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P-Channel Enhancement Mode MOSFET: Features Pin Description

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Axelite Confidential Materials, do not copy or distribute without written consent

Features Pin Description


-20V/-2.5A,
R
DS(ON)
=85m (typ.) @ V
GS
=-4.5V
R
DS(ON)
=110m (typ.) @ V
GS
=-2.5V
Super High Dense Cell Design
Reliable and Rugged

G
D
S
Top View
SOT-23

D
G
S

P Channel MOSFET
Applications
Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems.
Ordering and Marking Information


Package
R : SOT23-3L
Packing
Blank : Tube
A M2301
A1XXX AM2301 :
XXX
Date Code
Packing
Package

AM2301
A : Taping
1
P-Channel Enhancement Mode MOSFET
Rev. 1.0 Sep.06, 2010

2

Absolute Maximum Ratings (T
A
=25C Unless Otherwise Noted)

Symbol Parameter Rating Unit
V
DSS
Drain-Source Voltage
-20
V
V
GSS
Gate-Source Voltage
12
I
D
* Continue Drain Current -2.5
A
I
DM
* Pulsed Drain Current -10
I
S
* Diode continuous forward current -1.5 A
T
J
Maximum J unction Temperature 150
C
T
STG
Storage Temperature Range -55 to 150
P
D
* Maximum Power Dissipation
T
A
=25C 0.83
W
T
A
=100C 0.3
R
J A
* Thermal Resistance-J unction to Ambient
150 C/W
Notes
*Surface Mounted on 1in
2
pad area, t 10sec.

Electrical Characteristics (T
A
=25C Unless Otherwise Noted)

Symbol Parameter Test Condition
AM2301
Unit
Min. Typ. Max.
Static Characteristics
BV
DSS
Drain-Source Breakdown Voltage V
GS
=0V, I
DS
=-250A -20 V
I
DSS
Zero Gate Voltage Drain Current
V
DS
=-16V, V
GS
=0V -1
A
T
J
=85C -30
V
GS(th)
Gate Threshold Voltage V
DS
=V
GS
, I
DS
=-250A -0.45 -0.7 -1 V
I
GSS
Gate Leakage Current V
GS
=12V, V
DS
=0V 100 nA
R
DS(ON)

Drain-Source On-state Resistance
V
GS
=-4.5V, I
DS
=-2.5A 85 130
m
V
GS
=-2.5V, I
DS
=-2A 110 190
V
SD
Diode Forward Voltage I
SD
=-0.5A , V
GS
=0V -0.8 -1.3 V
Gate Charge Characteristics
b

Q
g
Total Gate Charge
V
DS
=-10V, V
GS
=-4.5V,
I
DS
=-2.5A
5 7
nC Q
gs
Gate-Source Charge 0.7
Q
gd
Gate-Drain Charge 0.6


AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010


3

Electrical Characteristics (Cont.) (T
A
=25C Unless Otherwise Noted)

Symbol Parameter Test Condition
AM2301
Unit
Min. Typ. Max.
Dynamic Characteristics
b

R
G
Gate Resistance V
GS
=0V,V
DS
=0V,F=1MHz 9.2
C
iss
Input Capacitance
V
GS
=0V,
V
DS
=-15V,
Frequency=1.0MHz
360
pF C
oss
Output Capacitance 80
C
rss
Reverse Transfer Capacitance 50
t
d(ON)
Turn-on Delay Time
V
DD
=-10V, R
L
=10
I
DS
=-1A, V
GEN
=-4.5V,
R
G
=6
8 16
ns
T
r
Turn-on Rise Time 7 15
t
d(OFF)
Turn-off Delay Time 18 35
T
f
Turn-off Fall Time 8 15
Notes
a : Pulse test ; pulse width300s, duty cycle2%.
b : Guaranteed by design, not subject to production testing.


AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010


4

Typical Characteristics



AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010


5

Typical Characteristics



AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010


6

Typical Characteristics



AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010


7

Package Information

SOT-23


Dim
Millimeters Inches
Min. Max. Min. Max.
A 1.00 1.30 0.039 0.051
A1 0.00 0.10 0.000 0.004
B 0.35 0.51 0.014 0.020
C 0.10 0.25 0.004 0.010
D 2.70 3.10 0.106 0.122
E 1.40 1.80 0.055 0.071
e1 1.90 TYP 0.075 TYP.
H 2.40 3.00 0.094 0.118
L 0.37 0.015

Physical Specifications

Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb,100%Sn).
Lead Solderability Meets EIA Specification RSI86-91, ANSI/J -STD-002 Category 3.
D
E H
e S
e1
A
A1
L
C
B
3
2
1


AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010

8

Reflow Condition
(IR/Convection or VPR Reflow)

t 25 C to Peak
tp
Ramp-up
t
L
Ramp-down
ts
Preheat
Tsmax
Tsmin
T
L
T
P
25
T
e
m
p
e
r
a
t
u
r
e
Time
Critical Zone
T
L
to T
P




Classification Reflow Profiles

Profile Feature
Sn-Pb Eutectic Assembly Pb-Free Assembly
Large Body Small Body Large Body Small Body
Average ramp-up rate
(T
L
to T
P
)
3C/second max. 3C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100C
150C
60-120 seconds
150C
200C
60-180 seconds
Tsmax to T
L

- Ramp-up Rate
3C/second max
Time maintained above:
- Temperature (TL)
- Time (t
L
)
183C
60-150 seconds
217C
60-150 seconds
Peak Temperature (Tp) 225 +0/-5C 240 +0/-5C 245 +0/-5C 250 +0/-5C
Time within 5C of actual
Peak Temperature (tp)
10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds
Ramp-down Rate 6C/second max. 6C/second max.
Time 25C to Peak Temperature 6 minutes max. 8 minutes max.
Notes: All temperatures refer to topside of the package .Measured on the body surface.



AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010

9

Package Reflow Conditions

pkg. thickness 2.5mm
and all bags
pkg. thickness < 2.5mm and
pkg. volume 350mm
3

pkg. thickness < 2.5mm and pkg. volume
< 350mm
3

Convection 220 +5/-0C Convection 235 +5/-0C
VPR 215-219C VPR 235 +5/-0C
IR/Convection 220 +5/-0C IR/Convection 220 +5/-0C

Reliability test program

Test Item Method Description
SOLDERABILITY MIL-STD-883D-2003 245C,5 SEC
HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @125C
PCT J ESD-22-B, A102 168 Hrs, 100% RH, 121C
TST MIL-STD 883D-1011.9 -65C ~150C, 200 Cycles

Carrier Tape & Reel Dimensions
t
Ao
E
W
Po
P
Ko
Bo
D1
D
F
P1

A
J
B
T2
T1
C







AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010


10

Application A B C J T1 T2 W P E
SOT- 23
1781 60 1.0 12.0 2.5 0.15 9.0 0.5 1.4
8.0+0.3
- 0.3
4.0 1.75
F D D1 Po P1 Ao Bo Ko t
3.5 0.05 1.5 +0.1 0.1MIN 4.0 2.0 0.05 3.1 3.0 1.3 0.20.03
(mm)

Cover Tape Dimensions

Application Carrier Width Cover Tape Width Devices Per Reel
SOT-23 8 5.3 3000



AM2301
Axelite Confidential Materials, do not copy or distribute without written consent



Rev. 1.0 Sep.06, 2010

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