimes low for organic solvents Low electrical conductivity Low thermal conductivity Inexpensive

Performance limitation: low resistance to high temperatures Melting/softening Combustion (oxidation)/decomposition Maximum use T <~300C

EMSE 201 Introduction to Materials Science

2003 Mark R. De Guire

rev. 1/13/03

Classes of Materials

p. 2.6

SEMICONDUCTORS Definition Column IV-A elements (C, Si, Ge), their compounds (SiC) and solid solutions* (Si-Ge) Compounds of III-A and V-A elements (III-V compounds, e.g. GaAs, InP) Compounds of II-B and VI-A elements (II-VI compounds, e.g. ZnSe, CdTe)

Typical properties Strong Low ductility Moderate electrical conductivity Low thermal conductivity

Performance Generally used for electrical characteristics: Resistivity Optical properties heavily influenced, & controlled, by the amounts and types of dopants Oxidation & melting limit high-T use

* For a discussion of solid solutions, see Callister 4.3 dopant an intentional impurity added usu. in small amounts (parts per million or less) to alter a the electrical properties of a material (typically a semiconductor)
EMSE 201 Introduction to Materials Science 2003 Mark R. De Guire rev. 1/13/03

Classes of Materials

p. 2.7

COMPOSITES Combining materials to Capitalize on desirable properties Alleviate shortcomings

Examples Fiberglass-reinforced polymers Formability & low cost of polymers Stiffness, strength of glass fibers

Tungsten carbide/cobalt cermets* used as abrasives Hardness of ceramics Toughness & formability of metal

* Cermet a composite consisting usu. of a particulate ceramic in a metal matrix

EMSE 201 Introduction to Materials Science

2003 Mark R. De Guire

rev. 1/13/03

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