mps430 Datasheet
mps430 Datasheet
mps430 Datasheet
DESCRIPTION
The Texas Instruments MSP430™ family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with extensive low-
power modes, is optimized to achieve extended battery life in portable measurement applications. The device
features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in 3.5
µs (typical).
The MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 are microcontroller configurations with
integrated USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 12-bit analog-to-digital
converter (ADC), two universal serial communication interfaces (USCI), hardware multiplier, DMA, real-time clock
module with alarm capabilities, and 63 I/O pins. The MSP430F5528, MSP430F5526, MSP430F5524, and
MSP430F5522 include all of these peripherals but have 47 I/O pins.
The MSP430F5519, MSP430F5517, and MSP430F5515 are microcontroller configurations with integrated USB
and PHY supporting USB 2.0, four 16-bit timers, two universal serial communication interfaces (USCI), hardware
multiplier, DMA, real time clock module with alarm capabilities, and 63 I/O pins. The MSP430F5514 and
MSP430FF5513 include all of these peripherals but have 47 I/O pins.
Typical applications include analog and digital sensor systems, data loggers, and others that require connectivity
to various USB hosts.
Family members available are summarized in Table 1.
(1) The additional 2 KB USB SRAM that is listed can be used as general purpose SRAM when USB is not in use.
(2) Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
(3) Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
XT2IN SYS
Unified ACLK Power I/O Ports I/O Ports I/O Ports I/O Ports
Management P1/P2 P3/P4 P5/P6 P7/P8 Full-speed
Clock 128KB 8KB+2KB Watchdog
XT2OUT 2×8 I/Os 2×8 I/Os 2×8 I/Os 1×8 I/Os USB
System SMCLK 96KB 6KB+2KB
Port Map Interrupt 1×3 I/Os
64KB 4KB+2KB LDO & Wakeup USB-PHY
32KB Control USB-LDO
SVM/SVS (P4)
MCLK USB-PLL
Brownout PA PB PC PD
Flash RAM 1×16 I/Os 1×16 I/Os 1×16 I/Os 1×11 I/Os
MAB
CPUXV2 DMA
and
Working MDB 3 Channel
Registers
EEM
(L: 8+2)
USCI0,1 ADC12_A
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.1/TDI/TCLK
P5.3/XT2OUT
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.0/CB0/A0
P5.2/XT2IN
PJ.2/TMS
PJ.0/TDO
PJ.3/TCK
PU.1/DM
PU.0/DP
AVSS2
VSSU
VUSB
VBUS
PUR
V18
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P6.4/CB4/A4 1 60 P7.7/TB0CLK/MCLK
P6.5/CB5/A5 2 59 P7.6/TB0.4
P6.6/CB6/A6 3 58 P7.5/TB0.3
P6.7/CB7/A7 4 57 P7.4/TB0.2
P7.0/CB8/A12 5 56 P5.7/TB0.1
P7.1/CB9/A13 6 55 P5.6/TB0.0
P7.2/CB10/A14 7 54 P4.7/PM_NONE
P7.3/CB11/A15 8 53 P4.6/PM_NONE
P5.0/A8/VREF+/VeREF+ 9 52 P4.5/PM_UCA1RXD/PM_UCA1SOMI
MSP430F5529IPN
P5.1/A9/VREF−/VeREF− 10 MSP430F5527IPN 51 P4.4/PM_UCA1TXD/PM_UCA1SIMO
AVCC1 11 MSP430F5525IPN 50 DVCC2
P5.4/XIN 12 MSP430F5521IPN 49 DVSS2
P5.5/XOUT 13 48 P4.3/PM_UCB1CLK/PM_UCA1STE
AVSS1 14 47 P4.2/PM_UCB1SOMI/PM_UCB1SCL
P8.0 15 46 P4.1/PM_UCB1SIMO/PM_UCB1SDA
P8.1 16 45 P4.0/PM_UCB1STE/PM_UCA1CLK
P8.2 17 44 P3.7/TB0OUTH/SVMOUT
DVCC1 18 43 P3.6/TB0.6
DVSS1 19 42 P3.5/TB0.5
VCORE 20 41 P3.4/UCA0RXD/UCA0SOMI
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P1.2/TA0.1
P2.1/TA1.2
P1.3/TA0.2
P1.6/TA1CLK/CBOUT
P1.1/TA0.0
P1.7/TA1.0
P1.4/TA0.3
P1.5/TA0.4
P2.0/TA1.1
P2.3/TA2.0
P2.5/TA2.2
P3.2/UCB0CLK/UCA0STE
P2.2/TA2CLK/SMCLK
P2.6/RTCCLK/DMAE0
P3.3/UCA0TXD/UCA0SIMO
P3.1/UCB0SOMI/UCB0SCL
P1.0/TA0CLK/ACLK
P2.4/TA2.1
P2.7/UCB0STE/UCA0CLK
P3.0/UCB0SIMO/UCB0SDA
XT2IN SYS
Unified ACLK Power I/O Ports I/O Ports I/O Ports
Management P1/P2 P3/P4 P5/P6 Full-speed
Clock 128KB 8KB+2KB Watchdog
XT2OUT 2×8 I/Os 1×5 I/Os 1×6 I/Os USB
System SMCLK 96KB 6KB+2KB
Port Map Interrupt 1×8 I/Os 1×8 I/Os
64KB 4KB+2KB LDO & Wakeup USB-PHY
32KB Control USB-LDO
SVM/SVS (P4)
MCLK USB-PLL
Brownout PA PB PC
Flash RAM 1×16 I/Os 1×13 I/Os 1×14 I/Os
MAB
CPUXV2 DMA
and
Working MDB 3 Channel
Registers
EEM
(L: 8+2)
USCI0,1 ADC12_A
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.1/TDI/TCLK
P5.3/XT2OUT
P5.2/XT2IN
PJ.2/TMS
PJ.0/TDO
PJ.3/TCK
PU.1/DM
PU.0/DP
AVSS2
VSSU
VUSB
VBUS
PUR
V18
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P6.0/CB0/A0 1 48 P4.7/PM_NONE
P6.1/CB1/A1 2 47 P4.6/PM_NONE
P6.2/CB2/A2 3 46 P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/CB3/A3 4 45 P4.4/PM_UCA1TXD/PM_UCA1SIMO
P6.4/CB4/A4 5 44 P4.3/PM_UCB1CLK/PM_UCA1STE
P6.5/CB5/A5 6 43 P4.2/PM_UCB1SOMI/PM_UCB1SCL
P6.6/CB6/A6 7 42 P4.1/PM_UCB1SIMO/PM_UCB1SDA
MSP430F5528IRGC
P6.7/CB7/A7 8 MSP430F5526IRGC 41 P4.0/PM_UCB1STE/PM_UCA1CLK
P5.0/A8/VREF+/VeREF+ 9 MSP430F5524IRGC 40 DVCC2
P5.1/A9/VREF−/VeREF− 10 MSP430F5522IRGC 39 DVSS2
AVCC1 11 38 P3.4/UCA0RXD/UCA0SOMI
P5.4/XIN 12 37 P3.3/UCA0TXD/UCA0SIMO
P5.5/XOUT 13 36 P3.2/UCB0CLK/UCA0STE
AVSS1 14 35 P3.1/UCB0SOMI/UCB0SCL
DVCC1 15 34 P3.0/UCB0SIMO/UCB0SDA
DVSS1 16 33 P2.7/UCB0STE/UCA0CLK
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P1.2/TA0.1
P2.4/TA2.1
P1.3/TA0.2
P1.1/TA0.0
P1.4/TA0.3
VCORE
P1.0/TA0CLK/ACLK
P1.5/TA0.4
P2.5/TA2.2
P2.1/TA1.2
P1.7/TA1.0
P1.6/TA1CLK/CBOUT
P2.3/TA2.0
P2.6/RTCCLK/DMAE0
P2.0/TA1.1
P2.2/TA2CLK/SMCLK
XT2IN SYS
Unified ACLK Power I/O Ports I/O Ports I/O Ports I/O Ports
Management P1/P2 P3/P4 P5/P6 P7/P8 Full-speed
Clock 128KB 4KB+2KB Watchdog
XT2OUT 2×8 I/Os 2×8 I/Os 2×8 I/Os 1×8 I/Os USB
System SMCLK 96KB
Port Map Interrupt 1×3 I/Os
64KB LDO & Wakeup USB-PHY
Control USB-LDO
SVM/SVS (P4)
MCLK Flash RAM USB-PLL
Brownout PA PB PC PD
1×16 I/Os 1×16 I/Os 1×16 I/Os 1×11 I/Os
MAB
CPUXV2 DMA
and
Working MDB 3 Channel
Registers
EEM
(L: 8+2)
USCI0,1
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.1/TDI/TCLK
P5.3/XT2OUT
P5.2/XT2IN
PJ.2/TMS
PJ.0/TDO
P6.3/CB3
P6.2/CB2
P6.1/CB1
PJ.3/TCK
P6.0/CB0
PU.1/DM
PU.0/DP
AVSS2
VSSU
VUSB
VBUS
PUR
V18
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P6.4/CB4 1 60 P7.7/TB0CLK/MCLK
P6.5/CB5 2 59 P7.6/TB0.4
P6.6/CB6 3 58 P7.5/TB0.3
P6.7/CB7 4 57 P7.4/TB0.2
P7.0/CB8 5 56 P5.7/TB0.1
P7.1/CB9 6 55 P5.6/TB0.0
P7.2/CB10 7 54 P4.7/PM_NONE
P7.3/CB11 8 53 P4.6/PM_NONE
P5.0 9 52 P4.5/PM_UCA1RXD/PM_UCA1SOMI
P5.1 10 MSP430F5519IPN 51 P4.4/PM_UCA1TXD/PM_UCA1SIMO
AVCC1 11 MSP430F5517IPN 50 DVCC2
MSP430F5515IPN
P5.4/XIN 12 49 DVSS2
P5.5/XOUT 13 48 P4.3/PM_UCB1CLK/PM_UCA1STE
AVSS1 14 47 P4.2/PM_UCB1SOMI/PM_UCB1SCL
P8.0 15 46 P4.1/PM_UCB1SIMO/PM_UCB1SDA
P8.1 16 45 P4.0/PM_UCB1STE/PM_UCA1CLK
P8.2 17 44 P3.7/TB0OUTH/SVMOUT
DVCC1 18 43 P3.6/TB0.6
DVSS1 19 42 P3.5/TB0.5
VCORE 20 41 P3.4/UCA0RXD/UCA0SOMI
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P1.2/TA0.1
P2.1/TA1.2
P1.3/TA0.2
P1.6/TA1CLK/CBOUT
P1.1/TA0.0
P1.7/TA1.0
P1.4/TA0.3
P1.5/TA0.4
P2.0/TA1.1
P2.3/TA2.0
P2.5/TA2.2
P3.2/UCB0CLK/UCA0STE
P2.2/TA2CLK/SMCLK
P2.6/RTCCLK/DMAE0
P3.3/UCA0TXD/UCA0SIMO
P3.1/UCB0SOMI/UCB0SCL
P1.0/TA0CLK/ACLK
P2.4/TA2.1
P2.7/UCB0STE/UCA0CLK
P3.0/UCB0SIMO/UCB0SDA
XT2IN SYS
Unified ACLK Power I/O Ports I/O Ports I/O Ports
Management P1/P2 P3/P4 P5/P6 Full-speed
Clock 64KB 4KB+2KB Watchdog
XT2OUT 2×8 I/Os 1×5 I/Os 1×6 I/Os USB
System SMCLK 32KB
Port Map Interrupt 1×8 I/Os 1×8 I/Os
LDO & Wakeup USB-PHY
Control USB-LDO
SVM/SVS (P4)
MCLK Flash RAM USB-PLL
Brownout PA PB PC
1×16 I/Os 1×13 I/Os 1×14 I/Os
MAB
CPUXV2 DMA
and
Working MDB 3 Channel
Registers
EEM
(L: 8+2)
USCI0,1
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.1/TDI/TCLK
P5.3/XT2OUT
P5.2/XT2IN
PJ.2/TMS
PJ.0/TDO
PJ.3/TCK
PU.1/DM
PU.0/DP
AVSS2
VSSU
VUSB
VBUS
PUR
V18
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P6.0/CB0 1 48 P4.7/PM_NONE
P6.1/CB1 2 47 P4.6/PM_NONE
P6.2/CB2 3 46 P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/CB3 4 45 P4.4/PM_UCA1TXD/PM_UCA1SIMO
P6.4/CB4 5 44 P4.3/PM_UCB1CLK/PM_UCA1STE
P6.5/CB5 6 43 P4.2/PM_UCB1SOMI/PM_UCB1SCL
P6.6/CB6 7 42 P4.1/PM_UCB1SIMO/PM_UCB1SDA
P6.7/CB7 8 MSP430F5514IRGC 41 P4.0/PM_UCB1STE/PM_UCA1CLK
P5.0 9 MSP430F5513IRGC 40 DVCC2
P5.1 10 39 DVSS2
AVCC1 11 38 P3.4/UCA0RXD/UCA0SOMI
P5.4/XIN 12 37 P3.3/UCA0TXD/UCA0SIMO
P5.5/XOUT 13 36 P3.2/UCB0CLK/UCA0STE
AVSS1 14 35 P3.1/UCB0SOMI/UCB0SCL
DVCC1 15 34 P3.0/UCB0SIMO/UCB0SDA
DVSS1 16 33 P2.7/UCB0STE/UCA0CLK
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P1.2/TA0.1
P2.4/TA2.1
P1.3/TA0.2
P1.1/TA0.0
P1.4/TA0.3
VCORE
P1.0/TA0CLK/ACLK
P1.5/TA0.4
P2.5/TA2.2
P2.1/TA1.2
P1.7/TA1.0
P1.6/TA1CLK/CBOUT
P2.3/TA2.0
P2.6/RTCCLK/DMAE0
P2.0/TA1.1
P2.2/TA2CLK/SMCLK
H8 H7 H6 H5 H4 H3 H2 H1 H1 H2 H3 H4 H5 H6 H7 H8
P2.7 P3.1 DVSS2 DVCC2 P4.1 P4.4 VSSU PU.0 PU.0 VSSU P4.4 P4.1 DVCC2 DVSS2 P3.1 P2.7
G8 G7 G6 G5 G4 G3 G2 G1 G1 G2 G3 G4 G5 G6 G7 G8
P3.0 P3.2 P3.3 P3.4 P4.2 P4.5 PUR PU.1 PU.1 PUR P4.5 P4.2 P3.4 P3.3 P3.2 P3.0
F8 F7 F6 F5 F4 F3 F2 F1 F1 F2 F3 F4 F5 F6 F7 F8
P2.4 P2.5 P2.6 P4.0 P4.3 P4.6 VBUS VUSB VUSB VBUS P4.6 P4.3 P4.0 P2.6 P2.5 P2.4
E8 E7 E6 E5 E4 E3 E2 E1 E1 E2 E3 E4 E5 E6 E7 E8
D P2.1 P2.2 P2.3 P2.0 P4.7 TEST V18 P5.2 D P5.2 V18 TEST P4.7 P2.0 P2.3 P2.2 P2.1
D8 D7 D6 D5 D4 D3 D2 D1 D1 D2 D3 D4 D5 D6 D7 D8
P1.7 P1.6 P1.5 RST/NMI PJ.1 PJ.0 AVSS2 P5.3 P5.3 AVSS2 PJ.0 PJ.1 RST/NMI P1.5 P1.6 P1.7
C8 C7 C6 C5 C4 C3 C2 C1 C1 C2 C3 C4 C5 C6 C7 C8
P1.3 P1.4 P1.2 P6.7 P6.3 P6.1 PJ.3 PJ.2 PJ.2 PJ.3 P6.1 P6.3 P6.7 P1.2 P1.4 P1.3
B8 B7 B6 B5 B4 B3 B2 B1 B1 B2 B3 B4 B5 B6 B7 B8
VCORE P1.0 P1.1 P5.1 P5.0 P6.5 P6.4 P6.0 P6.0 P6.4 P6.5 P5.0 P5.1 P1.1 P1.0 VCORE
A8 A7 A6 A5 A4 A3 A2 A1 A1 A2 A3 A4 A5 A6 A7 A8
DVSS1 DVCC1 P5.5 P5.4 AVSS1 AVCC1 P6.6 P6.2 P6.2 P6.6 AVCC1 AVSS1 P5.4 P5.5 DVCC1 DVSS1
E E
(2) VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590L – MARCH 2009 – REVISED MAY 2013 www.ti.com
(3) See Bootstrap Loader (BSL) and JTAG Operation for use with BSL and JTAG functions.
(4) See JTAG Operation for use with JTAG function.
(5) See Bootstrap Loader (BSL) and JTAG Operation for use with BSL and JTAG functions.
(6) When this pin is configured as reset, the internal pullup resistor is enabled by default.
(7) C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground.
SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All Program Counter PC/R0
operations, other than program-flow instructions, are
performed as register operations in conjunction with Stack Pointer SP/R1
seven addressing modes for source operand and four Status Register SR/CG1/R2
addressing modes for destination operand.
The CPU is integrated with 16 registers that provide Constant Generator CG2/R3
reduced instruction execution time. The register-to- General-Purpose Register R4
register operation execution time is one cycle of the
CPU clock. General-Purpose Register R5
Four of the registers, R0 to R3, are dedicated as General-Purpose Register R6
program counter, stack pointer, status register, and
constant generator, respectively. The remaining General-Purpose Register R7
registers are general-purpose registers.
General-Purpose Register R8
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with General-Purpose Register R9
all instructions.
General-Purpose Register R10
The instruction set consists of the original 51
instructions with three formats and seven address General-Purpose Register R11
modes and additional instructions for the expanded
address range. Each instruction can operate on word General-Purpose Register R12
and byte data. General-Purpose Register R13
Operating Modes
The MSP430 has one active mode and six software selectable low-power modes of operation. An interrupt event
can wake up the device from any of the low-power modes, service the request, and restore back to the low-
power mode on return from the interrupt program.
The following seven operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
– FLL loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active, MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK and FLL loop control and DCOCLK are disabled
– DCO's dc-generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– Crystal oscillator is stopped
– Complete data retention
• Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wakeup from RST/NMI, P1, and P2
Memory Organization
USB BSL
All devices come pre-programmed with the USB BSL. Use of the USB BSL requires external access to the six
pins shown in Table 6. In addition to these pins, the application must support external components necessary for
normal USB operation; for example, the proper crystal on XT2IN and XT2OUT, proper decoupling, and so on.
NOTE
The default USB BSL evaluates the logic level of the PUR pin after a BOR reset. If it is
pulled high externally, then the BSL is invoked. Therefore, unless the application is
invoking the BSL, it is important to keep PUR pulled low after a BOR reset, even if BSL or
USB is never used. Applying a 1-MΩ resistor to ground is recommended.
UART BSL
A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the pre-
programmed, factory supplied, USB BSL. Use of the UART BSL requires external access to the six pins shown
in Table 7.
JTAG Operation
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface. Spy-
Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire
interface pin requirements are shown in Table 9. For further details on interfacing to development tools and
device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278). For a complete description of
the features of the JTAG interface and its implementation, see MSP430 Programming Via the JTAG Interface
(SLAU320).
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x5xx and MSP430x6xx Family User's Guide
(SLAU208).
(1) The value of the PM_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored
resulting in a read out value of 31.
Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode,
I2C Mode)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,
A and B.
The USCI_An module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3 pin or 4 pin) or I2C.
The MSP430F55xx series includes two complete USCI modules (n = 0, 1).
(1) Timer functions are selectable through the port mapping controller.
(2) Only on devices with ADC
Table 40. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION REGISTER OFFSET
DMA channel 0 control DMA0CTL 00h
DMA channel 0 source address low DMA0SAL 02h
DMA channel 0 source address high DMA0SAH 04h
DMA channel 0 destination address low DMA0DAL 06h
DMA channel 0 destination address high DMA0DAH 08h
DMA channel 0 transfer size DMA0SZ 0Ah
DMA channel 1 control DMA1CTL 00h
DMA channel 1 source address low DMA1SAL 02h
DMA channel 1 source address high DMA1SAH 04h
DMA channel 1 destination address low DMA1DAL 06h
DMA channel 1 destination address high DMA1DAH 08h
DMA channel 1 transfer size DMA1SZ 0Ah
DMA channel 2 control DMA2CTL 00h
DMA channel 2 source address low DMA2SAL 02h
DMA channel 2 source address high DMA2SAH 04h
DMA channel 2 destination address low DMA2DAL 06h
DMA channel 2 destination address high DMA2DAH 08h
DMA channel 2 transfer size DMA2SZ 0Ah
DMA module control 0 DMACTL0 00h
DMA module control 1 DMACTL1 02h
DMA module control 2 DMACTL2 04h
DMA module control 3 DMACTL3 06h
DMA module control 4 DMACTL4 08h
DMA interrupt vector DMAIV 0Eh
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
(1) It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
(2) The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the PMM, SVS High Side threshold
parameters for the exact values and further details.
(3) USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
(4) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
25
20
12
1 1, 2 1, 2, 3
0 0, 1 0, 1, 2 0, 1, 2, 3
0
1.8 2.0 2.2 2.4 3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Electrical Characteristics
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(4) Current for brownout, high-side supervisor (SVSH) normal mode included. Low-side supervisor and monitor disabled (SVSL, SVML).
High-side monitor disabled (SVMH). RAM retention enabled.
(5) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1
MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0)
(6) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(7) Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(9) Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
(1) Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
(2) Also applies to RST pin when pullup or pulldown resistor is enabled.
(1) Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
(2) An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
(1) The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
(1) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
(2) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
(1) A resistive divider with 2 × R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
(2) The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
TA = 85°C
5.0
15.0
4.0
10.0
3.0
2.0
5.0
1.0
0.0 0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 0.5 1.0 1.5 2.0
VOL – Low-Level Output Voltage – V VOL – Low-Level Output Voltage – V
Figure 2. Figure 3.
Px.y Px.y
-1.0
-5.0
-2.0
-3.0
-10.0
-4.0
TA = 85°C
-15.0
TA = 85°C -5.0
-6.0 TA = 25°C
-20.0 TA = 25°C
-7.0
-25.0 -8.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 0.5 1.0 1.5 2.0
VOH – High-Level Output Voltage – V VOH – High-Level Output Voltage – V
Figure 4. Figure 5.
55.0
Px.y Px.y TA = 25°C
50.0
TA = 85°C 20
45.0
40.0 TA = 85°C
16
35.0
30.0 12
25.0
20.0 8
15.0
10.0 4
5.0
0.0 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 0.5 1.0 1.5 2.0
VOL – Low-Level Output Voltage – V VOL – Low-Level Output Voltage – V
Figure 6. Figure 7.
-5.0 Px.y
Px.y
-10.0
-4
-15.0
-20.0
-25.0 -8
-30.0
-35.0 -12
-40.0
-45.0 TA = 85°C
TA = 85°C -16
-50.0
-55.0 TA = 25°C
TA = 25°C
-60.0 -20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 0.5 1.0 1.5 2.0
VOH – High-Level Output Voltage – V VOH – High-Level Output Voltage – V
Figure 8. Figure 9.
(1) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this data sheet.
(3) Maximum frequency of operation of the entire device cannot be exceeded.
(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
(b) For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
(c) For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
(d) For XT1DRIVEx = 3, CL,eff ≥ 6 pF.
(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.
(1) Requires external capacitors at both terminals. Values are specified by crystal manufacturers. In general, an effective load capacitance
of up to 18 pF can be supported.
(2) To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
(3) This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(4) When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this data sheet.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.
(1) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
(2) Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
(1) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
(2) Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1)
fDCO(0,0) DCO frequency (0, 0) DCORSELx = 0, DCOx = 0, MODx = 0 0.07 0.20 MHz
fDCO(0,31) DCO frequency (0, 31) (1) DCORSELx = 0, DCOx = 31, MODx = 0 0.70 1.70 MHz
fDCO(1,0) DCO frequency (1, 0) (1) DCORSELx = 1, DCOx = 0, MODx = 0 0.15 0.36 MHz
fDCO(1,31) DCO frequency (1, 31) (1) DCORSELx = 1, DCOx = 31, MODx = 0 1.47 3.45 MHz
(1)
fDCO(2,0) DCO frequency (2, 0) DCORSELx = 2, DCOx = 0, MODx = 0 0.32 0.75 MHz
fDCO(2,31) DCO frequency (2, 31) (1) DCORSELx = 2, DCOx = 31, MODx = 0 3.17 7.38 MHz
fDCO(3,0) DCO frequency (3, 0) (1) DCORSELx = 3, DCOx = 0, MODx = 0 0.64 1.51 MHz
(1)
fDCO(3,31) DCO frequency (3, 31) DCORSELx = 3, DCOx = 31, MODx = 0 6.07 14.0 MHz
fDCO(4,0) DCO frequency (4, 0) (1) DCORSELx = 4, DCOx = 0, MODx = 0 1.3 3.2 MHz
fDCO(4,31) DCO frequency (4, 31) (1) DCORSELx = 4, DCOx = 31, MODx = 0 12.3 28.2 MHz
(1)
fDCO(5,0) DCO frequency (5, 0) DCORSELx = 5, DCOx = 0, MODx = 0 2.5 6.0 MHz
fDCO(5,31) DCO frequency (5, 31) (1) DCORSELx = 5, DCOx = 31, MODx = 0 23.7 54.1 MHz
fDCO(6,0) DCO frequency (6, 0) (1) DCORSELx = 6, DCOx = 0, MODx = 0 4.6 10.7 MHz
fDCO(6,31) DCO frequency (6, 31) (1) DCORSELx = 6, DCOx = 31, MODx = 0 39.0 88.0 MHz
(1)
fDCO(7,0) DCO frequency (7, 0) DCORSELx = 7, DCOx = 0, MODx = 0 8.5 19.6 MHz
fDCO(7,31) DCO frequency (7, 31) (1) DCORSELx = 7, DCOx = 31, MODx = 0 60 135 MHz
Frequency step between range
SDCORSEL SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO) 1.2 2.3 ratio
DCORSEL and DCORSEL + 1
Frequency step between tap
SDCO SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO) 1.02 1.12 ratio
DCO and DCO + 1
Duty cycle Measured at SMCLK 40 50 60 %
DCO frequency temperature
dfDCO/dT fDCO = 1 MHz 0.1 %/°C
drift (2)
(3)
dfDCO/dVCC DCO frequency voltage drift fDCO = 1 MHz 1.9 %/V
(1) When selecting the proper DCO frequency range (DCORSELx), the target DCO frequency, fDCO, should be set to reside within the
range of fDCO(n, 0),MAX ≤ fDCO ≤ fDCO(n, 31),MIN, where fDCO(n, 0),MAX represents the maximum frequency specified for the DCO frequency,
range n, tap 0 (DCOx = 0) and fDCO(n,31),MIN represents the minimum frequency specified for the DCO frequency, range n, tap 31
(DCOx = 31). This ensures that the target DCO frequency resides within the range selected. It should also be noted that if the actual
fDCO frequency for the selected range causes the FLL or the application to select tap 0 or 31, the DCO fault flag is set to report that the
selected range is at its minimum or maximum tap setting.
(2) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
(3) Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
10
fDCO – MHz
DCOx = 31
1
DCOx = 0
0.1
0 1 2 3 4 5 6 7
DCORSEL
(1) The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
(1) The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
(1) This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
and MSP430x6xx Family User's Guide (SLAU208).
(2) This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
(3) This value represents the time from the wakeup event to the reset vector execution.
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK,
fTA Timer_A input clock frequency External: TACLK, 1.8 V, 3 V 25 MHz
Duty cycle = 50% ± 10%
All capture inputs, minimum pulse
tTA,cap Timer_A capture timing 1.8 V, 3 V 20 ns
duration required for capture
Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
Internal: SMCLK, ACLK,
fTB Timer_B input clock frequency External: TBCLK, 1.8 V, 3 V 25 MHz
Duty cycle = 50% ± 10%
All capture inputs, minimum pulse
tTB,cap Timer_B capture timing 1.8 V, 3 V 20 ns
duration required for capture
(1) Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized, their duration should exceed the maximum specification of the deglitch time.
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI tLO/HI
tHD,MI
tSU,MI
SOMI
tHD,MO
tVALID,MO
SIMO
tSTE,LEAD tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
SIMO
tHD,SO
tSTE,ACC tVALID,SO tSTE,DIS
SOMI
tSTE,LEAD tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI tLO/HI
tHD,SI
tSU,SI
SIMO
tHD,MO
tSTE,ACC tVALID,SO tSTE,DIS
SOMI
SDA
tSU,DAT tSU,STO
tHD,DAT
(1) The leakage current is specified by the digital I/O input leakage.
(2) The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. If the
reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling
capacitors are required. See REF, External Reference andREF, Built-In Reference.
(3) The internal reference supply current is not included in current consumption parameter IADC12_A.
(4) ADC12ON = 1, REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0
(1) REFOUT = 0, external reference voltage: SREF2 = 0, SREF1 = 1, SREF0 = 0. AVCC as reference voltage: SREF2 = 0, SREF1 = 0,
SREF0 = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC. For other clock sources, the
specified performance of the ADC12 linearity is ensured with fADC12CLK maximum of 5.0 MHz.
(2) SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 1
(3) SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 0. The specified performance of the ADC12 linearity is ensured when
using the ADC12OSC divided by 2.
(4) The ADC12OSC is sourced directly from MODOSC inside the UCS.
(5) 13 × ADC12DIV × 1/fADC12CLK
(6) Approximately ten Tau (t) are needed to get an error of less than ±0.5 LSB:
tSample = ln(2n+1) x (RS + RI) × CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference
Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
1.4 V ≤ dVREF ≤ 1.6 V (2) ±2.0
EI Integral linearity error (1) 2.2 V, 3 V LSB
1.6 V < dVREF (2) ±1.7
ED Differential linearity error (1) (2)
2.2 V, 3 V ±1.0 LSB
dVREF ≤ 2.2 V (2) 2.2 V, 3 V ±1.0 ±2.0
EO Offset error (3) LSB
dVREF > 2.2 V (2) 2.2 V, 3 V ±1.0 ±2.0
EG Gain error (3) (2)
2.2 V, 3 V ±1.0 ±2.0 LSB
dVREF ≤ 2.2 V (2) 2.2 V, 3 V ±1.4 ±3.5
ET Total unadjusted error LSB
dVREF > 2.2 V (2) 2.2 V, 3 V ±1.4 ±3.5
(1) The internal reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 1. dVREF = VR+ - VR-.
(2) Parameters are derived using the histogram method.
(3) Parameters are derived using a best fit curve.
(4) The gain error and total unadjusted error are dominated by the accuracy of the integrated reference module absolute accuracy. In this
mode the reference voltage used by the ADC12_A is not available on a pin.
(1) The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of
the temperature sensor.
(2) The temperature sensor offset can be significant. A single-point calibration is recommended to minimize the offset error of the built-in
temperature sensor. The TLV structure contains calibration values for 30°C ± 3°C and 85°C ± 3°C for each of the available reference
voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR × (Temperature,°C) + VSENSOR, where TCSENSOR and
VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
(3) The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
(4) The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
1000
Typical Temperature Sensor Voltage - mV
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature - ˚C
(1) The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance (Ci) is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
(2) The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
(3) The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
(4) The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
(5) Two decoupling capacitors, 10 µF and 100 nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
(1) The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one
smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as,
used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference
for the conversion and utilizes the smaller buffer.
(2) The internal reference current is supplied by terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a
conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current
contribution of the larger buffer without external load.
(3) The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with
REFON =1 and REFOUT = 0.
(4) For devices without the ADC12, the parametrics with ADC12SR = 0 are applicable.
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(5) Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace.
(6) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C – (–40°C)).
(7) The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB. The settling time depends on the external
capacitive load when REFOUT = 1.
Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VCC Supply voltage 1.8 3.6 V
1.8 V 40
CBPWRMD = 00 2.2 V 30 50
Comparator operating supply
IAVCC_COMP current into AVCC, excludes 3.0 V 40 65 µA
reference resistor ladder
CBPWRMD = 01 2.2 V, 3 V 10 30
CBPWRMD = 10 2.2 V, 3 V 0.1 0.5
Quiescent current of local
CBREFACC = 1,
IAVCC_REF reference voltage amplifier into 22 µA
CBREFLx = 01
AVCC
VIC Common mode input range 0 VCC-1 V
CBPWRMD = 00 -20 20 mV
VOFFSET Input offset voltage
CBPWRMD = 01, 10 -10 10 mV
CIN Input capacitance 5 pF
ON - switch closed 3 4 kΩ
RSIN Series input resistance
OFF - switch open 30 MΩ
CBPWRMD = 00, CBF = 0 450 ns
Propagation delay, response
tPD CBPWRMD = 01, CBF = 0 600 ns
time
CBPWRMD = 10, CBF = 0 50 µs
CBPWRMD = 00, CBON = 1,
0.35 0.6 1.0 µs
CBF = 1, CBFDLY = 00
CBPWRMD = 00, CBON = 1,
0.6 1.0 1.8 µs
Propagation delay with filter CBF = 1, CBFDLY = 01
tPD,filter
active CBPWRMD = 00, CBON = 1,
1.0 1.8 3.4 µs
CBF = 1, CBFDLY = 10
CBPWRMD = 00, CBON = 1,
1.8 3.4 6.5 µs
CBF = 1, CBFDLY = 11
Comparator enable time, CBON = 0 to CBON = 1,
tEN_CMP 1 2 µs
settling time CBPWRMD = 00, 01, 10
tEN_REF Resistor reference enable time CBON = 0 to CBON = 1 1 1.5 µs
VIN × VIN × VIN ×
Reference voltage for a given VIN = reference into resistor
VCB_REF (n+0.5) (n+1) (n+1.5) V
tap ladder (n = 0 to 31)
/ 32 / 32 / 32
60
50
40 VCC = 1.8 V
TA = 85 ºC
30
20
10
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
VOL - Low-Level Output Voltage - V
-10
IOH - Typical High-Level Output Current - mA
-20
-30
VCC = 1.8 V
-40 TA = 85 ºC
-50
VCC = 3.0 V
-60 TA = 85 ºC
VCC = 1.8 V
-70 TA = 25 ºC VCC = 3.0 V
TA = 25 ºC
-80
-90
0.5 1 1.5 2 2.5 3
VOH - High-Level Output Voltage - V
2.0
T A = 25 !C, 85 !C
1.8
1.4
Input Threshold - V
1.2
0.8
0.6
0.4
0.2
0.0
1.8 2.2 2.6 3 3.4
VUSB Supply Voltage, V USB - V
(1) This voltage is for internal uses only. No external DC loading should be applied.
(2) This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
(3) A current overload will be detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
(4) Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
(5) This value, in series with an external resistor between PUR and D+, produces the Rpu as outlined in the USB specification.
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
DVCC(PGM,ERASE) Program and erase supply voltage 1.8 3.6 V
IPGM Average supply current from DVCC during program (1) 3 5 mA
IERASE Average supply current from DVCC during erase (1) 6 11 mA
Average supply current from DVCC during mass erase or bank
IMERASE, IBANK 6 11 mA
erase (1)
(2)
tCPT Cumulative program time See 16 ms
4 5
Program and erase endurance 10 10 cycles
tRetention Data retention duration TJ = 25°C 100 years
(3)
tWord Word or byte program time See 64 85 µs
(3)
tBlock, 0 Block program time for first byte or word See 49 65 µs
Block program time for each additional byte or word, except for last (3)
tBlock, 1–(N–1) See 37 49 µs
byte or word
(3)
tBlock, N Block program time for last byte or word See 55 73 µs
Erase time for segment, mass erase, and bank erase when (3)
tErase See 23 32 ms
available.
MCLK frequency in marginal read mode
fMCLK,MGR 0 1 MHz
(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)
(1) Default clock system frequency of MCLK = 1 MHz, ACLK = 32768 Hz, SMCLK = 1 MHz. No peripherals are enabled or active.
(2) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word- or byte-write and block-write modes.
(3) These values are hardwired into the flash controller's state machine.
(1) Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
(2) fTCK may be restricted to meet the timing requirements of the module selected.
INPUT/OUTPUT SCHEMATICS
Pad Logic
P1REN.x
DVSS 0
DVCC 1 1
P1DIR.x 0
Direction
From module 1 0: Input
1: Output
P1OUT.x 0
From module 1
P1.0/TA0CLK/ACLK
P1DS.x
P1SEL.x P1.1/TA0.0
0: Low drive
P1.2/TA0.1
1: High drive
P1.3/TA0.2
P1IN.x P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
EN
P1.7/TA1.0
To module D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x Set
P1SEL.x Interrupt
Edge
P1IES.x Select
Pad Logic
P2REN.x
DVSS 0
DVCC 1 1
P2DIR.x 0
Direction
From module 1 0: Input
1: Output
P2OUT.x 0
From module 1
P2.0/TA1.1
P2DS.x
P2SEL.x P2.1/TA1.2
0: Low drive
P2.2/TA2CLK/SMCLK
1: High drive
P2.3/TA2.0
P2IN.x P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
EN
P2.7/UB0STE/UCA0CLK
To module D
P2IE.x
EN
To module
Q
P2IFG.x Set
P2SEL.x Interrupt
Edge
P2IES.x Select
Pad Logic
P3REN.x
DVSS 0
DVCC 1 1
P3DIR.x 0
Direction
From module 1 0: Input
1: Output
P3OUT.x 0
From module 1
P3.0/UCB0SIMO/UCB0SDA
P3DS.x
P3SEL.x P3.1/UCB0SOMI/UCB0SCL
0: Low drive
P3.2/UCB0CLK/UCA0STE
1: High drive
P3.3/UCA0TXD/UCA0SIMO
P3IN.x P3.4/UCA0RXD/UCA0SOMI
P3.5/TB0.5
P3.6/TB0.6
EN
P3.7/TB0OUTH/SVMOUT
To module D
Pad Logic
P4REN.x
DVSS 0
DVCC 1 1
P4DIR.x 0
Direction
from Port Mapping Control 1 0: Input
1: Output
P4OUT.x 0
(1) The direction of some mapped secondary functions are controlled directly by the module. See Table 10 for specific direction control
information of mapped secondary functions.
Pad Logic
to/from Reference
(n/a MSP430F551x)
(n/a MSPF430F551x)
to ADC12
(n/a MSPF430F551x)
INCHx = x
P5REN.x
DVSS 0
DVCC 1 1
P5DIR.x 0
P5OUT.x 0
From module 1
P5.0/(A8/VREF+/VeREF+)
P5DS.x
P5SEL.x P5.1/(A9/VREF–/VeREF–)
0: Low drive
1: High drive
P5IN.x
EN Bus
Keeper
To module D
Pad Logic
To XT2
P5REN.2
DVSS 0
DVCC 1 1
P5DIR.2 0
P5OUT.2 0
Module X OUT 1
P5.2/XT2IN
P5DS.2
P5SEL.2 0: Low drive
1: High drive
P5IN.2
EN Bus
Keeper
Module X IN D
Pad Logic
To XT2
P5REN.3
DVSS 0
DVCC 1 1
P5DIR.3 0
P5OUT.3 0
Module X OUT 1
P5.3/XT2OUT
P5DS.3
P5SEL.3 0: Low drive
1: High drive
P5IN.3
EN Bus
Keeper
Module X IN D
Pad Logic
to XT1
P5REN.4
DVSS 0
DVCC 1 1
P5DIR.4 0
P5OUT.4 0
Module X OUT 1
P5.4/XIN
P5DS.4
P5SEL.4 0: Low drive
1: High drive
P5IN.4
EN Bus
Keeper
Module X IN D
Pad Logic
to XT1
P5REN.5
DVSS 0
DVCC 1 1
P5DIR.5 0
P5OUT.5 0
Module X OUT 1
P5.5/XOUT
P5SEL.5 P5DS.5
0: Low drive
XT1BYPASS 1: High drive
P5IN.5
EN Bus
Keeper
Module X IN D
Pad Logic
P5REN.x
DVSS 0
DVCC 1 1
P5DIR.x 0
Direction
From Module 1 0: Input
1: Output
P5OUT.x 0
P5DS.x
P5SEL.x P5.6/TB0.0
0: Low drive
P5.7/TB0.1
1: High drive
P5IN.x
EN
To module D
(1) F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only.
Pad Logic
to ADC12
(n/a MSPF430F551x)
INCHx = x
(n/a MSPF430F551x)
to Comparator_B
from Comparator_B
CBPD.x
P6REN.x
DVSS 0
DVCC 1 1
P6DIR.x 0
Direction
1 0: Input
1: Output
P6OUT.x 0
From module 1
P6.0/CB0/(A0)
P6DS.x
P6SEL.x P6.1/CB1/(A1)
0: Low drive
P6.2/CB2/(A2)
1: High drive
P6.3/CB3/(A3)
P6IN.x P6.4/CB4/(A4)
P6.5/CB5/(A5)
EN Bus P6.6/CB6/(A6)
Keeper P6.7/CB7/(A7)
To module D
(1) Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input
buffer for that pin, regardless of the state of the associated CBPD.x bit.
Pad Logic
to ADC12
(n/a MSPF430F551x)
INCHx = x
(n/a MSPF430F551x)
to Comparator_B
from Comparator_B
CBPD.x
P7REN.x
DVSS 0
DVCC 1 1
P7DIR.x 0
Direction
1 0: Input
1: Output
P7OUT.x 0
From module 1
P7.0/CB8/(A12)
P7DS.x
P7SEL.x P7.1/CB9/(A13)
0: Low drive
P7.2/CB10/(A14)
1: High drive
P7.3/CB11/(A15)
P7IN.x
EN Bus
Keeper
To module D
(1) F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only
(2) F5529, F5527, F5525, F5521 devices only
(3) Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input
buffer for that pin, regardless of the state of the associated CBPD.x bit.
Pad Logic
P7REN.x
DVSS 0
DVCC 1 1
P7DIR.x 0
Direction
From module 1 0: Input
1: Output
P7OUT.x 0
P7DS.x
P7SEL.x P7.4/TB0.2
0: Low drive
P7.5/TB0.3
1: High drive
P7.6/TB0.4
P7IN.x P7.7/TB0CLK/MCLK
EN
To module D
(1) F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only
Pad Logic
P8REN.x
DVSS 0
DVCC 1 1
P8DIR.x 0
Direction
from Port Mapping Control 1 0: Input
1: Output
P8OUT.x 0
EN
(1) F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only
PUOUT0 0 PU.0/
USB DP output 1 DP
PUIN0
USB DP input
PUIPE
.
PUIN1
USB DM input
PUOUT1 0 PU.1/
USB DM output 1 DM
VUSB VSSU
Pad Logic
PUREN
“1” PUR
PUSEL
PURIN
(1) PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the
device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the
3.3-V LDO is not being used and is disabled.
(2) Output state set by the USB module.
(1) PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the
device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the
3.3-V LDO is not being used and is disabled.
Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
DVSS 0
DVCC 1 1
PJDIR.0 0
DVCC 1
PJOUT.0 0
From JTAG 1
PJ.0/TDO
PJDS.0
From JTAG 0: Low drive
1: High drive
PJIN.0
EN
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.x
DVSS 0
DVCC 1 1
PJDIR.x 0
DVSS 1
PJOUT.x 0
From JTAG 1
PJ.1/TDI/TCLK
PJDS.x
From JTAG PJ.2/TMS
0: Low drive
PJ.3/TCK
1: High drive
PJIN.x
EN
To JTAG D
Table 65 and Table 66 list the complete contents of the device descriptor tag-length-value (TLV) structure for
each device type.
REVISION HISTORY
REVISION DESCRIPTION
SLAS590 Limited product preview release
SLAS590A Changes throughout for XMS430F5529 sampling
SLAS590B Changes throughout for updated preview
SLAS590C Changes throughout for updated preview
SLAS590D Production data release
SLAS590F Corrected terminal assignments for YFF package in Pin Designation – MSP430F5528IYFF, MSP430F5526IYFF,
MSP430F5524IYFF and Terminal Functions
Changed limits for wake-up time, LPM3/4 current, reference current, ADC12 maximum frequency, ADC linearity — see
the following tables:
Low-Power Mode Supply Currents (Into VCC) Excluding External Current
12-Bit ADC, Power Supply and Input Range Conditions
12-Bit ADC, Timing Parameters
SLAS590G
12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
REF, External Reference
REF, Built-In Reference
Changed notes regarding crystal capacitance in Crystal Oscillator, XT1, Low-Frequency Mode
www.ti.com 2-Dec-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
MSP430F5513IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5513
& no Sb/Br)
MSP430F5513IRGCT NRND VQFN RGC 64 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5513
& no Sb/Br)
MSP430F5513IZQE ACTIVE BGA ZQE 80 360 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5513
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5513IZQER ACTIVE BGA ZQE 80 2500 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5513
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5514IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5514
& no Sb/Br)
MSP430F5514IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5514
& no Sb/Br)
MSP430F5514IZQE ACTIVE BGA ZQE 80 360 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5514
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5514IZQER ACTIVE BGA ZQE 80 2500 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5514
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5515IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5515
& no Sb/Br)
MSP430F5515IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5515
& no Sb/Br)
MSP430F5517IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5517
& no Sb/Br)
MSP430F5517IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5517
& no Sb/Br)
MSP430F5519IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5519
& no Sb/Br)
MSP430F5519IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5519
& no Sb/Br)
MSP430F5521IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5521
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 2-Dec-2014
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
MSP430F5521IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5521
& no Sb/Br)
MSP430F5522IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5522
& no Sb/Br)
MSP430F5522IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5522
& no Sb/Br)
MSP430F5522IZQE ACTIVE BGA ZQE 80 360 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5522
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5522IZQER ACTIVE BGA ZQE 80 2500 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5522
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5524IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5524
& no Sb/Br)
MSP430F5524IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5524
& no Sb/Br)
MSP430F5524IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS SNAGCU Level-1-260C-UNLIM M430F5524
& no Sb/Br)
MSP430F5524IYFFT NRND DSBGA YFF 64 250 Green (RoHS SNAGCU Level-1-260C-UNLIM M430F5524
& no Sb/Br)
MSP430F5524IZQE ACTIVE BGA ZQE 80 360 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5524
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5524IZQER ACTIVE BGA ZQE 80 2500 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5524
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5525IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5525
& no Sb/Br)
MSP430F5525IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5525
& no Sb/Br)
MSP430F5526IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5526
& no Sb/Br)
MSP430F5526IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5526
& no Sb/Br)
MSP430F5526IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS SNAGCU Level-1-260C-UNLIM M430F5526
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 2-Dec-2014
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
MSP430F5526IYFFT NRND DSBGA YFF 64 250 Green (RoHS SNAGCU Level-1-260C-UNLIM M430F5526
& no Sb/Br)
MSP430F5526IZQE ACTIVE BGA ZQE 80 360 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5526
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5526IZQER ACTIVE BGA ZQE 80 2500 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5526
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5527IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5527
& no Sb/Br)
MSP430F5527IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5527
& no Sb/Br)
MSP430F5528IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5528
& no Sb/Br)
MSP430F5528IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5528
& no Sb/Br)
MSP430F5528IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 M430F5528
& no Sb/Br)
MSP430F5528IZQE ACTIVE BGA ZQE 80 360 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5528
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5528IZQER ACTIVE BGA ZQE 80 2500 Green (RoHS SNAGCU Level-3-260C-168 HR -40 to 85 M430F5528
MICROSTAR & no Sb/Br)
JUNIOR
MSP430F5529IPN ACTIVE LQFP PN 80 119 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5529
& no Sb/Br)
MSP430F5529IPNR ACTIVE LQFP PN 80 1000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5529
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 2-Dec-2014
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jan-2015
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jan-2015
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jan-2015
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MSP430F5513IZQER BGA MICROSTAR ZQE 80 2500 338.1 338.1 20.6
JUNIOR
MSP430F5514IRGCT VQFN RGC 64 250 210.0 185.0 35.0
MSP430F5514IZQER BGA MICROSTAR ZQE 80 2500 338.1 338.1 20.6
JUNIOR
MSP430F5515IPNR LQFP PN 80 1000 367.0 367.0 45.0
MSP430F5517IPNR LQFP PN 80 1000 367.0 367.0 45.0
MSP430F5519IPNR LQFP PN 80 1000 367.0 367.0 45.0
MSP430F5521IPNR LQFP PN 80 1000 367.0 367.0 45.0
MSP430F5522IRGCT VQFN RGC 64 250 210.0 185.0 35.0
MSP430F5522IZQER BGA MICROSTAR ZQE 80 2500 338.1 338.1 20.6
JUNIOR
MSP430F5524IRGCT VQFN RGC 64 250 210.0 185.0 35.0
MSP430F5524IYFFR DSBGA YFF 64 2500 367.0 367.0 35.0
MSP430F5524IYFFT DSBGA YFF 64 250 210.0 185.0 35.0
MSP430F5524IZQER BGA MICROSTAR ZQE 80 2500 338.1 338.1 20.6
JUNIOR
MSP430F5525IPNR LQFP PN 80 1000 367.0 367.0 45.0
MSP430F5526IYFFR DSBGA YFF 64 2500 367.0 367.0 35.0
MSP430F5526IYFFT DSBGA YFF 64 250 210.0 185.0 35.0
MSP430F5526IZQER BGA MICROSTAR ZQE 80 2500 338.1 338.1 20.6
JUNIOR
MSP430F5527IPNR LQFP PN 80 1000 367.0 367.0 45.0
MSP430F5528IRGCT VQFN RGC 64 250 210.0 185.0 35.0
MSP430F5528IYFFR DSBGA YFF 64 2500 367.0 367.0 35.0
MSP430F5528IZQER BGA MICROSTAR ZQE 80 2500 338.1 338.1 20.6
JUNIOR
MSP430F5529IPNR LQFP PN 80 1000 367.0 367.0 45.0
Pack Materials-Page 3
MECHANICAL DATA
0,27
0,50 0,08 M
0,17
60 41
61 40
0,13 NOM
80 21
1 20 Gage Plane
9,50 TYP
12,20 0,25
SQ
11,80 0,05 MIN 0°– 7°
14,20
SQ
13,80
1,45 0,75
1,35 0,45
Seating Plane
4040135 / B 11/96
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