SOC Encounter 2011

Training Course of SOC Encounter
REF: CIC Training Manual Cell-Based IC Physical Design and Verification with SOC Encounter, July, 2006 CIC Training Manual Mixed-Signal IC Design Concepts, July, 2007
Speaker: C. S. Hou
Outline
Basic Concept of the Placement & Routing Auto Place and Route Using SOC Encounter Hard Block Abstraction Using Abstract Generator LAB
Advanced Reliable Systems (ARES) Lab.
Basic Concept of the Placement & Routing
Cell-Based Design Flow

Spec. System Level
MATLAB/ C/ C++/ System C/ ADS/ Covergen (MaxSim) Memory Generator
RTL Level
Verilog/ VHDL
NC-Verilog/ ModelSim Debussy (Verdi)/ VCS Physical Compiler/ Magma Blast Fusion Design/ Power Compiler DFT Compiler/ TetraMAX NC-Verilog/ ModelSim Debussy (Verdi)/ VCS SOC Encounter/ Astro GDS II DRC/ LVS (Calibre)
PVS: Calibre xRC/ NanoSim (Time/ Power Mill)
Syntest
Logic Synthesis Design for Test Gate Level
Conformal/ Formality
Layout Level Post-Layout Verification
Tape Out
SOC Encounter P&R Flow

Netlist (Verilog) Timing Constraints (sdc) IO Constraints (ioc)
IO, P/G Placement Specify Floorplan Timing Analysis Pre-CTS Optimization Power Planning Power Analysis
Clock Tree Synthesis Timing Analysis Post-CTS Optimization Power Route SI Driven Route Timing/SI Analysis
GDS Netlist Spef DEF
IO, P/G Placement

Determine the positions of the PADs
Functional IO PAD Power/Ground PAD Corner PAD
Just for the connection of PAD power rings
Corner1
I1
VDD
O1
Corner2
I2
O2
IOVDD
IOVSS
I3
O3
Corner3
I4
VSS
O4
Corner4
Specify Floorplan
Determine the aspect ratio of the Core and the gap between the PAD and Core
The Core Utilization is determined in this step The final CHIP area is almost determined in this step
Hight
Width
Floorplan
Determine the related positions of Hard Blocks
The performance is highly affected Corner1 I1 VDD O1 Corner2
I2 M2 IOVDD M1 M3
O2
IOVSS
I3
O3
Corner3
I4
VSS
O4
Corner4
Amoeba Placement
Observe the result of cells and Hard Blocks placement
Power Planning
Plan the power ring & power stripe
IR-drop consideration
Clock Tree Synthesis
CLK
CLK
Power Analysis
IR-drop & electron migration
Power Route
Connect the power pins of standard cells to the global power lines
Add IO Filler
Fill the gap between PADs
Connect the PAD power rings
Routing
Construct the final interconnections
Prepare Data
Library
Physical Library (LEF)
Information of technology, standard cells, Hard Blocks, and APR
Timing Library (LIB)

Timing information of the standard cells and Hard Blocks
Capacitance Table
For more accurate RC analysis
Celtic Library
For crosstalk analysis
Not Necessary !
FireIce/Voltage Storm Library

For RC extraction and power analysis
User Data
Gate-Level Netlist (Verilog) SDC Constraint (*.sdc) IO Constraint (*.ioc)
LEF Format Process Technology

Layers POLY Contact Metal 1 Via1 Metal 2 Design Rule Net Width Net Spacing Area Enclosure Wide Metal Slot Antenna Current Density Parasitic Resistance Capacitance
LEF Format Process Technology: Layer Define
Layer Metal1 TYPE ROUTING; WIDTH 0.28; MAXWIDTH 8; AREA 0.202; SPACING 0.28; SPACING 0.6 RANGE 10.0 10000.0; PITCH 0.66; DIRECTION VERTICAL; THICKNESS 0.26; ANTENNACUMDIFFAREARATIO 5496; RESISTANCE RPERSQ 1.0e-01; CAPACITANCE CPERSQDIST 1.11e-04; EDGECAPACITANCE 9.1e-05; END Metal1
Wide Metal Spacing Width
Wide Metal
Spacing
LEF Format APR Technology

Unit Site Routing Pitch Default Direction Via Rule
LEF Format APR Technology: Site

The placement site gives the placement grid of a family of macros
a row
a site
a standard cell
Row Based PR
VDD
VSS
VDD VSS
LEF Format APR Technology: Routing Pitch, Default Direction
Metal1 Routing Pitch Via
Metal2 Routing Pitch
Horizontal Routing Metal1 Metal3 Metal5
Vertical Routing Metal2 Metal4 Metal6
LEF Format APR Technology: Via Generation

To connect the wide metal, a via array is generated to reduce the via resistance Formulas for generating via arrays are defined
Layer Metal1 Direction HORIZONTAL OVERHANG 0.2 Layer Metal2 Direction VERTICAL OVERHANG 0.2 Layer Via1 RECT -0.14 -0.14 0.14 0.14 SPACING 0.56 BY 0.56 Generated Via
Default Via
LEF Format APR Technology: Same Net Spacing
SPACING SAMENET Metal1 Metal1 0.23; SAMENET Metal2 Metal2 0.28 STACK; SAMENET Metal3 Metal3 0.28; SAMENET VIA12 VIA12 0.26; SAMENET VIA23 VIA23 0.26; SAMENET VIA12 VIA23 0.0 STACK; END SPACING
VIA12 and VIA23 Metal1 Metal3
VIA12 and VIA23 allow stack Metal1 Same Net Spacing Rule
0.23
LEF Format APR Technology: Physical Macros

Define physical data for
Standard cells I/O pads Memories Other hard macros Size Class Pins Obstructions
Describe abstract shape
LEF Format APR Technology: Physical Macros (Cont)

Metal MACRO ADD1 CLASS CORE; FOREIGN ADD1 0.0 0.0; ORIGEN 0.0 0.0; LEQ ADD; SIZE 19.8 BY 6.4; SYMMETRY x y; SITE coresite; PIN A DIRECTION INPUT; PORT LAYER Metal1; RECT 19.2 8.2 19.5 10.3; . END END A . END ADD1
VDD Y B A
VSS
Barrier
LIB Format
Operating condition
Slow, fast, typical
Pin type
Input/output/inout Function Data/clock Capacitance
Path delay Timing constraint

Setup, hold, mpwh, mpwl, recovery
Gate-Level Netlist
If designing a chip, IO PADs, power PADs, and Corner PADs should be added before the netlist is imported Make sure that there is no assign statement and no *cell* cell name in the netlist
SDC Constraint
Clock constraints Input delay/ Input drive Output delay/ Output load False path Multi-cycle path
IO Constraint
Version: 1 Pad: CORNER0 Pad: PAD_CLK Pad: PAD_HALT Pad: CORNER1 Pad: PAD_X1 Pad: PAD_X2 Pad: CORNER2 Pad: PAD_IOVDD1 Pad: PAD_IOVSS1 Pad: CORNER3 Pad: PAD_VDD1 Pad: PAD_VSS1 NW PCORNERDGZ N N
CORNER0
PAD_CLK
PAD_HALT
NE PCORNERDGZ W W SW PCORNERDGZ S PVDD2DGZ S PVSS2DGZ SE PCORNERDGZ E PVDD1DGZ E PVSS1DGZ
CORNER1
PAD_X2
PAD_VSS1
PAD_X1
PAD_VDD1
S
PAD_IOVDD1 PAD_IOVSS1
CORNER2
CORNER3
(*.ioc File)
How To Decide the NO. of Power/Ground PADs

The following factors are considered:
SSO: Simultaneously Switch Outputs SSN: The noise produced by SSO buffers DI: Maximum NO. of copies for one specific kind of IO PAD switching from high to low simultaneously without making ground voltage level higher than 0.8 volt for one ground PAD DF: Driving Factor, DF = 1/DI SDF: Sum of Driving Factor
Suggestion in SSO case:

Required NO. of ground PADs = SDF Required NO. of power PADs = SDF/1.1
SDF Example
IO Type 2mA 4mA 0.03 8mA 0.09 12mA 0.18 16mA 0.3 24mA 0.56
DF Value 0.02
If a design has 20 PDB02DGZ (2mA) and 10 PDD16DGZ (16mA). Then, SDF = 20 x 0.02 + 10 x 0.3 = 3.4 In SSO case,
NO. of VSS PAD = 3.4 4 NO. of VDD PAD = 3.4/1.1 = 3.09 4
Tips to Reduce the Power/Ground Bounce

Dont use stronger output buffers than what is necessary Use slew-rate controlled outputs Place power pad near the middle of the output buffer Place noise sensitive I/O pads away from SSO I/Os Place VDD and VSS pads next to clock input buffer
Auto Place and Route Using SOC Encounter
CHIP-Level Netlist
Ex:
If your gate-level netlist is generated by CORE-level synthesis, you should all the CHIP-level module in it
CHIP-Level Netlist (Cont)

If your design has a Hard Block, you should add an empty module for it
the module name should be the same as the cell name of the Hard Block
Ex:
(Module Declaration)
(Module Reference) Connected Wire Name in Verilog
Pin Name in SPICE

CHIP-Level Timing Constraint

Ex:
CHIP-Level Clock Declaration
Set False Path to Your Test Pins Set Parameters to the PAD IO
Getting Started
linux %> ssh -l user name cae18.ee.ncu.edu.tw unix %> source /APP/cad/cadence/SOC/CIC/soc.csh unix %> encounter (Do not run in the background mode !!)
Connect to Unix
Import Design <Design>

Design/Design Import Verilog Files: your gate-level netlist Tot Cell LEF Files (*.lef): including all the LEF files of cell libraries & hard blocks LIB Files (*.lib):
Max Timing Libraries Min Timing Libraries Common Model Libraries
IO Assignment File: *.ioc
Import Design <Timing>

Capacitance Table File Timing Constraint File: *.sdc
Import Design <Power> <IPO/CTS>

Power Nets Ground Nets Footprints for In-Place Layout Optimization (IPO) and Clock Tree Synthesis (CTS)
Import Design <Misc.>

QX Tech File QX Library Directory
(Floorplan View)
Global Net Connection

Floorplan/Global Net Connections
Specify Floorplan
Floorplan/Specify Floorplan
CORE Area
Specify Scan Chain

encounter %> specifyScanChain ScanChainName - start {ftname | instPinName} - start {ftname | instPinName} encounter %> scantrace
Ex:
(result)
Hard Block Placement

Move/Resize/Reshape floorplan object
Edit Block Halo

Floorplan/Edit Block Halo Reserve space without standard cell placement
Standard Cell Placement

Place/Place
Power Planning Add Rings

Floorplan/Custom Power Planning/Add Rings
Power Planning Add Block Rings

Floorplan/Custom Power Planning/Add Rings
Example for Power Rings
PAD Pins
Route/SRoute
Power Planning Add Stripes

Floorplan/Custom Power Planning/Add Stripes
Power Planning Add Stripes (Cont)

Ex:
Fix Un-Connected Stripes

Route/SRoute
Flow Clock Tree Synthesize
Create Clock Tree Spec clock spec Specify Clock Tree

Modify
Synthesis Clock Tree
Netlist Synthesis report Clock nets Routing guide
Display Clock Tree
Create/Specify/Synthesis Clock Tree Spec.

Clock/Create Clock Tree Spec
Clock/Specify Clock Tree
(Clock Spec.) Clock/Synthesis Clock Tree
Example for CTS Report
Display Clock Tree

Clock/Display/Display Clock Tree
Ex:
Power Analysis
Power/Edit Pad Location Power/Power Analysis/Statistical
Ex:
Power/Edit Net Toggle Probability
(Power Analysis Report)

Example for Rail Analysis of IR-Drop & EM
(IR-Drop)
(EM)
Power Route
Route/SRoute
IO Filler
encounter %> source addIoFiller.cmd
Nano Route
Route/NanoRoute
Example for Nano Route
Cell Filler
Place/Filler/Add Filler
Ex:
Save Design
Design/Save/Netlist *.v Timing/Calculate Delay *.sdf Design/Save/DEF *.def
SELECT Save Scan
Bounding PAD
unix %> chmod 755 addbonding.pl unix %> /usr/bin/perl addbonding.pl CHIP.def encounter %> source bondPads.cmd
Ex:
Save GDSII
Design/Save/GDS *.gds
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What is the overall design flow described in the document?

What is the overall design flow described in the document?

What are the main steps involved in floorplanning?

What are the main steps involved in floorplanning?

Training Course of SOC Encounter

Advanced Reliable Systems (ARES) Lab.

Basic Concept of the Placement & Routing

Advanced Reliable Systems (ARES) Lab.

Cell-Based Design Flow

Logic Synthesis Design for Test Gate Level

Layout Level Post-Layout Verification

SOC Encounter P&R Flow

Advanced Reliable Systems (ARES) Lab.

IO, P/G Placement

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Clock Tree Synthesis

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Timing Library (LIB)

FireIce/Voltage Storm Library

LEF Format Process Technology

Advanced Reliable Systems (ARES) Lab.

LEF Format Process Technology: Layer Define

Wide Metal Spacing Width

Advanced Reliable Systems (ARES) Lab.

LEF Format APR Technology

Advanced Reliable Systems (ARES) Lab.

LEF Format APR Technology: Site

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

LEF Format APR Technology: Routing Pitch, Default Direction

Metal1 Routing Pitch Via

Metal2 Routing Pitch

Horizontal Routing Metal1 Metal3 Metal5

Vertical Routing Metal2 Metal4 Metal6

Advanced Reliable Systems (ARES) Lab.

LEF Format APR Technology: Via Generation

LEF Format APR Technology: Same Net Spacing

VIA12 and VIA23 Metal1 Metal3

Advanced Reliable Systems (ARES) Lab.

LEF Format APR Technology: Physical Macros

Describe abstract shape

Advanced Reliable Systems (ARES) Lab.

LEF Format APR Technology: Physical Macros (Cont)

Advanced Reliable Systems (ARES) Lab.

Path delay Timing constraint

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

Advanced Reliable Systems (ARES) Lab.

NE PCORNERDGZ W W SW PCORNERDGZ S PVDD2DGZ S PVSS2DGZ SE PCORNERDGZ E PVDD1DGZ E PVSS1DGZ

How To Decide the NO. of Power/Ground PADs

Suggestion in SSO case:

Advanced Reliable Systems (ARES) Lab.