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Preliminary T8300AD
PWM Control 1200mA Step-Down Converter
Built-sensitive switch hysteresis control function

FEATURES

GENERAL DESCRIPTION

Wide Input Voltage Range: 4.5V to 30V

LED Output Current Up to 1200mA
Soft-start
Single pin on/off and brightness control
using DC voltage or PWM
High efficiency (up to 97%)
CCTV IR LED Driver add CDS control
Built-sensitive switch hysteresis control
function
Up to 1MHz switching frequency
Typical 5% output current accuracy
SOP-8 Lead-free Package

The T8300AD is a continuous mode inductive

step-down converter, designed for driving
single or multiple series connected LEDs
efficiently from a voltage source higher than
the LED voltage. The device operates from an
input supply between 4.5V and 30V and
provides an externally adjustable output
current of up to 1200mA. Depending upon
supply voltage and external components, this
can provide up to 29 watts of output power.
The T8300AD includes the output switch and
a high-side output current sensing circuit,
which uses an external resistor to set the
nominal average output current. The T8300AD
is available in SOP-8 Lead-free package.

Applications

PART NUMBER EXAMPLES

LED/Display Back Light Driver

Lightings
Portable Communication Devices
Handheld Electronics
CCTV IR LED Driver

PART NO.
T8300AD

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P. 1

PACKAGE
SOP-8

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Preliminary T8300AD

PIN ARRANGEMENT (Top view)

T8300AD
SOP-8

PIN DESCRIPTION
Symbol

SOP-8

Description

LX

3,4

Drain of NMOS switch

GND

5.6

Ground

CDI

CDO

ISENSE

VIN

CDS Application Input &Enable control signal, H: Active, L: Power

Down CDI longer than 3 seconds, to maintain a high voltage
Enable Application OutInput for IR Cut Driver
Connect resistor Rs from this pin to VIN to define nominal average output
current IOUTnom=0.1/Rs
Input voltage (4.5V to 30V).
Decouple to ground with 47uF or higher X7R ceramic capacitor close to
device.

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Preliminary T8300AD

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Value

Unit

VIN

-0.3 to +40

ISENSE pin Voltage

-5 to +0.3

CDI pin CDO pin Voltage

-0.3 to +6

Voltage on input pin relative to GND

Operating pn junction Temperature Range

Tj

-40 to 150

Operating Temperature Range

TA

-40 to 85

TLEAD

300

TS

-65 to +150

Power Dissipation, PD @ TA=25

SOP-8

0.8

Package Thermal Resistance, JA

SOP-8

50

/W

Maximum Soldering Temperature (at lead, 10sec)

Storage Temperature Range

Electrical Characteristics
(TA=-40 to 105 unless otherwise noted. Typical values are at TA=25, VDD=24V)
Symbol

Description

VIN

Input voltage

UVLO

Under Voltage lock out

VIRU

Internal regulator start-up threshold

VIRD

Conditions

Min.

Typ.

Max.

Unit

4.5

30

3.6

VIN rising

3.65

Internal regulator shutdown

VIN falling

3.55

IQOff

Quiescent supply current with output off

CDI&CDO pin grounded

170

uA

IQOn

Quiescent supply current with output CDI&CDO pin floating

switching
fsw= 250kHz

ISENSE

Mean current sense threshold voltage

(Defines LED current setting accuracy)

ISENTH

Sense threshold hysteresis

ISENSE

Measured on ISENSE pin with

respect to VIN,

95

System current hysteresis

IOUT=0.5A1.2A

ISENSE pin input current

VSENSE = VIN -0.1

CDO Output Voltage High

VOL CDO

CDO Output Voltage Low

CDI Positive Trigger Threshold Voltage

V CDI VP
VCDI VN

100

105

mV
%
%

10

uA

50

ppm/K

5
Output High Current
<400A

TTL OUTPUT

CDI Negatie Trigger Threshold Voltage

5
0

1.8

(Note2)

P. 3

V
0.8

2
0.8

(Note2)

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mA

25

CDO Output Voltage

VOH CDO

15

VREF /T Temperature coefficient of VREF

VCDO

1.8

V
V

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VCDI VH

Hysteresis Voltage (Note2)

1.2

T CDI VTH

High Hold up time (Note3)

VCDI 2V

1.2

T CDI VTN

Low Hold time

VCDI 0.8V

30

uS

VDT

Slow start

Vref=1.25V

300

ILXM

Continuous LX switch current(Note1)

TA=85

RLX

LX Switch On resistance

VIN12V @ILX=1.2A
SOP -8

ILXI

LX switch leakage current

TTP

Thermal Shutdown Protect

1.2

0.4

155

1.2

0.45

uA

160

TONmin

Minimum switch ON time

CDI/CDO pin floating,

L=33uH(0.093ohm)
IOUT=1.2A @VLED=3.6V
Driving 1LED
LX switch ON

TOFFmin

Minimum switch OFF time

LX switch OFF

200

ns

TPWmin

minimum switch ON time

LX switch 'ON' or OFF

800

ns

fLXmax
DLX

maximum operating frequency

Recommended duty cycle range of output
switch at Flx max

TPD

Internal comparator propagation delay

fLX

Operating frequency

280

KHz

240

ns

1
0.2

MHz

0.9
50

ns

Notes :
**Note1.Operating temperature 85 and adequate cooling conditions, the temperature, the higher the maximum
current decreasing
**Note2

CDI HYSTERESIS
**Note3

CDI&CDO Timing Diagram

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Preliminary T8300AD

Block Diagram

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Functional Description
The device, in conjunction with the coil (L1) and current sense resistor (RS), forms a selfoscillating
continuous-mode buck converter.

Device operation
Operation can be best understood by assuming that the EN pin of the device is unconnected and the
voltage on this pin (VCDI) appears directly at the (+) input of the comparator
When input voltage VIN is first applied, the initial current in L1 and RS is zero and there is no
output from the current sense circuit. Under this condition, the (-) input to the comparator is at
ground and its output is high. This turns MN on and switches the LX pin low, causing current to
flow from VIN to ground, via RS, L1 and the LED(s). The current rises at a rate determined by VIN
and L1 to produce a voltage ramp (VSENSE) across RS. The supply referred voltage VSENSE is
forced across internal resistor R1 by the current sense circuit and produces a proportional current in
internal resistors R2 and R3. This produces a ground referred rising voltage at the (-) input of the
comparator.When MN is off, the current in L1 continues to flow via D1 and the LED(s) back to
VIN. The current decays at a rate determined by the LED(s) and diode forward voltages to produce a
falling voltage at the input of the comparator.

Switching thresholds
Define an average VSENSE switching threshold of 100mV (measured on the ISENSE pin with
respect to VIN). The average output current IOUTnom is then defined by this voltage and RS
according to:
IOUTnom = 100mV/RS
Nominal ripple current is 15mV/RS

Output shutdown
The output of the low pass filter drives the shutdown circuit. When the input voltage to this circuit
falls below the threshold, the internal regulator and the output switch are turned off. The voltage
reference remains powered during shutdown to provide the bias current for the shutdown circuit.
Quiescent supply current during shutdown is nominally 35uA and switch leakage is below 5uA.

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Preliminary T8300AD

Applications Information
Setting nominal average output current with external resistor RS
The nominal average output current in the LED(s) is determined by the value of the external current
sense resistor (RS) connected between VIN and ISENSE and is given by:
IOUTnom = 0.1/RS [for RS 0.083 ohm]
The table below gives values of nominal average output current for several preferred values of
current setting resistor (RS) in the typical application circuit :
RS (ohm)
0.083
0.125
0.2
0.285
Nominal average
1200
800
500
350
output current (mA)
The above values assume that the EN pin is floating.
Shutdown mode
Taking the CDI pin to a voltage below 0.8V for more than approximately 100us, will turn off the
output and supply current will fall to a low standby level of 35uA nominal.
Capacitor selection
A low ESR capacitor should be used for input decoupling, as the ESR of this capacitor appears in
series with the supply source impedance and lowers overall efficiency. This capacitor has to supply
the relatively high peak current to the coil and smooth the current ripple on the input supply. A
minimum value of 47uF is acceptable if the input source is close to the device, but higher values
will improve performance at lower input voltages, especially when the source impedance is high. In
order to avoid high frequency noise influence and improve circuit stability, it is recommended to
shunt a value of 0.22uF Capacitor. The input capacitor should be placed as close as possible to the
IC. For maximum stability over temperature and voltage, capacitors with X7R, X5R, or better
dielectric are recommended. Capacitors with Y5V dielectric are not suitable for decoupling in this
application and should not be used.
Inductor selection
Recommended inductor values for the T8300AD are in the range 33uH to 100uH. Higher values of
inductance are recommended at higher supply voltages in order to minimize errors due to switching
delays, which result in increased ripple and lower efficiency. Higher values of inductance also result
in a smaller change in output current over the supply voltage range. The inductor should be mounted
as close to the device as possible with low resistance connections to the LX and VIN pins. The
chosen coil should have a saturation current higher than the peak output current and a continuous
current rating above the required mean output current.
The inductor value should be chosen to maintain operating duty cycle and switch 'on'/'off' times
within the specified limits over the supply voltage and load current range.
LX switch on time : ton = LI / (VIN VLED - Iavg (RS+rL+RLX)) , note: ton min > 240ns
LX switch off time : toff = LI / (VLED + VD + Iavg (RS+rL)) , note: toff min > 200ns
Where:
L is the coil inductance (H)
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Preliminary T8300AD

I is the coil peak-peak ripple current (A) {Internally set to 0.3 x Iavg}
rL is the coil resistance (ohm)
RS is the current sense resistance
Iavg is the required LED current (A)
VIN is the supply voltage (V)
VLED is the total LED forward voltage (V)
RLX is the switch resistance (ohm) {=0.4 ohm nominal}
VD is the diode forward voltage at the required load current (V)

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Preliminary T8300AD

TYPICAL APPLICATION CIRCUITS

T8300AD
SOP-8

* note : When outputs the big current, the noise are big, this and the system environment and PCB layout have the
influential, may defer to the actual need to increase the capacitor filtration noise.

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Preliminary T8300AD

PACKAGE DIMENSIONS
8-LEAD SOP
B
B1

T h e rm a l P a d *

A1

C1

C2
F
D

Symbol
A
A1
B
B1
C
C1
C2
D
E
F
J
K
H

Min.
5.70
3.75
1.35
0
0.31
0.30
0.10

Dimension in mm
Typ.
6.00
3.95
1.27
1.55
0.41
0.50
0.15
2.23 REF
2.97 REF
0~8

Max.
6.30
4.10
5.13
1.80
1.75
0.15
0.51
0.70
0.25

Min.
0.224
0.148
0.052
0.000
0.012
0.012
0.004

Dimension in inch
Typ.
0.236
0.156
0.050
0.061
0.016
0.020
0.006
0.088 REF
0.117 REF
0~8

Max.
0.248
0.164
0.202
0.071
0.069
0.006
0.020
0.028
0.010

*Note :
The thermal pad on the ICs bottom has to be mounted on the copper foil.
To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.
In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on PCB is soldered with
thermal pad. The thermal pad enhances the power dissipation. As a result, a large amount of current can be sunk safely
in one package.

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