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ICCAD '01: Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
2001 Proceeding
  • Conference Chair:
  • Rolf Ernst
Publisher:
  • IEEE Press
Conference:
ICCAD01: International Conference on Computer Aided Design San Jose California November 4 - 8, 2001
ISBN:
978-0-7803-7249-8
Published:
04 November 2001
Sponsors:
SIGDA, IEEE Circuits & Systems Society, The IEEE Computer Society DATC

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Abstract

On behalf of the ICCAD 2001 Executive and Technical Program committees, I would like to welcome you to the International Conference on Computer-Aided Design which will take place November 4 - 8 at the San Jose DoubleTree Hotel.The main part of the ICCAD program consists of 30 technical paper sessions. The 92 papers which will be presented in these sessions were selected from 301 paper submissions. The technical paper sessions are complemented by 5 embedded tutorials, each giving an overview on the most recent developments in an emerging or hot topic presented by leading experts in the field. This time, the embedded tutorials cover embedded software & systems, platform based design, RF and analog synthesis, power design issues, and EDA problems of MEMS design. A panel on Wednesday afternoon titled "Automatic Hierarchical Design: Fantasy or Reality?" will discuss the highly controversial matter of hierarchical versus flat design.A core task of forward looking EDA research is the observation of long term trends in design technologies to timely identify upcoming challenges and opportunities for EDA tools and methodologies. As a novel approach to increase the awareness of the EDA community for such trends, ICCAD 2001 has invited key experts to introduce and discuss materials, circuits, architectures, and design issues of nanotechnologies. The keynote, "Nanotechnology and the Information Age" by Thomas Theis, Director of Physical Sciences at IBM Research, will be followed by a panel: "Will Nanotechnology Change the Way We Design and Verify Systems?" on Monday evening, bringing together experts from different areas of this exciting research field.This technical program has been organized by the Program Chair, Larry Pileggi, and by the Vice Program Chair, Andreas Kuehlmann, with the support of the Program and the Executive Committees.Thursday, November 8, brings a new set of the very successful series of ICCAD full-day tutorials. They were organized by our tutorial chair, Hidetoshi Onodera, and will cover the topics 1) Low-Power Embedded Software: What, Why, and How? 2) Optimization Strategies for Physical Synthesis and Timing Closure 3) Signal Integrity (new edition of the best selling tutorial of ICCAD 2000) 4) Boolean Satisfiability.I hope you will enjoy the conference and experience some of the enthusiasm and excitement which spurs our research community to accept the ever increasing challenges of EDA in the deep submicron design age.

SESSION: Session 1C: Interconnect planning
Article
Analysis of substrate thermal gradient effects on optimal buffer insertion
Pages 44–48

This paper studies the effects of the substrate thermal gradients on the buffer insertion techniques. Using a non-uniform temperature-dependent distributed RC interconnect delay model, the buffer insertion problem is analyzed and design guidelines are ...

Article
A new algorithm for routing tree construction with buffer insertion and wire sizing under obstacle constraints
Pages 49–56

Buffer insertion and wire sizing are critical in deep submicron VLSI design. This paper studies the problem of constructing routing trees with simultaneous buffer insertion and wire sizing in the presence of routing and buffer obstacles. No previous ...

Article
Bus encoding to prevent crosstalk delay
Pages 57–63

The propagation delay across long on-chip buses is increasingly becoming a limiting factor in high-speed designs. Crosstalk between adjacent wires on the bus may create a significant portion of this delay. Placing a shield wire between each signal wire ...

Contributors
  • Technical University of Braunschweig

Recommendations

Acceptance Rates

Overall Acceptance Rate 457 of 1,762 submissions, 26%
YearSubmittedAcceptedRate
ICCAD '164089724%
ICCAD '133549226%
ICCAD '0751013927%
ICCAD '0349012926%
Overall1,76245726%