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Effectiveness of low power dual-Vt designs in nano-scale technologies under process parameter variations

Published: 08 August 2005 Publication History
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    This paper explores the effectiveness of dual-Vt design under aggressive scaling of technology, which results in significant increase in all components of leakage (subthreshold, gate and junction tunneling) while having large variations in process parameters. The present way of realizing high-Vt devices results in high junction tunneling leakage compared to low-Vt devices, which in turn may result in negligible leakage savings for dual-Vt designs in scaled technologies. Moreover, increase in process variation severely affects the yield of such designs. This paper suggests important measures that need to be incorporated in conventional dual-Vt design to achieve total leakage power improvement while ensuring yield. It also shows that different process options, such as metal gate work function engineering, are required to realize high-performance and low-leakage dual-Vt designs in sub-50nm technologies

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    Cited By

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    • (2015)Reducing random-dopant fluctuation impact using footer transistors in many-core systemsIntegration, the VLSI Journal10.1016/j.vlsi.2014.06.00548:C(46-54)Online publication date: 1-Jan-2015
    • (2011)Process variation aware dual-Vth assignment technique for low power nanoscale CMOS designMicroelectronics Reliability10.1016/j.microrel.2011.04.01151:12(2357-2365)Online publication date: Dec-2011
    • (2008)Fine-grained supply gating through hypergraph partitioning and Shannon decomposition for active power reductionProceedings of the conference on Design, automation and test in Europe10.1145/1403375.1403466(373-378)Online publication date: 10-Mar-2008
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    1. Effectiveness of low power dual-Vt designs in nano-scale technologies under process parameter variations

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        cover image ACM Conferences
        ISLPED '05: Proceedings of the 2005 international symposium on Low power electronics and design
        August 2005
        400 pages
        ISBN:1595931376
        DOI:10.1145/1077603
        Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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        Publication History

        Published: 08 August 2005

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        Author Tags

        1. dual-Vt
        2. leakage
        3. metal gate
        4. process variation
        5. yield

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        View all
        • (2015)Reducing random-dopant fluctuation impact using footer transistors in many-core systemsIntegration, the VLSI Journal10.1016/j.vlsi.2014.06.00548:C(46-54)Online publication date: 1-Jan-2015
        • (2011)Process variation aware dual-Vth assignment technique for low power nanoscale CMOS designMicroelectronics Reliability10.1016/j.microrel.2011.04.01151:12(2357-2365)Online publication date: Dec-2011
        • (2008)Fine-grained supply gating through hypergraph partitioning and Shannon decomposition for active power reductionProceedings of the conference on Design, automation and test in Europe10.1145/1403375.1403466(373-378)Online publication date: 10-Mar-2008
        • (2008)Fine-Grained Supply Gating Through Hypergraph Partitioning and Shannon Decomposition for Active Power Reduction2008 Design, Automation and Test in Europe10.1109/DATE.2008.4484709(373-378)Online publication date: Mar-2008
        • (2007)Device-aware yield-centric dual-Vt design under parameter variations in nanoscale technologiesIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2007.89868315:6(660-671)Online publication date: 1-Jun-2007
        • (2006)An evaluation of the impact of gate oxide tunneling on dual-V-based leakage reduction techniquesProceedings of the 16th ACM Great Lakes symposium on VLSI10.1145/1127908.1127935(105-110)Online publication date: 30-Apr-2006
        • (2006)Static Memory DesignHigh-Performance Energy-Efficient Microprocessor Design10.1007/978-0-387-34047-0_4(89-119)Online publication date: 2006

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