IPC A 610DC Telecom Addendum

IPC-A-610DC
Telecom Addendum
August 2009
A standard developed by IPC
Association Connecting Electronics Industries
®
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IPC-A-610DC
®
Telecom Addendum
Developed by the Telecom IPC-A-610 Addendum Task Group (7-31bc) of

the Product Assurance Committee (7-30) of IPC
Users of this standard are encouraged to participate in the

development of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
August 2009 IPC-A-610DC
Acknowledgment
Members of the Telecom IPC-A-610 Addendum Task Group have worked together to develop this document. We would like
to thank them for their dedication to this effort. Any document involving a complex technology draws material from a vast
number of sources. While the principal members of the Telecom IPC-A-610 Addendum Task Group (7-31bc) of the Prod-
uct Assurance Committee (7-30) are shown below, it is not possible to include all of those who assisted in the evolution of
this standard. To each of them, the members of the IPC extend their gratitude.
Product Assurance IPC-A-610 Telecom Technical Liaisons of the

Committee Addendum Task Group IPC Board of Directors
Chair Chair
Mel Parrish Darrin Dodson Peter Bigelow
STI Electronics Alcetel-Lucent IMI Inc.
Sammy Yi
Aptina Imaging Corporation
Members of the IPC-A-610 Telecom Addendum Task Group
Tom Bennett, Adtran Inc. Michael Nadreau, Henkel Jennifer Day, Sanmina-SCI
Trevor Bowers, Adtran Inc. Corporation Ofer Cohen, Seabridge Ltd., A
Darrin Dodson, Alcatel-Lucent Bai Chun Xiang, Huawei Siemens Company
Christopher Sattler, AQS - All Technologies Co., Ltd. Mel Parrish, STI Electronics
Quality & Services, Inc. Stephen Tisdale, Intel Corporation Todd Herman, Tellabs
Joe Bartnicki, Fujitsu Network Vasu Vasudevan, Intel Corporation Bob Willis, The SMART Group
Communications Girish Wable, Jabil Circuit, Inc. (HQ)
Steven Smith, Fujitsu Network Beverley Christian, Research In
Communications Motion Limited
SPECIAL ACKNOWLEDGMENT
We would like to provide special acknowledgment to the following member for providing pictures and illustrations that
are used in this revision.
Darrin Dodson, Alcatel-Lucent
ii
Telecom Addendum
0.1 Scope This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in
IPC-A-610D to ensure that electrical and electronic assemblies meet requirements for customers requiring Telecordia GR-78-
CORE compliance.
Where content criteria are not supplemented, the Class 2 requirements of IPC-A-610D apply.
0.1.1 Purpose When required by procurement documentation/drawings, this Addendum supplements or replaces specifically
identified requirements of IPC-A-610D.
0.1.2 Precedence Customer contractual requirements take precedence over this Addendum, referenced standards and user-
approved drawings. In the event of a conflict between this Addendum and the applicable documents cited herein, this Addendum
takes precedence. Where referenced criteria of this addendum differ from the published IPC-A-610D, this addendum takes pre-
cedence.
0.1.3 Existing or Previously Approved Designs This Addendum shall not constitute the sole cause for the redesign of pre-
viously approved designs. When drawings for existing or previously approved designs undergo revision they should be reviewed
and changes made that allow for compliance with the requirements of this Addendum.
0.1.4 Use This Addendum is applicable for rigid single sided, double sided, and multilayer boards.
This Addendum shall not to be used as a standalone document.
Where criteria are not supplemented, the Class 2 requirements of IPC-A-610D apply. Criteria defined in IPC-A-601D as ‘‘process
defects’’ for class 2 shall be treated as defective, unless otherwise stated in this Addendum.
If an IPC-A-610D requirement is changed or added by this Addendum, the clause is identified and that entire IPC-A-610D clause
or subordinate clause is replaced by the criteria in this Addendum.
The clauses modified by this Addendum do not include subordinate clauses unless specifically stated (e.g., 1.4 does not include
1.4.1). Clauses, Tables, Figures, etc., in IPC-A-610D that are not listed in this Addendum are to be used as-published.
In this addendum, as in the published IPC-A-610D, in case of conflict or discrepancy, the description or written crite-
ria always take precedence over the illustrations.
The surface insulation resistance and the electromigration resistance of the finished PBA shall be in accordance with GR-78-
CORE. This is relevant for no-clean assembly processes, which should be used preferably, as well as for fluxes which are intended
to be cleaned, and for SMC adhesives.
Solder alloy shall comply with J-STD-006 or equivalent.
0.1.5 Additional Referenced Standards Telcordia GR-78-CORE Generic Requirements for the Physical Design and Manufac-
ture of Telecommunications Products and Equipment (http://telecom-info.telcordia.com).
A-610DC August 2009 1

Telecom Addendum
1.4.5 Electrical Clearance
These criteria replace all of 1.4.5 in published IPC-A-610D.
Minimum electrical clearance for products built to this document is specified as 0.13 mm [.005 in].
4.1.3 Hardware Installation – Threaded Fasteners
Defect
• Less than one and one-half thread extends beyond the
threaded hardware, (e.g., nut) unless thread extension
would interfere with other component.
• Thread extension more than 3 mm [0.12 in] plus one and
one-half threads for bolts or screws up to 25 mm [0.984 in].
• Thread extension more than 6.3 mm [0.248 in] plus one and
one-half threads for bolts or screws over 25 mm [0.984 in].
• Bolts or screws without locking mechanisms.
4.1.3.1 Hardware Installation – Threaded Fasteners – Torque
These criteria replace all of 4.1.3.1 in published IPC-A-610D.

When connections are made using threaded fasteners they must be tight to ensure the reliability of the connection. When split-
ring type lock washers are used, the threaded fastener must be tight enough to compress the lock washer. Fastener torque value,
if not specified, shall be specified by engineering documentation.
Acceptable
• Fasteners are tight and split-ring lock washers, when used,
are fully compressed.
• Fasteners torque values are within the limits as specified by
drawing, or as specified by engineering documentation.
Defect
• Split-ring lock washer not compressed.
• Fasteners are not properly torqued within the limits specified
by drawing, or as specified by engineering documentation.
4.1.3.2 Hardware Installation – Threaded Fasteners – Wires
Criteria in published IPC-A-610D 4.1.3.2 are not applicable to users of this addendum.
2 August 2009 A-610DC

Telecom Addendum
4.3.2 Connector Pins – Press Fit Pins

Acceptable
• Damaged nonfunctional lands for single and double-sided
boards are acceptable if firmly attached to board in unlifted
areas.
Defect
• Any functional annular ring which is lifted.
4.4.1 Wire Bundle Securing – General

Metal cable clamps shall not be used unless they are insulated.
Acceptable
• The wires are secured in the wire bundle.
• Cable ties are cut flush with the locking head.
Defect
• Spot tie wrap or knot is loose.
• Wire bundle is loose.
• Cable tied with an improper knot. This tie may eventually
loosen.
• Restraining devices, clamps, plastic ties, lacing cord, etc.
damages the wiring insulation or cable by compression.
• End of cut tie wrap protrudes past the face of the locking
head.
4.5.2 Routing – Bend Radius
This replaces Table 4-1 in 4.5.2 of published IPC-A-610D. All of the rest of 4.5.2 in published IPC-A-610D is applicable.
IPC-A-610DC Table 4-1 Minimum Bend Radius Requirements

Cable Type IPC-A-610DC
Bare bus or enamel insulated wire 2X
Insulated wire and flat ribbon cable 2X
Cable bundles with no coax cables 2X
Cable bundles with coax cables 5X
Coaxial cables 5X
CAT5 Ethernet cable 4X
Fiber Optic Cable - Buffered and Jacketed Single Fiber 1 inch or as specified by the manufacturer
Larger jacketed fibers 15X cable diameter or as specified by the manufacturer

Telecom Addendum
4.5.3 Routing – Coaxial Cable

Defect
• Inside bend radii does not meet the criteria of Table 4-1.
Defect
• Spot ties or tie wraps that cause any deformation of coaxial
cables.
5.2.1 Soldering Anomalies – Exposed Basis Metal

Process Indicator
• Exposed basis metal on component leads, conductors or
land surfaces from nicks or scratches provided conditions
do not exceed the requirements of 7.1.2.3 for leads and
10.2.9.1 for conductors and lands.
5.2.2 Soldering Anomalies – Pin Holes/Blow Holes

Process Indicator
• Blowholes, pinholes, voids, etc., providing the solder con-
nection meets all other requirements.
7.1 Component Mounting
Use 7.1 published criteria in IPC-A-610D with this added statement:
The presence of engineering approved spacers or insulators, used to improve manufacturability, shall not be cause for rejection.

Telecom Addendum
7.1.7 Component Mounting – Radial Leads – Horizontal
Target
• The component body is in flat contact with the board’s sur-
face.
Acceptable
• Component in contact with board on at least one side
and/or surface.
Note: When documented on an approved assembly drawing,
a component may be either side mounted or end mounted.
The side or surface of the body, or at least one point of any
irregularly configured component (such as certain pocketbook
capacitors), needs to be in full contact with the printed board.
The body shall be bonded or otherwise secured to the board
to prevent damage when vibration and shock forces are
applied.
Defect
• Component not secured.
7.1.8 Component Mounting – Connectors

These criteria apply to soldered connectors and unsoldered press fit connectors. For connector pin criteria see 4.3. For connec-
tor damage criteria see 9.5.
Connector module/pin misalignment, defined in this section, is to be measured at the connector lead-in area/hole (for receptacles)
or at the pin tip (for pin headers).
In cases where an assembly connector is composed of two or more identical connector modules, it shall not be permissible to
mix modules manufactured by different suppliers.

Telecom Addendum
7.1.8.1 Connector Mounting – Heat Staking
Added criteria in this addendum.
Heat Stake/Press Peg Appearance After heat staking, the

heat staked heads shall meet the requirements shown on
Figure 7-1 of this specification.
• The heat staked heads shall not have any loose flash or
loose fractured pieces.
• PWB conductor paths and solder-resist areas adjacent to
A the heat staked heads shall not be damaged by the heat
staking process.
Missing or Nonconforming Heat Stakes On any connec-

tor, heat stakes (press pegs) may be missing or not conform-
ing to the requirements provided that they are not higher than
B 1.6 mm [0.062 in] above the PWB, and each nonconforming
heat stake (press peg) is bounded on either side by two heat
IPC-610D-C07-001 stakes (press pegs) that are conforming. The outer two heat
Figure 7-1 stakes (press pegs) on either end of the connector must con-
A. 1.680 ± 0.20 mm max. height form to production requirements.
B. Max. diameter of 4.0 ± 0.2 mm
Target
Figure 7-2

Telecom Addendum
7.1.8.1 Connector Mounting – Heat Staking (cont.)
Acceptable
• ≥50% of the heat stake is present.
• No loose or fractured flash pieces.
Figure 7-3
Defect
• <50% of the heat stake is present.
• Loose flashing from heat stake process (see Figure 7-5).
Figure 7-4

Telecom Addendum
7.1.8.1 Connector Mounting – Heat Staking (cont.)
Figure 7-5
7.1.8.2 Connector Mounting – Soldered Connectors –

Right Angle – Pin Spacing ≥2.5 mm [0.098 in]
Target
• Connector is mounted flush with the surface of the board.
Figure 7-6
Acceptable
• Connector-to-board spacing is equal to or less than 0.25
mm [0.010 in] (not shown).
Defect
• Connector to board spacing is greater than 0.25 mm [0.010
in] (not shown).

Telecom Addendum
7.1.8.3 Connector Mounting – Soldered Connectors –

Right Angle – Pin Spacing <2.5 mm [0.098 in]
Target
• Connector is mounted flush with the surface of the board
(A).
• All modules of a multi-part connector are aligned and are
mounted flush to adjoining modules (B).
Figure 7-7
Acceptable
• Maximum misalignment is ≤0.25 mm [0.010 in] across the
faces (contact openings) of all modules (connectors) in the
connector lineup (see Figure 7-8(A)).
Defect
• Connector-to-board spacing is greater than 0.13 mm [0.005
Figure 7-8
in] (not shown).
• Maximum misalignment is >0.25 mm [0.010 in] across the
connector lineup (see Figure 7-8(A)).

Telecom Addendum
7.1.8.4 Connector Mounting – Soldered Connectors – Vertical Shrouded Pin

Headers and Vertical Receptacle Connectors – (2 mm - 2.54 mm Pin Spacing)
Target
mounted flush to adjoining modules (not shown).
Acceptable
• Individual module contact openings, requiring alignment, are
equal to, or less than, 0.25 mm [0.010 in], with adjacent
modules (not shown). Maximum misalignment between any
Figure 7-9
two modules/pins in the connector lineup is ≤0.25 mm
[0.010 in] (not shown).
Defect
in].
• Maximum misalignment between any two modules/pins in
the connector lineup is >0.25 mm [0.010 in] (not shown).
Figure 7-10

Telecom Addendum
7.1.8.5 Connector Mounting – Compliant Pin Connectors
7.1.8.5.1 Connector Mounting – Compliant

Pin Connectors – Pin Spacing ≥2.5 mm
Target
Figure 7-11
Acceptable
• Connector-to-board separation is less than or equal to 0.25
• Connector tail pins protrude through, or are flush with, the
surface of the board (not shown).
• Connector tail pins are of equal length from pin to pin within
the same row (not shown).
Defect
• Connector-to-board separation is greater than 0.25 mm
[0.010 in].
• Connector tail pins do not protrude through, or are not flush
with, the surface of the board (not shown).
• Connector tail pins are not of equal length from pin to pin
within the same row (not shown).
Figure 7-12

Telecom Addendum
7.1.8.5.2 Connector Mounting – Compliant Pin

Connectors – Right Angle, Pin Spacing ≤2.5 mm
Target
• Connector pins of similar modules are of equal length from
pin to pin within the same row.
• Shield (if applicable) is installed according to the fabrication
design requirements (see Figure 7-14).
mounted flush to adjoining modules (see Figure 7-15).
Figure 7-13
Figure 7-14
Figure 7-15

Telecom Addendum
7.1.8.5.2 Connector Mounting – Compliant Pin

Connectors – Right Angle, Pin Spacing ≤2.5 mm (cont.)
Acceptable
mm [0.005 in] (see Figure 7-16).
• Maximum misalignment is ≤0.25 mm [0.010 in] across the
Figure 7-16 faces (contact openings) of all modules (connectors) in the
connector lineup (see Figure 7-17).
• Connector tail pins protrude through, or are flush with, the
surface of the board.
• Connector tail pins of similar modules are of equal length
from pin to pin within the same row.
Figure 7-17
Defect
in] (see Figure 7-18).
• Maximum misalignment is >0.25 mm [0.010 in] across the
connector lineup.
• Connector tail pins do not protrude through, or are not flush
with, the surface of the board.
• Connector tail pins of similar modules are not of equal length
from pin to pin within the same row.
Figure 7-18

Telecom Addendum
7.1.8.5.3 Connector Mounting – Compliant Pin Connectors – Vertical Shrouded

Pin Headers and Vertical Receptacle Connectors (2 mm - 2.54 mm Pin Spacing)
Target
• All modules/pins of a multi-part connector are aligned and
are mounted flush to adjoining modules.
Figure 7-19
Acceptable
• Connector-to-board spacing (A) is equal to or less than 0.13
mm [0.005 in] from any edge or corner(not shown).
• Connector tail pins protrude through the board and are of
equal length from pin to pin (not shown). (This is not appli-
cable when design, PCB thickness or length of specified
component leads prevents pin protrusion.)
the connector lineup is ≤0.25 mm [0.010 in] (not shown).
Figure 7-20
Defect
in] at any edge or corner (not shown).
• Connector tail pins do not protrude through the board (not
shown).
• Connector pins protruding through the board are not of
equal length from pin to pin (not shown).
the connector lineup is >0.25 mm [0.010 in].
Figure 7-12

Telecom Addendum
7.1.10 Component Mounting – Front Panel Mounted LEDs

There are no illustrations for these criteria.
Target
• Through-hole mounted LEDs are centered in the mounting
hole.
• The tops of through-hole mounted LEDs protrude from the
surface of the panel.
Acceptable
• The tops of through-hole mounted LEDs are flush with the
surface of the panel.
• Three or more LEDs mounted in a row on a panel are
aligned center to center and height.
Defect
• Front panel mounted LEDs are recessed below the surface
of the panel.
7.1.11 Component Mounting – Conductive Cases

Where a potential for shorting (violation of minimum electrical clearance) exists between conductive component bodies, at least
one of the bodies will be protected by an insulator.
7.5.1 Supported Holes – Axial Leaded – Horizontal

Defect
• Component height exceeds user-determined dimension (H).
• Components dissipating greater than 1 Watt are mounted
less than 1.5 mm [0.059 in] above the board surface.
7.5.5.1 Supported Holes – Solder – Vertical fill (A)
Where large areas of copper (e.g., ground or power planes) or other heat sinks (e.g., heavy component leads) are connected to
PTHs in PCBs, or where pin-in-paste processes are used on thick PCBs results in insufficient vertical solder fill and/or secondary
side land wetting, hole fill shall be sufficient to ensure that the minimum pin-wetted length within the barrel is at least .047 inch
regardless of board thickness.

Telecom Addendum
7.5.5.7 Supported Holes – Solder Conditions – Meniscus in Solder

Defect
• Does not meet requirements of Tables 7-6 or 7-7.
• Coating meniscus is in the plated through hole.
• Coating meniscus is embedded in the solder connection.
8.2 SMT Connections
These criteria replace all of 8.2 in published IPC-A-610D.
SMT connections must meet the criteria of 8.2.1 through 8.2.14, as appropriate.
Where a potential for shorting (violation of minimum electrical clearance) exists between conductive component bodies, at least
one of the bodies will be protected by an insulator.
9.5.1 Component Damage – Connectors – Keys

Acceptable
• Keying slots or holes are free of cracks, chips, or foreign
material that could interfere with the mating pin, blade, or
alignment device (not shown).
Defect
• Keying slots or holes have cracks, chips, or foreign material
that interferes with the mating pin, blade, or alignment
device (not shown).
Some connectors, e.g., FutureBus®, have key tabs where

keys may be inserted. To prevent damage during handling of
the finished circuit pack, it is permissible to remove the key
tabs at the extreme ends of the connector line-up (A) after the
connectors are installed. In addition, a maximum of two (2)
additional key tabs may be removed (if damaged during sub-
sequent handling) provided that the following criteria are met:
• Broken tabs are trimmed flush to the connector body.
• Two (2) missing tabs are not next to each other on a given
Figure 9-1 module.
A. End tab key
• Two (2) missing tabs are not the end tabs on adjacent con-
nector modules (A).
• Tabs that secure required keys shall not be damaged.

Telecom Addendum
9.5.1 Component Damage – Connectors – Keys (cont.)
Acceptable
• Any removed tab is trimmed flush.
Figure 9-2
Defect
• Tab not trimmed flush to connector body.
Figure 9-3
9.5.2 Component Damage – Connectors – Surface Damage
Acceptable
• Chips, burn blemishes, or handling damage on connector
surface do not extend into the contact lead-in surface.
Figure 9-4

Telecom Addendum
9.5.2 Component Damage – Connectors – Surface Damage (cont.)
Acceptable
• At the rate of one per assembly, the connector shield
attachment device or retaining method may be damaged or
missing provided that all of the following conditions are met:
• It is not the first or last such device located at either end of
the individual module.
• The shield is adequately secured and does not interfere
with alignment or prevent mating with shrouded pin header
contacts.
• The retaining device is flush or below flush with the con-
nector housing.
Figure 9-5
Defect
• Chips, burns, or handling damage on connector surface,
which extends into the contact lead-in surface.
• Connector body is damaged/deformed.
• The shield is not adequately secured and/or interferes with
the alignment or prevents mating with shrouded pin header
contacts (see Figure 9-8).
• The number of damaged connector shield attachment
devices or retaining methods exceeds one per assembly
(not shown).
Figure 9-6
• The retaining device is not flush or below flush with the con-
nector housing (not shown).
Figure 9-7

Telecom Addendum
9.5.2 Component Damage – Connectors – Surface Damage (cont.)
Figure 9-8
For electrically enhanced (EE) connectors, it shall be permis-

sible to have three (3) missing ground contacts on the bottom
side per PWB provided the following criteria are met:
• Damaged ground contacts shall be trimmed flush to the
ground shield (see Figure 9-10).
• Only one (1) missing ground contact per connector module
is allowed.
• No damage to the top-side ground contacts is permitted.
Figure 9-9
Figure 9-10

Telecom Addendum
9.6 Component Damage – Relays
Acceptable
B • Minor scratches, cuts, chips, or other imperfections that do

not penetrate the case or affect the seal (not shown).
C Defect
A • Scratches, cuts, chips, or other imperfections that penetrate

the case or affect the seal (A, B).
• The case is bulging or swollen (C).
IPC-610D-C09-011
Figure 9-11

Telecom Addendum
9.7 Component Damage – Transformer Core Damage
Acceptable
• Chips and/or scratches on exterior edges of core are per-
missible, providing they do not extend into core mating sur-
faces and do not exceed 1/2 the thickness of the core.
Figure 9-12
Defect
• Chip in the core material is located on mating surface.
• Chip extending greater than 50% of the core thickness.
• Cracks in the core material.
Figure 9-13

Telecom Addendum
10.1 Gold Fingers (Contact Fingers)
The term contact area is defined as the area that encompasses all points that could be contacted by the mating connector con-
tacts under all tolerance conditions. This includes the area from the edge of the PCB to the fully mated contact position, but
excludes copper exposed by chamfering the leading edge of the PCB.
Gold plating shall normally extend 0.51 mm [0.020 in] above the shoulder of the contact. In situations where an extension would
include holes in the gold plated area, the gold plating line shall end just below the pad of the hole. A demarcation line showing
copper and/or discolored tin-lead shall not exceed 0.051 mm [0.002 in].
For the purpose of interpreting requirements on defects and surface variations on the gold-plated surface of a connector finger
(see Figure 10-1), the following definitions shall apply:
Pits: A pit is a sharply defined depression in the gold-plated surface that does not extend through the underlying
copper.
Indentations: An indentation is a gradual depression in the gold-plated surface resulting from a shallow imperfection in the
underlying material. An indentation has no discernible sharp or jagged edges.
Scratches: A gold scratch is an abrasion in the gold-plated surface that alters or removes the gold plate and produces
either exposed copper or nickel, or sharp, jagged edges. However, abrasions that merely mar or polish (bur-
nish) the gold-plated surfaces are not considered scratches.
Pores: A pore is any defect other than a pit or a scratch in the gold surface that exposes the underlying copper or
nickel.
Pinholes: A pinhole is any defect that extends through the underlying copper to the base material. A pinhole may or may
not be gold plated.
Nodules: A nodule is a volume of metal, generally round or elongated as a ridge, which projects above the surrounding
gold surface. When nodules are very small and numerous, they may appear as dark or brownish gold due to
their effect on reflectivity.
G K
H
E F Ga Gb J Ka Kb
D
C
IPC-610D-C10-001
Figure 10-1
A. Substrate Ga. Scratch with exposed copper
B. Copper Gb. Scratch with no exposed copper
C. Nickel H. Nodule
D. Gold J. Pore
E. Pit K. Pinholes
F. Indentation Ka. Pinhole with exposed copper
E/G. Scratches Kb. Pinhole with gold plating

Telecom Addendum
10.1 Gold Fingers (Contact Fingers) (cont.)
Nickel, gold, or other contact metal plating, shall not be applied over solder on contact fingers.
Contact plating on circuits and vias in the demarcation area is not cause for rejection.
Solder spots, smears, or other contaminates, visible with 1.75X magnification are not acceptable. 4X magnification may be used
for referee purposes.
Isolated conditions, including but not limited to indentations, nicks, scratches or pits in the contact area of gold fingers, shall not
expose base metal or under-plate.
Minor test probe indentations are acceptable provided the laminate, copper or nickel is not exposed and their maximum diameter
does not exceed 0.25 mm [0.010 in].
No more than 5% of the finger width of an edge board contact may be removed when drilled holes are used to remove plating
bars between gold fingers. Loss of adhesion of the metallization or residual burrs is not acceptable.
Repair of gold plating shall meet all requirements of this specification.
Replacement of gold fingers is not allowed.
Clean areas have the same dimensional requirements as contact areas. Clean areas shall be free from all labels, stamps, foreign
material, solder traces, planes, silk screens, reference designators, or other material that could contaminate the contacts.
Criteria listed are not required for unused contacts.
B
A
IPC-610D-C10-002
Figure 10-2
A. 6.35 mm [0.25 in]
B. 0.125 mm [0.005 in]
C. Contact area
Target
• No solder or foreign material on gold surface.
Acceptable
• Contact plating is smooth and of uniform color (not shown).
Defect
Figure 10-3 • Violations of the above acceptable criteria (not shown).

Telecom Addendum
10.2.1 Laminate Conditions – Measling and Crazing
Target
• No evidence of measling.
Acceptable
• Measled areas in laminate substrates do not exceed 50% of the physical spacing between internal conductors.
Defect
• Measled areas in laminate substrates exceed 50% of the physical spacing between internal conductors.
Note: This document takes exception to the bare board measling criteria of some versions of IPC-A-600 and IPC-6012.
10.2.3 Laminate Conditions – Weave Texture/Weave Exposure

Acceptable
• No weave exposure.
Defect
• Weave exposure is not acceptable.
10.2.9.2 Printed Circuit Boards – Pad Damage

Acceptable
• Separation between outer edge of conductor, pad or land
and laminate surface is less than one pad thickness.
Note: Lifted and/or separated land area(s) is typically a result
of the soldering process that warrants immediate investigation
to determine root cause. Efforts to eliminate and/or prevent
this condition should be made.

Telecom Addendum
10.3 Marking

Acceptable
• Required marking is present.
• Marking is legible at a viewing distance of 460 mm [18 in].
Defect
• Required marking is not present.
• Marking is not legible.
• Marking cannot be read at a viewing distance of 460 mm
[18 in].
10.3.3 Marking – Stamped

Acceptable
• Lines of a number or letter may be broken (or the ink thin
over a portion of the character) providing the breaks do not
make the markings illegible.
• The open areas within characters may be filled providing the
characters are legible, i.e., cannot be confused with another
letter or number.
Defect
• Marking ink is present on the land interfering with the solder
requirements of Tables 7-3, 7-6 or 7-7 or with the surface
mount soldering requirements of Section 8.
• Marking inks form a conductive path that violates minimum
electrical clearance.
Acceptable
• Marking that has been smeared or blurred but is still legible.
• Double stamped markings are acceptable provided the gen-
eral intent can be determined.
• Missing or smeared marking does not exceed 10% of the
character and the character is still legible.
Note: Acceptance stamp impressions do not need to be leg-
ible as long as the intent of the stamp can be determined and
the operation/approval is recorded electronically.

Telecom Addendum
10.3.5.3 Marking – Labels – Adhesion and Damage
Acceptable
• Adhesion is complete, shows no sign of damage or peeling.
Figure 10-4
Defect
• Label is peeling.
• Missing labels.
• Label wrinkle affects readability.
• Labels are not positioned according to engineering docu-
mentation or labels that are not consistent, square, parallel,
or centered.
Figure 10-5
• Labels are not readable in the finished assembly.
• Labels or markings obscure other markings or identifica-
tions.
• Labels or markings damage the underlying surface, create
conductive paths, or affect the utility of the product.
• Labels are placed in areas where they are susceptible to
damage.
• Wrap-around cable labels do not wrap completely around
the cable.
• Wrap-around labels where the clear over-wrap portion does
not completely cover the markings.
• Cable marking bands create a safety hazard (burrs, sharp
edges) or a potential for electrical shorts.
• Tie-on labels are held in place with conductive materials.
Figure 10-6 • Tie-on labels restrict access or visibility to marking informa-
tion or cause problems with entanglement with other
assemblies.
• Labels replaced by putting one label on top of another.

Telecom Addendum
11.1.4 Solderless Wrap – Raised Turns Overlap
Raised turns are squeezed out of the helix and therefore no longer have intimate contact with the terminal corners. Raised turns
may overlap or override other turns.
Target
• No raised turns.
Figure 11-1
Acceptable
• Raised turns anywhere provided remaining total turns still
have contact and meet minimum turns requirement.
• No more than half turn raised within countable turns, any
amount elsewhere.
• No raised turns within countable turns, any amount else-
where.
• No overlap of turns.
Figure 11-2
Defect
• Any raised turns within countable turns.
• Any overlap within turns.
Figure 11-3

Telecom Addendum
11.2 Jumper Wires
These criteria do not constitute authority for repair to assemblies without prior customer consent; see 1.1. This section establishes
visual acceptability criteria for the installation of discrete wires (jumper wires, haywires, etc.) used to interconnect components
where there is no continuous printed circuit.
The requirements relative to wire type, wire routing, staking and soldering requirements are the same for both haywires and jumper
wires. For the sake of simplicity only the more common term, jumper wires, is used in this section, however these requirements
would apply to both haywires and jumper wires.
Methods described in this section apply to both modification and repair.
The following items are addressed:

Wire type
Wire routing
Adhesive staking of wire
Solder termination
They may be terminated in plated holes, and/or to terminal standoffs, conductor lands, and component leads.
Jumper wires are considered as components and are covered by an engineering instruction document for routing, termination,
staking and wire type.
Keep jumper wires as short as practical and unless otherwise documented do not route over or under other replaceable compo-
nents.
Design constraints such as real estate availability and minimum electrical clearance need to be taken into consideration when rout-
ing or staking wires. A jumper wire 25 mm [0.984 in] maximum in length whose path does not pass over conductive areas and
do not violate the designed spacing requirements may be uninsulated. Insulation, when required on the jumper wires, needs to be
compatible with conformal coating.
11.2.1 Jumper Wires – Wire Selection
The following considerations are to be made when selecting wires for jumpers:
1. Wire is insulated if greater than 25 mm [0.984 in] in length or is liable to short between lands or component leads.
2. Silver plated stranded wire should not be used. Under some conditions corrosion of the wire can occur.
3. Select the smallest diameter wire that will carry the required current needs.
4. The insulation of the wire should withstand soldering temperatures, have resistance to abrasion, and have a dielectric resis-
tance equal to or better than the board insulation material.
5. Recommended wire is solid, insulated, plated copper wire.
6. Chemical solutions, pastes, and creams used to strip solid wires do not cause degradation to the wire.
7. A unique color shall be used for modification wires on PWB assemblies; this shall be different from the colors used during
normal manufacturing.

Telecom Addendum
11.2.2 Jumper Wires – Wire Routing

Acceptable
• Unavoidable crossing of component footprint or land area.
Defect
• Insufficient slack in wire to allow relocation from unavoidable
lands during component replacement.
11.2.3 Jumper Wires – Wire Staking

Jumper wires on PCB assemblies shall be secured to the PWB using adhesive or tape (dots or strips); wires shall not be secured
to components or component leads.
When adhesive is used, it is to be mixed and cured in accordance with the manufacturer’s instructions. All adhesive must be fully
cured before acceptance.
Adhesives/tapes used to secure jumper wires to PCB assemblies shall maintain their adhesive properties for the design life of the
equipment.
Spot bond so that the stake fillet is sufficient to secure the wire with no spillover onto adjacent lands or components.
Jumper wires are not to be staked to, or allowed to touch, any moving parts or sharp edges. Wires are staked within the radius
of each bend for each change of direction.
11.2.4 Jumper Wires – Plated-Through Holes

Jumper wires may be attached by any of the following methods. However, the method used for a particular assembly type needs
to be defined.
This section is intended to show jumper wire practices that are used in original manufacturing and/or repair.
Jumper wires shall, where possible, be inserted into plated through-holes (component locations or PCB vias) and soldered into
position. When practical, unused plated through-holes shall be used. Plated through-holes already containing components may
be used if there is sufficient room for additional leads. The component lead and jumper wire shall exhibit protrusion in the sol-
dered connection.
Where plated-through hole installation of modification wires on PCB assemblies is not possible, lap soldering of modification wires
to surface mount vacant land lands, surface mount component pad/leads and PCB traces, can be performed if requirements con-
tained herein are met.
11.2.4.1 Jumper Wires – PTH/Via – Lead in Hole

Acceptable
• Wire soldered into PTH with component lead.

Telecom Addendum
13 Wiring and Cabling – General Requirements
All individual cables and cable harness assemblies shall contain the part number, revision level, date code (date of manufacturer),
and supplier identification (name, abbreviation, or number).
Supplier lot control numbers/date codes shall be marked on cables and harnesses.
The component manufacturer’s recommended tooling and processes shall be used in all preparation and assembly operations.
Splicing is not permitted.
14 Modification and Repair

Modifications:
Modifications are defined as the alteration of printed circuit boards (PCBs) to incorporate approved engineering changes. Modified
PCBs shall be clearly identified (e.g., raising revision level or variant) to avoid confusion with unmodified product. Before begin-
ning any modifications, engineering shall provide documented & released process instructions.
Repairs:
Conductor short repairs (cut/drilled traces, etc.) shall be limited to a maximum of six per PWB, provided a qualified polymeric
coating is subsequently applied to the affected area. Repairs to outer layer conductors of PWBs for open circuits (added wires,
welded conductors, etc.), shall not exceed five for a single cause (such as a single scratch through up to five adjacent conduc-
tors); however, the limit is one, solitary defect per 0.064 square meters [100 square in]. For boards of less than 0.064 square
meters [100 square in], five repairs for a single defect cause are permitted.
SUBTRACTIVE MODIFICATIONS/REPAIRS
Cut Traces:
• The width of all circuit trace cuts shall exceed 0.063 mm [0.005 in].
• All loose material shall be removed from the cut area.
• Circuit trace cuts shall be sealed with an approved epoxy.
• Removed circuit traces must be a minimum of 0.063 mm [0.005 in] from lands, circuit junctions, and component leads.
Holes and Terminals:

Holes may be drilled in boards to add terminals, to route added wires, or to interrupt internal circuits providing the following con-
ditions are met:
• The drilled hole does not interfere with other circuits.
• There is no smeared metallization that could short ground and power planes on multi-layer boards.
• Holes to interrupt internal circuits and holes penetrating more than one conductive layer must be filled with epoxy to prevent
absorption of moisture or other contaminants.
• The edge of the drilled hole shall be a minimum of 0.38 mm [0.015 in] away from any adjacent hole, pad, internal PTH (Plated
Through-Hole) clearance diameter, etc.
• Excess, mislocated or unused holes or slots in boards may be filled with an approved epoxy.
Lifted/Cut Component Leads:

• Lifted (truncated) pins shall be cut short enough to prevent shorting to the pad from which they were lifted.
• Minimum electrical clearance requirements shall be maintained.

Telecom Addendum
14 Modification and Repair (cont.)
COMPONENT ADDITIONS
Leaded Components
• Connections must be supported, preferably by existing terminals or PTH. Terminals may be added as the case dictates.
• Added components shall be soldered into plated through-holes (component locations or PCB vias). Added components shall
be mounted on the same side of the PCB as the original mounted component.
• Butt mounting of axial leaded components is prohibited.
• Components not reasonably secure shall have epoxy applied between the body and PCB surface.
SMT Components
Surface mounted components shall be added only where lands are provided. The use of additional adapter board supported SMT
lands is permitted to replace damaged lands or to incorporate approved engineering changes. SMT pad size and configuration
shall be as specified for the component.
CONDUCTOR REPAIR
General Requirements
The following repair methods may be used to repair conductor breaks, scratches, or similar defects; see Section 11.2 conductor
repair.
Lifted or debonded circuit traces may be replaced with lap-soldered jumper wires. PTHs, lands, and vias shall be used wherever
possible. Wires may be lap-soldered to circuit traces if PTHs, lands, or vias are not available.
Jumper wire size, spacing, and current carrying capacity must not be reduced below allowable tolerance or electrical requirements.
Jumper wire size shall not exceed the width of the defective circuit trace.
15 Finished Surfaces

The following classifications are to be used for inspection of finished surfaces unless workmanship requirements are specified on
the released engineering drawing.
Note: The terms Grade 1, Grade 2 and Grade 3 correspond to terms commonly used in the Telecom industry Class 1, Class 2
and Class 3 where Grade 1/Class 1 are the most stringent requirements. In IPC documents the terms Class 1, 2, or 3 are used
to reflect criticality of need and ability to operate in harsh environmental conditions (thermal, vibration, etc.) where Class 3 are the
most stringent requirements. In this addendum the committee chose to use the designation ‘‘Grade’’ instead of ‘‘Class’’ to reduce
confusion with the Class designations used in all IPC documents.
Grade 1 Surfaces
• Surfaces frequently viewed in the finished product by the final customer (Examples: Front covers, module covers, faceplates, filler
panels, heat ramps, external labels, etc.).
• Grade 1 surfaces shall be free of blisters, clamp or brake marks, extrusion lines, gouges, nicks, pits, runs, scratches, extrane-
ous or irregular sanding lines, spot-weld craters, voids, or other defects which detract from the general appearance.
• Appearance of a grade 1 surface is as important as form, fit, and function.
Grade 2 Surfaces
• Surfaces occasionally viewed in the finished product by the final customer (Examples: Internal labels and surrounding area, inside
of accessible covers, side panels visible from the front, outside of rear covers, outdoor equipment enclosures, etc.).
• Grade 2 surfaces may have slight surface imperfections/scratches if they are not readily noticeable from a distance of 18 inches.
• Appearance of a grade 2 surface, while important, is secondary to form, fit, and function.
• Consideration should be given to how the flaw affects the general appearance.

Telecom Addendum
15 Finished Surfaces (cont.)
Grade 3 Surfaces
• Surfaces infrequently or never viewed in the finished product by the final customer (Examples: Normally concealed surfaces, bot-
tom plates, top plates, internal surfaces of assemblies, etc.).
• Grade 3 surfaces are allowed to have a limited number of minor flaws that would be considered non-conforming in Grade 1 and
2 as long as form, fit, and function of the part are not affected.
• Scratches that are visible at a distance of 457 mm [18.0 in] are allowed providing the scratch does not expose the base mate-
rial.
• Form, fit, and function are the primary considerations when evaluating a grade 3 surface.
Evaluation Requirements
When evaluating a flaw, consider whether the flaw adversely affects the general appearance, based on the quality requirements
for the surface exposure classification.
The product shall be viewed under the following conditions:

Angle Product shall be viewed within the viewing range as shown below.
Distance Approximately 457 mm [18.0 in].
Lighting Use normal room lighting for exterior surfaces; inspection lamps may be used for interior surfaces.
Magnification None; increased magnification may be used for verification of functional flaws only.
Time A sufficient amount of time should be used to inspect the product. When making an accept/reject judgment
about a flaw, avoid using concentrated study.
The following is a suggested guideline (see Figure 15-1). View the area at an approximate rate of 5 seconds per square foot. Based
on the quality requirements for the surface, consider whether the flaw adversely affects the general appearance.
A
B
30º 30º
IPC-610D-C15-001
Figure 15-1
A. Viewing range
B. Viewing surface

Telecom Addendum
15.1 General Finish Requirements and Acceptance Criteria

Target
• Cosmetic and protective finishes shall be of uniform
appearance and typically smooth; deliberately textured fin-
ishes are permissible when directed by engineering docu-
mentation.
• Finishes shall conform to environmental conditions and
restrictions as delineated in engineering documentation. Fin-
ishes shall also be resistant to cleaning agents or other
manufacturing processes and shall not functionally
degrade over the expected life of the product.
• All finishes, regardless of class, shall provide the intended
corrosion protection. Exposed base material is a defect in
any finish class.
• Touch-up of finishes on all grades is allowed. Completed
touch-up areas shall meet the requirements of the appro-
priate finish grade.
Acceptable
• See specific finish sections for detailed criteria on accept-
able finishes.
Defect
• Flaws on mechanical assembly component parts, that may
in any way endanger the safety of persons using or coming
in contact with these parts, are always considered defects.
• Flaws that affect the form, fit, or function of a part or the
product, regardless of surface exposure classification, are
always considered defects.
• There shall be no evidence of bleed-out or corrosion due to
entrapment of plating or cleaning solutions.
• See specific finish sections for detailed criteria on defect fin-
ishes.

Telecom Addendum
15.2 Adhesion Requirements for Chromated Surfaces
Adhesion Tape Test

• Adhesion of chromated surfaces shall be determined by the following adhesion tape test. A new strip of tape shall be used for
each test.
• A two inch minimum effective length of pressure sensitive tape conforming to the requirements of Federal Specification PPP-T-
42C, Type II (such as 3M Flatback Tape #250™) shall be firmly pressed onto the surface to be tested.
• All air bubbles should be rubbed out.
• Allow approximately 10 seconds for the test area to return to room temperature.
• Grasp a free end of the tape and at a rapid speed, strip it by pulling the tape back on itself at 90- 180° so that the tape is folded
back to back during the procedure.
Acceptable
• No presence of chromate coating on the removed tape.
Defect
• Any chromate coating present on the removed tape.
15.3 Adhesion Requirements for Silkscreen Ink
Adhesion Tape Test

• Ink shall have sufficient adhesion to withstand the following adhesion tape test. A new strip of tape shall be used for each test.
• Flatback™ masking tape conforming to the requirements of Federal Specification PPP-T-42C, Type II (Minnesota Mining and
Manufacturing Company, No. 250) and of sufficient width to cover the characters shall be used.
• Press a strip of the tape approximately 50.8 mm [2 in] long firmly across the silkscreen ink surface and substrate.
• Immediately remove a short length of one end of the applied tape and then rapidly remove the tape by manual force applied 90
- 180° to the ink marking.
Target
Acceptable
• No presence of ink on the removed tape.
Defect
• Any portion of ink markings present on the removed tape.
15.4 General Requirements for All Surfaces

Requirements for physical defects and finish defects are in Tables 15-1 and 15-2.

Telecom Addendum
15.4 General Requirements for All Surfaces (cont.)
Table 15-1 Criteria for Enclosures and Other Finished Surfaces - Physical Defects
Physical Defects
The following defects refer to physical defects (disturbing base material, mechanical damage, etc.).
Note: the headers Grade 1, Grade 2 and Grade 3 correspond to terms commonly used in the Telecom industry Class 1, Class 2 and
Class 3 where Grade 1/Class 1 are the most stringent requirements. In this addendum the committee chose to use the designation
‘‘Grade’’ instead of ‘‘Class’’ to reduce confusion with the Class designations used in all IPC documents.
In IPC documents the terms Class 1, 2, or 3 are used to reflect criticality of need and ability to operate in harsh environmental
conditions (thermal, vibration, etc.) where Class 3 are the most stringent requirements.
Characteristic Grade 1 Grade 2 Grade 3
Burrs Unacceptable Unacceptable Acceptable providing it is
permanently attached and
does not cause a safety
hazard, nor interfere with or
chafe on any other equipment.
Corrosion Unacceptable Unacceptable Unacceptable
Dent Unacceptable Unacceptable Unacceptable if dent affects
function or alignment.
Die, Tool, or Brake Mark Unacceptable Acceptable, providing they Acceptable
are consistent in appearance,
do not exceed 0.076 mm
[0.003 in] in depth, and high
areas are sanded flush with
surrounding surfaces.
Flat Head Rivet Unacceptable Acceptable providing it is Acceptable
flush to .005 inches below
the surrounding surfaces.
Fracture Unacceptable Unacceptable Unacceptable
Material Pitting Unacceptable Unacceptable Acceptable if less than
1.59 mm [0.0625 in]
in diameter.
Mechanical Misalignment Unacceptable Acceptable, providing parts Acceptable, providing
can be adjusted to achieve functionality of equipment
a balanced appearance. is not affected.
Mold Line A visible line is acceptable. A visible line is acceptable. A visible line is acceptable.
Flash Unacceptable. Permanently attached flash Permanently attached
shall not exceed the flash shall not impair
appropriate dimensional the functionality of the
tolerance of the part. Flash equipment. Flash that can
that can be easily removed be easily removed shall be
shall be removed. removed.
Spot-Weld Crater Unacceptable Acceptable providing it is flush Acceptable
to .13 mm [.005 in] below the
surrounding surfaces.
Weld Burn Unacceptable Yellow to brown discoloration is Yellow to brown discoloration is
acceptable (except aluminum). acceptable (except aluminum).
Purple discoloration on Purple discoloration on
stainless steel is unacceptable. stainless steel is unacceptable.
Weld Flash and Splatter Unacceptable Unacceptable Acceptable providing it is
permanently attached, does
not cause a safety hazard,
nor interfere with or chafe
on any other equipment.
Flash that can be easily
removed shall be removed.

Telecom Addendum
15.4 General Requirements for All Surfaces (cont.)
Table 15-2 Criteria for Enclosures and Other Finished Surfaces - Finish Defects
Finish Defects
The following defects refer to attributes of applied finishes (e.g., paint or powder coat) and plated finishes (e.g., plated, chromated,
anodized).
Adhesion - (Loss of, Unacceptable Unacceptable Unacceptable
e.g., peeling)
Bleeding (e.g., Unacceptable Unacceptable Gradual color change is
between painted acceptable.
surfaces)
Blistered Finish Unacceptable Unacceptable Unacceptable
Crack or Chip in Unacceptable Unacceptable Unacceptable if greater than
Finish 3.2 mm [0.125 in] in length or
corrosion susceptible material
is exposed.
Discoloration or Unacceptable Gradual discoloration or texture Acceptable
Non-uniform Texture change is acceptable.
Entrapped Foreign Unacceptable Unacceptable Acceptable
Material
Orange Peel Unacceptable Acceptable Acceptable
Overspray Unacceptable Unacceptable Acceptable
Pinhole Unacceptable Unacceptable Unacceptable if corrosion
susceptible material is exposed.
Pitting or Plating Unacceptable Acceptable if localized in an area Acceptable
Etching less than 50.8 mm [2.0 in] in
diameter.
Plating Bleedout Unacceptable Unacceptable Unacceptable
Plating Burn Unacceptable unless specifically Unacceptable unless specifically Acceptable
allowed by applicable plating allowed by applicable plating
specification. specification.
Plating Stain or Unacceptable Refer to applicable plating Refer to applicable plating
Burnish specifications. specifications.
Run Unacceptable A run is acceptable if it does not Acceptable
exceed 6.4 mm [0.25 in] wide by
50.8 mm [2.0 in] long and there is
no more than 1 run per 0.0036
square m [1.0 square ft].
Sag Unacceptable A slight sag is acceptable if it is More than 2 sags per 0.0036
no greater than 50.8 mm [2.0 in] square m [1.0 square ft] is
wide and there is no more than unacceptable.
1 sag per 0.0036 square m
[1.0 square ft].
Scratch Unacceptable Slight scratches (e.g., sanding Scratches are acceptable,
and polishing marks) are providing that no corrosion
acceptable, providing that the susceptible material is exposed.
scratches cannot be felt with a
finger and not readily noticeable
at a distance of 457 mm [18.0 in].
Smear Unacceptable Unacceptable Acceptable providing that
is not exposed.
Thin Spot Unacceptable Unacceptable Acceptable providing that
is not exposed.
Void Unacceptable Unacceptable Acceptable providing that
is not exposed.

Telecom Addendum
15.5 Rivets
Rivets shall be installed with well-formed driven heads seated tightly against their bearing surface (any evidence of loose parts or
loose rivets that can be moved or turned with finger tip pressure shall not be acceptable). Joined parts shall fit firmly showing
no significant distortion or other physical damage (such as tool marks as a result of the riveting operation). There shall be no for-
eign material captured between the mating materials or under the heads of the rivet.
Hollow shank rivets, such as tubular rivets, shall be installed tight against their mounting surface with no portion of the hole vis-
ible. The driven head shall be formed with a rollover line having complete contact with the mounting surface. The internal portion
of tubular rivets shall be free of any visible cracks or distortion.
Pop rivets shall meet all of the criteria for tubular rivets except that the rollover on the backside of the rivet is not present.
Target
IPC-610D-C15-002
Figure 15-2
Acceptable
B A C • Rivets used to install handles must not exceed a height of
0.38 mm [0.015 in] as measured from the handle surface to
the top of the rivet and cannot exceed the allowable maxi-
mum or minimum component height for that assembly (refer
to Section 4.5).
IPC-610D-C15-003
• Internal gap equal to or less than 0.15 mm [0.006 in] (A) and
Figure 15-3 gap does not extend to rivet shank (B).
• The heads of flat countersunk head rivets shall be between
0.64 mm [0.025 in] above flush and 0.13 mm [0.005 in]
below flush. The heads shall not protrude to the extent that
mechanical interference will result.
• Mating surfaces free of foreign material or burrs (C).
• Slight gap under rivet head where 50% of the head is in
contact with the mating surface and the gap does not
IPC-610D-C15-004
exceed 0.38 mm [0.015 in].
Figure 15-4 • Cut or tool mark in material less than 25% of the material
thickness (A) or cut in rivet head less than 0.64 mm [0.025
B in] (B).
A
IPC-610D-C15-005
Figure 15-5

Telecom Addendum
15.5 Rivets (cont.)
Defect
B A C • Internal gap between joined materials exceeds 0.15 mm
[0.006 in] (A).
• Gap extends to rivet shank (B).
• Burrs, foreign material between mating surfaces (C).
IPC-610D-C15-006 • Rivet swelled between joined materials (B).
Figure 15-6 • Rivet is not seated firmly.
• Joined material visibly distorted (A) or tool marks evident (B).
B
• Cut or tool mark in material surface more than 25% of mate-
rial thickness or 0.38 mm [0.015 in] deep (A), whichever is
less.
• Cut in rivet head more than 0.25 mm [0.010 in] deep (B).
IPC-610D-C15-007
Figure 15-7
IPC-610D-C15-008
Figure 15-8
A
B
IPC-610D-C15-009
Figure 15-9
B
A
A
C
IPC-610D-C15-010
Figure 15-10

Telecom Addendum
15.5.1 Rivet Head Deformation
Acceptable
• Bevel driven head: The formed head shall be between
25-75% of the original head height.
• Offset driven head: The head can be off center with the
shank but the shank shall not be exposed.
• Step driven head: The minimum thickness shall be 25% of
the original head height.
IPC-610D-C15-011
Figure 15-11
IPC-610D-C15-012
Figure 15-12
IPC-610D-C15-013
Figure 15-13

Telecom Addendum
15.5.2 Tubular and Pop Rivets
Acceptable
• Rivet tight against mounting surface.
• Rollover complete.
• Edge of hole not visible.
• Gap equal to or less than 0.051 mm [0.002 in].
• Splits in the head of the rivet are acceptable providing there
IPC-610D-C15-014 are no more than 3, all spaced greater than 90° apart, and
they do not extend into the rivet shank.
Figure 15-14
• Pop rivets do not need to have a captive mandrel present as
long as the secondary head is fully formed.
Defect
A B • Rivet not tight against mounting surface.
• Rollover incomplete.
• Edge of hole visible.
• Gap greater than 0.051 mm [0.002 in].
• More than 3 splits in the head of the rivet or excessive
bulges that may weaken the rivet.
C
• Secondary head on pop rivet is not fully formed and rivet is
IPC-610D-C15-015
loose.
Figure 15-15 • Rivet too short and does not form proper rollover (A).
• Driven head flattened, formed with improper tool (B).
• Insufficient forming, bulged ends not curled (C).
A B C
IPC-610D-C15-016
Figure 15-16

Telecom Addendum
16 Fiber Optics
General Requirements
Optical connectors are used to connect, disconnect, and reconnect fiber cables with a minimum of signal loss. Small cracks on
the face of an optical connector reduce signal power; large cracks cause signal loss. An optical connection is made by physically
aligning two optical fibers so that both fibers illuminate and touch one another. As a result, contamination of these surfaces caused
by dust, oil from operator’s fingers, or other foreign matter may cause excessive signal loss or connector damage. Therefore,
operators and technicians shall inspect and, if needed, clean all fiber end connectors before any assembly or testing is performed.
The following requirements should also be observed:
• Never bend or coil cable less than the minimum bend radius (Refer to Section 13.4).
• Dry nitrogen (only) shall be used to blow loose contaminants from optical fiber connectors.
• If a wet process is used to clean fiber optics (example Isopropyl Alcohol) it must be followed up with a dry cleaning process and
visual inspection.
• Canned compressed air shall not be used.
• Do not pull on fiber cables or allow them to support any weight.
• When handling fiber assemblies, always handle by the connectors.
• Never touch the fiber cable ends or module connectors.
• Avoid twisting fiber cable while turning end connectors or routing the cable during installation and test.
• Do not allow optical connectors to strike or drag across work surfaces or the floor.
• Do not allow fiber cable ends/module connectors to be uncapped when not in use.
• Cable ties shall not be used to secure fiber optic cables.
General Inspection Requirements

The elements of fiber optic cable and connector end face are illustrated in Figures 16-1 and 16-2.
• Fiber optic connectors are normally inspected at 200X magnification with up to 400X used for defect resolution.
• Use a video feed optical viewing scope (min. 200X magnification) if powered optics must be inspected.
• The core of the fiber should be readily visible if the opposite end of the fiber is illuminated.
Warning
Never look into the end of an optical fiber while optical power is being applied to the fiber.
When cleaning or making measurements, avoid eye exposure to open-ended fibers
and optical connectors because they may be connected to laser transmitters.

Telecom Addendum
16 Fiber Optics (cont.)
D1
D2 D
D3
IPC-610D-C16-001
Figure 16-1
Main Elements of Fiber Optic Cable:
A. Outer jacket
B. Strength members
C. Buffer jacket
D. Optical fiber
D1. Silicone coating
D2. Cladding (silica)
D3. Core (silica)
B C
A D
IPC-610D-C16-002
Figure 16-2
Main elements of Connector End
A. Fiber core
B. Fiber cladding
C. Ferrule
D. Epoxy

Telecom Addendum
16.1 Bend Radius Requirements – Fiber Optic Cabling
Unless otherwise specified by design, fiber manufacturer, or the OEM, the Table 16-1 and Figure 16-3 should be used to deter-
mine the minimum allowable bend radius.
Table 16-1 Cable Bend Radius

Cable Type Minimum Bend Radius (A)
Buffered & Jacketed Single Fibers 1 in.
Larger Jacketed Fibers 15X Fiber Cable Diameter (B)
IPC-610D-C16-003
Figure 16-3
A. Bend radius
B. Cable diameter
Caution must be observed when handling or assembling optical glass cable. Violating the minimum bend radius can cause the
following effects:
• Bends increase attenuation. Bends change the angles of reflection enough to affect transmit or receive power (see Figure 16-4).
• Bends may cause micro fractures along the surface of the fiber. Micro fractures will eventually cause a break in the fiber caus-
ing signal loss.
• Micro bends are small variations or ‘‘bumps’’ in the core to cladding interface (see Figure 16-5). Micro bends can cause high-
order modes to reflect at angles that will not allow desired reflection (the light signal may be reduced or lost).
IPC-610D-C16-005
Figure 16-5
IPC-610D-C16-004
Figure 16-4

Telecom Addendum
16.1 Connector End Face
Fiber Optic end faces shall be inspected at 200x magnification for surface anomalies.
16.1.1 Connector End Face – Non-angled PC Polish Connectors
Acceptability of non-angled PC polish connectors shall conform to Table 16.2.
Table 16-2 Allowable Defects for Non-angled PC Polish Connectors

Allowable Defects/Scratches2, 3
E Contamination/Pits
Zone Description Diameter (non-removable)4, 5 Scratches6
Core Zone
0 to 25 µm None None
(Single-Mode)
A A
Core Zone 5 <5 µm 5 µm
0 to 66 µm
(Multi-Mode) none 5 µm none 3 µm
Any <2 µm
Cladding Zone
B 25 - 120 µm 5 from 2 -5 µm none >3 µm1
(Single-Mode)
none >5 µm
B7, 9
Any <2 µm
Cladding Zone
C 66 - 130 µm 8 from 2 -5 µm none >3 µm1
(Multi-Mode)
A. Core Zone none >5 µm
B. Cladding Zone D
C. Adhesive Zone C Adhesive Zone 120 - 130 µm any any
D. Contact Zone
E. Core D8 Contact Zone 130 - 250 µm None >10 µm any
Table Notes:
1) When inspecting after polishing or while performing quality assurance of a new connector, a limit of five fine scratches (<3 µm) may be set in Zone B in order to
establish that a reliable process is being used by the manufacturer.
2) Any contaminants that are removable must be cleaned from the end-face.
3) Any defects or scratches that extend across multiple zones are subject to the most stringent criteria.
4) The size of a defect is equal to the smallest circle that can completely encompass the defect.
5) Defects are defined as ‘‘permanent nonlinear features.’’ This includes contamination, pits, etc.
6) Scratches are defined as ‘‘permanent linear features.’’
7) MT ferrules (e.g., ribbon) have allowable edge chipping from 115 to 125 µm.
8) Zone D criteria does not apply to MT-ferrule or Metallic-ferrule connectors.
9) Cracks, that when extended intersect Zone A, are not allowed.

Telecom Addendum
16.1.2 Connector End Face – Receptacles (with internal fiber stubs)
Acceptability of receptacles (with internal fiber stubs) shall conform to Table 16-3.
Table 16-3 Allowable Defects for Receptacles (with internal fiber stubs)
Allowable Defects/Scratches2, 3
Contamination/Pits
4, 5
Zone Description Diameter (non-removable) Scratches6
Core Zone (Single-Mode) 0 to 25 µm None None
A 5 <5 µm 5 <3 µm
Core Zone (Multi-Mode) 0 to 66 µm
none >5 µm none >3 µm
Any <5 µm
Cladding Zone (Single-Mode) 25 - 120 µm 5 from 5 -10 µm none >3 µm1
none >10 µm
B7, 9
Any <5 µm
Cladding Zone (Multi-Mode) 66 -130 µm 8 from 5 -10 µm none >3 µm1
none >10 µm
C Adhesive Zone 120 - 130 µm any any
any <20 µm
D7, 8 Contact Zone 130 - 250 µm 3 from 20 - 50 µm any
None >50 µm
Notes:
1) When inspecting after polishing or while performing quality assurance of a new connector, a limit of five fine scratches (<3 µm) may be set in Zone B in order to
establish that a reliable process is being used by the manufacturer.
2) Any contaminants that are removable must be cleaned from the end-face.
3) Any defects or scratches that extend across multiple zones are subject to the most stringent criteria.
4) The size of a defect is equal to the smallest circle that can completely encompass the defect.
5) Defects are defined as ‘‘permanent nonlinear features.’’ This includes contamination, pits, etc.
6) Scratches are defined as ‘‘permanent linear features.’’
7) MT ferrules (e.g., ribbon) have allowable edge chipping from 115 to 125 µm.
8) Zone D criteria does not apply to MT-ferrule or Metallic-ferrule connectors.
9) Cracks, that when extended intersect Zone A, are not allowed.
Target
• No evidence of contamination, scratches, or any other
anomaly.
Figure 16-6

Telecom Addendum
16.1.2 Connector End Face –

Receptacles (with internal fiber stubs) (cont.)
Acceptable
• Contamination falls within Cladding Zone but outside of Core
Zone. Diameter is less than 2 µm.
• Contamination is in Contact Zone and diameter is less than 10 µm.
• Contamination (less than 2 µm) in Cladding / Epoxy Zone.
• One scratch (less than 3 µm) in Cladding Zone. Multiple scratches
in Contact Zone.
Figure 16-7
Figure 16-8
Figure 16-9 Figure 16-10

Telecom Addendum

Defect
• Heavy cracks and chips.
• Core area damaged.
Figure 16-11
Defect
• Fiber surface pulverized by rotational contact with mating connector.
(‘‘Crashed’’)
Figure 16-12
Defect
• Severe chipping and cracking. (‘‘Crashed’’)
Figure 16-13

Telecom Addendum

Defect
• Large chip or surface pitting.
Figure 16-14
Defect
• Scratches across face of fiber, typical of coarse polish. Core not
visible.
Figure 16-15
Defect
• Surface cracks and chips extending into core area. Core area
damaged.
Figure 16-16

Telecom Addendum

Defect
• Contamination in the Core Zone.
Figure 16-17
Defect
• Large Particle in Cladding Zone.
Figure 16-18
Defect
• Scratch through Core.
Figure 16-19

Telecom Addendum

Defect
• Particle in Cladding Zone exceeds maximum allowed
diameter.
Figure 16-20
Defect
• Removable (Oil) Contamination - must be cleaned and
re-inspected.
Figure 16-21
Defect
• Large contamination on core/cladding. (Multi-cable
example.)
Figure 16-22

Telecom Addendum
16.1.3 Acceptance Criteria for Receptacles (with lens)
A lensed device consists of a ball lens located inside the barrel of an optical device. One will not be able to identify a clearly defined
core and cladding area.
Defect
• Deep surface crack near core area.
Figure 16-23
Defect
• Deep surface crack near core area.
Figure 16-23

Telecom Addendum
16.1.3 Acceptance Criteria for Receptacles (with lens) (cont.)
Defect
• Severe chipping. (‘‘Crashed’’)
Figure 16-25
Defect
• Foreign material on surface and contaminated.
Note: The connector end face shall not have particles or residues of
any kind on its surface at the time of connection.
Figure 16-26
Defect
• Deep scratch in core area.
Figure 16-27

Telecom Addendum
16.1.3 Acceptance Criteria for Receptacles (with lens) (cont.)
Figure 16-28 fiber stub end face compared to Figure 16-29

lens as seen through the inspection tool at 200x magnifica-
tion.
Figure 16-28
Figure 16-29
It may be possible to identify a lensed device visually without

the inspection tool. Figure 16-30 shows a transceiver with a
combined fiber stub and lens. The fiber stub is in the port on
the left. The lensed device is the port on the right.
Figure 16-30

Telecom Addendum
16.1.4 Lensed Device Acceptance Criteria
The lensed device is to be inspected for contamination, damage, or defects in the glass per the inspection criteria in the below
table. The main area of concern is the 500 µm viewing area (A). This will be almost the entire area that is visible at 200X magnifi-
cation. The Outer diameter of the lens (i.e., the 1.5 mm Region C) will not be visible at this magnification. For this area, a lower
magnification should be used.
Table 16-4 Lensed Device Acceptance Criteria

A Acceptance Criteria
Area Diameter Particles Bubbles in Glass Cracks
C
None >75 µm
Max. Qty. 3
Region A 500 µm Max Qty 3 Dia. 25-50 µm None
Max. Dia. 75 µm
No Limit Dia. <25 µm
Region C 1.5 mm No Limit No Limit Dia. <125 µm None

Telecom Addendum
16.1.5 Fiber Optic Cable Insulation Damage
Target
• No damage to jacket.
Figure 16-31
Acceptable
• Slight discoloration/melting are acceptable if caused by inci-
dental contact with soldering iron during assembly or
rework.
• Damage shall not expose fiber.
Figure 16-32
Defect
• Melted jacket with visibly burned (charred) area.
• Discoloration/melting related to power/heat sources con-
tained within the effected assembly.
• Any cut or burn that exposes inner layers.
Figure 16-33 • Jacket with compression marks evident.
• Possible crushed fiberglass core.
Figure 16-34

®
Standard Improvement Form IPC-A-610DC

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Technical Committee of IPC with input submit comments to IPC. All comments this form and return to:
from the industry regarding usage of will be collected and dispersed to the IPC
the subject standard. appropriate committee(s). 3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
Fax 847 615.7105
E-mail: answers@ipc.org
1. I recommend changes to the following:

Requirement, paragraph number
Test Method number , paragraph number
The referenced paragraph number has proven to be:

Unclear Too Rigid In Error
Other
2. Recommendations for correction:
3. Other suggestions for document improvement:
Submitted by:
Name Telephone
Company E-mail
Address
City/State/Zip Date
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3000 Lakeside Drive, Suite 309 S

Bannockburn, IL 60015
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www.ipc.org

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What are the principles that standards should follow according to the document?

What are the principles that standards should follow according to the document?

What are some things standards should not do according to the document?

What are some things standards should not do according to the document?

IPC-A-610DC

A standard developed by IPC

Association Connecting Electronics Industries

Thank you for your continued support.

Developed by the Telecom IPC-A-610 Addendum Task Group (7-31bc) of

Users of this standard are encouraged to participate in the

Product Assurance IPC-A-610 Telecom Technical Liaisons of the

Members of the IPC-A-610 Telecom Addendum Task Group

A-610DC August 2009 1

1.4.5 Electrical Clearance

These criteria replace all of 1.4.5 in published IPC-A-610D.

4.1.3 Hardware Installation – Threaded Fasteners

These criteria replace all of 4.1.3 in published IPC-A-610D.

4.1.3.1 Hardware Installation – Threaded Fasteners – Torque

These criteria replace all of 4.1.3.1 in published IPC-A-610D.

4.1.3.2 Hardware Installation – Threaded Fasteners – Wires

2 August 2009 A-610DC

4.3.2 Connector Pins – Press Fit Pins

These criteria replace all of 4.3.2 in published IPC-A-610D.

4.4.1 Wire Bundle Securing – General

These criteria replace all of 4.4.1 in published IPC-A-610D.

4.5.2 Routing – Bend Radius

IPC-A-610DC Table 4-1 Minimum Bend Radius Requirements

A-610DC August 2009 3

4.5.3 Routing – Coaxial Cable

These criteria replace all of 4.5.3 in published IPC-A-610D.

5.2.1 Soldering Anomalies – Exposed Basis Metal

These criteria replace all of 5.2.1 in published IPC-A-610D.

5.2.2 Soldering Anomalies – Pin Holes/Blow Holes

These criteria replace all of 5.2.2 in published IPC-A-610D.

7.1 Component Mounting

Use 7.1 published criteria in IPC-A-610D with this added statement:

4 August 2009 A-610DC

7.1.7 Component Mounting – Radial Leads – Horizontal

These criteria replace all of 7.1.7 in published IPC-A-610D.

7.1.8 Component Mounting – Connectors

These criteria replace all of 7.1.8 in published IPC-A-610D.

A-610DC August 2009 5

7.1.8.1 Connector Mounting – Heat Staking

Added criteria in this addendum.

Heat Stake/Press Peg Appearance After heat staking, the

Missing or Nonconforming Heat Stakes On any connec-

6 August 2009 A-610DC

7.1.8.1 Connector Mounting – Heat Staking (cont.)

A-610DC August 2009 7

7.1.8.1 Connector Mounting – Heat Staking (cont.)

7.1.8.2 Connector Mounting – Soldered Connectors –

Added criteria in this addendum.

8 August 2009 A-610DC

7.1.8.3 Connector Mounting – Soldered Connectors –

Added criteria in this addendum.

A-610DC August 2009 9

7.1.8.4 Connector Mounting – Soldered Connectors – Vertical Shrouded Pin

Added criteria in this addendum.

10 August 2009 A-610DC