Integrated Circuits

WHAT IS AN INTEGRATED
CIRCUIT?
An IC is complete electronic circuit in
which both the active & passive

components are fabricated on a tiny single
chip of SILICON.
Active components are those components
which are able to produce gain.
Passive components are those components
which do not have this ability.
HISTORY
Tremendous changes in
Electronic circuitry starts after

the invention of Triode by L.D
Forest in 1907.
Invention of Transistor in 1948
by W.H Bardeen & I.Bardeen
electronic circuit became
reduced in size.
In early 1960 field of
microelectronic born to meet
the requirement of Military.
CONTD
J.S Kilby was first
person who develop

IC.
Soon after Robert
Noyce fabricate a
complete IC including
interconnection on
single chip.
SCALE OF
INTEGRATION
SSI small scale
integration
MSI medium scale
integration
LSI large scale
integration
VLSI very large scale
integration
ULSI ultra large scale
integration
GSI giga scale
integration
CIRCUITS PER CHIP

SSI < 12 (No. of comp.less than 50)
MSI 12 99 (No. of comp. 50 5000)
LSI 100 9999 (No. of comp. 5000 100000)
VLSI 10000 99999 (No. of comp. 100000
1000000)
ULSI 100000 999999 (No. of comp. 1000000
10000000)
GSI >1000000 (No. of comp. 100000000)
CLASSIFICATION OF ICs
On structure basis
On function basis
ON STRUCTURE BASIS
MONOLITHIC INTEGRATED CIRCUITS
THICK & THIN FILM INTEGRATED
CIRCUITS
HYBRID / MULTICHIP INTEGRATED
CIRCUITS
MONOLLITHIC IC
The word monolithic means SINGLE
STONE or more appropriately Single

solid structure.
In this all circuit all components are
fabricated within single continuous piece of
silicon crystalline material called WAFER
or SUBSTRATE
ADVANTAGES &
DISADVANTAGES OF
MONOLITHIC ICs
These have advantage of lower cost and
high reliability.
However they have poor isolation between
the components, short range of passive
components, no flexibility of circuit design.
INDUCTORS cannot be fabricated.
THICK & THIN FILM IC

The difference between between thick &
thin film are not their relative thickness but

method of depositing film.
These ICs are not formed within single
silicon wafer but surface of an insulating
substrate such as glass or ceramic materials.
Only passive components are formed
through thick or thin film.
THIN FILM IC
Such circuits are constructed by depositing
film of conducting material through a mask

on the surface of substrate made of glass or
ceramic.
Following methods are used to produce thin
film.
VACUUM EVAPORATION
CATHODE SPUTTERING
THICK FILM IC
These are printed thin film circuits.
Silk screen printing techniques are
employed to create the desired circuit

pattern on the surface of substrate
ADVANTAGES &
DISADVANTAGES OF FILM
ICs
These have advantages of forming passive
components of broader range.

High tolerance
Isolation is better
Better high frequency performance.
CONTD
Not able to fabricate active components
Comparatively higher cost
Larger physical size
HYBRID IC
These ICs are formed either by
interconnecting a number of individual

chips or by combination of film &
monolithic ICs
They have chief advantage high flexibility
but too much expensive for mass production
and least reliability.
ON FUNCTION BASIS
LINEAR
DIGITAL
LINEAR ICs (LICs)

These also referred as Analog IC.
They possess much high reliability
Their use is much less as compared to
digital and mostly used in military and

industrial application
USE OF LICs
Operational amp.
Small signal amp.
Power amp.
RF & IF amp.
Microwave amp.
Multipliers
Voltage comparators
Voltage regulators
DIGITAL ICs
About 80% of IC market has been captured
by digital IC which is mostly used in

computer IC
Digital IC contain circuits whose input and
output voltages are limited to 2 possible
level high and low
USES OF DIGITAL ICs

Digital circuits
Calculator chips
Flip flops
Memory chips
Counters
Microprocessors
Clock chips
ADVANTAGES OF ICs
Extremely small physical
size
Very small weight
Reduced cost
Extremely high reliability
Increased response time &
speed
Low power consumption
Easy replacement
Higher yield
DRAWBACK OF ICs
Coils & inductors cannot be fabricated
ICs function are fairly low voltage
They handle only limited amount of power
They are quite delicate and cannot
withstand rough handling or excessive heat

Integrated Circuits

Uploaded by

Copyright:

Available Formats

Integrated Circuits

Uploaded by

Document Information

Original Description:

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Integrated Circuits

Uploaded by

Copyright:

Available Formats

WHAT IS AN INTEGRATED

which both the active & passive

Electronic circuitry starts after

person who develop

CIRCUITS PER CHIP

STONE or more appropriately Single

These have advantage of lower cost and

THICK & THIN FILM IC

thin film are not their relative thickness but

film of conducting material through a mask

employed to create the desired circuit

These have advantages of forming passive

components of broader range.

interconnecting a number of individual

LINEAR ICs (LICs)

digital and mostly used in military and

Small signal amp.

by digital IC which is mostly used in

USES OF DIGITAL ICs

withstand rough handling or excessive heat

You might also like