GND and AGND

Progress Report
Muhammad Faizan Malik

04/16/2024
1
Weekly Progress
1. Digital Isolator Design Guide
2. Addressing High-Voltage Design Challenges With Reliable and
Affordable Isolation Technologies
3. CMU 009 Digital Isolator Capacitance
2
Digital Isolator Design Guide
Parameters of Interest
• Isolation Performance:
– and
– and
• Timing Parameters:
– Data rate
– Propagation Delay
– Glitch Filter
3
Parameters of Interest
• Common Mode Transient Immunity (CMTI):
– CMTI indicates the isolator’s ability to tolerate fast changes in the potential
difference between its grounds, or in other words, fast changes in common
mode, without causing bit errors. High CMTI indicates a robust isolation
channel.
• Power Consumption:
– Creepage and Clearance: Distance along the surface of the package and through the air
between pins on one side of the isolator to the pins on the other side. System level standards
mandate minimum values of these parameters based on the working voltage, the peak transient
voltage, and the surge voltage.
– Comparative Tracking Index (CTI) indicates the ability of the package mold compound to
handle steady high voltage without surface degradation. A higher CTI allows the use of smaller4
packages for the same working voltage.
Decoupling Capacitors
• “When connecting a capacitor between the power and ground planes,
the power supply is actually loaded with a series resonant circuit, whose
frequency dependent R-L-C components represent the equivalent circuit
of a real capacitor. Figure shows the parasitic components of an initial
equivalent circuit and their conversion into a series resonant circuit”.
5
Decoupling Capacitors
Note that the ESR is frequency dependent, and contrary to
popular belief, does not reach its minimum at SRF. The
impedance Z.
The reason why the paralleling of capacitors in a distributed
decoupling network works is because the total capacitance
increases to CTOT = C × n, where n is the number of
decoupling capacitors used. And with Xc = 1/(ω × C), the
capacitor impedance is reduced to Xc = 1/(n × ω × C) for
frequencies below SRF. Similarly, this holds true for the
inductance. Here LTOT = L/n, and because XL = ω × L, the
impedance decreases to XL = ω × L/n for frequencies above
SRF. Designing a solid decoupling network must include lower
frequencies down to dc, which requires the implementation of
large bypass capacitors. Therefore, to provide sufficient low
impedance at low frequencies, place 1-μF to 10-μF tantalum
capacitors at the output of voltage regulators and at the point
where power is supplied to the PCB. For the higher frequency
range, place several 0.1-μF or 0.01-μF ceramic capacitors next 6
to every high-speed switching IC.
Addressing High-Voltage Design Challenges With Reliable and Affordable
Isolation Technologies
When GND1 is broken from GND2, I1 is

galvanically isolated from I2. Since there is no
commonality between GND1 and GND2, there is
no common DC GND current shared through the
isolation barrier.
In addition to isolating shared GND connections
and signal communication without conduction, it
is also possible to use galvanic isolation for
voltage-level shifting, since GND2 is transferable
to a different floating potential relative to GND1.
7
Addressing High-Voltage Design Challenges With Reliable and Affordable
Isolation Technologies
High-speed gate-driver signals and digital communication

signals must all cross the isolation barrier. Many analog
and digital circuits have specific bias voltage
requirements where both digital signals and power cross
the isolation barrier. An isolated high-resolution analog-
to-digital converter (ADC) may require 3.3 V in the same
system, whereas an isolated gate driver may require +15
V and –5 V. These requirements necessitate not just the
transfer of signals across the isolation barrier but power as
well.
8
CMU 009 Digital Isolator Capacitance
ADU Digital Isolator for AGND and DGND 1000pF at 30MHz Capacitance 1000pF at 150MHz Capacitance
9
Testing at Low Frequency
1000pF at 1KHz 1000pF at 10KHz 1000pF at 100KHz
10
11
CGA7K1X7R3D102K130KA 1000pF CGA2B2C0G1H221J050BA 220pF
12

GND and AGND

Uploaded by

Copyright:

Available Formats

GND and AGND

Uploaded by

Document Information

Original Description:

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

GND and AGND

Uploaded by

Copyright:

Available Formats

Progress Report

Muhammad Faizan Malik

When GND1 is broken from GND2, I1 is

High-speed gate-driver signals and digital communication

1000pF at 1KHz 1000pF at 10KHz 1000pF at 100KHz

CGA7K1X7R3D102K130KA 1000pF CGA2B2C0G1H221J050BA 220pF

You might also like