Datasheet TDA7000 PDF

INTEGRATED CIRCUITS
DATA SHEET
TDA7000
FM radio circuit
Product specification
File under Integrated Circuits, IC01
May 1992
Philips Semiconductors
FM radio circuit
TDA7000
GENERAL DESCRIPTION
The TDA7000 is a monolithic integrated circuit for mono FM portable radios, where a minimum on peripheral components
is important (small dimensions and low costs).
The IC has an FLL (Frequency-Locked-Loop) system with an intermediate frequency of 70 kHz. The i.f. selectivity is
obtained by active RC filters. The only function which needs alignment is the resonant circuit for the oscillator, thus
selecting the reception frequency. Spurious reception is avoided by means of a mute circuit, which also eliminates too
noisy input signals. Special precautions are taken to meet the radiation requirements.
The TDA7000 includes the following functions:
R.F. input stage
Mixer
Local oscillator
I.F. amplifier/limiter
Phase demodulator
Mute detector
Mute switch
QUICK REFERENCE DATA
2,7 to 10 V
Supply voltage range (pin 5)
VP
Supply current at VP = 4,5 V
IP
typ.
R.F. input frequency range
frf
1,5 to 110 MHz
8 mA
Sensitivity for -3 dB limiting

(e.m.f. voltage)
(source impedance: 75 ; mute disabled)
EMF typ.
1,5 V
EMF typ.
200 mV
Signal handling (e.m.f. voltage)

(source impedance: 75 )
A.F. output voltage at RL = 22 k
Vo
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102HE); SOT102-1; 1996 July 24.
May 1992
typ.
75 mV
FM radio circuit
TDA7000
Fig.1 Block diagram.
May 1992
FM radio circuit
TDA7000
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 5)
VP
max.
12 V
Oscillator voltage (pin 6)
V6-5
Total power dissipation
see derating curve Fig.2
Storage temperature range
Tstg
Operating ambient temperature range
Tamb
VP0,5 to VP + 0,5 V
55 to +150 C
0 to + 60 C
Fig.2 Power derating curve.
D.C. CHARACTERISTICS
VP = 4,5 V; Tamb = 25 C; measured in Fig.4; unless otherwise specified
PARAMETER
SYMBOL
Supply voltage (pin 5)
MIN.
TYP.
MAX.
UNIT
VP
2,7
4,5
10
IP
mA
Supply current
at VP = 4,5 V
Oscillator current (pin 6)
I6
280
Voltage at pin 14
V14-16
1,35
Output current at pin 2
I2
60
Voltage at pin 2; RL = 22 k
V2-16
1,3
May 1992
FM radio circuit
TDA7000
A.C. CHARACTERISTICS
VP = 4,5 V; Tamb = 25 C; measured in Fig.4 (mute switch open, enabled); frf = 96 MHz (tuned to max. signal
at 5 V e.m.f.) modulated with f = 22,5 kHz; fm = 1 kHz; EMF = 0,2 mV (e.m.f. voltage at a source impedance of
75 ); r.m.s. noise voltage measured unweighted (f = 300 Hz to 20 kHz); unless otherwise specified.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Sensitivity (see Fig.3)

(e.m.f. voltage)
for 3 dB limiting;
muting disabled
EMF
1,5
for 3 dB muting
EMF
for S/N = 26 dB
EMF
5,5
EMF
200
mV
S/N
60
dB
at f = 22,5 kHz
THD
0,7
at f = 75 kHz
THD
2,3
AMS
50
dB
RR
10
dB
V6-5(rms)
250
mV
Signal handling (e.m.f. voltage)

for THD < 10%; f = 75 kHz
Signal-to-noise ratio
Total harmonic distortion
AM suppression of output voltage

(ratio of the AM output signal
referred to the FM output signal)
FM signal: fm = 1 kHz; f = 75 kHz
AM signal: fm = 1 kHz; m = 80%
Ripple rejection (VP = 100 mV;
f = 1 kHz)
Oscillator voltage (r.m.s. value)
at pin 6
Variation of oscillator frequency
fosc
60
kHz/V
S+300
45
dB
S300
35
dB
frf
300
kHz
10
kHz
Vo(rms)
75
mV
at VP = 4,5 V
RL
22
at VP = 9,0 V
RL
47
with supply voltage (VP = 1 V)

Selectivity
A.F.C. range
Audio bandwidth at Vo = 3 dB
measured with pre-emphasis (t = 50 s)
A.F. output voltage (r.m.s. value)
at RL = 22 k
Load resistance
May 1992
FM radio circuit
Fig.3
TDA7000
A.F output voltage (Vo) and total harmonic distortion (THD) as a function of the e.m.f. input voltage (EMF)
with a source impedance (RS) of 75 : (1) muting system enabled; (2) muting system disabled.
Conditions:
0 dB = 75 mV; frf = 96 MHz.

for S + N curve: f = 22,5 kHz; fm = 1 kHz.
for THD curve; f = 75 kHz; fm = 1 kHz.
Notes
1. The muting system can be disabled by feeding a current of about 20 A into pin 1.
2. The interstation noise level can be decreased by choosing a low-value capacitor at pin 3. Silent tuning can be
achieved by omitting this capacitor.
May 1992
FM radio circuit
TDA7000
Fig.4 Test circuit; for printed-circuit boards see Figs 5 and 6.
May 1992
FM radio circuit
TDA7000
Fig.5 Track side of printed-circuit board used for the circuit of Fig.4.
Fig.6 Component side of printed-circuit board showing component layout used for the circuit of Fig.4.
May 1992
FM radio circuit
TDA7000
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
ME
seating plane
A2
A1
c
e
w M
b1
(e 1)
b
b2
MH
10
18
pin 1 index
E
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b1
b2
D (1)
E (1)
e1
ME
MH
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
0.85
inches
0.19
0.020
0.15
0.055
0.044
0.021
0.015
0.055
0.044
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
93-10-14
95-01-23
SOT102-1
May 1992
EUROPEAN
PROJECTION
FM radio circuit
TDA7000
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in
our IC Package Databook (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992
10

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INTEGRATED CIRCUITS

Supply voltage range (pin 5)

Supply current at VP = 4,5 V

R.F. input frequency range

1,5 to 110 MHz

Sensitivity for -3 dB limiting

Signal handling (e.m.f. voltage)

Fig.1 Block diagram.

Oscillator voltage (pin 6)

Total power dissipation

see derating curve Fig.2

Storage temperature range

Operating ambient temperature range

Fig.2 Power derating curve.

Supply voltage (pin 5)

Output current at pin 2

Sensitivity (see Fig.3)

Signal handling (e.m.f. voltage)

AM suppression of output voltage

with supply voltage (VP = 1 V)

0 dB = 75 mV; frf = 96 MHz.

Fig.4 Test circuit; for printed-circuit boards see Figs 5 and 6.

Repairing soldered joints

This text gives a very brief insight to a complex technology.

This data sheet contains final product specifications.

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