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View all- Forero FChampac VRenovell M(2022)B-open Defect: A Novel Defect Model in FinFET TechnologyACM Journal on Emerging Technologies in Computing Systems10.1145/356424419:1(1-19)Online publication date: 16-Sep-2022
Effectiveness of Low-Voltage Testing to Detect Interconnect Open Defects Under Process Variations
Pages 378 - 382
Abstract
Interconnect opens are a major class of defects found in today’s nanometer technologies. These defects present subtle behavior that could lead to test escapes and hence compromise test quality. Furthermore, they could become a reliability risk. Low-voltage testing has been suggested as a static test to improve the defect coverage of interconnect opens. In nanometer technologies, process variability is predominant and considering only the nominal value of parameters is not realistic. Hence, process variations should be considered to analyze the behavior of interconnect opens. In this brief, the detection capabilities of low-voltage testing for interconnect opens considering process variations is investigated. A statistical model is used for the interconnect open defect. Correlation between parameters of the affected gates and spatial correlation of the parameters for those gates tied to the defective floating node have been considered. The proposed methodology is implemented in a software tool to determine the probability of detection of via opens for some ISCAS85 benchmark circuits. Based on these results, it is suggested to use low <inline-formula> <tex-math notation="LaTeX">$V_{\rm DD}$ </tex-math></inline-formula> in conjunction with favorable logic conditions at the coupling lines to enhance the defect coverage of interconnect opens leading to better test quality and higher product reliability.
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Index Terms
- Effectiveness of Low-Voltage Testing to Detect Interconnect Open Defects Under Process Variations
Index terms have been assigned to the content through auto-classification.
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View all- Forero FChampac VRenovell M(2022)B-open Defect: A Novel Defect Model in FinFET TechnologyACM Journal on Emerging Technologies in Computing Systems10.1145/356424419:1(1-19)Online publication date: 16-Sep-2022
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