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After Schematic The Procedure To Follow To Create Footprint: Step 1

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AFTER SCHEMATIC THE PROCEDURE TO FOLLOW TO CREATE FOOTPRINT : STEP 1 :

All prog > cadence > release 16.3 > pcb editor utilities > PAD DESIGNER.

For Through Hole components :

For SMD components : 1. For Begin layer :

2. For SloderMask_Top layer :

After this set up to save the file format : File > save > file name > For TH : TH(width)REC(height).pad For SMD : SMD(width)REC(height).pad

3. For PastMask_Top layer :

STEP 2 :

All prog > cadence > release 16.3 > PCB EDITOR 1. File > new >

Drawing Name : SOIC_(no of pins)P_(pitch)_(assembly).dra After filling the drawing name and selecting PACKAGE SYMBOLY (WIZARD) click OK Enable SOIC > Next

Click on Load template > Next

Here in this window we need to enter

Units used to enter dimensions in this wizard : Millimeters Accuracy : 3 Units used to create package symbol : Mils Accuracy : 2 Click on Next

Here in this window we need to enter We need to enter the following details : No of pins (N) : Lead pitch (e) : Terminal row spacing (e1) : Packaging width (E) : Packaging length (D) : After filling Click on NEXT

Here in this window we need to provide The path of before saved PADSTACK file in both the conditions. Click NEXT

Here in this window we need to Enable : For SMD : center of the symbol body. For TH : pin 1 of symbol.

After enabling click on NEXT then FINISH, we will get new window of footprint we created. We see the window below.

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