FloBoss Manual
FloBoss Manual
FloBoss Manual
Revision Tracking Sheet February 2007 This manual may be revised periodically to incorporate new or updated information. The revision date of each page appears at the bottom of the page opposite the page number. A change in revision date to any page also changes the date of the manual that appears on the front cover. Listed below is the revision date of each page (if applicable):
Revision Feb-07
ROCLINK and FloBoss are trademarks of one of the Emerson Process Management companies. The Emerson logo is a trademark and service mark of Emerson Electric Co. All other marks are the property of their respective owners. 2007 Remote Automation Solutions, division of Emerson Process Management. All rights reserved. Printed in the U.S.A. www.EmersonProcess.com/flow While this information is presented in good faith and believed to be accurate, Emerson Process Management does not guarantee satisfactory results from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee, express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, nor as a recommendation to use any product or process in conflict with any patent. Emerson Process Management reserves the right, without notice, to alter or improve the designs or specifications of the products described herein.
ii
Issued Feb-07
Contents
Chapter 1 General Information
1.1 1.2 1.3
1-1
1.4
1.5 1.6
1.7 1.8
Scope of Manual............................................................................................................... 1-2 FloBoss 107 Overview...................................................................................................... 1-2 Hardware .......................................................................................................................... 1-5 1.3.1 Processor and Memory ...................................................................................... 1-6 1.3.2 Backplane........................................................................................................... 1-6 1.3.3 Expansion Rack ................................................................................................. 1-6 1.3.4 Central Processing Unit (CPU)........................................................................... 1-6 1.3.5 Battery and Super-capacitor............................................................................... 1-8 1.3.6 Built-in Inputs and Outputs ................................................................................. 1-8 1.3.7 Built-in Communications..................................................................................... 1-8 1.3.8 Built-in Resistance Thermal Device (RTD) ...................................................... 1-10 1.3.9 Built-in Loop Output Power .............................................................................. 1-10 1.3.10 Optional Inputs and Outputs............................................................................. 1-10 1.3.11 Optional Communication Module COM3....................................................... 1-11 1.3.12 Optional Multi-Variable Sensor (MVS) ............................................................. 1-11 1.3.13 Optional License Key ....................................................................................... 1-12 Firmware......................................................................................................................... 1-12 1.4.1 History Points ................................................................................................... 1-13 1.4.2 Alarm Log ......................................................................................................... 1-15 1.4.3 Event Log ......................................................................................................... 1-15 1.4.4 Security............................................................................................................. 1-16 1.4.5 I/O Database .................................................................................................... 1-16 1.4.6 Function Sequence Tables (FST) .................................................................... 1-16 1.4.7 PID Control ....................................................................................................... 1-16 1.4.8 Spontaneous-Report-By-Exception (SRBX) Alarming ..................................... 1-17 1.4.9 Softpoints.......................................................................................................... 1-17 1.4.10 Opcodes ........................................................................................................... 1-17 1.4.11 Pass Through Communications ....................................................................... 1-18 1.4.12 ROC and Modbus Protocols............................................................................. 1-18 1.4.13 User C Programs.............................................................................................. 1-18 ROCLINK 800 Configuration Software........................................................................... 1-19 Product Electronics......................................................................................................... 1-20 1.6.1 Real-Time Clock............................................................................................... 1-20 1.6.2 Diagnostic Monitoring....................................................................................... 1-20 1.6.3 Automatic Self Tests ........................................................................................ 1-21 1.6.4 Low Power Mode.............................................................................................. 1-21 Flow Measurements ....................................................................................................... 1-21 Additional Information..................................................................................................... 1-23
2-1
2.2 2.3
Installation Requirements ................................................................................................. 2-1 2.1.1 Environmental Requirements ............................................................................. 2-1 2.1.2 Site Requirements.............................................................................................. 2-2 2.1.3 Compliance with Hazardous Area Standards .................................................... 2-4 Power Installation Requirements...................................................................................... 2-5 Grounding Installation Requirements ............................................................................... 2-5 2.3.1 Installing Grounding for the FloBoss 107 ........................................................... 2-6 2.3.2 I/O Wiring Requirements .................................................................................... 2-7 Contents iii
Issued Feb-07
2.4
2.5 2.6
2.7 2.8
Installing the FloBoss 107 and Expansion Rack .............................................................. 2-7 2.4.1 Required Tools ................................................................................................... 2-7 2.4.2 Installing the FloBoss 107 without an Expansion Rack ..................................... 2-8 2.4.3 Installing the FloBoss with an Expansion Rack.................................................. 2-9 2.4.4 Removing an Expansion Rack ......................................................................... 2-11 2.4.5 Removing and Installing Module Covers.......................................................... 2-11 2.4.6 Removing and Installing Wire Channel Covers................................................ 2-12 Memory Backup Battery ................................................................................................. 2-12 2.5.1 Removing and Installing the Battery ................................................................ 2-13 Central Processor Unit (CPU) ........................................................................................ 2-13 2.6.1 Removing the CPU Module.............................................................................. 2-14 2.6.2 Installing the CPU Module................................................................................ 2-15 License Keys .................................................................................................................. 2-16 Startup and Operation .................................................................................................... 2-16 2.8.1 Startup .............................................................................................................. 2-16 2.8.2 Operation.......................................................................................................... 2-17
3-1
Power Input Descriptions.................................................................................................. 3-1 Determining Power Consumption..................................................................................... 3-3 Wiring Connections .......................................................................................................... 3-8 Wiring Power to the CPU Module..................................................................................... 3-9
4-1
I/O Description .................................................................................................................. 4-1 Installing a Module............................................................................................................ 4-5 Removing a Module.......................................................................................................... 4-6 Wiring a Module................................................................................................................ 4-6 Selecting the Type of I/O .................................................................................................. 4-7 Analog Inputs (AI) ............................................................................................................. 4-9 4.6.1 Wiring the Analog Inputs .................................................................................... 4-9 4.7 Analog Outputs (AO) ...................................................................................................... 4-11 4.7.1 Wiring the Analog Outputs ............................................................................... 4-11 4.8 Discrete Inputs (DI)......................................................................................................... 4-12 4.8.1 Wiring the Discrete Inputs ................................................................................ 4-13 4.9 Discrete Outputs (DO) .................................................................................................... 4-13 4.9.1 Wiring the Discrete Outputs ............................................................................. 4-14 4.10 Pulse Inputs (PI) ............................................................................................................. 4-15 4.10.1 Wiring the Pulse Inputs .................................................................................... 4-16 4.11 Resistance Temperature Detector (RTD) Input.............................................................. 4-16 4.11.1 Wiring the RTD Input........................................................................................ 4-17
Chapter 5 Communications
5.1 5.2 5.3 5.4 5.5 5.6
5-1
Communications Overview............................................................................................... 5-1 Installing/Removing a Communications Module .............................................................. 5-4 Wiring the Local Operator Interface (LOI) Port................................................................. 5-5 5.3.1 Using the LOI ..................................................................................................... 5-5 Wiring EIA-485 (RS-485) Communications...................................................................... 5-6 Wiring EIA-232 (RS-232) Communications...................................................................... 5-7 Wiring the Liquid Crystal Display (LCD) ........................................................................... 5-8
iv
Contents
Issued Feb-07
6-1
MVS Overview .................................................................................................................. 6-1 Installing/Removing an MVS Module ............................................................................... 6-3 Configuring a Multi-drop MVS Module Setup ................................................................... 6-3 MVS Lightning Protection ................................................................................................. 6-5
Chapter 7 Troubleshooting
7.1 7.2 7.3
7-1
7.4
General Guidelines........................................................................................................... 7-1 Graphical User Interface (GUI)......................................................................................... 7-2 Checklists ......................................................................................................................... 7-3 7.3.1 LEDs................................................................................................................... 7-3 7.3.2 Serial Communications ...................................................................................... 7-3 7.3.3 Inputs/Outputs .................................................................................................... 7-4 7.3.4 Preserving Configuration and Log Data ............................................................. 7-5 7.3.5 ROCLINK 800 Configuration Software............................................................... 7-5 7.3.6 Powering Up ....................................................................................................... 7-6 7.3.7 Multi-Variable Sensor (MVS).............................................................................. 7-6 7.3.8 Resistance Thermal Device (RTD)..................................................................... 7-7 Procedures ....................................................................................................................... 7-7 7.4.1 Resetting the FB107........................................................................................... 7-7 7.4.2 Restarting and Reconfiguring the FB107 ........................................................... 7-8 7.4.3 Troubleshooting Analog Inputs .......................................................................... 7-8 7.4.4 Troubleshooting Analog Outputs........................................................................ 7-9 7.4.5 Troubleshooting Discrete Inputs ...................................................................... 7-10 7.4.6 Troubleshooting Discrete Outputs.................................................................... 7-11 7.4.7 Troubleshooting Pulse Inputs........................................................................... 7-11 7.4.8 Troubleshooting RTD Inputs ............................................................................ 7-12 7.4.9 Troubleshooting MVS....................................................................................... 7-13
Appendix A Glossary
A-1
Index
I-1
Issued Feb-07
Contents
vi
Contents
Issued Feb-07
1.4
1.5 1.6
1.7 1.8
Issued Feb-07
General Information
1-1
1.2
operation using a personal computer (PC) running ROCLINK 800 (ROCLINK 800) software. The FB107 can measure up to four meter runs through a variety of devices, such as an orifice plate, turbine meter, or other pulse-generating devices. Meter inputs may also use analog transmitters. For multiple differential pressure-run applications, you can add an optional MultipleVariable Sensor (MVS) module to provide an interface to remote MVS transmitters. The FB107 performs minute, hourly, daily, and minimum / maximum historical data archival for standard history and a configurable time interval archival for extended history. The solution to electronically replace traditional paper charting, the FB107 records the corrected flow for differential or pulse counts and stores the data. The FB107 computes flow for both volume and energy. It provides onsite functionality and supports remote monitoring, measurement, data archival, communications, and control. It stores the results of the flow
1-2
General Information
Issued Feb-07
calculations in memory and can be communicated to an external device either on demand or periodically. The FB107 design allows you to configure specific applications, including those requiring logic and sequencing control using a Function Sequence Table (FST).
Local (LOI) Communication Port Slot 0 = CPU Module Slot 3 = I/O or MVS module Slot 2 = I/O, MVS module, or COM module (COM2) Slot 1 = I/O, MVS, or COM module (COM3)
Issued Feb-07
General Information
1-3
1-4
General Information
Issued Feb-07
Figure 1-3. FloBoss 107 with Expansion Rack The FB107 provides the following components and features: 32-bit processor board, inter-connect board, and backplane board. Central processing unit (CPU). Field upgradeable 2 MB flash ROM (read only memory). 2 MB battery backed-up RAM (random access memory) storage. Two-, three-, or four-wire 100-ohm resistance thermal device (RTD) input. Battery and super-capacitor backed memory retention to provide short and longer-term data, configuration, and operational integrity when the FB107 is not in service or is in storage. Three built-in communication ports. Input power and output loop power. Extensive applications firmware.
1.3
Hardware
The FB107 is available with four basic configurations: Non-isolated CPU without I/O. Non-isolated CPU with six points of I/O. Isolated CPU without I/O. Isolated CPU with six points of I/O.
Issued Feb-07
General Information
1-5
FloBoss 107 Instruction Manual Note: Isolation occurs between the CPU and the field logic.
The FB107 base unit has four slots. Slot 0 is reserved for the CPU module, which provides three communication ports, an RTD, power input, loop power output, system variables, and optional 6 points of I/O. Slots 1 and 2 can each contain one communication module. Slots 1, 2, and 3 can contain input/outputs (I/O), MVS, and smart application modules.
1.3.2 Backplane
The backplane board routes signals to and from the CPU to the I/O modules, smart application modules, expansion rack, the Multi-Variable Sensor, and communication modules.