SMD resistor packages

SMD resistors come in a variety of packages. As the technology has moved forward so the size
of the resistor packages has fallen. The main packages with their sizes are summarised below:

 1812 - 4.6 mm x 3.0 mm (0.18" � 0.12")

 1206 - 3.0 mm x 1.5 mm (0.12" � 0.06")
 0805 - 2.0 mm x 1.3 mm (0.08" � 0.05")
 0603 - 1.5 mm x 0.8 mm (0.06" � 0.03")
 0402 - 1.0 mm x 0.5 mm (0.04" � 0.02")
 0201 - 0.6 mm x 0.3 mm (0.02" � 0.01")

It can be seen from the dimensions in Imperial measurements, that the package names
correspond to the dimensions in hundredths of an inch. This an SMD resistor with an 0805
package measures 0.08 by 0.05 inches.

Other sizes including 1210, 2010, 2512, 3616, and 4022 are available for some high power or
specialist SMD resistor applications.

Specifications

SMD resistors are manufactured by a number of different companies. Accordingly the

specifications vary from one manufacturer to the next. It is therefore necessary to look at the
manufacturers rating for a specific SMD resistor before deciding upon exactly what is required.
However it is possible to make some generalisations about the ratings that might be anticipated.

Power rating:     The power rating needs careful consideration in any design. For designs using
SMDs the levels of power that can be dissipated are smaller than those for circuits using wire
ended components. As a guide typical power ratings for some of the more popular SMD resistor
sizes are given below. These can only be taken as a guide because they may vary.

 1206:       1/8 watt

 0805:       1/10 watt
 0603:       1/16 watt

Some manufacturers will quote higher power levels than these. The figures given are
conservative.

Tolerance:     In view of the fact that SMD resistors are manufactured using metal oxide film
they available in relative close tolerance values. Normally 5%, 2%, and 1% are widely available.
For specialist applications 0.5% and 0.1% values may be obtained.

Temperature coefficient:     Again the use of metal oxide film enables these SMD resistors to
provide a good temperature coefficient. Values of 25, 50 and 100 ppm / C are available.
Ceramic SMD capacitors

The ceramic SMD capacitors form the majority of SMD capacitors that are used and
manufactured. They are normally contained in the same type of packages used for resistors.

 1812 - 4.6 mm � 3.0 mm (0.18" � 0.12")

 1206 - 3.0 mm � 1.5 mm (0.12" � 0.06")
 0805 - 2.0 mm � 1.3 mm (0.08" � 0.05")
 0603 - 1.5 mm � 0.8 mm (0.06" � 0.03")
 0402 - 1.0 mm � 0.5 mm (0.04" � 0.02")
 0201 - 0.6 mm � 0.3 mm (0.02" � 0.01")

Construction:   The SMD capacitor consists of a rectangular block of ceramic dielectric in which
a number of interleaved precious metal electrodes are contained. This structure gives rise to a
high capacitance per unit volume. The inner electrodes are connected to the two terminations,
either by silver palladium (AgPd) alloy in the ratio 65 : 35, or silver dipped with a barrier layer
of plated nickel and finally covered with a layer of plated tin (NiSn).

Ceramic capacitor manufacture:   The raw materials for the dielectric are finely milled and
carefully mixed. Then they are heated to temperatures between 1100 and 1300�C to achieve the
required chemical composition. The resultant mass is reground and additional materials added to
provide the required electric properties.

The next stage in the process is to mix the finely ground material with a solvent and binding
additive. This enables thin sheets to be made by casting or rolling.

For multilayer capacitors electrode material is printed on the sheets and after stacking and
pressing of the sheets co-fired with the ceramic compact at temperatures between 1000 and
1400�C. The totally enclosed electrodes of a multilayer capacitor guarantee good life test
behaviour as well.

Tantalum SMD capacitors

Tantalum SMD capacitors are widely used to provide levels of capacitance that are higher than
those that can be achieved when using ceramic capacitors. As a result of the different
construction and requirements for tantalum SMT capacitors, there are some different packages
that are used for them. These conform to EIA specifications.

 Size A   3.2 mm � 1.6 mm � 1.6 mm (EIA 3216-18)

 Size B   3.5 mm � 2.8 mm � 1.9 mm (EIA 3528-21)
 Size C   6.0 mm � 3.2 mm � 2.2 mm (EIA 6032-28)
 Size D   7.3 mm � 4.3 mm � 2.4 mm (EIA 7343-31)
  Size E   7.3 mm � 4.3 mm � 4.1 mm (EIA 7343-43)

Electrolytic SMD capacitors

Electrolytic capacitors are now being used increasingly in SMD designs. Their very high levels
of capacitance combined with their low cost make them particularly useful in many areas.

Often SMD electrolytic capacitors are marked with the value and working voltage. There are two
basic methods used. One is to include their value in microfarads (m F), and another is to use a
code. Using the first method a marking of 33 6V would indicate a 33 F capacitor with a
working voltage of 6 volts. An alternative code system employs a letter followed by three
figures. The letter indicates the working voltage as defined in the table below and the three
figures indicate the capacitance on picofarads. As with many other marking systems the first two
figures give the significant figures and the third, the multiplier. In this case a marking of G106
would indicate a working voltage of 4 volts and a capacitance 0f 10 times 10^6 picofarads. This
works out to be 10 F

Letter Voltage
e 2.5
G 4
J 6.3
A 10
C 16
D 20
E 25
V 35
H 50
above-board profile The height that a component such as a connector stands above the
top surface of the PCB

acceptance tests A set of tests performed to determine the acceptability of a PCB.

active component An electronic component whose parametric characteristics change while

operating on an applied signal.

adhesive dam A method of controlling the flow of adhesive material on inner layers of a
multi layer board during lamination by providing an etched border of copper around the
outer edges of the conductor layers.

analogue (circuit) (USA ‘analog’) A type of circuit that deals with continuously varying
voltage or current values that represent physical quantities, and where the output varies as
a continuous function of the input, as contrasted with a digital circuit.

angle of attack The angle between the squeegee face and the stencil plane.

anti-wicking contacts Contacts on components such as connectors or switches that

prevent entry of either flux or solder up into the contacts during the process that solders the
contacts to the PCB.

aperture A predetermined shape (round, square, oblong, etc.), size (width, diameter), and
type (draw or flash) that is exposed on artwork film by a photoplotter.

aperture library A collection of standard aperture descriptions.

aperture wheel Contains a set of individual physical apertures (or software definitions of
apertures) that are specific for plotting a type or family of circuit board artworks.

aqueous cleaning A generic cleaning approach that uses water in combination with
neutralizers, saponifiers and surfactants.

archiving data The process of relocating all the design and data files required to produce
an end product into a retrievable storage area.

array A group of components arranged in rows and columns.

artwork (master) A photoprocessing tool used to fabricate a printed circuit board that
consists of an accurately scaled image of the required pattern on the surface of a stable
transparent film base.

Confusingly, as well as describing the photoplotted film, the term ‘artwork’ may refer just to
the Gerber files used to drive the photoplotter, but is also often used to include other
documentation used by a board house to manufacture a bare printed circuit board such as
the NC drill file. See master artwork set.

The artwork description should include specifications for quality and orientation which will
affect subsequent photoprocessing operations and/or usability .

aspect ratio The ratio of the length or depth of a hole to its preplated diameter. Often used
for the ratio of the thickness of the board to the diameter of its smallest via hole. Holes with
high aspect ratios are difficult both to drill and plate and may be susceptible to cracking.

assembly A number of parts or subassemblies or any combination thereof that are joined
together.

assembly drawing A document that shows the physical relation of a combination of parts
and subassemblies that form a higher order assembly, giving both the locations of
components and their reference designators. See Bill of Materials.

atmospheric variations Changes in operational or storage conditions. See ambient.

automated assembly Automatic component placement and attachment to a printed circuit

board.

automated optical inspection (AOI) A vision system that captures and stores an image
and compares it to an expected image and/or a set of design rules, in order to detect errors
on printed circuit artwork, boards, or assemblies.

autoplacement The activity by CAD software that automatically places components on a

circuit board layout based on preset rules.

autorouter CAD layout software that automatically determines the placement of

interconnections on a circuit board based upon predetermined design rules.

axial lead A lead wire extending from a component or module body along its longitudinal
axis.

bare board test(ing) Tests of electrical connectivity and isolation carried out by the
manufacturer on the unassembled (unpopulated) circuit board. In the case of high
frequency boards, can sometimes include impedance control measurements.

base (or basis) metal (or material) A metal or material upon which coatings are
deposited.

base laminate The insulating support material (most usually epoxy-glass) used in the
fabrication of printed wiring boards. (Also see ‘substrate’)

base substrate The insulating material that forms the support for conductor patterns and
components.

BAT: Best Available Techniques, defined under Integrated Pollution Prevention and Control
(IPPC). Note that BAT has many more cost and implementation issues than its predecessor
BATNEEC.
BATNEEC: Best Available Techniques Not Entailing Excessive Cost, defined under
Integrated Pollution Control (IPC).

bill of material(s) (‘BOM’) A document that lists all electronic, electrical, and mechanical
components, and supporting materials that are required to manufacture an assembly, and
gives the quantities used. The BOM will use reference designators that uniquely identify
each component and material, including associated part/find numbers. A BOM is used for
part procurement and, in conjunction with the assembly drawing(s), shows which parts are
positioned where on the assembly.

binary alloy Alloy consisting of two metals (e.g. tin/lead or tin/silver).

blind via A via that extends from an outer surface of a multilayer circuit board to at least
one of the inner layers, but does not go completely through the board.

blistering (blister) A localised swelling and separation between any of the layers of a
laminated base material or between base material and the metal cladding. (A form of
‘delamination’)

blowhole A large void in the solder connection created by outgassing during the soldering
process. Volatile contaminants, air or gas trapped in the solder expand with the application
of heat, leaving holes in the solder joint.

board construction Defines the types and dimensions of materials, the layering sequence
of the cross-sectional structure of a circuit board, and its finished thickness.

board detail drawing A drawing that provides and describes all the requirements for
fabricating a bare circuit board.

board extractor A device that is used as a means of extracting a PCA from its mating
connector without damage to its electrical components. It can be permanently mounted on
the circuit board or provided as external tool.

board profiling (also board routing process) A machining process for defining the
outline of a circuit board. Pin routing uses a pin-guided template for manually profiling
boards; NC routing utilizes programmable equipment to define a board profile. Both
methods use cutters similar to end mills.

board-to-board stacking height The distance between the two inside faces of parallel
mounted PCBs.

board thickness The overall thickness of the base laminate and the conductive pattern,
usually measured at the gold fingers.

body The central portion of an electronic component, excluding its pins or leads.

BOM [pronounced ‘bomb’] see Bill of Materials.

bond strength The force required to separate a layer of material from the adjoining base.
It is a measure of the structural effectiveness of adhesives, welds, solders, glues, or of the
chemical bond formed between materials, when subjected to stress loading (shear, tension,
or compression).

bonding agent An adhesive for bonding individual layers to form a multilayer laminate.

bonding layer An adhesive layer for laminating the separate substrates of a multilayer
board.

bottom side The secondary side of a PCA, opposite the primary side. The bottom side of a
PCA having some or all through-hole components (Assembly Types II and III) is the side
accepting solder on the component leads. (Also referred to as ‘solder side’, ‘circuitry side’ or
‘conductor side’)

buried via A via that makes a circuit connection between internal layers of a multilayer
board, but does not extend to either external surface of the board.

bypass capacitor Minimizes the effects of current variations in a power circuit caused by
switching transients generated during circuit operation.

CAD (Computer-Aided Design) A system where engineers create a design and see the
proposed product in front of them on a graphics screen or in the form of a computer
printout or plot. In electronics, the result would be a printed circuit layout. They may assist
in performing all steps in artwork generation.

CAD/CAM A concatenation of the terms CAD and CAM. CAD/CAM systems are computer-
aided design/manufacturing methods that translate circuit designs into actual products.

CAE = Computer-Aided Engineering ( Computer Assisted Engineering) A software

package used as an automated tool for circuit design and schematic generation.

CAF = Conductive Anodic Filament. Metal migration between two conductors or the
dendritic growth seen under Temperature, Humidity and Bias test.

CAM = Computer-Aided Manufacturing system A system used to generate data for

fabricating circuit boards and manufacturing finished assemblies. CAM files are data files
used directly in the manufacture of printed wiring. Typically this data is manipulated by the
fabricator to meet production requirements (for example for panelisation) and to ensure the
intended result is achieved.

Some design software companies refer to all plotter or printer files as CAM files, although
some of the plots may be check plots which are not used in manufacture.

capture Extract information automatically through the use of software, as opposed to hand-
entering of data into a computer file.

card another name for a printed circuit board.

card-edge connector A connector which is fabricated as an integral portion of a printed
circuit board along part of its edge. Often employed to enable a daughter or add-on card to
be plugged directly into another much larger printed board, the motherboard or back-plane.
See finger.

carriers Holding devices for PCBs and other parts to facilitate handling during component
placement, soldering and other processing.

castellation Metallised semicircular radial features on the edges of LCCCs that interconnect
conducting surfaces. Castellations typically are found on all four edges of a leadless chip
carrier. Each lies within the termination area for direct attachment to the land patterns.

CBGA = Ceramic Ball Grid Array (also Column BGA) Less common than the standard ball
grid array, which uses balls of eutectic solder, CBGAs contacts are columns of a high-
melting solder. When reflowed in contact with eutectic solder on the substrate, only a small
portion of the column melts into the joint, so that the package is held off the substrate. The
resultsing separation gives a degree of flexibility which allows for differences in CTE
between the ceramic body of the CBGA and the FR4 board.

chip carrier A low profile surface-mount component package, usually square, whose
conductor chip cavity or mounting area is a large fraction of the package size and whose
external connections are usually on all four sides of the package. It may be leaded or
leadless.

chip component Generic term for any two-terminal leadless box-shaped surface mount
passive device, such as a resistor or capacitor. Also known as ‘discretes.’

chip on board see COB

chip package A carrier in which an IC chip is mounted. The package interconnects the chip
to the outside world and is sealed to provide environmental protection for the chip.

circuit (circuitry) The interconnection of a number of electrical elements and/or devices to

perform a desired electrical function.

circuit coupling The creation of a false signal in a circuit by a signal in another circuit. This
is usually caused by radiated energy between adjacent conductors on the same or different
layers.

circuit density The proportion of circuit elements and interconnections required for
performing an electrical function to the allotted area of a circuit board.

circuit symbol Used in a schematic diagram as a graphic representation of a specific type

of electronic device.

clad A copper object on a printed circuit board. Specifying certain text items for a board to
be ‘in clad’ means that the text should be made of copper, not silkscreen.

cladding A thin layer of metal foil bonded to a substrate to form the conductive PCB
pattern.
clamshell fixture An in-circuit test fixture that permits simultaneous probing of both sides
of a board or assembly. The top probe section is hinged to allow board insertion.

clinching The process of forming or bending a component lead following its insertion
through a hole in a circuit board. The main purpose is to secure the part mechanically
during the soldering process.

closed bottom contact The back of the contact is closed to prevent solder ingress, usually
this applies to PCB and solder tail contacts

COB = Chip-On-Board Generic term for any component assembly technology in which an
unpackaged silicon die is mounted directly on the substrate, instead of first being packaged.
Connections from die to the pads on the board can be made by wire bonding, tape
automated bonding (TAB), or flip-chip bonding. For commercial use the die is protected by a
plastic ‘glob top’, usually black in colour.

component mounting orientation The direction in which the components on a printed

board or other assembly are lined up, with respect to one another, to the solder wave, and
to the board.

component side The primary side of a printed board upon which the major of component
parts are mounted. Where size allows, the component side may be printed with the ‘legend’.
(Also see ‘ topside’)

component termination This term can refer to a lead, but is more commonly a description
applied to the interface between the body of the component and the board in a leadless
device. Termination materials need to adhere to the component, forming a reliable
connection, and be wettable by (but not soluble in) the solder used for attachment to the
board. Typically, for a chip component, this termination will be made of several layers, with
a ‘solder barrier’ (a material insoluble in solder) underlying a (usually thinner) layer of
something highly solderable.

conductive ink The paste used on thick film materials to form the circuit pattern, usually
containing metal, metal oxide and solvent.

conductor (conductive) pattern The configuration or design of the conductive material

on the base laminate, including conductors, lands, vias, heat-sinks and passive components
when these are an integral part of the manufacturing process.

conductor A current-carrying interconnection path. A single conductive path in a

conductive pattern. Also known as a ‘trace’.

conductor layer The total conductor pattern formed on one side of a single layer of
laminate material.

conductor pattern The configuration or design of the conductive material on one side of a
single layer of base material.

conductor separation Permanent separation of the printed wiring conductive foil from the
base laminate. (Also see ‘ delamination’)
conductor side The side of a printed board containing the conductors. Commonly referred
to as the ‘solder side’ when opposite through-hole components. (Also see ‘bottom side’)

configuration control A method for ensuring that a specific version of data and drawings
defines the correct requirements and physical description of the intended version of a PCA,
and that the actual hardware conforms in all respects to the data and drawings.

conformal coating An insulating protective coating applied to the completed board

assembly, which conforms to the configuration of the objects coated and provides a barrier
against deleterious effects of their environment.

connectivity The intelligence inherent in PCB CAD software which maintains the correct
connections between pins of components as defined by the schematic.

continuity test A test for the presence of current flow between two or more interconnected
points

copper weight A measurement of the thickness of copper foil, in terms of its weight in
ounces per square foot of surface area. 1-ounce copper is nominally 35µm (0.0014 in) thick,
½-ounce copper is 18µm (0.0007 in thick.

copper-clad dielectric material The basic material used for fabricating a printed circuit
board, consisting of a flat reinforced dielectric to which is bonded copper foil on one or both
surfaces.

core A supporting plane that is internal to a packaging and interconnecting structure.

Multilayer circuit boards may contain unclad laminate cores, or special-purpose cores made
of metal (aluminium, copper) to enhance heat dissipation or for other purposes.

curing agent A chemical added to a resin to stimulate a final set or hardening.

current rating The maximum allowable continuous current that can be passed through a
component or a conductor without causing degradation of performance.

cuts Modification of a circuit board by separating conductors on an external layer to break a

circuit connection.

daughter board A PCA attached to a mother board to provide additional and/or alternate
electrical functions and capabilities.

DCA = Direct Chip Attach See Chip-On-Board.

decal A graphic software representation of a component, so named because hand tape-up

of printed circuit boards employed the use of pull-off and paste decals to represent
components. Also called a part, footprint or package. On a manufactured board the body of
a footprint is an epoxy-ink outline.

decoupling capacitor See bypass capacitor.

delamination A separation between plies within the base material, between the base
material and the conductive foil, or both. Occurs both in PCBs and chip ceramic capacitors.
design cycle The entire technical activity associated with the design fabrication, assembly,
test, and integration of a PCA

Design for Manufacture (Manufacturability) (DfM) Designing a product to be produced

in the most efficient manner possible in terms of time, cost and resources, taking into
consideration how the product will be processed, and using the existing skill base to achieve
the highest yields possible.

design qualification Verification through test and analysis that a PCA design will perform
its required operational functions.

design reviews Checkpoints established at critical points in the design process to verify
the validity of the design and its associated data and documentation, and evaluate the
producibility, testability, and projected reliability of the product.

design rules A set of layout guidelines which is used to ensure that designs meet the
criteria of electronic circuit performance, ease of board fabrication and yield/cost at
assembly, test and rework. Typically these rules will establish minimum dimensions and
spacing, and contain recommendations on good practice. Be aware that the design rules
applied by board fabricators and assemblers will vary between different companies.

design standards Layout processes, guidelines, and procedures that are widely used
throughout the industry.

desoldering methods Disassembling solder parts to repair or replace by wicking, sucking,

heat and pull, or solder extraction.

differential pair Conductors carrying sensitive signals that should generally be routed in
parallel with matched overall lengths.

digital clock lines Conductors that carry a continuous stream of uniform pulses (0s and
1s) that establish the timing of operation of associated digital circuitry.

digital signal processor An integrated circuit that electronically processes signals such as
sound, radio, and microwaves by converting them from analogue to digital signals.

digitising A method of capturing the X-Y coordinates of feature locations on a PCA layout
and converting that data to a digital format.

dimensional origin See datum intersection (origin).

dissipation factor A measure of the absorption of electromagnetic energy passing through

a dielectric material.

documentation Information for a PCB that explains the electromechanical design concept,
types and quantities of parts and materials, special instructions, and revisions. Will include a
Bill of Materials.

documentation/data release The activity that takes place following final review and
approval (signoff), when all drawings and design data are placed into a
configuration/records control system.
dolls To-scale cut-outs that represent physical parts to be mounted on a circuit board. They
are used to perform component placement during a manual layout effort.

double-sided (board) A printed board with a conductive pattern on both sides of the
board.

double-track Slang for fine line design with two traces between DIP pins.

drill data Information that specifies X-Y locations for all drilled holes, their sizes, and their
plating requirements.

drill spindle run-out The undesirable deviation from the theoretical centre of rotation of a
drill spindle due to its inherent mechanical tolerances.

drill-out A method used to modify a fabricated circuit board or assembly by drilling through
a conductor (usually internal) or plated hole to break the connection.

dry film material A photosensitive resist or solder mask material available as a film (as
opposed to a liquid) that is applied to a circuit board during fabrication, using heat and
pressure. Dry film solder mask can manage the higher resolution required for fine line
design and surface mount, but is more expensive than liquid photoimageable solder mask.

dual solder wave A wave soldering process in which an initial ‘wave’ of molten solder
covers all PCB surfaces contacted. It is followed by a second laminar or ‘flat’ wave that
serves to ‘finish’ the board by removing all solder bridges and icicles.

electroless plating A process for chemically depositing metallic material on a

nonconductive surface. It is primarily used for metallising holes in a circuit board to prepare
them for addition of electroplated metal.

electroplating ( electrolytic plating) Direct deposition of metallic materials on a surface

using an electrolytic process. It involves passing a current between an anode and a cathode
through a conductive solution containing metal ions. The conductive surface of the laminate
(circuit board) to be plated is the negative electrode (cathode).

EMI/EMC Electromagnetic interference (EMI) is the detrimental effect stray radiated

electromagnetic energy has on the performance of a circuit. Electromagnetic compatibility
(EMC) involves the control and reduction of this energy.

end-to-end design Integrating the inputs and outputs of CAE, CAD and CAM software
packages to allow design to flow smoothly in both directions with minimal manual
intervention.

In the field of board design, end-to-end design sometimes refers to only the electronic
schematic/PCB layout interface. Childers points out that this is a narrow view of the
potentialities of the concept. For example, end-to-end systems can also implement
electronic circuit simulation, parts procurement and beyond.

epoxy(epoxide) A family of thermosetting resin materials having high strength and low
shrinkage during curing; used as a coating or adhesive.
ESD = electrostatic discharge The rapid transfer of a voltage potential into a circuit or
component. Depending on its sensitivity to ESD, the overstress can permanently damage a
component.

etch-back Chemical removal of dielectric material in the barrels of holes in a multilayer

board. The purpose is to increase exposure of internal conductor areas (usually pads) to
enhance physical and electrical contact with metal to be plated in those holes.

etch (etching) Chemical removal of material, usually associated with defining conductor
patterns on a circuit board.

Excellon data format A proprietary data format structure that is used to convert physical
hole data (location, diameter, etc.) into a format that a software program can use to drive a
numerically controlled (NC) drilling machine. It is considered a de facto industry standard.

excess solder A solder connection characterised by the complete obscuring of the

connected metal surfaces or by the presence of solder beyond the connection area. The
connection appears as a rounded, piled-up, convex solder fillet, and it is impossible to
determine if a proper bond has been achieved.

fab Short for fabrication. Used both for the manufacture of printed circuit boards and
semiconductors.

(board) fabrication The bare-board manufacturing process, which begins after design but
before assembly. Individual processes include layer lamination, metal addition/subtraction,
drilling, plating, routing and cleaning.

fabrication drawing A drawing used to aid the construction of a printed board. It shows all
of the locations of the holes to be drilled, their sizes and tolerances, dimensions of the board
edges, and notes on the materials and methods to be used. Called ‘fab drawing’ for short. It
relates the board edge to at least one hole location as a reference point, so that the NC drill
file can be properly lined up.

fatigue failure Mechanical failure of a material caused by application of repeated cycles of

stress (force) and strain (movement) over a period of time. These forces may be due to
vibration or caused by changes in temperature, and in PCAs may result in cracked plated
through-holes, open solder joints, or board delamination.

fatigue resistance The ability of a solder joint to resist vibration.

feed-through A conductor that connects patterns on opposite sides of a printed circuit

board, e.g. an eyelet, plated through hole or clinched jumper wire.

feed-through via A plated-through hole in a PWB used to route a trace vertically in the
board, that is, from one layer to another.

fine-line design Printed circuit design permitting two (rarely three) traces between
adjacent DIP pins. It entails the use of a either dry film solder mask or liquid
photoimageable solder mask, both of which are more accurate than wet solder mask.
fine-pitch A term which always refers to the distance between lead centres of device
packages, but whose value depends on the date of the definition. Previously lead pitches
below 1.27mm (0.050in) were regarded as fine pitch; in 2002, given improvements in
printing and paste technology, the frontier probably lies at 0.63mm (0.025in).

flex circuit Printed circuitry that utilizes flexible rather than rigid laminate material.

footprint 1) The pattern and space on a board taken up by a component. 2) The hole, pad
and conductor pattern associated with a specific electronic component package
configuration. A non-preferred term for land pattern. See also decal

Gerber data (Gerber file) Named after Gerber Scientific Co., who made the original vector
photoplotter. A data format that converts physical feature information (location, shape etc.)
into data used to control a numerically controlled photoplotter that produces printed circuit
artwork.

ground plane A conductor layer that covers all or a large portion of a board (with suitable
clearances around through-holes and vias), and which is used as a common reference point
for circuit returns, shielding or heat sinks. The similar power plane distributes power to
circuitry on the board. Both ground and power planes may also be used as an
electromagnetic shield and as a reference plane for high-frequency (stripline) circuitry.

grounding As used by the connector industry, sending current flow to earth in the case of a
short circuit.

heat sink A device that aids in the removal of heat from electronic equipment, and is
particularly important when heat is generated in a small area, or when devices such as
power transistors, rectifiers and microprocessors are operated. Heat sinks may be added to
components, or to complete assemblies. Typically they are made of metal with high thermal
conductivity, and the removal of heat may be assisted by built-in fans as well as depending
on natural or forced convection.

high-speed circuitry

hi-pot test The definition is a generic term for tests at ‘high potential’, intended to provide
assurance that a circuit will operate safely, with the required isolation between components.
Whilst the bottom limit for a hi-pot test is 40 volts, many similar tests are carried out at
substantially higher voltages. Always with these tests, you should take precautions to
protect the operator from exposure to high voltage.

hole breakout A condition in which a hole is not completely surrounded by its associated
land.

hybrid (micro)circuit A generic term for a range of technologies which integrate passive
and active components. Most commonly refers to ceramic substrates patterned with
precious metal interconnect and resistor materials, on which chip ceramic capacitors and
integrated circuits are soldered, resin bonded and/or wire bonded. A frequent base for Chip-
On-Board assembly.

insulator A non-metallic material designed to prevent current flow.

integration The marriage of an operational PCA with the system or product with which it is
to function.

intermetallic layer Refers to the actual bond formed in soldering from the interdiffusion of
two or more metals (e.g. copper/tin). The intermetallic layer is the most brittle part of the
joint, and increases in depth in logarithmic proportion to both time and temperature during
the soldering process. (Staying on the joint twice as long, or with an iron twice as hot,
causes the intermetallic layer to become 10 times thicker.) The ideal intermetallic layer is
continuous but thin.

internal layer A conductive pattern which is contained entirely within a multi-layer printed
board, performing an interconnection function which is not generally visible from the
surface. Defects in metallisation may result in open-circuit or short-circuit conditions, so
internal layers are always subject to rigorous inspection before laminating.

IPC Until 1999 IPC was the Institute for Interconnecting and Packaging Electronic Circuits.
The new name is accompanied with an identity statement – Association Connecting
Electronics Industries. IPC is a leading industry association and the final US authority on
how to design and manufacture printed wiring. IPC develops and distributes standards, as
well as other information of value to designers, users, suppliers, and fabricators.

jumper A component or wire that forms a discrete electrical connection between conductive
areas on the external surface of a circuit board. Some jumpers are added during normal
assembly, through-hole components using formed wire, and surface mount assemblies
using zero-ohm chip resistors. Others are pluggable components.

Another use of the term ‘jumper’ is for an electrical connection which is added after
fabrication, usually to correct errors or to enable modification of circuitry. Such jumpers are
typically made of wire (exceptionally of flexible circuit board), soldered to the surface, and
thus referred to as “wire adds”. In order to ensure a reliable joint, this repair operation has
to be conducted with extreme care, An alternative way of making jumpers uses wire-
wrapping around terminals

junction temperature The operating temperature of the active element of a circuit

component.

keep-out area A region of a circuit board where specific items such as components,
conductors and holes cannot be placed during layout. The restriction may be as a result of
electrical constraints (such as clearance for high voltage), mechanical constraints (such as
requirement to fit boards close to each other), or process reasons (where clearance is
needed for the correct operation of assembly equipment).

laminate A lamina is a ‘thin plate or scale’; a laminate is a composite built by laminating a

number of (usually thin) layers of material. A PCB is a laminate both because it combines a
number of layers of copper and insulator and because the base material is itself a laminate
of epoxide resin and glass fibre. See copper-clad dielectric material.

lamination The process of fabricating a circuit board by using heat and pressure to glue
together a number of interconnection layers to form a single multilayer assembly.
land A portion of a conductive pattern usually, but not exclusively, used for the connection
and/or attachment of a component termination (usually by soldering), or as a contact point
for a test probe. Also referred to as ‘pad’.

land pattern The conductive pattern on a board which is intended for the attachment and
electrical connection of a compatible surface mount device. Preferred term for footprint.

laser photoplotter (also ‘laser plotter’) A photoplotter which simulates a vector

photoplotter by using software to create a raster image of the individual objects in a CAD
database, then plotting the image as a series of lines of dots at very fine resolution. A laser
photoplotter is capable of more accurate and consistent plots than a vector photoplotter.

layout Document or electronic equivalent that shows the physical size and location of
electronic and mechanical components on a circuit board, and the routing of conductors that
electrically interconnect the components. Information is provided in sufficient detail to allow
the preparation of documentation and artwork for fabrication, assembly and test of a PCA.

layout grid A lattice of orthogonal lines spaced in standard increments (typically 25 or 50

mils). Components, plated and non-plated holes, surface mount land patterns, and other
features are usually located at the intersection of these grid lines during the layout of a
circuit board.

layout rules Rules established, based on the design type and performance requirements,
that determine component placement, conductor routing, layer stack-up, etc.

legend (marking) A format of letters, numbers, symbols, and/or patterns on the printed
board that are primarily used to identify component locations and orientation for
convenience in assembly and replacement operations. Also referred to as ‘nomenclature’,
‘screen print’ or silk screen’

loads (noun) Digital devices attached to a net that will have their logic levels changed by a
driver on that net.

LPI = liquid photoimageable solder mask A mask sprayed on using photographic

imaging techniques to control deposition. It is the most accurate method of mask
application and results in a thinner mask than dry film solder mask. It is often preferred for
dense SMT.

manufacturer’s data specification sheet It provides electrical and mechanical data

about a part and is used as a source of information for library inputs, design activities, and
material procurement.

manufacturing data Information consisting of photoplotting files, drill files, pick-and-place

files, bare and loaded board testing files, support drawings, and bills of materials required to
do the actual fabrication, assembly and test of a PCA.

manufacturing engineering The technical organization that is usually responsible for

planning and implementing PCA production activities.
markings Information imprinted on parts and circuit boards, such as reference
designations, part or serial numbers, revision level, orientation or polarization symbols, bar
codes, and electrostatic discharge (ESD) sensitivity.

mask A chrome and glass pattern for a layer of the wafer used in the photolithography
process for silicon device manufacture.

mass soldering The process of forming all solder joints on a PCA simultaneously (wave
soldering, dip soldering, oven reflow, vapour phase soldering).

master artwork set An accurately scaled, 1:1 pattern that is used as the source for
producing working artwork films for circuit board fabrication.

master pattern drawing A document that shows the dimensional limits or grid locations
applicable to any or all parts of the circuit board. This also includes the arrangements of
conductive and nonconductive patterns or elements, the size, type, and location of holes,
and other information necessary to describe the product for fabrication.

material panel Laminate, prepreg, and copper foil materials used for manufacturing circuit
boards that are produced in standard sheet or panel sizes.

mixed analogue/digital An integrated circuit or PCA that contains both analogue and
digital circuitry.

mixed technology When both through-hole and surface-mounting component types are
used on the same assembly

multilayer (printed circuit board) A PCB manufactured from (normally rigid) base
material upon which completely processed printed wiring has been formed on more than
two layers, each separated by insulating materials, and bonded together. Internal layers are
connected to the outer layers by plated via holes.

NC drill Numeric Control drill machine. A machine used to drill the holes in a printed board
at exact locations, which are specified in a data file

NC drill file A text file which tells an NC drill where to drill its holes.

NC (Numeric Control) equipment Any machine whose activity is commanded by

instructions that are input to a programmable controller.

NC fabrication equipment Numerically controlled machine tools such as routers and

drilling machines.

net An independent set of circuit nodes on a schematic that are connected together to
define an isolated circuit. Each net is given a unique (alphanumeric) name to differentiate it
from the other nets in the schematic.

net list An alphanumeric listing of symbols or parts and their connection points which are
logically connected in each net of a circuit. A net list can be ‘captured’ (extracted
electronically on a computer) from a properly prepared CAE schematic.
non-functional pad A land on an internal or external layer that is not connected to an
active conductive pattern on that layer.

non-recurring cost The one-time (hopefully!) cost of design and development activities
prior to starting production of a PCA.

off-grid Circuit board features that are not located on a grid intersection.

Omegameter An instrument that measures ionic residues on PCBs by immersing an

assembly into a water/alcohol mixture having a known high resistivity, and measuring and
recording, over a specified period, the drop in resistivity resulting from ionic residues going
into solution.

overstressed Material or component exposed to operating conditions beyond specified

limits.

panel Refers to the rectangular or square sheet of metal-clad base laminate from which
boards are fabricated. A common panel size is 12in by 18in, of which 11in by 17in is
available for printed circuitry.

Where the panel contains a number of small circuit boards or boards with irregular outlines,
as a means of standardising on board size to reduce the cost of product changeover, and to
make the panel easy to handle, the term ‘panel’ is used to differentiate the original sheet
from the individual circuit board(s) from which it is composed.

panel plating The process of electroplating copper on all conductive surfaces and holes of a
circuit board. A circuit is defined by applying a resist pattern to the plated surfaces and
etching away all copper not covered by resist.

panelisation The placement of multiple patterns on a single panel, so that they may be
processed simultaneously. Also used for the lay-up of multiple modules into a sub-panel, so
that these can be assembled as a unit.

passive component A part that exhibits a fixed or controlled value: and performs an
elementary function in a circuit, such as a resistor, capacitor, inductor or conductor.

PCA = Printed Circuit Assembly An assembly designed to perform a specific function,

consisting of a printed circuit board to which separately manufactured electrical,
electromechanical and mechanical component parts have been added.

PCB = Printed Circuit (Board) The generic term for completely processed ‘printed wiring’,
where predetermined conductive patterns are used to interconnect electronic components
on a common insulating base. It includes single-sided, double-sided and multilayer boards
made with rigid, flexible and rigid-flex materials, but the most usual PCB is a substrate of
copper-clad epoxy-glass laminate material which has been etched to form a pattern of
conductive traces. More correctly, but less usually, referred to as a ‘Printed Wiring Board’
(PWB). Especially within the computer industry, the term is also loosely applied to a board
onto which semiconductor components are connected, although this is properly called a
Printed Circuit Assembly (PCA).
PCB database All of the data fundamental to a PCB design, stored as one or more files on
a computer.

PCB design 1) The creation of artwork for the manufacture of bare PCBs. 2) The artwork so
created. 3) A computer database used to generate such artwork as data files (CAM files).
Also called ‘PCB layout’.