TECHNICAL BULLETIN

ALPHA® EF-6000
No-Clean Flux for Lead-Free & Sn-Pb Wave Soldering

DESCRIPTION

ALPHA EF-6000 was specifically developed to deliver outstanding board cosmetics and to eliminate the
tendency for solder balling and solder bridging, two types of defects which are normally associated with
the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, ALPHA EF-6000 exhibits the
lowest tendency for solder ball generation over a wide variety of solder masks during wave soldering and
Selective Soldering operations. ALPHA EF-6000 should be considered for use by any assembler who
has board designs which are sensitive to solder bridging, performs pin testing, or whose specification
requires an extremely low frequency of solder balls.

ALPHA EF-6000 is an active, low solids, no-clean flux. It has been designed with a wide thermal process
window enabling best-in-class productivity with lead-free wave soldering applications, and is an excellent
choice for remaining tin-lead production lines. It is formulated with a proprietary mixture of organic
activators. Several proprietary additives are formulated into ALPHA EF-6000 to reduce the surface
tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solder
ball generation. The formulation of ALPHA EF-6000 is also more thermally stable, thereby, reducing the
occurrence of solder bridging during lead-free dual wave soldering.

FEATURES & BENEFITS

• Thermally stable activators provide the lowest solder bridging in a low-solids, no-clean flux for
wave soldering and Selective Soldering in tin-lead and lead-free applications.
• Reduces the surface tension between solder mask and solder to provide the lowest solder ball
frequency of any low solids, no-clean flux.
• Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible
residue.
• Cleaning is not required which reduces operating costs.
• IPC-J-STD-004 compliant for long term electrical reliability.

APPLICATION

PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is

important to begin the process with circuit boards and components that meet established requirements for
solderability and ionic cleanliness. It is suggested that assemblers establish specifications on these items
with their suppliers and that suppliers provide

Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A common
specification for the ionic cleanliness of incoming boards and components is 5μg/in2 (0.77μg/cm2)
maximum, as measured by an ionic contamination tester.

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ALPHA® EF-6000
No-Clean Flux for Lead-Free & Sn-Pb Wave Soldering
Care should be taken in handling the circuit boards throughout the process. Boards should always be
held at the edges. The use of clean, lint-free gloves is also recommended. When switching from one flux
to another, the flux reservoir, flux tank and lines of the spray fluxer assembly should be purged with IPA.
Conveyors, fingers and pallets should be cleaned periodically with DI Water, IPA or other commercial
Solvent Cleaners to eliminate residues on the assembly edges.

FLUX APPLICATION: ALPHA EF-6000 is formulated to be applied by spray methods. A uniform coating
of flux is essential to successful soldering. When spray fluxing, the uniformity of the coating can be
visually checked by running a piece of cardboard over the spray fluxer or by processing a board sized
piece of tempered glass through the spray and then through the preheat section.

OPERATING PARAMETER SAC305 / SACX0307 63/37 Sn-Pb

2
Single Wave: 500 – 800 μg/in Single Wave: 200 – 600 μg/in2
(78 - 124 μg/cm2) of solids (31 – 93 μg/cm2) of solids
Amount of Flux Applied by Spray
Dual Wave: 850 – 1400 μg/in2 Dual Wave: 600 – 1000 μg/in2
(132 – 217 μg/cm2) of solids (93 – 155 μg/cm2) of solids
Topside Preheat Temperature 105°C – 120°C (221°F – 248°F) 75°C -100°C (167°F - 212°F)
about 35°C (95°F) about 35°C (95°F)
Bottom side Preheat Temperature
higher than topside higher than topside
Maximum Ramp Rate of Topside
Temperature (to avoid component 2°C/second maximum 2°C/second maximum
damage)
Conveyor Angle 4°- 7° (6° typical) 4°- 7° (6° typical)
Conveyor Speed 3 - 6 ft./min. (0.9 – 1.8 m./min.) 3 - 6 ft./min. (0.9 - 1.8 m./min.)
Contact Time in the Solder
1.5 - 3.5 seconds 1.5 - 3.5 seconds
(includes Chip Wave and Primary
(2.5 - 3 seconds most common) (2.5 - 3 seconds most common)
Wave)
Solder Pot Temperature 255°C – 265°C (491°F – 509°F) 240°C - 250°C (464°F – 482°F)
These are general guidelines, which have proven to yield excellent results; however, depending upon your equipment, components, and circuit
boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a designed experiment,
optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board
orientation).

FLUX SOLIDS CONTROL: As with any flux with less than 5% solids content, specific gravity is not an
effective measurement for assessing and controlling the solids content. Monitoring and controlling the acid
number is recommended for maintaining the solids content. The acid number should be controlled to
between 16.5 and 18.5. Alpha's Flux Solids Control Kit #3, a digital titrator, is suggested. Request Alpha's
Technical Bulletin SM-458 for details on the kit and titration procedure.

RESIDUE REMOVAL: ALPHA EF-6000 is a no-clean flux and the residues are designed to be left on the
board. However, if desired, ALPHA EF-6000 residues can be removed with hot DI Water, ALPHA 2110
Saponifier or commercial solvent cleaners.

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ALPHA® EF-6000
No-Clean Flux for Lead-Free & Sn-Pb Wave Soldering

TOUCH-UP/REWORK - Use of the ALPHA Cleanline Write Flux Applicator with ALPHA NR-205 flux and
ALPHA Telecore Series cored solder is recommended for hand soldering applications.

TECHNICAL DATA

Item Typical Values Item Typical Values

Clear, pale-yellow
Appearance Pounds Per Gallon 6.8
liquid
Solids Content, wt/wt 2.2 % Recommended Thinner ALPHA 425
Specific Gravity @ Shelf Life (from Date of
0.790 ± 0.003 360 days
25°C(77°F) Mfg.)
IPC J-STD-004
Acid Number (mg KOH/g) 17.5 ± 1.0 ORL0
Designation
pH (5% aqueous solution) 3.3 Packaging Size 1, 5 & 55 Gallons
Flash Point (T.C.C.) 53°F (12°C)

CORROSION & ELECTRICAL TESTING

CORROSION TESTING
Test Requirements for ORL0 Results
Silver Chromate Paper Test No Detection of Halide PASS
Copper Mirror Test No Complete Removal of Copper PASS
IPC Copper Corrosion Test No evidence of corrosion PASS

J-STD-004 SURFACE INSULATION RESISTANCE

Test Condition Requirements Results
IPC J-STD-004A Comb-Down – Un-cleaned 1.0 x 108 minimum 1.7 x 1010
IPC-J-STD-004A Comb-Up – Un-cleaned 1.0 x 108 minimum 1.5 x 1010
IPC J-STD-004A Control Board 1.0 x 109 minimum 2.7 x 1010
IPC Test Condition (per J-STD-004A): 85°C/85%RH/7days/-50V, measurement @ 100V/IPC B-24 board (0.4mm lines, 0.5mm
spacing). All values in ohms.

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ALPHA® EF-6000
No-Clean Flux for Lead-Free & Sn-Pb Wave Soldering

BELLCORE ELECTROMIGRATION
Test Condition SIR (Initial) SIR (Final) Requirement Result
Bellcore "Comb-
7.8 x 109 1.7 x 1011 SIR (Initial)/SIR (Final) < 10 PASS
Up" Un-cleaned
Bellcore "Comb-
1.6 x 1010 1.4 x 1011 SIR (Initial)/SIR (Final) < 10 PASS
Down" Un-cleaned
Bellcore Test Condition (per GR 78-CORE, Issue 1): 65°C/85%RH/500 Hours/10V, measurement @ 100V/IPC B-25 B Pattern
(12.5 mil lines, 12.5 mil spacing). All values in ohms.

SAFETY

Inhalation of the flux solvent and volatilized activator fumes, which are generated at soldering
temperatures, may cause headaches, dizziness and nausea. Suitable fume extraction equipment should
be used to remove the flux from the work area. An exhaust at the exit end of the wave solder machine
may also be needed to completely capture the fumes. Observe precautions during handling and use.
Suitable protective clothing should be worn to prevent the material from coming in contact with skin and
eyes.

ALPHA EF-6000 flux contains a highly flammable solvent with a flash point of 53°F (12°C). The flux must
not be used near open flames or near non-flameproof electrical equipment. Consult the SDS for all safety
information. The most recent version of the SDS is available from AlphaAssembly.com.

CONTACT INFORMATION

To confirm this is the most recent issue, please contact Alpha Assembly Solutions
AlphaAssembly.com

North America Europe Asia

300 Atrium Drive Unit 2, Genesis Business Park 8/F., Paul Y. Centre
Somerset, NJ 08873, USA Albert Drive 51 Hung To Road
800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong
01483.758400 Kong
852.3190.3100
Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE. Emergency directory assistance Chemtrec 1 - 800 - 424 - 9300.

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OR
MERCHANTABILITY OR WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express,
implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to
replace any product defective at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct or consequential, arising out of the inability
to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if products are
used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product failure and of all direct, indirect and consequential damages that may
result from use of the products under conditions, and agrees to exonerate, indemnify and hold harmless MacDermid Incorporated therefrom. No suggestion for product use nor anything
contained herein shall be construed as a recommendation to use any product in infringement of any patent rights, and seller and manufacturer assume no responsibility or liability for any such
infringement.

® Registered Trademark of MacDermid Performance Solutions. ™ Trademark of MacDermid Performance Solutions.

© Platform Specialty Products Corporation and its subsidiaries 2016.

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