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Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays

Authors:

Sravan K. Marella,

Sachin S. SapatnekarAuthors Info & Claims

DAC '17: Proceedings of the 54th Annual Design Automation Conference 2017

Article No.: 21, Pages 1 - 6

https://doi.org/10.1145/3061639.3062266

Published: 18 June 2017 Publication History

Abstract

Modern power grids use via arrays to connect wires across metal layers. These arrays are susceptible to electromigration (EM), which creates voids under the vias, potentially causing circuit malfunction. We combine the effect of via redundancy with models that characterize the effect of via array geometry on thermomechanical stress, and determine how the choice of via arrays can affect EM-induced failure in a power grid based on IR-drop threshold based failure criteria.

References

[1]

J. Lloyd, "Black's law revisted---Nucleation and growth in electromigration failure," Microelectron. Reliab., vol. 47, no. 9, pp. 1468--1472, 2007.

[2]

V. Mishra and S. S. Sapatnekar, "The impact of electromigration in copper interconnects on power grid integrity," in Proc. DAC, pp. 88:1--88:6, 2013.

Digital Library

[3]

X. Huang, et al., "Physics-based electromigration assessment for power grid networks," in Proc. DAC, pp. 80:1--80:6, 2014.

Digital Library

[4]

D.-A. Li, et al., "Multi-Via Electromigration Lifetime Model," Proc. SISPAD, pp. 308--311, 2012.

[5]

Z. Zhang, et al., "Effect of via arrangement on electromigration performance," Proc. IRPS, pp. 4--7, 2014.

[6]

A. Heryanto, et al., "The effect of stress migration on electromigration in dual damascene copper interconnects," J. Appl. Phys., vol. 109, no. 1, pp. 013716-1--013716-9, 2011.

[7]

J.-M. Paik, et al., "Effect of low-k dielectric on stress and stress-induced damage in Cu interconnects," Microelectron. Eng., vol. 71, no. 3--4, pp. 348--357, 2004.

Digital Library

[8]

P. Packan, et al., "High performance 32nm logic technology featuring 2nd generation high-k + metal gate transistors," in Proc. IEDM, pp. 1--4, 2009.

[9]

M. A. Korhonen, et al., "Stress evolution due to electromigration in confined metal lines," J. Appl. Phys., vol. 73, no. 8, pp. 3790--3799, 1993.

[10]

A. S. Oates and M. H. Lin, "Analysis and modeling of critical current density effects on electromigration failure distributions of Cu dual-damascene vias," in Proc. IRPS, pp. 385--391, 2008.

[11]

R. J. Gleixner, et al., "Void nucleation in passivated interconnect lines: Effects of site geometries, interfaces, and interface flaws," J. Mater. Res., vol. 12, pp. 2081--2090, 1997.

[12]

R. L. de Orio, et al., "Physically based models of electromigration: From Black's equation to modern TCAD models," Microelectron. Reliab., vol. 50, no. 6, pp. 775--789, 2010.

[13]

"ABAQUS unified FEA tool." available at http://www.3ds.com/products-services/simulia/products/abaqus.

[14]

C. Alpert et al., "What makes a design difficult to route," in Proc. ISPD, pp. 7--12, 2010.

Digital Library

[15]

P. Jain, et al., "Stochastic and topologically aware electromigration analysis for clock skew," in Proc. IRPS, pp. 3D.4.1--3D.4.6, 2015.

[16]

S. R. Nassif, "Power grid analysis benchmarks," in Proc. ASP-DAC, pp. 376--381, 2008

Digital Library

Cited By

Zhao WZhang RWang D(2022)Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit InterconnectsMicromachines10.3390/mi1306088313:6(883)Online publication date: 31-May-2022
https://doi.org/10.3390/mi13060883
Wang JCai YZhou Q(2021)A Power Grids Electromigration Analysis with Via Array Using Current-Tracing Model2021 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS51556.2021.9401432(1-5)Online publication date: May-2021
https://doi.org/10.1109/ISCAS51556.2021.9401432
Wang JCai YZhou Q(2021)Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid NetworksJournal of Computer Science and Technology10.1007/s11390-021-0909-836:5(1133-1144)Online publication date: 30-Sep-2021
https://doi.org/10.1007/s11390-021-0909-8
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cover image ACM Conferences

DAC '17: Proceedings of the 54th Annual Design Automation Conference 2017

June 2017

533 pages

ISBN:9781450349277

DOI:10.1145/3061639

Copyright © 2017 ACM.

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Published: 18 June 2017

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DAC '17: The 54th Annual Design Automation Conference 2017

June 18 - 22, 2017

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Cited By

Zhao WZhang RWang D(2022)Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit InterconnectsMicromachines10.3390/mi1306088313:6(883)Online publication date: 31-May-2022
https://doi.org/10.3390/mi13060883
Wang JCai YZhou Q(2021)A Power Grids Electromigration Analysis with Via Array Using Current-Tracing Model2021 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS51556.2021.9401432(1-5)Online publication date: May-2021
https://doi.org/10.1109/ISCAS51556.2021.9401432
Wang JCai YZhou Q(2021)Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid NetworksJournal of Computer Science and Technology10.1007/s11390-021-0909-836:5(1133-1144)Online publication date: 30-Sep-2021
https://doi.org/10.1007/s11390-021-0909-8
Tan SSun ZSadiqbatcha S(2020)Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-ChipIPSJ Transactions on System LSI Design Methodology10.2197/ipsjtsldm.13.4213(42-55)Online publication date: 2020
https://doi.org/10.2197/ipsjtsldm.13.42
Zhou CFung RWen SWong RKim C(2020)Electromigration Effects in Power Grids Characterized From a 65 nm Test ChipIEEE Transactions on Device and Materials Reliability10.1109/TDMR.2019.295615820:1(74-83)Online publication date: Mar-2020
https://doi.org/10.1109/TDMR.2019.2956158
Sapatnekar SBustany ISwartz W(2019)Electromigration-Aware Interconnect DesignProceedings of the 2019 International Symposium on Physical Design10.1145/3299902.3313156(83-90)Online publication date: 4-Apr-2019
https://dl.acm.org/doi/10.1145/3299902.3313156
Wang KCao YChang CJi X(2019)High-Speed True Random Number Generator Based on Differential Current Starved Ring Oscillators with Improved Thermal Stability2019 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS.2019.8702785(1-5)Online publication date: May-2019
https://doi.org/10.1109/ISCAS.2019.8702785
Wang JLi ZYao LChen SWu F(2019)Low-Resource Hardware Architecture for Semi-Global Stereo Matching2019 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS.2019.8702234(1-4)Online publication date: May-2019
https://doi.org/10.1109/ISCAS.2019.8702234
Wang JCai YYan MZhou Q(2019)Composite Optimization for Electromigration Reliability and Noise in Power Grid Networks2019 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS.2019.8702122(1-5)Online publication date: May-2019
https://doi.org/10.1109/ISCAS.2019.8702122

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