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X-ray Lithography
X-Ray Lithography
 X-Ray Photolithography is a
process which uses X-rays to
transfer a geometric pattern
from a mask to the resist on
the substrate.
 X-rays having wavelengths of
0.04nm to 0.5nm represent
another radiation source for
high-resolution design
reproduction.
 X-ray lithography can be
extended optical resolution
of 15 nm.
Synchrotron X-ray source
A synchrotron is an extremely
powerful source of X-rays.
The X-rays are produced by
high energy electrons as they
circulate around the synchrotron.
Procedure of X-Ray Lithography
 PMMA is applied to the surface of silicon wafer
 PMMA hardens when contacted with x-rays
 X-ray mask is applied on top of silicon wafer
before exposure
 Absorber
 Membrane
 Synchrotron radiation (0.4 – 4 nm)
 Gap between substrate and mask
Applications
 IC industry
 Proposed for fabricating Gigabit-level DRAM
 Not a mainstream technique for IC fabrication
Nano electronics
MEMS applications
 High aspect ratio devices
X-Ray Lithography - Pros
 Shorter wavelength (0.4 – 4nm) than UV light
 High penetration, high resolution
 Minimum feature size around 10 – 20 nm
 Simple process – can use both positive and negative resists
 Essentially negligible diffraction
 Longer mask lifetime than with photolithography
X-Ray Lithography - Cons
 Very costly (compared to photolithography)
 Requires special masks and resists
 X-ray absorbers: gold and tungsten
 X-ray membrane: silicon carbide or diamond
 X-rays cannot be focused -> prevents the use of
lenses
Thank You

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X-ray lithography

  • 2. X-Ray Lithography  X-Ray Photolithography is a process which uses X-rays to transfer a geometric pattern from a mask to the resist on the substrate.  X-rays having wavelengths of 0.04nm to 0.5nm represent another radiation source for high-resolution design reproduction.  X-ray lithography can be extended optical resolution of 15 nm.
  • 3. Synchrotron X-ray source A synchrotron is an extremely powerful source of X-rays. The X-rays are produced by high energy electrons as they circulate around the synchrotron.
  • 4. Procedure of X-Ray Lithography  PMMA is applied to the surface of silicon wafer  PMMA hardens when contacted with x-rays  X-ray mask is applied on top of silicon wafer before exposure  Absorber  Membrane  Synchrotron radiation (0.4 – 4 nm)  Gap between substrate and mask
  • 5. Applications  IC industry  Proposed for fabricating Gigabit-level DRAM  Not a mainstream technique for IC fabrication Nano electronics MEMS applications  High aspect ratio devices
  • 6. X-Ray Lithography - Pros  Shorter wavelength (0.4 – 4nm) than UV light  High penetration, high resolution  Minimum feature size around 10 – 20 nm  Simple process – can use both positive and negative resists  Essentially negligible diffraction  Longer mask lifetime than with photolithography
  • 7. X-Ray Lithography - Cons  Very costly (compared to photolithography)  Requires special masks and resists  X-ray absorbers: gold and tungsten  X-ray membrane: silicon carbide or diamond  X-rays cannot be focused -> prevents the use of lenses