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    Special Cells: - Decap Cells - Endcap Cells - Tap Cells - Spare Cells - Antenna Diode - Filler Cells - Tie Cells

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    sravan
    This document describes different types of cells used in integrated circuit design including decap cells, endcap cells, tap cells, spare cells, antenna diode cells, filler cells, and tie cells. Decap cells contain decoupling capacitors to reduce dynamic voltage drop. Endcap cells are placed at row edges to prevent damage and meet design rules. Tap cells avoid latchup by tying wells and substrates. Spare cells allow for error correction. Filler cells connect gaps between cells. Tie cells prevent damage by tying gates to power and ground.

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    Special Cells: - Decap Cells - Endcap Cells - Tap Cells - Spare Cells - Antenna Diode - Filler Cells - Tie Cells

    Uploaded by

    sravan
    205 views17 pages
    This document describes different types of cells used in integrated circuit design including decap cells, endcap cells, tap cells, spare cells, antenna diode cells, filler cells, and tie cells. Decap cells contain decoupling capacitors to reduce dynamic voltage drop. Endcap cells are placed at row edges to prevent damage and meet design rules. Tap cells avoid latchup by tying wells and substrates. Spare cells allow for error correction. Filler cells connect gaps between cells. Tie cells prevent damage by tying gates to power and ground.

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    special Cells used in PD...

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    Special Cells

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    This document describes different types of cells used in integrated circuit design including decap cells, endcap cells, tap cells, spare cells, antenna diode cells, filler cells, and tie cells. Decap cells contain decoupling capacitors to reduce dynamic voltage drop. Endcap cells are placed at row edges to prevent damage and meet design rules. Tap cells avoid latchup by tying wells and substrates. Spare cells allow for error correction. Filler cells connect gaps between cells. Tie cells prevent damage by tying gates to power and ground.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    205 views17 pages

    Special Cells: - Decap Cells - Endcap Cells - Tap Cells - Spare Cells - Antenna Diode - Filler Cells - Tie Cells

    Uploaded by

    sravan
    This document describes different types of cells used in integrated circuit design including decap cells, endcap cells, tap cells, spare cells, antenna diode cells, filler cells, and tie cells. Decap cells contain decoupling capacitors to reduce dynamic voltage drop. Endcap cells are placed at row edges to prevent damage and meet design rules. Tap cells avoid latchup by tying wells and substrates. Spare cells allow for error correction. Filler cells connect gaps between cells. Tie cells prevent damage by tying gates to power and ground.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    of 17
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    Decap cells, endcap cells, tap cells, spare cells, antenna diodes, filler cells and tie cells are different types of cells used in integrated circuit design and manufacturing. Each type of cell serves a specific purpose related to power distribution, preventing cell damage, or accommodating design changes.

    Decap cells, also known as decoupling capacitor cells, have a capacitor placed between the power rail and ground rail. They are used to overcome dynamic voltage drop caused by high transient currents drawn from the power grid.

    Endcap cells are placed at the edges of a cell row to avoid cell damage at the row ends and prevent issues during manufacturing from incorrect laser wavelength. They also help satisfy design rules.

    Special cells

    • Decap cells
    • Endcap cells
    • Tap cells
    • Spare cells
    • Antenna diode
    • Filler cells
    • Tie cells
    Decap cells
    – Charge Sharing;To avoid the Dynamic IR drop ,charge stores in
    the cells and release the charge to Nets.
    – Decoupling capacitor cells , or Decap cells, are cells that have a
    capacitor placed.
    – Between the Power rail and Ground rail to Over come Dynamic
    voltage drop.
    – Dynamic IR Drop happens at the active edge of the clock at
    which a High currents is drawn from the Power Grid for a small
    Duration.
    – If the Power is far from a flop the chances are there that flop
    can go into Metastable State.
    – To overcome decaps are added , when current requirements is
    High this Decaps discharges and provide boost to the power
    grid.
    Endcap cells
    – To Know the end of the row,and At the edges endcap cells are
    placed to avoid the cells damages at the end of the row to
    avoid wrong laser wavelength for correct manufacturing.
    – You can add Endcap cells at both Ends of a cell row.
    – placed at the edge of row.
    – The library cells do not have cell connectivity as they are only
    connected to Power and Ground rail,
    – Thus ensure that gaps do not occure between "WELL" and
    "IMPLANT LAYER" and to prevent the DRC violations by
    satisfying "WELL TIE - OFF" requirements for core rows we use
    End cap cells.
    – Usually adding the "Well Extension" for DRC correct designs.
    – End caps are a "POLY EXTENSION" to avoid drain source SHORT
    Tap cells
    – Avoids Latch up Problem(Placing these cells with a
    particular distance).
    – Cells are physical-only cells that have power and ground
    pins and dont have signal pins.
    – Tap cells are well-tied cells that bias the silicon
    infrastructure of n-wells or p-wells.
    – They are traditionally used so that Vdd or Gnd are
    connected to substrate or n-well respectively.
    – This is to Help TIE Vdd and Gnd which results in lesser
    drift and prevention from latchup.
    – Required by some technology libraries to limit resistance
    between Power or Ground connections to well of the
    substrate.
    Spare cells

    – Used at the ECO.


    – Spare cells are standard cells in a design that are
    not used by the netlist.
    – Placing the spare cells in your design provides a
    margin for correcting logical error that might be
    detected later in the design flow, or for adjusting
    the speed of your design.
    – Spare cells are used by the fix ECO command
    during ECO process.
    Antenna diode
    • Antenna violation:
    Filler cells
    – Filler cells are used to connect the gaps between the cells
    after placement.
    – Filler cells are used to establish the continuity of the N-
    Wells and the IMPLANT LAYERS on the standard cells
    rows, some of the cells also don't have the Bulk
    Connection (Substrate connection) Because of their small
    size (thin cells).
    – In those cases, the abutment of cells through inserting
    filler cells can connect those substrates of small cells to
    the Power/Ground nets.
    – i.e. those tin cells can use the Bulk connection of the
    other cells(this is one of the reason why you get stand
    alone LVS check failed on some cells)
    Tie cells
    • It is used for preventing Damage of cells; Tie High
    cell(Gate One input is connected to Vdd, another input is
    connected to signal net);Tie low cells Gate one input is
    connected to Vss, another input is connected to signal .
    • Tie - high and Tie - low cells are used to connect the gate of
    the transistor to either Power and Ground.
    • In lower technology nodes, if the gate is connected to
    Power or Ground. The transistor might be turned
    "ON/OFF" due to Power or Ground Bounce.
    • These cells are part of the std cell library.
    • The cells which require Vdd(Typically constant signals tied
    to 1) conncet to tie high cells.
    • The cells which require Vss/Vdd (Typically constant signals
    tied to 0) connect to tie low cells.

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