research-article

The impact of electromigration in copper interconnects on power grid integrity

Authors:

Sachin S. SapatnekarAuthors Info & Claims

DAC '13: Proceedings of the 50th Annual Design Automation Conference

Article No.: 88, Pages 1 - 6

https://doi.org/10.1145/2463209.2488842

Published: 29 May 2013 Publication History

Abstract

Electromigration (EM), a growing problem in on-chip interconnects, can cause wire resistances in a circuit to increase under stress, to the point of creating open circuits. Classical circuit-level EM models have two drawbacks: first, they do not accurately capture the physics of degradation in copper dual-damascene (CuDD) metallization, and second, they fail to model the inherent resilience in a circuit that keeps it functioning even after a wire fails. This work overcomes both limitations. For a single wire, our probabilistic analysis encapsulates known realities about CuDD wires, e.g., that some regions of these wires are more susceptible to EM than others, and that void formation/growth show statistical behavior. We apply these ideas to the analysis of on-chip power grids and demonstrate the inherent robustness of these grids that maintains supply integrity under some EM failures.

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Cited By

Dong XChen YChen JWang YLi JNi TShi ZYin XZhuo C(2023)Worst-case Power Integrity Prediction Using Convolutional Neural NetworkACM Transactions on Design Automation of Electronic Systems10.1145/356493228:4(1-19)Online publication date: 17-May-2023
https://dl.acm.org/doi/10.1145/3564932
Al Shohel MChhabria VEvmorfopoulos NSapatnekar S(2023)Frequency-Domain Transient Electromigration Analysis Using Circuit Theory2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323810(1-8)Online publication date: 28-Oct-2023
https://doi.org/10.1109/ICCAD57390.2023.10323810
Zhao WZhang RWang D(2022)Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit InterconnectsMicromachines10.3390/mi1306088313:6(883)Online publication date: 31-May-2022
https://doi.org/10.3390/mi13060883
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Index Terms

The impact of electromigration in copper interconnects on power grid integrity
1. Hardware

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cover image ACM Conferences

DAC '13: Proceedings of the 50th Annual Design Automation Conference

May 2013

1285 pages

ISBN:9781450320719

DOI:10.1145/2463209

Copyright © 2013 ACM.

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Published: 29 May 2013

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Cited By

Dong XChen YChen JWang YLi JNi TShi ZYin XZhuo C(2023)Worst-case Power Integrity Prediction Using Convolutional Neural NetworkACM Transactions on Design Automation of Electronic Systems10.1145/356493228:4(1-19)Online publication date: 17-May-2023
https://dl.acm.org/doi/10.1145/3564932
Al Shohel MChhabria VEvmorfopoulos NSapatnekar S(2023)Frequency-Domain Transient Electromigration Analysis Using Circuit Theory2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323810(1-8)Online publication date: 28-Oct-2023
https://doi.org/10.1109/ICCAD57390.2023.10323810
Zhao WZhang RWang D(2022)Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit InterconnectsMicromachines10.3390/mi1306088313:6(883)Online publication date: 31-May-2022
https://doi.org/10.3390/mi13060883
Hou TWong NChen QJi ZChen H(2022)A Space–Time Neural Network for Analysis of Stress Evolution Under DC Current StressingIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2022.316610341:12(5501-5514)Online publication date: Dec-2022
https://doi.org/10.1109/TCAD.2022.3166103
Weng WChen HTing YChen HWu WTu KLiao C(2022)Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper NanowiresNano Letters10.1021/acs.nanolett.2c0343722:22(9071-9076)Online publication date: 7-Nov-2022
https://doi.org/10.1021/acs.nanolett.2c03437
Al Shohel MChhabria VEvmorfopoulos NSapatnekar S(2021)Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)10.1109/ICCAD51958.2021.9643570(1-8)Online publication date: 1-Nov-2021
https://doi.org/10.1109/ICCAD51958.2021.9643570
Shohel MChhabria VSapatnekar S(2021)A New, Computationally Efficient “Blech Criterion” for Immortality in General Interconnects2021 58th ACM/IEEE Design Automation Conference (DAC)10.1109/DAC18074.2021.9586127(913-918)Online publication date: 5-Dec-2021
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Tan SSun ZSadiqbatcha S(2020)Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-ChipIPSJ Transactions on System LSI Design Methodology10.2197/ipsjtsldm.13.4213(42-55)Online publication date: 2020
https://doi.org/10.2197/ipsjtsldm.13.42
Sapatnekar SBustany ISwartz W(2019)Electromigration-Aware Interconnect DesignProceedings of the 2019 International Symposium on Physical Design10.1145/3299902.3313156(83-90)Online publication date: 4-Apr-2019
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Wang KCao YChang CJi X(2019)High-Speed True Random Number Generator Based on Differential Current Starved Ring Oscillators with Improved Thermal Stability2019 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS.2019.8702785(1-5)Online publication date: May-2019
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