Mixed Signal Microcontroller: Features
Mixed Signal Microcontroller: Features
Mixed Signal Microcontroller: Features
FEATURES
Low Supply-Voltage Range: 1.8 V to 3.6 V Ultralow Power Consumption Active Mode (AM): All System Clocks Active 290 A/MHz at 8 MHz, 3.0 V, Flash Program Execution (Typical) 150 A/MHz at 8 MHz, 3.0 V, RAM Program Execution (Typical) Standby Mode (LPM3): Real Time Clock With Crystal , Watchdog, and Supply Supervisor Operational, Full RAM Retention, Fast Wake-Up: 1.9 A at 2.2 V, 2.1 A at 3.0 V (Typical) Low-Power Oscillator (VLO), General-Purpose Counter, Watchdog, and Supply Supervisor Operational, Full RAM Retention, Fast Wake-Up: 1.4 A at 3.0 V (Typical) Off Mode (LPM4): Full RAM Retention, Supply Supervisor Operational, Fast Wake-Up: 1.1 A at 3.0 V (Typical) Shutdown Mode (LPM4.5): 0.18 A at 3.0 V (Typical) Wake-Up From Standby Mode in Less Than 5 s 16-Bit RISC Architecture, Extended Memory, up to 25-MHz System Clock Flexible Power Management System Fully Integrated LDO With Programmable Regulated Core Supply Voltage Supply Voltage Supervision, Monitoring, and Brownout Unified Clock System FLL Control Loop for Frequency Stabilization Low Power/Low Frequency Internal Clock Source (VLO) Low Frequency Trimmed Internal Reference Source (REFO) 32-kHz Watch Crystals (XT1) High-Frequency Crystals up to 32 MHz (XT2) 16-Bit Timer TA0, Timer_A With Five Capture/Compare Registers 16-Bit Timer TA1, Timer_A With Three Capture/Compare Registers 16-Bit Timer TA2, Timer_A With Three Capture/Compare Registers 16-Bit Timer TB0, Timer_B With Seven Capture/Compare Shadow Registers Two Universal Serial Communication Interfaces USCI_A0 and USCI_A1 Each Supporting Enhanced UART supporting Auto-Baudrate Detection IrDA Encoder and Decoder Synchronous SPI USCI_B0 and USCI_B1 Each Supporting I2CTM Synchronous SPI Full-Speed Universal Serial Bus (USB) Integrated USB-PHY Integrated 3.3-V/1.8-V USB Power System Integrated USB-PLL Eight Input, Eight Output Endpoints 12-Bit Analog-to-Digital (A/D) Converter (MSP430F552x Only) With Internal Reference, Sample-and-Hold, and Autoscan Feature Comparator Hardware Multiplier Supporting 32-Bit Operations Serial Onboard Programming, No External Programming Voltage Needed Three Channel Internal DMA Basic Timer With Real-Time Clock Feature Family Members are Summarized in Table 1 For Complete Module Descriptions, See the MSP430x5xx Family User's Guide (SLAU208)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
DESCRIPTION
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with extensive low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 5 s. The MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 are microcontroller configurations with integrated USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 12-bit analog-to-digital converter (ADC), two universal serial communication interfaces (USCI), hardware multiplier, DMA, real-time clock module with alarm capabilities, and 63 I/O pins. The MSP430F5528, MSP430F5526, MSP430F5524, and MSP430F5522 include all of these peripherals but have 47 I/O pins. The MSP430F5519, MSP430F5517, and MSP430F5515 are microcontroller configurations with integrated USB and PHY supporting USB 2.0, four 16-bit timers, two universal serial communication interfaces (USCI), hardware multiplier, DMA, real time clock module with alarm capabilities, and 63 I/O pins. The MSP430F5514 and MSP430FF5513 include all of these peripherals but have 47 I/O pins. Typical applications include analog and digital sensor systems, data loggers, etc. that require connectivity to various USB hosts. Family members available are summarized in Table 1. Table 1. Family Members
USCI Device Flash (KB) 128 128 96 96 64 64 SRAM (KB) (1) 8+2 8+2 6+2 6+2 4+2 4+2 Timer_A
(2)
Timer_B
(3)
Channel B: SPI/I2C 2 2 2 2 2 2
ADC12_A (Ch) 14 ext / 2 int 10 ext / 2 int 14 ext / 2 int 10 ext / 2 int 14 ext / 2 int 10 ext / 2 int
Comp_B (Ch) 12 8 12 8 12 8
I/O
Package Type 80 PN 64 RGC, 64 YFF, 80 ZQE 80 PN 64 RGC, 64 YFF, 80 ZQE 80 PN 64 RGC, 64 YFF, 80 ZQE 64 RGC, 80 ZQE 80 PN 80 PN 80 PN 80 PN 64 RGC, 80 ZQE 64 RGC, 80 ZQE
5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3
7 7 7 7 7 7
63 47 63 47 63 47
32 32 128 96 64 64 32
5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3 5, 3, 3
7 7 7 7 7 7 7
2 2 2 2 2 2 2
2 2 2 2 2 2 2
8 12 12 12 12 8 8
47 63 63 63 63 47 47
The additional 2 KB USB SRAM that is listed can be used as general purpose SRAM when USB is not in use. Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively. Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
ACLK SMCLK 128KB 96KB 64KB 32KB Flash 8KB+2KB 6KB+2KB 4KB+2KB RAM
MCLK
PB 116 I/Os
PC 116 I/Os
MAB MDB
DMA 3 Channel
EEM (L: 8+2) USCI0,1 JTAG/ SBW Interface TA0 MPY32 Timer_A 5 CC Registers TA1 Timer_A 3 CC Registers TA2 Timer_A 3 CC Registers TB0 Timer_B 7 CC Registers RTC_A CRC16 USCI_Ax: UART, IrDA, SPI USCI_Bx: SPI, I2C ADC12_A 12 Bit 200 KSPS 16 Channels (14 ext/2 int) Autoscan REF COMP_B 12 Channels
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
P6.3/CB3/A3 P6.2/CB2/A2 P6.1/CB1/A1 P6.0/CB0/A0 RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P5.3/XT2OUT P5.2/XT2IN AVSS2 V18 VUSB VBUS PU.1/DM PUR PU.0/DP VSSU
P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P7.0/CB8/A12 P7.1/CB9/A13 P7.2/CB10/A14 P7.3/CB11/A15 P5.0/A8/VREF+/VeREF+ P5.1/A9/VREF/VeREF AVCC1 P5.4/XIN P5.5/XOUT AVSS1 P8.0 P8.1 P8.2 DVCC1 DVSS1 VCORE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
P7.7/TB0CLK/MCLK P7.6/TB0.4 P7.5/TB0.3 P7.4/TB0.2 P5.7/TB0.1 P5.6/TB0.0 P4.7/PM_NONE P4.6/PM_NONE P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO DVCC2 DVSS2 P4.3/PM_UCB1CLK/PM_UCA1STE P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.0/PM_UCB1STE/PM_UCA1CLK P3.7/TB0OUTH/SVMOUT P3.6/TB0.6 P3.5/TB0.5 P3.4/UCA0RXD/UCA0SOMI
P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UCB0STE/UCA0CLK P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO
Copyright 20092011, Texas Instruments Incorporated
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Functional Block Diagram MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
XIN XOUT RST/NMI DVCC DVSS VCORE AVCC AVSS P1.x PA P2.x P3.x PB P4.x P5.x PC P6.x DP,DM,PUR
ACLK SMCLK 128KB 96KB 64KB 32KB Flash 8KB+2KB 6KB+2KB 4KB+2KB RAM
MCLK
MAB MDB
DMA 3 Channel
EEM (L: 8+2) USCI0,1 JTAG/ SBW Interface TA0 MPY32 Timer_A 5 CC Registers TA1 Timer_A 3 CC Registers TA2 Timer_A 3 CC Registers TB0 Timer_B 7 CC Registers RTC_A CRC16 USCI_Ax: UART, IrDA, SPI USCI_Bx: SPI, I2C ADC12_A 12 Bit 200 KSPS 12 Channels (10 ext/2 int) Autoscan REF COMP_B 8 Channels
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
P6.0/CB0/A0 P6.1/CB1/A1 P6.2/CB2/A2 P6.3/CB3/A3 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P5.0/A8/VREF+/VeREF+ P5.1/A9/VREF/VeREF AVCC1 P5.4/XIN P5.5/XOUT AVSS1 DVCC1 DVSS1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 47 46 45 44 43 42 41 40 39 38 37 36 35 34
RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P5.3/XT2OUT P5.2/XT2IN AVSS2 V18 VUSB VBUS PU.1/DM PUR PU.0/DP VSSU
MSP430F5528IRGC MSP430F5526IRGC MSP430F5524IRGC MSP430F5522IRGC
16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P4.7/PM_NONE P4.6/PM_NONE P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO P4.3/PM_UCB1CLK/PM_UCA1STE P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.0/PM_UCB1STE/PM_UCA1CLK DVCC2 DVSS2 P3.4/UCA0RXD/UCA0SOMI P3.3/UCA0TXD/UCA0SIMO P3.2/UCB0CLK/UCA0STE P3.1/UCB0SOMI/UCB0SCL P3.0/UCB0SIMO/UCB0SDA P2.7/UCB0STE/UCA0CLK
Note: Power Pad connection to VSS recommended.
VCORE P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
MCLK
RAM
PB 116 I/Os
PC 116 I/Os
MAB MDB
DMA 3 Channel
EEM (L: 8+2) USCI0,1 JTAG/ SBW Interface TA0 MPY32 Timer_A 5 CC Registers TA1 Timer_A 3 CC Registers TA2 Timer_A 3 CC Registers TB0 Timer_B 7 CC Registers RTC_A CRC16 USCI_Ax: UART, IrDA, SPI USCI_Bx: SPI, I2C COMP_B 12 Channels
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
P6.3/CB3 P6.2/CB2 P6.1/CB1 P6.0/CB0 RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P5.3/XT2OUT P5.2/XT2IN AVSS2 V18 VUSB VBUS PU.1/DM PUR PU.0/DP VSSU
P6.4/CB4 P6.5/CB5 P6.6/CB6 P6.7/CB7 P7.0/CB8 P7.1/CB9 P7.2/CB10 P7.3/CB11 P5.0 P5.1 AVCC1 P5.4/XIN P5.5/XOUT AVSS1 P8.0 P8.1 P8.2 DVCC1 DVSS1 VCORE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
P7.7/TB0CLK/MCLK P7.6/TB0.4 P7.5/TB0.3 P7.4/TB0.2 P5.7/TB0.1 P5.6/TB0.0 P4.7/PM_NONE P4.6/PM_NONE P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO DVCC2 DVSS2 P4.3/PM_UCB1CLK/PM_UCA1STE P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.0/PM_UCB1STE/PM_UCA1CLK P3.7/TB0OUTH/SVMOUT P3.6/TB0.6 P3.5/TB0.5 P3.4/UCA0RXD/UCA0SOMI
P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UCB0STE/UCA0CLK P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO
Copyright 20092011, Texas Instruments Incorporated
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
MCLK
RAM
MAB MDB
DMA 3 Channel
EEM (L: 8+2) USCI0,1 JTAG/ SBW Interface TA0 MPY32 Timer_A 5 CC Registers TA1 Timer_A 3 CC Registers TA2 Timer_A 3 CC Registers TB0 Timer_B 7 CC Registers RTC_A CRC16 USCI_Ax: UART, IrDA, SPI USCI_Bx: SPI, I2C COMP_B 8 Channels
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
P6.0/CB0 P6.1/CB1 P6.2/CB2 P6.3/CB3 P6.4/CB4 P6.5/CB5 P6.6/CB6 P6.7/CB7 P5.0 P5.1 AVCC1 P5.4/XIN P5.5/XOUT AVSS1 DVCC1 DVSS1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 47 46 45 44 43 42
RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P5.3/XT2OUT P5.2/XT2IN AVSS2 V18 VUSB VBUS PU.1/DM PUR PU.0/DP VSSU
MSP430F5514IRGC MSP430F5513IRGC
41 40 39 38 37 36 35 34 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P4.7/PM_NONE P4.6/PM_NONE P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO P4.3/PM_UCB1CLK/PM_UCA1STE P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.0/PM_UCB1STE/PM_UCA1CLK DVCC2 DVSS2 P3.4/UCA0RXD/UCA0SOMI P3.3/UCA0TXD/UCA0SIMO P3.2/UCB0CLK/UCA0STE P3.1/UCB0SOMI/UCB0SCL P3.0/UCB0SIMO/UCB0SDA P2.7/UCB0STE/UCA0CLK
Note: Power Pad connection to VSS recommended.
10
VCORE P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
DVSS1 VCORE J1 J2
11
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
P6.7 RST/NMI P2.0 E3 P1.2 F3 P1.4 G3 P1.3 H3 E4 P1.5 F4 P1.6 G4 P1.7 H4 E5 P2.3 F5 P2.2 G5 P2.1 H5
DVSS1 VCORE H1 H2
Package Dimensions The package dimensions for this YFF package are shown in Table 2. See the package drawing at the end of this data sheet for more details. Table 2. YFF Package Dimensions
PACKAGED DEVICES MSP430F5528 MSP430F5526 MSP430F5524 D 3.76 0.03 E 3.76 0.03
12
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
P6.4/CB4/A4
P6.5/CB5/A5
C2
D2
I/O
P6.6/CB6/A6
B1
D1
I/O
P6.7/CB7/A7
E3
D3
I/O
P7.0/CB8/A12
N/A
N/A
N/A
I/O
P7.1/CB9/A13
N/A
N/A
N/A
I/O
P7.2/CB10/A14
N/A
N/A
N/A
I/O
P7.3/CB11/A15
N/A
N/A
N/A
I/O
P5.0/A8/VREF+/VeREF+
D2
E1
I/O
P5.1/A9/VREF-/VeREF-
10
10
E2
E2
I/O
AVCC1 P5.4/XIN P5.5/XOUT AVSS1 P8.0 P8.1 P8.2 DVCC1 DVSS1 VCORE (2) P1.0/TA0CLK/ACLK
11 12 13 14 15 16 17 18 19 20 21
P1.1/TA0.0
22
19
F2
H3
I/O
(1) (2)
I = input, O = output, N/A = not available VCORE is for internal usage only. No external current loading is possible. VCORE should only be connected to the recommended capacitor value, CVCORE. 13
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
P1.2/TA0.1
24 25 26
21 22 23
H3 G3 F4
G4 H4 J4
P1.6/TA1CLK/CBOUT
27
24
G4
G5
I/O
28 29 30 31 32 33 34
25 26 27 28 29 30 31
H4 E5 H5 G5 F5 H6 G6
H5 J5 G6 J6 H6 J7 J8
P2.6/RTCCLK/DMAE0
35
32
F6
J9
I/O
P2.7/UCB0STE/UCA0CLK
36
33
H8
H7
I/O
P3.0/UCB0SIMO/UCB0SDA
37
34
H7
H8
I/O
P3.1/UCB0SOMI/UCB0SCL
38
35
G8
H9
I/O
P3.2/UCB0CLK/UCA0STE
39
36
G7
G8
I/O
P3.3/UCA0TXD/UCA0SIMO
40
37
F7
G9
I/O
P3.4/UCA0RXD/UCA0SOMI
41
38
E7
G7
I/O
P3.5/TB0.5
42
N/A
N/A
N/A
I/O
P3.6/TB0.6
43
N/A
N/A
N/A
I/O
P3.7/TB0OUTH/SVMOUT
44
N/A
N/A
N/A
I/O
14
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
P4.0/PM_UCB1STE/ PM_UCA1CLK
45
41
E6
E8
I/O
46
42
D8
E7
I/O
47
43
D7
D9
I/O
P4.3/PM_UCB1CLK/ PM_UCA1STE DVSS2 DVCC2 P4.4/PM_UCA1TXD/ PM_UCA1SIMO P4.5/PM_UCA1RXD/ PM_UCA1SOMI P4.6/PM_NONE P4.7/PM_NONE
48
44
D6
D8
I/O
49 50 51
39 40 45
F8 E8 C8
F9 E9 D7
52
46
C7
C9
I/O
53 54
47 48
C6 D5
C8 C7
I/O I/O
P5.6/TB0.0
55
N/A
N/A
N/A
I/O
P5.7/TB0.1
56
N/A
N/A
N/A
I/O
P7.4/TB0.2
57
N/A
N/A
N/A
I/O
P7.5/TB0.3
58
N/A
N/A
N/A
I/O
P7.6/TB0.4
59
N/A
N/A
N/A
I/O
P7.7/TB0CLK/MCLK
60
N/A
N/A
N/A
I/O
61 62 63 64 65 66 67 68
49 50 51 52 53 54 55 56
B8 A8 B7 A7 B6 A6 B5 B4
B8, B9 A9 B7 A8 A7 A6 B6 A5
15
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
76
64
E4
A2
I/O
P6.0/CB0/A0
77
A2
A1
I/O
P6.1/CB1/A1
78
C3
B2
I/O
P6.2/CB2/A2
79
A1
B1
I/O
80 N/A N/A
4 N/A Pad
D3 N/A N/A
C2
(5)
I/O
N/A
See Bootstrap Loader (BSL) and JTAG Operation for usage with BSL and JTAG functions See JTAG Operation for usage with JTAG function. C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground.
16
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
17
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Operating Modes
The MSP430 has one active mode and six software selectable low-power modes of operation. An interrupt event can wake up the device from any of the low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program. The following seven operating modes can be configured by software: Active mode (AM) All clocks are active Low-power mode 0 (LPM0) CPU is disabled ACLK and SMCLK remain active, MCLK is disabled FLL loop control remains active Low-power mode 1 (LPM1) CPU is disabled FLL loop control is disabled ACLK and SMCLK remain active, MCLK is disabled Low-power mode 2 (LPM2) CPU is disabled MCLK and FLL loop control and DCOCLK are disabled DCO's dc-generator remains enabled ACLK remains active Low-power mode 3 (LPM3) CPU is disabled MCLK, FLL loop control, and DCOCLK are disabled DCO's dc generator is disabled ACLK remains active Low-power mode 4 (LPM4) CPU is disabled ACLK is disabled MCLK, FLL loop control, and DCOCLK are disabled DCO's dc generator is disabled Crystal oscillator is stopped Complete data retention Low-power mode 4.5 (LPM4.5) Internal regulator disabled No data retention Wakeup from RST/NMI, P1, and P2
18
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
(2)
Reset
0FFFEh
63, highest
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG, VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG, JMBOUTIFG (SYSSNIV) (1) NMIIFG, OFIFG, ACCVIFG, BUSIFG (SYSUNIV) (1) (2) Comparator B interrupt flags (CBIV) (1) TB0CCR0 CCIFG0
(3) (3)
(Non)maskable
0FFFCh
62
0FFFAh 0FFF8h 0FFF6h 0FFF4h 0FFF2h 0FFF0h 0FFEEh 0FFECh 0FFEAh 0FFE8h 0FFE6h 0FFE4h 0FFE2h 0FFE0h 0FFDEh 0FFDCh 0FFDAh 0FFD8h 0FFD6h 0FFD4h 0FFD2h 0FFD0h
61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 0, lowest
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6, TB0IFG (TB0IV) (1) (3) WDTIFG UCA0RXIFG, UCA0TXIFG (UCA0IV) (1) UCB0RXIFG, UCB0TXIFG (UCAB0IV) TA0CCR0 CCIFG0 (3) TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4, TA0IFG (TA0IV) (1) (3) USB interrupts (USBIV) (1) TA1CCR0 CCIFG0 (3) TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2, TA1IFG (TA1IV) (1) (3) P1IFG.0 to P1IFG.7 (P1IV) (1)
(3) (3) (3) (3) (1) (3)
Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable Maskable
UCA1RXIFG, UCA1TXIFG (UCA1IV) (1) UCB1RXIFG, UCB1TXIFG (UCB1IV) (1) TA2CCR0 CCIFG0
(3)
TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2, TA2IFG (TA2IV) (1) (3) P2IFG.0 to P2IFG.7 (P2IV) (1)
(3)
Reserved
0FF80h
Multiple source flags A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space. (Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it. Interrupt flags are located in the module. Only on devices with ADC, otherwise reserved. Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain compatibility with other devices, it is recommended to reserve these locations. 19
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Memory Organization
Table 5. Memory Organization (1)
MSP430F5522 MSP430F5521 MSP430F5513 Memory (flash) Main: interrupt vector Total Size Bank D Bank C Main: code memory Bank B Bank A Sector 3 Sector 2 RAM Sector 1 Sector 0 USB RAM (4) Sector 7 Info A Info B Information memory (flash) Info C Info D BSL 3 BSL 2 Bootstrap loader (BSL) memory (flash) BSL 1 BSL 0 Peripherals (1) (2) (3) (4) Size 32 KB 00FFFFh00FF80h N/A N/A 15 KB 00FFFFh00C400h 17 KB 00C3FFh008000h 2 KB (2) 0043FFh003C00h 2 KB (3) 003BFFh003400h 2 KB 0033FFh002C00h 2 KB 002BFFh002400h 2 KB 0023FFh001C00h 128 B 0019FFh001980h 128 B 00197Fh001900h 128 B 0018FFh001880h 128 B 00187Fh001800h 512 B 0017FFh001600h 512 B 0015FFh001400h 512 B 0013FFh001200h 512 B 0011FFh001000h 4 KB 000FFFh0h MSP430F5525 MSP430F5524 MSP430F5515 MSP430F5514 64 KB 00FFFFh00FF80h N/A N/A 32 KB 0143FFh00C400h 32 KB 00C3FFh004400h N/A N/A 2 KB 0033FFh002C00h 2 KB 002BFFh002400h 2 KB 0023FFh001C00h 128 B 0019FFh001980h 128 B 00197Fh001900h 128 B 0018FFh001880h 128 B 00187Fh001800h 512 B 0017FFh001600h 512 B 0015FFh001400h 512 B 0013FFh001200h 512 B 0011FFh001000h 4 KB 000FFFh0h MSP430F5527 MSP430F5526 MSP430F5517 96 KB 00FFFFh00FF80h N/A 32 KB 01C3FFh014400h 32 KB 0143FFh00C400h 32 KB 00C3FFh004400h N/A 2 KB 003BFFh003400h 2 KB 0033FFh002C00h 2 KB 002BFFh002400h 2 KB 0023FFh001C00h 128 B 0019FFh001980h 128 B 00197Fh001900h 128 B 0018FFh001880h 128 B 00187Fh001800h 512 B 0017FFh001600h 512 B 0015FFh001400h 512 B 0013FFh001200h 512 B 0011FFh001000h 4 KB 000FFFh0h MSP430F5529 MSP430F5528 MSP430F5519 128 KB 00FFFFh00FF80h 32 KB 0243FFh01C400h 32 KB 01C3FFh014400h 32 KB 0143FFh00C400h 32 KB 00C3FFh004400h 2 KB 0043FFh003C00h 2 KB 003BFFh003400h 2 KB 0033FFh002C00h 2 KB 002BFFh002400h 2 KB 0023FFh001C00h 128 B 0019FFh001980h 128 B 00197Fh001900h 128 B 0018FFh001880h 128 B 00187Fh001800h 512 B 0017FFh001600h 512 B 0015FFh001400h 512 B 0013FFh001200h 512 B 0011FFh001000h 4 KB 000FFFh0h
N/A = Not available 'F5522 only 'F5522, 'F5521 only USB RAM can be used as general purpose RAM when not used for USB operation.
20
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
UART BSL A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the pre-programmed, factory supplied, USB BSL. Usage of the UART BSL requires external access to the six pins shown in Table 7. Table 7. UART BSL Pin Requirements and Functions
DEVICE SIGNAL RST/NMI/SBWTDIO TEST/SBWTCK P1.1 P1.2 VCC VSS BSL FUNCTION Entry sequence signal Entry sequence signal Data transmit Data receive Power supply Ground supply
21
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
JTAG Operation
JTAG Standard Interface The MSP430 family supports the standard JTAG interface which requires four signals for sending and receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430 development tools and device programmers. The JTAG pin requirements are shown in Table 8. For further details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278). Table 8. JTAG Pin Requirements and Functions
DEVICE SIGNAL PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK RST/NMI/SBWTDIO VCC VSS DIRECTION IN IN IN OUT IN IN FUNCTION JTAG clock input JTAG state control JTAG data input/TCLK input JTAG data output Enable JTAG pins External reset Power supply Ground supply
Spy-Bi-Wire Interface In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface. Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire interface pin requirements are shown in Table 9. For further details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278. Table 9. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL TEST/SBWTCK RST/NMI/SBWTDIO VCC VSS DIRECTION IN IN, OUT FUNCTION Spy-Bi-Wire clock input Spy-Bi-Wire data input/output Power supply Ground supply
Flash Memory
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the flash memory include: Flash memory has n segments of main memory and four segments of information memory (A to D) of 128 bytes each. Each segment in main memory is 512 bytes in size. Segments 0 to n may be erased in one step, or each segment may be individually erased. Segments A to D can be erased individually. Segments A to D are also called information memory. Segment A can be locked separately.
22
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
RAM Memory
The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage, however all data is lost. Features of the RAM memory include: RAM memory has n sectors. The size of a sector can be found in the Memory Organization section. Each sector 0 to n can be complete disabled, however data retention is lost. Each sector 0 to n automatically enters low power retention mode when possible. For Devices that contain USB memory, the USB memory can be used as normal RAM if USB is not required.
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all instructions. For complete module descriptions, see the MSP430x5xx Family User's Guide (SLAU208). Digital I/O There are up to eight 8-bit I/O ports implemented: For 80 pin options, P1, P2, P3, P4, P5, P6, and P7 are complete. P8 is reduced to 3-bit I/O. For 64 pin options, P3 and P5 are reduced to 5-bit I/O and 6-bit I/O, respectively. P7 and P8 are completely removed. Port PJ contains four individual I/O ports, common to all devices. All individual I/O bits are independently programmable. Any combination of input, output, and interrupt conditions is possible. Pullup or pulldown on all ports is programmable. Drive strength on all ports is programmable. Edge-selectable interrupt and LPM4.5 wakeup input capability is available for all bits of ports P1 and P2. Read/write access to port-control registers is supported by all instructions. Ports can be accessed byte-wise (P1 through P8) or word-wise in pairs (PA through PD).
23
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Port Mapping Controller The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P4. Table 10. Port Mapping, Mnemonics, and Functions
VALUE 0 1 2 PxMAPy MNEMONIC PM_NONE PM_CBOUT0 PM_TB0CLK PM_ADC12CLK PM_DMAE0 PM_SVMOUT 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 - 30 31 (0FFh) (1)
(1)
INPUT PIN FUNCTION None TB0 clock input DMAE0 input TB0 high impedance input TB0OUTH TB0 CCR0 capture input CCI0A TB0 CCR1 capture input CCI1A TB0 CCR2 capture input CCI2A TB0 CCR3 capture input CCI3A TB0 CCR4 capture input CCI4A TB0 CCR5 capture input CCI5A TB0 CCR6 capture input CCI6A
PM_TB0OUTH PM_TB0CCR0A PM_TB0CCR1A PM_TB0CCR2A PM_TB0CCR3A PM_TB0CCR4A PM_TB0CCR5A PM_TB0CCR6A PM_UCA1RXD PM_UCA1SOMI PM_UCA1TXD PM_UCA1SIMO PM_UCA1CLK PM_UCB1STE PM_UCB1SOMI PM_UCB1SCL PM_UCB1SIMO PM_UCB1SDA PM_UCB1CLK PM_UCA1STE PM_CBOUT1 PM_MCLK Reserved PM_ANALOG
TB0 CCR0 compare output Out0 TB0 CCR1 compare output Out1 TB0 CCR2 compare output Out2 TB0 CCR3 compare output Out3 TB0 CCR4 compare output Out4 TB0 CCR5 compare output Out5 TB0 CCR6 compare output Out6
USCI_A1 UART RXD (Direction controlled by USCI - input) USCI_A1 SPI slave out master in (direction controlled by USCI) USCI_A1 UART TXD (Direction controlled by USCI - output) USCI_A1 SPI slave in master out (direction controlled by USCI) USCI_A1 clock input/output (direction controlled by USCI) USCI_B1 SPI slave transmit enable (direction controlled by USCI) USCI_B1 SPI slave out master in (direction controlled by USCI) USCI_B1 I2C clock (open drain and direction controlled by USCI) USCI_B1 SPI slave in master out (direction controlled by USCI) USCI_B1 I2C data (open drain and direction controlled by USCI) USCI_B1 clock input/output (direction controlled by USCI) USCI_A1 SPI slave transmit enable (direction controlled by USCI) None None None Comparator_B output MCLK DVSS
Disables the output driver as well as the input Schmitt-trigger to prevent parasitic cross currents when applying analog signals.
The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored resulting in a read out value of 31.
24
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Oscillator and System Clock The clock system in the MSP430F552x and MSP430F551x family of devices is supported by the Unified Clock System (UCS) module that includes support for a 32 kHz watch crystal oscillator (XT1 LF mode - XT1 HF mode not supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO), an integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator XT2. The UCS module is designed to meet the requirements of both low system cost and low-power consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the selected FLL reference frequency. The internal DCO provides a fast turn-on clock source and stabilizes in less than 5 s. The UCS module provides the following clock signals: Auxiliary clock (ACLK), sourced from a 32 kHz watch crystal (XT1), a high-frequency crystal (XT2), the internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal digitally-controlled oscillator DCO. Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made available to ACLK. Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by same sources made available to ACLK. ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32. Power Management Module (PMM) The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor (SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is implemented to provide the proper internal reset signal to the device during power-on and power-off. The SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the device is not automatically reset). SVS and SVM circuitry is available on the primary supply and core supply. Hardware Multiplier The multiplication operation is supported by a dedicated peripheral module. The module performs operations with 32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication as well as signed and unsigned multiply and accumulate operations. Real-Time Clock (RTC_A) The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit timers that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. Calendar mode integrates an internal calendar which compensates for months with less than 31 days and includes leap year correction. The RTC_A also supports flexible alarm functions and offset-calibration hardware.
Copyright 20092011, Texas Instruments Incorporated
25
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Watchdog Timer (WDT_A) The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the module can be configured as an interval timer and can generate interrupts at selected time intervals. System Module (SYS) The SYS module handles many of the system functions within the device. These include power on reset and power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data exchange mechanism via JTAG called a JTAG mailbox that can be used in the application. Table 12. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER ADDRESS 019Eh INTERRUPT EVENT No interrupt pending Brownout (BOR) RST/NMI (POR) PMMSWBOR (BOR) Wakeup from LPMx.5 Security violation (BOR) SVSL (POR) SVSH (POR) SYSRSTIV , System Reset SVML_OVP (POR) SVMH_OVP (POR) PMMSWPOR (POR) WDT timeout (PUC) WDT password violation (PUC) KEYV flash password violation (PUC) FLL unlock (PUC) Peripheral area fetch (PUC) PMM password violation (PUC) Reserved 019Ch No interrupt pending SVMLIFG SVMHIFG SVSMLDLYIFG SVSMHDLYIFG SYSSNIV , System NMI VMAIFG JMBINIFG JMBOUTIFG SVMLVLRIFG SVMHVLRIFG Reserved 019Ah No interrupt pending NMIFG SYSUNIV, User NMI OFIFG ACCVIFG BUSIFG Reserved VALUE 00h 02h 04h 06h 08h 0Ah 0Ch 0Eh 10h 12h 14h 16h 18h 1Ah 1Ch 1Eh 20h 22h to 3Eh 00h 02h 04h 06h 08h 0Ah 0Ch 0Eh 10h 12h 14h to 1Eh 00h 02h 04h 06h 08h 0Ah to 1Eh Lowest Highest Lowest Highest Lowest Highest PRIORITY
26
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
DMA Controller The DMA controller allows movement of data from one memory address to another without CPU intervention. For example, the DMA controller can be used to move data from the ADC12_A conversion memory to RAM. Using the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or from a peripheral. The USB timestamp generator also utilizes the DMA trigger assignments described in Table 13. Table 13. DMA Trigger Assignments (1)
TRIGGER 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 (1) (2) CHANNEL 0 DMAREQ TA0CCR0 CCIFG TA0CCR2 CCIFG TA1CCR0 CCIFG TA1CCR2 CCIFG TA2CCR0 CCIFG TA2CCR2 CCIFG TB0CCR0 CCIFG TB0CCR2 CCIFG Reserved Reserved Reserved Reserved Reserved Reserved Reserved UCA0RXIFG UCA0TXIFG UCB0RXIFG UCB0TXIFG UCA1RXIFG UCA1TXIFG UCB1RXIFG UCB1TXIFG ADC12IFGx Reserved Reserved USB FNRXD USB ready MPY ready DMA2IFG DMAE0
(2)
1 DMAREQ TA0CCR0 CCIFG TA0CCR2 CCIFG TA1CCR0 CCIFG TA1CCR2 CCIFG TA2CCR0 CCIFG TA2CCR2 CCIFG TB0CCR0 CCIFG TB0CCR2 CCIFG Reserved Reserved Reserved Reserved Reserved Reserved Reserved UCA0RXIFG UCA0TXIFG UCB0RXIFG UCB0TXIFG UCA1RXIFG UCA1TXIFG UCB1RXIFG UCB1TXIFG ADC12IFGx Reserved Reserved USB FNRXD USB ready MPY ready DMA0IFG DMAE0
(2)
2 DMAREQ TA0CCR0 CCIFG TA0CCR2 CCIFG TA1CCR0 CCIFG TA1CCR2 CCIFG TA2CCR0 CCIFG TA2CCR2 CCIFG TB0CCR0 CCIFG TB0CCR2 CCIFG Reserved Reserved Reserved Reserved Reserved Reserved Reserved UCA0RXIFG UCA0TXIFG UCB0RXIFG UCB0TXIFG UCA1RXIFG UCA1TXIFG UCB1RXIFG UCB1TXIFG ADC12IFGx (2) Reserved Reserved USB FNRXD USB ready MPY ready DMA1IFG DMAE0
If a reserved trigger source is selected, no Trigger1 is generated. Only on devices with ADC. Reserved on devices without ADC.
27
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Universal Serial Communication Interface (USCI) The USCI modules are used for serial data communication. The USCI module supports synchronous communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions, A and B. The USCI_An module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, or IrDA. The USCI_Bn module provides support for SPI (3 pin or 4 pin) or I2C. The MSP430F55xx series includes two complete USCI modules (n = 0, 1). TA0 TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 14. TA0 Signal Connections
INPUT PIN NUMBER RGC/YFF/ ZQE 18/H2-P1.0 PN 21-P1.0 DEVICE INPUT SIGNAL TA0CLK ACLK (internal) SMCLK (internal) 18/H2-P1.0 19/H3-P1.1 21-P1.0 22-P1.1 TA0CLK TA0.0 DVSS DVSS DVCC 20/J3-P1.2 23-P1.2 TA0.1 CBOUT (internal) DVSS DVCC 21/G4-P1.3 24-P1.3 TA0.2 ACLK (internal) DVSS DVCC 22/H4-P1.4 25-P1.4 TA0.3 DVSS DVSS DVCC 23/J4-P1.5 26-P1.5 TA0.4 DVSS DVSS DVCC (1) Only on devices with ADC. MODULE INPUT SIGNAL TACLK ACLK Timer SMCLK TACLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCI3A CCI3B GND VCC CCI4A CCI4B GND VCC CCR4 TA4 TA0.4 23/J4-P1.5 26-P1.5 CCR3 TA3 TA0.3 22/H4-P1.4 25-P1.4 CCR2 TA2 TA0.2 21/G4-P1.3 24-P1.3 20/J3-P1.2 ADC12 (internal) (1) ADC12SHSx = {1} 23-P1.2 ADC12 (internal) (1) ADC12SHSx = {1} CCR0 TA0 TA0.0 19/H3-P1.1 22-P1.1 NA NA MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL OUTPUT PIN NUMBER RGC/YFF/ZQE PN
CCR1
TA1
TA0.1
28
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
TA1 TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 15. TA1 Signal Connections
INPUT PIN NUMBER RGC/YFF/ ZQE 24/G5-P1.6 PN 27-P1.6 DEVICE INPUT SIGNAL TA1CLK ACLK (internal) SMCLK (internal) 24/G5-P1.6 25/H5-P1.7 27-P1.6 28-P1.7 TA1CLK TA1.0 DVSS DVSS DVCC 26/J5-P2.0 29-P2.0 TA1.1 CBOUT (internal) DVSS DVCC 27/G6-P2.1 30-P2.1 TA1.2 ACLK (internal) DVSS DVCC MODULE INPUT SIGNAL TACLK ACLK Timer SMCLK TACLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCR2 TA2 TA1.2 27/G6-P2.1 30-P2.1 CCR1 TA1 TA1.1 26/J5-P2.0 29-P2.0 CCR0 TA0 TA1.0 25/H5-P1.7 28-P1.7 NA NA MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL OUTPUT PIN NUMBER RGC/YFF/ ZQE PN
29
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
TA2 TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 16. TA2 Signal Connections
INPUT PIN NUMBER RGC/YFF/ ZQE 28/J6-P2.2 PN 31-P2.2 DEVICE INPUT SIGNAL TA2CLK ACLK (internal) SMCLK (internal) 28/J6-P2.2 29/H6-P2.3 31-P2.2 32-P2.3 TA2CLK TA2.0 DVSS DVSS DVCC 30/J7-P2.4 33-P2.4 TA2.1 CBOUT (internal) DVSS DVCC 31/J8-P2.5 34-P2.5 TA2.2 ACLK (internal) DVSS DVCC MODULE INPUT SIGNAL TACLK ACLK Timer SMCLK TACLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCR2 TA2 TA2.2 31/J8-P2.5 34-P2.5 CCR1 TA1 TA2.1 30/J7-P2.4 33-P2.4 CCR0 TA0 TA2.0 29/H6-P2.3 32-P2.3 NA NA MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL OUTPUT PIN NUMBER RGC/YFF/ ZQE PN
30
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
TB0 TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 17. TB0 Signal Connections
INPUT PIN NUMBER RGC/YFF/ ZQE (1) PN 60-P7.7 DEVICE INPUT SIGNAL TB0CLK ACLK (internal) SMCLK (internal) 60-P7.7 55-P5.6 55-P5.6 TB0CLK TB0.0 TB0.0 DVSS DVCC 56-P5.7 TB0.1 CBOUT (internal) DVSS DVCC 57-P7.4 57-P7.4 TB0.2 TB0.2 DVSS DVCC 58-P7.5 58-P7.5 TB0.3 TB0.3 DVSS DVCC 59-P7.6 59-P7.6 TB0.4 TB0.4 DVSS DVCC 42-P3.5 42-P3.5 TB0.5 TB0.5 DVSS DVCC 43-P3.6 TB0.6 ACLK (internal) DVSS DVCC (1) (2) MODULE INPUT SIGNAL TBCLK ACLK Timer SMCLK TBCLK CCI0A CCI0B GND VCC CCI1A CCI1B GND VCC CCI2A CCI2B GND VCC CCI3A CCI3B GND VCC CCI4A CCI4B GND VCC CCI5A CCI5B GND VCC CCI6A CCI6B GND VCC CCR6 TB6 TB0.6 43-P3.6 CCR5 TB5 TB0.5 42-P3.5 CCR4 TB4 TB0.4 59-P7.6 CCR3 TB3 TB0.3 58-P7.5 CCR2 TB2 TB0.2 57-P7.4 ADC12 (internal) ADC12SHSx = {3} 56-P5.7 ADC12 (internal) ADC12SHSx = {3} ADC12 (internal) (2) ADC12SHSx = {2} 55-P5.6 ADC12 (internal) (2) ADC12SHSx = {2} NA NA MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL OUTPUT PIN NUMBER RGC/YFF/ZQE (1) PN
CCR0
TB0
TB0.0
CCR1
TB1
TB0.1
Timer functions selectable via the port mapping controller. Only on devices with ADC.
31
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Comparator_B The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions, battery voltage supervision, and monitoring of external analog signals. ADC12_A The ADC12_A module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR core, sample select control, reference generator and a 16 word conversion-and-control buffer. The conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without any CPU intervention. CRC16 The CRC16 module produces a signature based on a sequence of entered data values and can be used for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard. REF Voltage Reference The reference module (REF) is responsible for generation of all critical reference voltages that can be used by the various analog peripherals in the device. USB Universal Serial Bus The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The module supports full-speed operation of control, interrupt, and bulk transfers. The module includes an integrated LDO, PHY, and PLL. The PLL is highly-flexible and can support a wide range of input clock frequencies. USB RAM, when not used for USB communication, can be used by the system. Embedded Emulation Module (EEM) The Embedded Emulation Module (EEM) supports real-time in-system debugging. The L version of the EEM implemented on all devices has the following features: Eight hardware triggers/breakpoints on memory access Two hardware trigger/breakpoint on CPU register write access Up to ten hardware triggers can be combined to form complex triggers/breakpoints Two cycle counters Sequencer State storage Clock control on module level
32
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
33
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
34
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Table 28. Port Mapping Registers (Base Address of Port Mapping Control: 01C0h, Port P4: 01E0h)
REGISTER DESCRIPTION Port mapping key/ID register Port mapping control register Port P4.0 mapping register Port P4.1 mapping register Port P4.2 mapping register Port P4.3 mapping register Port P4.4 mapping register Port P4.5 mapping register Port P4.6 mapping register Port P4.7 mapping register REGISTER PMAPKEYID PMAPCTL P4MAP0 P4MAP1 P4MAP2 P4MAP3 P4MAP4 P4MAP5 P4MAP6 P4MAP7 00h 02h 00h 01h 02h 03h 04h 05h 06h 07h OFFSET
35
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
36
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
37
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
38
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
39
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
40
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
41
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Table 40. DMA Registers (Base Address DMA General Control: 0500h, DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION DMA channel 0 control DMA channel 0 source address low DMA channel 0 source address high DMA channel 0 destination address low DMA channel 0 destination address high DMA channel 0 transfer size DMA channel 1 control DMA channel 1 source address low DMA channel 1 source address high DMA channel 1 destination address low DMA channel 1 destination address high DMA channel 1 transfer size DMA channel 2 control DMA channel 2 source address low DMA channel 2 source address high DMA channel 2 destination address low DMA channel 2 destination address high DMA channel 2 transfer size DMA module control 0 DMA module control 1 DMA module control 2 DMA module control 3 DMA module control 4 DMA interrupt vector REGISTER DMA0CTL DMA0SAL DMA0SAH DMA0DAL DMA0DAH DMA0SZ DMA1CTL DMA1SAL DMA1SAH DMA1DAL DMA1DAH DMA1SZ DMA2CTL DMA2SAL DMA2SAH DMA2DAL DMA2DAH DMA2SZ DMACTL0 DMACTL1 DMACTL2 DMACTL3 DMACTL4 DMAIV 00h 02h 04h 06h 08h 0Ah 00h 02h 04h 06h 08h 0Ah 00h 02h 04h 06h 08h 0Ah 00h 02h 04h 06h 08h 0Eh OFFSET
42
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
43
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
44
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
45
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
46
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to VSS. VCORE is for internal device usage only. No external DC loading or voltage should be applied. Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
47
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
NOM
MAX 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6
UNIT V V V V V V V V V V V C C nF
1.8 2.0 2.2 2.4 1.8 2.0 2.2 2.4 2.2 2.4 0
85 85
MHz
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be tolerated during power up and operation. USB operation with USB PLL enabled requires PMMCOREVx 2 for proper operation. Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
25 3
20 2 12 1 8 1, 2 1, 2, 3 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
Supply Voltage - V The numbers within the fields denote the supported PMMCOREVx settings.
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Electrical Characteristics Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
PARAMETER EXECUTION MEMORY VCC PMMCOREVx 0 IAM,
Flash (2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK) 1 MHz TYP 0.36 0.40 0.44 0.46 0.20 0.22 0.24 0.26 0.24 1 2 3 0 IAM,
RAM
8 MHz TYP 2.32 2.65 2.90 3.10 1.20 1.35 1.50 1.60 1.30 MAX 2.60
12 MHz TYP 4.0 4.3 4.6 2.0 2.2 2.4 2.2 MAX 4.4
UNIT
MAX 0.47
Flash
3.0 V
7.1 7.6
mA
RAM
3.0 V
1 2 3
3.7 3.9
mA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0). fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency. XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
49
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
-40C TYP 73 79 6.5 7.0 1.60 1.65 1.75 1.8 1.9 2.0 2.0 1.1 1.1 1.2 1.3 0.9 1.1 1.2 1.3 0.15 MAX
25C TYP 77 83 6.5 7.0 1.90 2.00 2.15 2.1 2.3 2.4 2.5 1.4 1.4 1.5 1.6 1.1 1.2 1.2 1.3 0.18 1.6 0.35 3.0 1.5 3.9 2.7 2.9 MAX 85 92 12 13
60C TYP 80 88 10 11 2.6 2.7 2.9 2.8 2.9 3.0 3.1 1.9 2.0 2.1 2.2 1.8 2.0 2.1 2.2 0.26 MAX
85C TYP 85 95 11 12 4.4 4.6 4.9 4.6 4.8 5.0 5.1 4.2 4.3 4.4 4.5 4.0 4.2 4.3 4.4 0.5 8.0 1.0 8.5 6.0 9.0 6.5 7.0 MAX 97 105 17 18
UNIT A A
3.0 V
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz USB disabled (VUSBEN = 0, SLDOEN = 0). Current for brownout, high side supervisor (SVSH) normal mode included. Low side supervisor and monitors disabled (SVSL, SVML). High side monitor disabled (SVMH). RAM retention enabled. Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1 MHz operation, DCO bias generator enabled. USB disabled (VUSBEN = 0, SLDOEN = 0) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz USB disabled (VUSBEN = 0, SLDOEN = 0) Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz USB disabled (VUSBEN = 0, SLDOEN = 0) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz USB disabled (VUSBEN = 0, SLDOEN = 0) Internal regulator disabled. No data retention. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
50
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Schmitt-Trigger Inputs General Purpose I/O (1) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER VIT+ VIT Vhys RPull CI (1) (2) Positive-going input threshold voltage Negative-going input threshold voltage Input voltage hysteresis (VIT+ VIT) Pullup/pulldown resistor (2) Input capacitance For pullup: VIN = VSS For pulldown: VIN = VCC VIN = VSS or VCC TEST CONDITIONS VCC 1.8 V 3V 1.8 V 3V 1.8 V 3V MIN 0.80 1.50 0.45 0.75 0.3 0.4 20 35 5 TYP MAX 1.40 2.10 1.00 1.65 0.85 1.0 50 UNIT V V V k pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN). Also applies to RST pin when pullup/pulldown resistor is enabled.
MIN 20
MAX
UNIT ns
Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions. An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set by trigger signals shorter than t(int).
Leakage Current General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER Ilkg(Px.x) (1) (2) High-impedance leakage current
(1) (2)
TEST CONDITIONS
MIN -50
MAX 50
UNIT nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted. The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is disabled.
Outputs General Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS I(OHmax) = 3 mA (1) VOH High-level output voltage I(OHmax) = 10 mA (2) I(OHmax) = 5 mA (1) I(OHmax) = 15 mA (2) I(OLmax) = 3 mA (1) VOL Low-level output voltage I(OLmax) = 10 mA (2) I(OLmax) = 5 mA
(1)
UNIT
VSS VSS + 0.25 VSS VSS + 0.60 VSS VSS + 0.25 VSS VSS + 0.60 V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 48 mA to hold the maximum voltage drop specified. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 100 mA to hold the maximum voltage drop specified. 51
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Outputs General Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS I(OHmax) = 1 mA (2) VOH High-level output voltage I(OHmax) = 3 mA (3) I(OHmax) = 2 mA
(2)
UNIT
I(OHmax) = 6 mA (3) I(OLmax) = 1 mA (2) VOL Low-level output voltage I(OLmax) = 3 mA (3) I(OLmax) = 2 mA (2) I(OLmax) = 6 mA (3) (1) (2) (3)
VSS VSS + 0.25 VSS VSS + 0.60 VSS VSS + 0.25 VSS VSS + 0.60 V
Selecting reduced drive strength may reduce EMI. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed 100 mA to hold the maximum voltage drop specified.
Output Frequency General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER Port output frequency (with load) ACLK SMCLK MCLK CL = 20 pF (2) TEST CONDITIONS VCC = 1.8 V PMMCOREVx = 0 VCC = 3 V PMMCOREVx = 3 VCC = 1.8 V PMMCOREVx = 0 VCC = 3 V PMMCOREVx = 3
(1) (2)
MIN
MAX 16
UNIT
fPx.y
MHz 25 16 MHz 25
fPort_CLK
(1) (2)
A resistive divider with 2 R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full drive strength, R1 = 550 . For reduced drive strength, R1 = 1.6 k. CL = 20 pF is connected to the output to VSS. The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
52
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
TA = 85C
TA = 85C 15.0
10.0
5.0
0.0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.5
1.0
1.5
2.0
-10.0
-15.0
TA = 85C
TA = 85C
-20.0
TA = 25C
TA = 25C
-25.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VOH High-Level Output Voltage V
0.0
2.0
Figure 4.
Figure 5.
53
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 0.0
TA = 25C
TA = 25C
TA = 85C
20 TA = 85C
16
12
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 0.0
0.5
1.0
1.5
2.0
-5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 -45.0 -50.0 -55.0 -60.0 0.0
-8
-12 TA = 85C -16 TA = 25C -20 0.0 0.5 1.0 1.5 2.0
TA = 85C
TA = 25C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VOH High-Level Output Voltage V
Figure 8.
Figure 9.
54
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
VCC
MIN
TYP 0.075
MAX
UNIT
IDVCC.LF
3.0 V
fXT1,LF0 fXT1,LF,SW
Hz kHz
XT1 oscillator logic-level square-wave input frequency, XTS = 0, XT1BYPASS = 1 (2) LF mode Oscillation allowance for LF crystals (4)
OALF
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, fXT1,LF = 32768 Hz, CL,eff = 6 pF XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, fXT1,LF = 32768 Hz, CL,eff = 12 pF XTS = 0, XCAPx = 0 (6) XTS = 0, XCAPx = 1 XTS = 0, XCAPx = 2 XTS = 0, XCAPx = 3 XTS = 0, Measured at ACLK, fXT1,LF = 32768 Hz XTS = 0 (8) fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, TA = 25C, CL,eff = 6 pF fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25C, CL,eff = 12 pF
CL,eff
tSTART,LF
(1)
(5)
To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Maximum frequency of operation of the entire device cannot be exceeded. Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application: (a) For XT1DRIVEx = 0, CL,ef f 6 pF. (b) For XT1DRIVEx = 1, 6 pF CL,ef f 9 pF. (c) For XT1DRIVEx = 2, 6 pF CL,ef f 10 pF. (d) For XT1DRIVEx = 3, CL,ef f 6 pF. Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Requires external capacitors at both terminals. Values are specified by crystal manufacturers. Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals.
55
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
VCC
MIN
MAX
UNIT
IDVCC.XT2
XT2DRIVEx = 0, XT2BYPASS = 0, fXT2,HF0 = 6 MHz, CL,eff = 15 pF Oscillation allowance for HF crystals (5) XT2DRIVEx = 1, XT2BYPASS = 0, fXT2,HF1 = 12 MHz, CL,eff = 15 pF XT2DRIVEx = 2, XT2BYPASS = 0, fXT2,HF2 = 20 MHz, CL,eff = 15 pF XT2DRIVEx = 3, XT2BYPASS = 0, fXT2,HF3 = 32 MHz, CL,eff = 15 pF fOSC = 6 MHz, XT2BYPASS = 0, XT2DRIVEx = 0, TA = 25C, CL,eff = 15 pF fOSC = 20 MHz, XT2BYPASS = 0, XT2DRIVEx = 2, TA = 25C, CL,eff = 15 pF
OAHF
tSTART,HF
Startup time
Integrated effective load capacitance, HF mode (6) (7) Measured at ACLK, fXT2,HF2 = 20 MHz Oscillator fault frequency (8) XT2BYPASS = 1
(9)
40 30
50
Requires external capacitors at both terminals. Values are specified by crystal manufacturers. To improve EMI on the XT2 oscillator the following guidelines should be observed. (a) Keep the traces between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT. (d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation. When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Oscillation allowance is based on a safety factor of 5 for recommended crystals. Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Requires external capacitors at both terminals. Values are specified by crystal manufacturers. Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals.
56
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Calculated using the box method: (MAX(-40 to 85C) MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C (40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V 1.8 V)
Calculated using the box method: (MAX(-40 to 85C) MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C (40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V 1.8 V)
57
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER fDCO(0,0) fDCO(0,31) fDCO(1,0) fDCO(1,31) fDCO(2,0) fDCO(2,31) fDCO(3,0) fDCO(3,31) fDCO(4,0) fDCO(4,31) fDCO(5,0) fDCO(5,31) fDCO(6,0) fDCO(6,31) fDCO(7,0) fDCO(7,31) SDCORSEL SDCO Duty cycle dfDCO/dT dfDCO/dVCC (1) (2) DCO frequency temperature drift (1) DCO frequency voltage drift
(2)
TEST CONDITIONS DCORSELx = 0, DCOx = 0, MODx = 0 DCORSELx = 0, DCOx = 31, MODx = 0 DCORSELx = 1, DCOx = 0, MODx = 0 DCORSELx = 1, DCOx = 31, MODx = 0 DCORSELx = 2, DCOx = 0, MODx = 0 DCORSELx = 2, DCOx = 31, MODx = 0 DCORSELx = 3, DCOx = 0, MODx = 0 DCORSELx = 3, DCOx = 31, MODx = 0 DCORSELx = 4, DCOx = 0, MODx = 0 DCORSELx = 4, DCOx = 31, MODx = 0 DCORSELx = 5, DCOx = 0, MODx = 0 DCORSELx = 5, DCOx = 31, MODx = 0 DCORSELx = 6, DCOx = 0, MODx = 0 DCORSELx = 6, DCOx = 31, MODx = 0 DCORSELx = 7, DCOx = 0, MODx = 0 DCORSELx = 7, DCOx = 31, MODx = 0 SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO) SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO) Measured at SMCLK fDCO = 1 MHz, fDCO = 1 MHz
MIN 0.07 0.70 0.15 1.47 0.32 3.17 0.64 6.07 1.3 12.3 2.5 23.7 4.6 39.0 8.5 60 1.2 1.02 40
TYP
MAX 0.20 1.70 0.36 3.45 0.75 7.38 1.51 14.0 3.2 28.2 6.0 54.1 10.7 88.0 19.6 135 2.3 1.12
UNIT MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz ratio ratio % %/C %/V
DCO frequency (0, 0) DCO frequency (0, 31) DCO frequency (1, 0) DCO frequency (1, 31) DCO frequency (2, 0) DCO frequency (2, 31) DCO frequency (3, 0) DCO frequency (3, 31) DCO frequency (4, 0) DCO frequency (4, 31) DCO frequency (5, 0) DCO frequency (5, 31) DCO frequency (6, 0) DCO frequency (6, 31) DCO frequency (7, 0) DCO frequency (7, 31) Frequency step between range DCORSEL and DCORSEL + 1 Frequency step between tap DCO and DCO + 1
50 0.1 1.9
60
Calculated using the box method: (MAX(-40 to 85C) MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C (40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V 1.8 V)
Typical DCO Frequency, VCC = 3.0 V, TA = 25C 100
10
fDCO MHz
DCOx = 31
0.1
DCOx = 0
DCORSEL
58
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
VCORE2(AM)
1.80
VCORE1(AM)
1.60
VCORE0(AM)
1.40
VCORE3(LPM)
1.94
VCORE2(LPM)
1.84
VCORE1(LPM)
1.64
VCORE0(LPM)
1.44
59
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
tpd(SVSH)
t(SVSH)
dVDVCC/dt (1)
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide (SLAU208) on recommended settings and usage.
60
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
MIN
MAX
UNIT nA nA A
1.74 1.94 2.14 2.30 2.40 2.70 3.10 3.10 3.75 2.5
SVMHE = 1, SVSMHRRL = 4 SVMHE = 1, SVSMHRRL = 5 SVMHE = 1, SVSMHRRL = 6 SVMHE = 1, SVSMHRRL = 7 SVMHE = 1, SVMHOVPE = 1 SVMHE = 1, dVDVCC/dt = 10 mV/s, SVMHFP = 1 SVMHE = 1, dVDVCC/dt = 1 mV/s, SVMHFP = 0 SVMHE = 0 1 SVMHFP = 1 SVMHE = 0 1 SVMHFP = 0
tpd(SVMH)
s 20 12.5 s 100
t(SVMH)
(1)
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide (SLAU208) on recommended settings and usage.
61
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
tpd(SVSL)
t(SVSL)
tpd(SVML)
t(SVML)
s ms ms
(2)
(3)
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide (SLAU208). This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current) mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide (SLAU208). This value represents the time from the wakeup event to the reset vector execution.
62
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER fTA Timer_A input clock frequency TEST CONDITIONS Internal: SMCLK, ACLK External: TACLK Duty cycle = 50% 10% All capture inputs. Minimum pulse width required for capture. VCC 1.8 V/ 3.0 V 1.8 V/ 3.0 V 20 MIN TYP MAX 25 UNIT MHz
tTA,cap
ns
Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER fTB Timer_B input clock frequency TEST CONDITIONS Internal: SMCLK, ACLK External: TBCLK Duty cycle = 50% 10% All capture inputs. Minimum pulse width required for capture. VCC 1.8 V/ 3.0 V 1.8 V/ 3.0 V 20 MIN TYP MAX 25 UNIT MHz
tTB,cap
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are correctly recognized their width should exceed the maximum specification of the deglitch time.
63
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
tVALID,MO
(2)
ns ns
tHD,MO
fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)). For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) see the SPI parameters of the attached slave. Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams in Figure 11 and Figure 12. Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 11 and Figure 12.
64
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI tHD,MI SOMI tHD,MO tVALID,MO SIMO
tHD,MI
65
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
tVALID,SO
(2)
ns ns
tHD,SO
fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)). For the master's parameters tSU,MI(Master) and tVALID,MO(Master) see the SPI parameters of the attached slave. Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams in Figure 11 and Figure 12. Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 11 and Figure 12.
66
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
tSTE,LAG
tHD,SI SIMO
tSTE,ACC SOMI
tHD,SO tVALID,SO
tSTE,DIS
tSTE,ACC SOMI
tHD,MO tVALID,SO
tSTE,DIS
67
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
VCC
MIN
TYP
MAX fSYSTEM
400
600 600
ns
tSP
tSU,DAT tHD,DAT
tSU,STO
68
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
The leakage current is specified by the digital I/O input leakage. The analog input voltage range must be within the selected reference voltage range VR+ to VR for valid conversion results. If the reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling capacitors are required. See REF, External Reference andREF, Built-In Reference. The internal reference supply current is not included in current consumption parameter IADC12_A.
tCONVERT
Conversion time
Sampling time
ns
The ADC12OSC is sourced directly from MODOSC inside the UCS. 13 ADC12DIV 1/fADC12CLK Approximately ten Tau () are needed to get an error of less than 0.5 LSB: tSample = ln(2n+1) x (RS + RI) CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
69
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS ADC12ON = 1, INCH = 0Ah, TA = 0C ADC12ON = 1, INCH = 0Ah ADC12ON = 1, INCH = 0Ah, Error of conversion result 1 LSB ADC12ON = 1, INCH = 0Bh ADC12ON = 1, INCH = 0Bh ADC12ON = 1, INCH = 0Bh, Error of conversion result 1 LSB 2.2 V 3V 2.2 V/3 V VCC 2.2 V 3V 2.2 V 3V 2.2 V 3V 30 30 0.48 1.06 1.44 1000 0.5 1.1 1.5 MIN TYP 680 680 2.25 2.25 MAX UNIT mV mV/C s 0.52 VAVCC 1.14 1.56 V ns
(3) (4)
The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of the temperature sensor. The temperature sensor offset can be as much as 20C. A single-point calibration is recommended in order to minimize the offset error of the built-in temperature sensor. The TLV structure contains calibration values for 30C 3C and 85C 3C for each of the available reference voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR * (Temperature,C) + VSENSOR, where TCSENSOR and VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx Family User's Guide (SLAU208). The typical equivalent impedance of the sensor is 51 k. The sample time required includes the sensor-on time tSENSOR(on). The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
1000
950 900 850 800 750 700 650 600 550 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature - C
70
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
VCC
TYP
UNIT V V V
(3)
(4)
IVeREF+, IVREF/VeREF
1.4 V VeREF+ VAVCC , VeREF = 0 V, fADC12CLK = 5 MHz, ADC12SHTx = 1h, Conversion rate 200ksps 1.4 V VeREF+ VAVCC , VeREF = 0 V, fADC12CLK = 5 MHz, ADC12SHTx = 8h, Conversion rate 20ksps
2.2 V/3 V
-26
26
2.2 V/3 V
-1
(5)
10
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy. The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with reduced accuracy requirements. Two decoupling capacitors, 10F and 100nF, should be connected to VREF to decouple the dynamic current required for an external reference source if it is used for the ADC12_A. See also the MSP430x5xx Family User's Guide (SLAU208).
2.50 2.5375
3V
1.9503
1.98 2.0097
2.2 V/ 3 V
1.49 1.5124
IREF+
(1)
(2) (3)
The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as, used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference for the conversion and utilizes the smaller buffer. The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current contribution of the larger buffer without external load. The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with REFON =1 and REFOUT = 0. 71
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
2500 V/mA
CVREF+/TCREF+
100 50
pF ppm/ C
PSRR_DC
120
300
V/V
PSRR_AC
6.4
mV/V
75 s 75
tSETTLE
Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace, etc. Two decoupling capacitors, 10F and 100nF, should be connected to VREF to decouple the dynamic current required for an external reference source if it is used for the ADC12_A. See also the MSP430x5xx Family User's Guide (SLAU208). Calculated using the box method: (MAX(-40 to 85C) MIN(-40 to 85C)) / MIN(-40 to 85C)/(85C (40C)). The condition is that the error in a conversion started after tREFON is less than 0.5 LSB. The settling time depends on the external capacitive load when REFOUT = 1.
72
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER VCC Supply voltage 1.8 V IAVCC_COMP Comparator operating supply current into AVCC. Excludes reference resistor ladder. CBPWRMD = 00 CBPWRMD = 01 CBPWRMD = 10 IAVCC_REF VIC VOFFSET CIN RSIN Quiescent current of local reference voltage amplifier into AVCC. Common mode input range Input offset voltage Input capacitance Series input resistance ON - switch closed OFF - switch opened CBPWRMD = 00, CBF = 0 tPD Propagation delay, response time CBPWRMD = 01, CBF = 0 CBPWRMD = 10, CBF = 0 CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 00 Propagation delay with filter active CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 01 CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 10 CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 11 tEN_CMP tEN_REF VCB_REF Comparator enable time, settling time Resistor reference enable time Reference voltage for a given tap CBON = 0 to CBON = 1, CBPWRMD = 00, 01, 10 CBON = 0 to CBON = 1 VIN = reference into resistor ladder, n = 0 to 31 0.35 0.6 1.0 1.8 0.6 1.0 1.8 3.4 1 1 30 450 600 50 1.0 1.8 3.4 6.5 2 1.5 CBPWRMD = 00 CBPWRMD = 01, 10 CBREFACC = 1, CBREFLx = 01 0 -20 -10 5 3 4 2.2 V 3.0 V 2.2/3.0 V 2.2/3.0 V 30 40 10 0.1 TEST CONDITIONS VCC MIN 1.8 TYP MAX 3.6 40 50 65 30 0.5 22 VCC-1 20 10 A V mV mV pF k M ns ns s s s s s s s V A UNIT V
tPD,filter
VOL
0.4
VIH
VIL
0.8
73
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011
TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE
90 80
IOL - Typical Low-Level Output Current - mA
www.ti.com
VCC = 3.0 V TA = 25 C
VCC = 1.8 V TA = 85 C
1.1
1.2
-10
IOH - Typical High-Level Output Current - mA
-20
-30
-40
VCC = 1.8 V TA = 85 C
-50
-60
-70
-80
1.6
Input Threshold - V
1.4
0.8
0.6
0.4
0.2
74
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
75
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
VCC
TYP
UNIT V V V V
3.3 1.8
3.597
USB LDO is on 60 USB LDO is on, USB PLL disabled USB LDO is on USB 1.8V LDO is disabled. VBUS = 5.0V USBDETEN = 0 or 1 USB LDO is disabled. USB 1.8V LDO is disabled. VBUS > VLAUNCH USBDETEN = 1 1.8/ 3.0V 60
12 100 250
mA mA A
Operating supply current into VBUS terminal. (4) Operating supply current into VBUS terminal. Represents the current of the 3.3 V LDO only. Operating supply current into VBUS terminal. Represents the current of the VBUS detection logic. VBUS terminal recommended capacitance VUSB terminal recommended capacitance V18 terminal recommended capacitance Settling time VUSB and V18 Pullup resistance of PUR terminal (5)
IUSB_LDO
IVBUS_DETE
CT
1.8/ 3.0V
A F nF nF 2 ms
CBUS CUSB C18 tENABLE RPUR (1) (2) (3) (4) (5)
150
This voltage is for internal usages only. No external DC loading should be applied. This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB operation. A current overload will be detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value. Does not include current contribution of Rpu and Rpd as outlined in the USB specification. This value, in series with an external resistor between PUR and D+, produces the Rpu as outlined in the USB specification.
76
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER DVCC(PGM/ERASE) Program and erase supply voltage IPGM IERASE IMERASE, IBANK tCPT tRetention tWord tBlock, tBlock, tBlock, tErase fMCLK,MGR (1) (2)
0 1(N1) N
TEST CONDITIONS
MIN 1.8
TYP
MAX 3.6
Average supply current from DVCC during program Average supply current from DVCC during erase Average supply current from DVCC during mass erase or bank erase Cumulative program time Program/erase endurance Data retention duration Word or byte program time Block program time for first byte or word Block program time for each additional byte or word, except for last byte or word Block program time for last byte or word Erase time for segment, mass erase, and bank erase when available. MCLK frequency in marginal read mode (FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1) TJ = 25C See See See See See
(2) (2) (2) (2) (2)
5 2 2
See
(1)
s s s s ms MHz
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming methods: individual word/byte write and block write modes. These values are hardwired into the flash controller's state machine.
MIN 0 0.025
TYP
MAX 20 15 1
Spy-Bi-Wire input frequency Spy-Bi-Wire low clock pulse length Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge) (1) Spy-Bi-Wire return to normal operation time TCK input frequency - 4-wire JTAG (2) Internal pulldown resistance on TEST
100 5 10 80
Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the first SBWTCK clock edge. fTCK may be restricted to meet the timing requirements of the module selected.
77
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
INPUT/OUTPUT SCHEMATICS Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
P1REN.x Pad Logic
0 1 1
0 1 P1DS.x 0: Low drive 1: High drive P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0
EN To module D
P1SEL.x P1IES.x
78
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
79
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
0 1 1
0 1 P2DS.x 0: Low drive 1: High drive P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UB0STE/UCA0CLK
EN To module D
P2SEL.x P2IES.x
80
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
FUNCTION
X = Don't care The pin direction is controlled by the USCI module. UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI A0/B0 is forced to 3-wire SPI mode if 4-wire SPI mode is selected.
81
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
0 1 1
0 1 P3DS.x 0: Low drive 1: High drive P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO P3.4/UCA0RXD/UCA0SOMI P3.5/TB0.5 P3.6/TB0.6 P3.7/TB0OUTH/SVMOUT
EN To module D
FUNCTION
X = Don't care The pin direction is controlled by the USCI module. If the I2C functionality is selected, the output drives only the logical 0 to VSS level. UCB0CLK function takes precedence over UCA0STE function. If the pin is required as UCB0CLK input or output, USCI A0/B0 is forced to 3-wire SPI mode if 4-wire SPI mode is selected. 'F5529, 'F5527, 'F5525, 'F5521, 'F5519, 'F5517, 'F5515 devices only.
82
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
DVSS DVCC P4DIR.x from Port Mapping Control 0 1 Direction 0: Input 1: Output
0 1 1
0 1 P4DS.x 0: Low drive 1: High drive P4.0/P4MAP0 P4.1/P4MAP1 P4.2/P4MAP2 P4.3/P4MAP3 P4.4/P4MAP4 P4.5/P4MAP5 P4.6/P4MAP6 P4.7/P4MAP7
The direction of some mapped secondary functions are controlled directly by the module. See Table 10 for specific direction control information of mapped secondary functions.
83
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
0 1 1
EN To module D
Bus Keeper
FUNCTION
X = Don't care VREF+/VeREF+ available on MSP430F552x devices only. Default condition Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A when available. Channel A8, when selected with the INCHx bits, is connected to the VREF+/VeREF+ pin. Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. The VREF+ reference is available at the pin. Channel A8, when selected with the INCHx bits, is connected to the VREF+/VeREF+ pin. VREF-/VeREF- available on MSP430F552x devices only. Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A when available. Channel A9, when selected with the INCHx bits, is connected to the VREF-/VeREF- pin. Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. The VREF reference is available at the pin. Channel A9, when selected with the INCHx bits, is connected to the VREF-/VeREF- pin.
84
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
P5REN.2
0 1 1
EN Module X IN D
Bus Keeper
85
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
P5REN.3
0 1 1
EN Module X IN D
Bus Keeper
X = Don't care Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal mode or bypass mode. Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as general-purpose I/O.
86
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
P5REN.4
0 1 1
EN Module X IN D
Bus Keeper
87
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
P5REN.5
0 1 1
EN Module X IN D
Bus Keeper
FUNCTION
X = Don't care Setting P5SEL.4 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.4 is configured for crystal mode or bypass mode. Setting P5SEL.4 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.5 can be used as general-purpose I/O.
88
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
0 1 1
P5OUT.x
0 1
P5.6/TB0.0 P5.7/TB0.1
FUNCTION
P5.7/TB0.1
(1)
TB0.CCI1A TB0.1
(1)
89
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
to ADC12 (n/a MSPF430F551x) INCHx = x (n/a MSPF430F551x) to Comparator_B from Comparator_B CBPD.x
0 1 P6DS.x 0: Low drive 1: High drive P6.0/CB0/(A0) P6.1/CB1/(A1) P6.2/CB2/(A2) P6.3/CB3/(A3) P6.4/CB4/(A4) P6.5/CB5/(A5) P6.6/CB6/(A6) P6.7/CB7/(A7)
EN To module D
Bus Keeper
90
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer for that pin, regardless of the state of the associated CBPD.x bit.
91
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
to ADC12 (n/a MSPF430F551x) INCHx = x (n/a MSPF430F551x) to Comparator_B from Comparator_B CBPD.x
EN To module D
Bus Keeper
92
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
FUNCTION
P7.3/CB11/(A15)
'F5529, 'F5527, 'F5525, 'F5521, 'F5519, 'F5517, 'F5515 devices only. 'F5529, 'F5527, 'F5525, 'F5521 devices only. Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer for that pin, regardless of the state of the associated CBPD.x bit.
93
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
0 1 1
P7OUT.x
0 1
FUNCTION
P7.5/TB0.3
(1)
P7.6/TB0.4 (1)
P7.7/TB0CLK/MCLK (1)
(1)
94
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
DVSS DVCC P8DIR.x from Port Mapping Control 0 1 Direction 0: Input 1: Output
0 1 1
95
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Pad Logic
PUOUT0 USB DP output PUIN0 USB DP input PUIPE . PUIN1 USB DM input PUOUT1 USB DM output
0 1
PU.0/ DP
0 1
PU.1/ DM
VUSB PUREN
VSSU
Pad Logic
1 PUSEL PURIN
PUR
96
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the 3.3-V LDO is not being used and is disabled. Output state set by the USB module.
PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the 3.3-V LDO is not being used and is disabled.
97
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
PJREN.0 Pad Logic
0 1 1
EN D
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
PJREN.x Pad Logic
0 1 1
EN To JTAG D
98
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
FUNCTION
X = Don't care Default condition The pin direction is controlled by the JTAG module. In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
99
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
(1) 100
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
101
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
01A1Ch
blank
blank
blank
blank
blank
01A1Eh
blank
blank
blank
blank
blank
01A20h
blank
blank
blank
blank
blank
01A22h
blank
blank
blank
blank
blank
01A24h
blank
blank
blank
blank
blank
1 1 2 2 2 1 1 2 2 2 2 2
12h 06h per unit per unit per unit 02h 61h 08h 8Ah 0Ch 86h 0Eh 2Ah 12h 2Eh 22h 96h
12h 06h per unit per unit per unit 02h 63h 08h 8Ah 0Ch 86h 0Eh 2Ah 12h 2Dh 2Ah 22h
12h 06h per unit per unit per unit 02h 61h 08h 8Ah 0Ch 86h 0Eh 2Ah 12h 2Ch 22h 94h
12h 06h per unit per unit per unit 02h 5Fh 08h 8Ah 0Ch 86h 0Eh 2Ah 12h 2Ch 22h 94h
12h 06h per unit per unit per unit 02h 5Fh 08h 8Ah 0Ch 86h 0Eh 2Ah 12h 2Ch 40h 92h
103
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
104
MSP430F551x MSP430F552x
www.ti.com SLAS590E MARCH 2009 REVISED APRIL 2011
105
MSP430F551x MSP430F552x
SLAS590E MARCH 2009 REVISED APRIL 2011 www.ti.com
REVISION HISTORY
REVISION SLAS590 SLAS590A SLAS590B SLAS590C SLAS590D SLAS590E Limited product preview release Changes throughout for XMS430F5529 sampling Changes throughout for updated preview Changes throughout for updated preview Production data release Updated YFF and ZQE pinout drawings Changed Tstg maximum to 150C Changed fXT2,HF,SW MIN to 0.7 MHz DESCRIPTION
106
www.ti.com
9-Aug-2011
PACKAGING INFORMATION
Orderable Device MSP430F5513IRGCR MSP430F5513IRGCT MSP430F5513IZQE Status
(1)
Package Type Package Drawing VQFN VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR VQFN VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR LQFP LQFP LQFP LQFP LQFP LQFP LQFP RGC RGC ZQE
Pins 64 64 80
Eco Plan
(2)
(3)
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
MSP430F5513IZQER
ACTIVE
ZQE
80
2500
SNAGCU
Level-3-260C-168 HR
64 64 80
MSP430F5514IZQER
ACTIVE
ZQE
80
2500
SNAGCU
Level-3-260C-168 HR
PN PN PN PN PN PN PN
80 80 80 80 80 80 80
CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR
Addendum-Page 1
www.ti.com
9-Aug-2011
Status
(1)
Package Type Package Drawing LQFP VQFN VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR VQFN VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR LQFP LQFP VQFN VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR PN RGC RGC ZQE
Pins 80 64 64 80
Eco Plan
(2)
(3)
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
MSP430F5522IZQER
ACTIVE
ZQE
80
2500
SNAGCU
Level-3-260C-168 HR
64 64 80
MSP430F5524IZQER
ACTIVE
ZQE
80
2500
SNAGCU
Level-3-260C-168 HR
80 80 64 64 80
CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR SNAGCU Level-3-260C-168 HR
MSP430F5526IZQER
ACTIVE
ZQE
80
2500
SNAGCU
Level-3-260C-168 HR
Addendum-Page 2
www.ti.com
9-Aug-2011
Status
(1)
Package Type Package Drawing LQFP LQFP VQFN VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR DIESALE LQFP LQFP PN PN RGC RGC ZQE
Pins 80 80 64 64 80
Eco Plan
(2)
(3)
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR SNAGCU Level-3-260C-168 HR
MSP430F5528IZQER
ACTIVE
ZQE
80
2500
SNAGCU
Level-3-260C-168 HR
Y PN PN
0 80 80
Call TI
Call TI
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 3
www.ti.com
9-Aug-2011
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
Device
Package Package Pins Type Drawing BGA MI CROSTA R JUNI OR BGA MI CROSTA R JUNI OR LQFP LQFP LQFP LQFP BGA MI CROSTA R JUNI OR BGA MI CROSTA R JUNI OR LQFP ZQE 80
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 5.3
B0 (mm) 5.3
K0 (mm) 1.5
P1 (mm) 8.0
MSP430F5513IZQER
2500
MSP430F5514IZQER
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
PN PN PN PN ZQE
80 80 80 80 80
Q2 Q2 Q2 Q2 Q1
MSP430F5524IZQER
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5525IPNR
PN
80
1000
330.0
24.4
14.6
14.6
1.9
20.0
24.0
Q2
Pack Materials-Page 1
Device
Package Package Pins Type Drawing BGA MI CROSTA R JUNI OR LQFP BGA MI CROSTA R JUNI OR LQFP ZQE 80
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 5.3
B0 (mm) 5.3
K0 (mm) 1.5
P1 (mm) 8.0
MSP430F5526IZQER
2500
MSP430F5527IPNR MSP430F5528IZQER
PN ZQE
80 80
1000 2500
330.0 330.0
24.4 12.4
14.6 5.3
14.6 5.3
1.9 1.5
20.0 8.0
24.0 12.0
Q2 Q1
MSP430F5529IPNR
PN
80
1000
330.0
24.4
14.6
14.6
1.9
20.0
24.0
Q2
Package Type BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR LQFP LQFP LQFP LQFP BGA MICROSTAR
Pins 80 80 80 80 80 80 80
Pack Materials-Page 2
Device
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BGA MICROSTAR JUNIOR LQFP BGA MICROSTAR JUNIOR LQFP BGA MICROSTAR JUNIOR LQFP
80 80 80 80 80 80
Pack Materials-Page 3
MECHANICAL DATA
MTQF010A JANUARY 1995 REVISED DECEMBER 1996
PN (S-PQFP-G80)
0,27 0,17 41
0,50 60
0,08 M
61
40
80
0,13 NOM 21
20
Gage Plane
0,75 0,45
Seating Plane 1,60 MAX 0,08 4040135 / B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee Solutions www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Applications Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Transportation and Automotive Video and Imaging Wireless www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/automotive www.ti.com/video www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2011, Texas Instruments Incorporated