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    02-StencilPRN-Overview of SMT

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    Lane Meda
    Surface Mount Technology (SMT) involves placing electronic components directly onto the surface of printed circuit boards rather than through holes. SMT requires less space and is widely used where miniaturization is important. Key aspects of the SMT process include solder paste selection, stencil printing to apply the paste, component placement, and reflow soldering. Printing is a critical step, as 50-70% of defects originate there due to factors like paste, stencil quality, board flatness, and squeegee technique.

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    02-StencilPRN-Overview of SMT

    Uploaded by

    Lane Meda
    29 views15 pages
    Surface Mount Technology (SMT) involves placing electronic components directly onto the surface of printed circuit boards rather than through holes. SMT requires less space and is widely used where miniaturization is important. Key aspects of the SMT process include solder paste selection, stencil printing to apply the paste, component placement, and reflow soldering. Printing is a critical step, as 50-70% of defects originate there due to factors like paste, stencil quality, board flatness, and squeegee technique.

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    Osnove SMT tehnologije za operatere

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    Surface Mount Technology (SMT) involves placing electronic components directly onto the surface of printed circuit boards rather than through holes. SMT requires less space and is widely used where miniaturization is important. Key aspects of the SMT process include solder paste selection, stencil printing to apply the paste, component placement, and reflow soldering. Printing is a critical step, as 50-70% of defects originate there due to factors like paste, stencil quality, board flatness, and squeegee technique.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    29 views15 pages

    02-StencilPRN-Overview of SMT

    Uploaded by

    Lane Meda
    Surface Mount Technology (SMT) involves placing electronic components directly onto the surface of printed circuit boards rather than through holes. SMT requires less space and is widely used where miniaturization is important. Key aspects of the SMT process include solder paste selection, stencil printing to apply the paste, component placement, and reflow soldering. Printing is a critical step, as 50-70% of defects originate there due to factors like paste, stencil quality, board flatness, and squeegee technique.

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 15

    STENCIL PRINTING

    Pregled SMT tehnologije


    STENCIL PRINTING
    Pregled SMT tehnologije
    SURFACE MOUNT TECHNOLOGY (SMT) je tehnologija koja se
    odnosi na specifičnu vrstu elektronskih sklopova kod kojih se
    elektronske komponente postavljaju na površinu podloge, tipično
    na štampanu ploču (PCB – Printed Circuit Board).

    SMT je savremena alternativa za tradicionalnu Thru-Hole


    Tehnologiju (THT) kod koje se komponente postavljaju i učvršćuju
    na podlogu pomoću nožica koje postoje na komponenti i koje se
    provlače kroz rupe izbušene na podlozi.

    Tehnologija površinske montaže zahteva manje prostora, tako da


    je široko primenjena u današnje vreme kad se zahteva
    minijaturizacija elektronskih sklopova.
    STENCIL PRINTING
    Pregled SMT tehnologije
    STENCIL PRINTING
    Pregled SMT tehnologije

    kristal soli

    0402m (metric)

    0201m (metric)
    0201“ (imperial)
    0603“ (imperial)
    0402“ (imperial)
    1mm
    STENCIL PRINTING
    Pregled SMT tehnologije
    Deklaracija komponente
    [in] x [in] Imperijalistički Metrički kod [mm] x [mm]
    kod
    008004q 0201 0.25 x 0.25
    - 03015 0.3 x 0.15
    0.016“ x 0.0079“ 01005 0402 0.4 x 0.2
    0.024“ x 0.012“ 0201 0603 0.6 x 0.3
    0.039“ x 0.020“ 0402 1005 1.0 x 0.5
    0603 1608 1.6 x 0.8
    STENCIL PRINTING
    Pregled SMT tehnologije
    STENCIL PRINTING
    Tok SMT procesa
    STENCIL PRINTING
    Tok SMT procesa
    STENCIL PRINTING
    Kritični elementi u SMT procesu
    • Solderability
    • Izbor solder paste (Solder Paste
    Selection)
    • Proces printinga (Printing Process)
    • Postavljanje komponenata (Component
    Placement)
    • Reflow proces
    • Proces čišćenja (Cleaning Process)

    50 – 70% defekata u proizvodnji nastaje zbog grešaka u postupku printinga


    STENCIL PRINTING
    Kritični elementi u SMT procesu
    Components
    Reflow

    Placement

    Printing process

    Mesto nastanka defekata koji se detektuju na kraju SMT linije


    STENCIL PRINTING
    Faktori koji utiču na proces printinga
    STENCIL PRINTING
    Ključni elementi za kvalitetan Printing
    • Solder pasta • Tooling (podrška)
    • Stencil (šablon) • Release (odvajanje)
    • Štampana ploča (PCB) • Wiping (čišćenje)
    • Squegee (SQ) • Offsets

    Prikaz jednog dobrog nanošenja solder paste u postupku stencil printinga


    STENCIL PRINTING
    Ključni elementi za kvalitetan Printing
    • Solder pasta • Tooling (podrška)
    • Stencil (šablon) • Release (odvajanje)
    • Štampana ploča (PCB) • Wiping (čišćenje)
    • Squegee (SQ) • Offsets
    STENCIL PRINTING
    Ključni elementi za kvalitetan Printing
    • Solder pasta • Tooling (podrška)
    • Stencil (šablon) • Release (odvajanje)
    • Štampana ploča (PCB) • Wiping (čišćenje)
    • Squegee (SQ) • Offsets
    STENCIL PRINTING
    Ključni elementi za kvalitetan Printing
    • Solder pasta • Tooling (podrška)
    • Stencil (šablon) • Release (odvajanje)
    • Štampana ploča (PCB) • Wiping (čišćenje)
    • Squegee (SQ) • Offsets

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