Pzuxb Series NXP

1.
Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface
Mounted Device (SMD) plastic package.
1.2 Features
Total power dissipation: 310 mW
Tolerance series: B: approximately 5 %; B1, B2, B3: sequential, approximately 2 %
Small plastic package suitable for surface mounted design
Wide working voltage range: nominal 2.4 V to 36 V
1.3 Applications
General regulation functions
1.4 Quick reference data

[1] Pulse test: t
p
300 s; 0.02
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
2
.
PZUxB series
Single Zener diodes in a SOD323F package
Rev. 02 15 November 2009 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
F
forward voltage I
F
=100 mA
[1]
- - 1.1 V
P
tot
total power dissipation T
amb
25 C
[2]
- - 310 mW
[3]
- - 550 mW
PZUXB_SER_2 NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 15 November 2009 2 of 12
NXP Semiconductors PZUxB series
2. Pinning information

[1] The marking bar indicates the cathode
3. Ordering information

[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.
4. Marking

Table 2. Pinning
Pin Description Simplified outline Symbol
1 cathode
[1]
2 anode
2 1
sym068
2 1
Table 3. Ordering information
Type number Package
Name Description Version
PZU2.4B to
PZU36B
[1]
SC-90 plastic surface mounted package; 2 leads SOD323F
Table 4. Marking codes
Type number Marking code Type number Marking code
B B1 B2 B3 B B1 B2 B3
PZU2.4 G3 - - - PZU10 GJ FH HF KB
PZU2.7 G4 F3 H1 - PZU11 GK FJ HG KC
PZU3.0 G5 F4 H2 - PZU12 GL FK HH KD
PZU3.3 G6 F5 H3 - PZU13 GM FL HJ KE
PZU3.6 G7 F6 H4 - PZU14 - - HK -
PZU3.9 G8 F7 H5 - PZU15 GN FM HL KF
PZU4.3 G9 F8 H6 HS PZU16 GP FN HM KG
PZU4.7 GA F9 H7 HT PZU18 GQ FP HN KH
PZU5.1 GB FA H8 HU PZU20 GR FQ HP KJ
PZU5.6 GC FB H9 HV PZU22 GS FR HQ KK
PZU6.2 GD FC HA HW PZU24 GT FS HR KL
PZU6.8 GE FD HB HX PZU27 GU - - -
PZU7.5 GF FE HC HY PZU30 GV - - -
PZU8.2 GG FF HD HZ PZU33 GW - - -
PZU9.1 GH FG HE KA PZU36 GX - - -
5. Limiting values

[1] t
p
=100 s; square wave; T
j
=25 C prior to surge
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
.
6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
.
[3] Soldering point of cathode tab
7. Characteristics

[1] Pulse test: t
p
300 s; 0.02
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
I
F
forward current - 200 mA
I
ZSM
non-repetitive peak reverse
current
- see Table 8
and 9
P
ZSM
non-repetitive peak reverse
power dissipation
[1]
- 40 W
P
tot
total power dissipation T
amb
25 C
[2]
- 310 mW
[3]
- 550 mW
T
j
junction temperature - 150 C
T
amb
ambient temperature 65 +150 C
T
stg
storage temperature 65 +150 C
Table 6. Thermal characteristics
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 400 K/W
[2]
- - 230 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
[3]
- - 55 K/W
Table 7. Characteristics
T
j
= 25 C unless otherwise specified
V
F
forward voltage I
F
=10 mA
[1]
- - 0.9 V
I
F
=100 mA
[1]
- - 1.1 V

[1] f =1 MHz; V
R
=0 V
[2] t
p
j
Table 8. Characteristics per type; PZU2.4B to PZU5.6B3
T
j
PZU
xxx
Sel Working
voltage
V
Z
(V);
I
Z
= 5 mA
Maximum differential
resistance
r
dif
()
Reverse
current
I
R
(A)
Temperature
coefficient
S
Z
(mV/K);
I
Z
= 5 mA
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive peak
reverse current
I
ZSM
(A)
[2]
Min Max I
Z
= 0.5 mA I
Z
= 5 mA Max V
R
(V) Typ Max Max
2.4 B 2.3 2.6 1000 100 50 1 1.6 450 8
2.7 B 2.5 2.9 1000 100 20 1 2.0 440 8
B1 2.5 2.75
B2 2.65 2.9
3.0 B 2.80 3.20 1000 95 10 1 2.1 425 8
B1 2.80 3.05
B2 2.95 3.20
3.3 B 3.10 3.50 1000 95 5 1 2.4 410 8
B1 3.10 3.35
B2 3.25 3.50
3.6 B 3.40 3.80 1000 90 5 1 2.4 390 8
B1 3.40 3.65
B2 3.55 3.80
3.9 B 3.70 4.10 1000 90 3 1 2.5 370 8
B1 3.70 3.97
B2 3.87 4.10
4.3 B 4.01 4.48 1000 90 3 1 2.5 350 8
B1 4.01 4.21
B2 4.15 4.34
B3 4.28 4.48
4.7 B 4.42 4.90 800 80 2 1 1.4 325 8
B1 4.42 4.61
B2 4.55 4.75
B3 4.69 4.90
5.1 B 4.84 5.37 250 60 2 1.5 0.3 300 5.5
B1 4.84 5.04
B2 4.98 5.20
B3 5.14 5.37
5.6 B 5.31 5.92 100 40 1 2.5 1.9 275 5.5
B1 5.31 5.55
B2 5.49 5.73
B3 5.67 5.92

Table 9. Characteristics per type; PZU6.2B to PZU36B
T
j
PZU
xxx
Sel Working
voltage
V
Z
(V);
I
Z
= 5 mA
resistance
r
dif
()
Reverse
current
I
R
(nA)
Temperature
coefficient
S
Z
(mV/K);
I
Z
= 5 mA
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive peak
reverse current
I
ZSM
(A)
[2]
Min Max I
Z
= 0.5 mA I
Z
= 5 mA Max V
R
(V) Typ Max Max
6.2 B 5.86 6.53 80 30 500 3 2.7 250 5.5
B1 5.86 6.12
B2 6.06 6.33
B3 6.26 6.53
6.8 B 6.47 7.14 60 20 500 3.5 3.4 215 5.5
B1 6.47 6.73
B2 6.65 6.93
B3 6.86 7.14
7.5 B 7.06 7.84 60 10 500 4 4.0 170 3.5
B1 7.06 7.36
B2 7.28 7.60
B3 7.52 7.84
8.2 B 7.76 8.64 60 10 500 5 4.6 150 3.5
B1 7.76 8.10
B2 8.02 8.36
B3 8.28 8.64
9.1 B 8.56 9.55 60 10 500 6 5.5 120 3.5
B1 8.56 8.93
B2 8.85 9.23
B3 9.15 9.55
10 B 9.45 10.55 60 10 100 7 6.4 110 3.5
B1 9.45 9.87
B2 9.77 10.21
B3 10.11 10.55
11 B 10.44 11.56 60 10 100 8 7.4 108 3
B1 10.44 10.88
B2 10.76 11.22
B3 11.10 11.56
12 B 11.42 12.60 80 10 100 9 8.4 105 3
B1 11.42 11.90
B2 11.74 12.24
B3 12.08 12.60
13 B 12.47 13.96 80 10 100 10 9.4 103 2.5
B1 12.47 13.03
B2 12.91 13.49
B3 13.37 13.96
14 B2 13.70 14.30 80 10 100 11 10.4 101 2
[1] f =1 MHz; V
R
=0 V
[2] t
p
j
15 B 13.84 15.52 80 15 50 11 11.4 99 2
B1 13.84 14.46
B2 14.34 14.98
B3 14.85 15.52
16 B 15.37 17.09 80 20 50 12 12.4 97 1.5
B1 15.37 16.01
B2 15.85 16.51
B3 16.35 17.09
18 B 16.94 19.03 80 20 50 13 14.4 93 1.5
B1 16.94 17.70
B2 17.56 18.35
B3 18.21 19.03
20 B 18.86 21.08 100 20 50 15 16.4 88 1.5
B1 18.86 19.70
B2 19.52 20.39
B3 20.21 21.08
22 B 20.88 23.17 100 25 50 17 18.4 84 1.3
B1 20.88 21.77
B2 21.54 22.47
B3 22.23 23.17
24 B 22.93 25.57 120 30 50 19 20.4 80 1.3
B1 22.93 23.96
B2 23.72 24.78
B3 24.54 25.57
27 B 25.1 28.9 150 40 50 21 23.4 73 1
30 B 28 32 200 40 50 23 26.6 66 1
33 B 31 35 250 40 50 25 29.7 60 0.9
36 B 34 38 300 60 50 27 33.0 59 0.8
Table 9. Characteristics per type; PZU6.2B to PZU36B continued
T
j
PZU
xxx
Sel Working
voltage
V
Z
(V);
I
Z
= 5 mA
resistance
r
dif
()
Reverse
current
I
R
(nA)
Temperature
coefficient
S
Z
(mV/K);
I
Z
= 5 mA
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive peak
reverse current
I
ZSM
(A)
[2]
Min Max I
Z
= 0.5 mA I
Z
= 5 mA Max V
R
(V) Typ Max Max

T
j
=25 C PZU2.4B to PZU4.3B
T
j
=25 C to 150C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Temperature coefficient as a function of
working current; typical values
PZU4.7B to PZU12B
T
j
=25 C to 150 C
FR4 PCB, standard footprint
Fig 3. Temperature coefficient as a function of
working current; typical values
Fig 4. Power derating curve
V
F
(V)
0.6 1 0.8
mbg781
100
200
300
I
F
(mA)
0
0 60
0
2
3
1
mgl273
20 40
I
Z
(mA)
S
Z
(mV/K)
4.3
3.9
3.6
3.3
3.0
2.4
2.7
0 20 16
10
0
5
5
mgl274
4 8 12
I
Z
(mA)
S
Z
(mV/K)
4.7
12
11
10
9.1
8.2
7.5
6.8
6.2
5.6
5.1
T
amb
(C)
0 200 150 50 100
006aaa687
200
100
300
400
P
tot
(mW)
0
8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 14.
10. Soldering

Fig 5. Package outline SOD323F (SC-90)
04-09-13 Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PZU2.4B to
PZU36B
SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD323F (SC-90)
001aab169
1.65
0.50
(2)
2.10
1.60
2.80
0.60
3.05
0.50 0.95
solder lands
solder resist
occupied area
solder paste
11. Mounting

PCB thickness =1.6 mm PCB thickness =1.6 mm
Fig 7. FR4 PCB, standard footprint Fig 8. FR4 PCB, mounting pad for
cathode 1cm
2
006aaa487
40
Dimensions in mm
0.6
0.6
0.5
0.6
43.4
0.6
006aaa488
40
0.6
0.6
10
0.5
10
43.4
Dimensions in mm
12. Revision history

Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PZUXB_SER_2 20091115 Product data sheet - PZUXB_SER_1
Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PZUXB_SER_1 20060307 Product data sheet - -
13. Legal information
13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term short data sheet is explained in section Definitions.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customers own risk.
Applications Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 November 2009
Document identifier: PZUXB_SER_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information . . . . . . . . . . . . . . . . . . . . . 8
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information. . . . . . . . . . . . . . . . . . . . . 11
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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