Ug850 zc702 Eval BD PDF

ZC702 Evaluation Board
for the Zynq-7000

XC7Z020 SoC
User Guide
UG850 (v1.7) March 27, 2019

Please Read: Important Legal Notices
The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum
extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES
AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY,
NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including
negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with,
the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage
(including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such
damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. Xilinx assumes no obligation to correct
any errors contained in the Materials or to notify you of updates to the Materials or to product specifications. You may not reproduce,
modify, distribute, or publicly display the Materials without prior written consent. Certain products are subject to the terms and conditions
of Xilinx’s limited warranty, please refer to Xilinx’s Terms of Sale which can be viewed at https://www.xilinx.com/legal.htm#tos; IP cores may
be subject to warranty and support terms contained in a license issued to you by Xilinx. Xilinx products are not designed or intended to be
fail-safe or for use in any application requiring fail-safe performance; you assume sole risk and liability for use of Xilinx products in such
critical applications, please refer to Xilinx’s Terms of Sale which can be viewed at https://www.xilinx.com/legal.htm#tos.
AUTOMOTIVE APPLICATIONS DISCLAIMER
AUTOMOTIVE PRODUCTS (IDENTIFIED AS “XA” IN THE PART NUMBER) ARE NOT WARRANTED FOR USE IN THE DEPLOYMENT OF AIRBAGS
OR FOR USE IN APPLICATIONS THAT AFFECT CONTROL OF A VEHICLE (“SAFETY APPLICATION”) UNLESS THERE IS A SAFETY CONCEPT OR
REDUNDANCY FEATURE CONSISTENT WITH THE ISO 26262 AUTOMOTIVE SAFETY STANDARD (“SAFETY DESIGN”). CUSTOMER SHALL, PRIOR
TO USING OR DISTRIBUTING ANY SYSTEMS THAT INCORPORATE PRODUCTS, THOROUGHLY TEST SUCH SYSTEMS FOR SAFETY PURPOSES.
USE OF PRODUCTS IN A SAFETY APPLICATION WITHOUT A SAFETY DESIGN IS FULLY AT THE RISK OF CUSTOMER, SUBJECT ONLY TO
APPLICABLE LAWS AND REGULATIONS GOVERNING LIMITATIONS ON PRODUCT LIABILITY.
© Copyright 2012–2019 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands
included herein are trademarks of Xilinx in the United States and other countries. Arm is a registered trademark of Arm in the EU and other
countries. All other trademarks are the property of their respective owners.
Revision History
The following table shows the revision history for this document.
Date Version Revision

05/24/2012 1.0 Initial Xilinx release.
10/08/2012 1.1 The board photo in Figure 1-2 was updated. Table 1-2, Switch SW16 Configuration
Option Settings was added. The part number in Quad-SPI Flash Memory changed
to N25Q128A13ESF40F. In Table 1-6, the J35 shunt controls OTG and Device mode.
The frequency jitter in System Clock changed from 20 ppm to 50 ppm. The action
description under Program_B Pushbutton changed. The 34 differential user-defined
signals are defined as 34 LA pairs, LA00–LA33, in LPC Connectors J3 and J4. In the
same section, 34 differential user-defined pairs changed to 68 single-ended or 34
differential user-defined signals. Appendix E, Regulatory and Compliance
Information now includes a link to the Declaration of Conformity and markings for
waste electrical and electronic equipment (WEEE), restriction of hazardous
substances (RoHS), and CE compliance.
ZC702 Board User Guide www.xilinx.com 2

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04/04/2013 1.2 Chapter 1, ZC702 Evaluation Board Features: Marvell 88E1111 was changed to
Marvell 88E1116R throughout the document. The bullet just before Block Diagram,
page 10 changed from PL JTAG header to PS JTAG header. In Table 1-1, callout 3,
PC28F00AG18FE StrataFlash memory changed to 128 Mb, N25Q128A11ESF40G. In
callout 9, Marvell M88E1116R-BAB1C000 changed to 88E1116RA0-NNC1C000.
Callout 30 for J59 and 31 for J60 were added. The Zynq-7000 XC7Z020 SoC, page 14
description for callout 1 changed. Callout 29 added a link to Table 1-2. Table 1-2
was removed because it is a duplicate of Table 1-10. Above Table 1-2,
“configuration option” was changed to “JTAG configuration option.” In Table 1-2,
the PLL Used mode row was removed and the default setting changed. Section
Encryption Key Backup Circuit, page 17 was added. In I/O Voltage Rails, “There are
four I/O banks available on the XC7Z020 SoC” was changed to “There are four PL
I/O banks available on the XC7Z020 SoC.” A note about DDR3 memory was added
after Table 1-4. In Quad-SPI Flash Memory and Figure 1-6, N25Q128A13ESF40F
(Micron/Numonyx) changed to N25Q128A11ESF40G. In Quad-SPI Flash Memory,
“The configuration section of UG585...” was changed to add “The configuration and
QSPI section of UG585...” JTAG information in Figure 1-10 and Table 1-10 was
updated. In Figure 1-10 pin numbers 5 and 6 are swapped and in U76, IN2 and IN1
switched places. In Table 1-10, SW10 became SW10[1:2] in the table column
heading and the default setting was added. In Processing System Clock Source,
frequency jitter changed from 20 ppm to 50 ppm. In I2C Bus, NXP semiconductor
changed to TI. Figure 1-15 is updated. R249 was added to Figure 1-17. In
Table 1-22, reference designator DS12 changed to DS14. U3 level shifter was
changed to TXS0104E in Figure 1-19 and Table 1-21. The User I/O section was
updated. Figure 1-21 added two LEDs. Table 1-23 added Net Name PS_LED1 and
PS_MIO8_LED0 and removed pin info. Section User PS Switches was added. The
Figure 1-26 title changed. A paragraph about design criteria was added to Power
Management. A paragraph about the TI Fusion Digital Power graphical user
interface precedes Table 1-30. Voltages were added to the description of U19 in
Table 1-30. The TI link on page 62 was updated.
Appendix A, Default Switch and Jumper Settings: In Table A-1, SW16 position 4
changed from right to left.
Appendix C, Xilinx Design Constraints: A reminder was added to use the latest UCF
listing. Minor changes were made to the list, and power and ground pin constraints
were removed.
Appendix D, Board Specifications: This appendix was added to the book.
Appendix E, Regulatory and Compliance Information: A link to the ZC702 board
master answer record was added.
06/04/2014 1.3 Table 1-6 USB Jumper Settings was updated to highlight default shunt positions.
GND changed to GA0 = 0 = GND in Table 1-28 and Table 1-29. The Appendix C
Master UCF Listing was replaced with the Xilinx Design Constraints (XDC) file listing.
The link in Declaration of Conformity was updated.
04/30/2015 1.4 Description added to FMC Connector JTAG Bypass. Modifications to Table 1-12,
Table 1-16, Table 1-17, Table 1-23, Table 1-25, Table 1-27, Table 1-28, and
Table 1-29. Note added to Table 1-20. Revised the PMBus Controller–Aux address
for U34 from 53 to 54 in Table 1-30. Annotations added to ZC702 Board Constraints
File Listing. Added Figure Figure A-1 to identify jumper locations referenced in
Table A-2.

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09/04/2015 1.5 Added missing symbol font to fix improperly rendered text (kW, mF) to the correct
units (kΩ, μ F) in Table 1-6, rows 3 and 4. Removed base ambiguity from PMBUS
address numbers 52, 53, and 54 by updating them according to context to 52
decimal, 53 decimal, and 54 decimal or to binary 0b0110100, 0b0110101 and
0b0110110 in Table 1-19, in Figure 1-29, in Table 1-30, in the first paragraph under
Monitoring Voltage and Current, in Table 1-31, in Table 1-32, and in Table 1-33.
01/03/2018 1.6 Fixed typographical error in Figure 1-1. Updated User PMOD GPIO Headers.
06/29/2018 1.6.1 Editorial updates only. No technical content updates.
03/27/2019 1.7 Updated Electrostatic Discharge Caution information. Updated the DDR3
Component Memory and LPC Connectors J3 and J4 sections. Updated the function
of callout 1 in Table A-2. Appendix C is renamed Xilinx Design Constraints, the
constraints file list is removed, and access instructions are added. Updated
Appendix E, Regulatory and Compliance Information. Corrected the v1.6.1 revision
history date to 06/29/2018.

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Table of Contents
Please Read: Important Legal Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Chapter 1: ZC702 Evaluation Board Features

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ZC702 Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Electrostatic Discharge Caution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Feature Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Zynq-7000 XC7Z020 SoC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Encryption Key Backup Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
I/O Voltage Rails . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
DDR3 Component Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Component Memory Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Quad-SPI Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
USB 2.0 ULPI Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
SD Card Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Programmable Logic JTAG Programming Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Programmable Logic JTAG Select Switch, JTAG Cable Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
FMC Connector JTAG Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
System Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Programmable User Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Processing System Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
10/100/1000 MHz Tri-Speed Ethernet PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Ethernet PHY Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
USB-to-UART Bridge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
HDMI Video Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Real-Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
I/O Expansion Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
High Speed CAN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Status LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Ethernet PHY User LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
User I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
User LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
User Pushbuttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
GPIO DIP Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
User PS Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

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User PMOD GPIO Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Power On/Off Slide Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Program_B Pushbutton . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
PS Power-On and System Reset Pushbuttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
FPGA Mezzanine (FMC) Card Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
LPC Connectors J3 and J4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
VADJ Voltage Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Monitoring Voltage and Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Cooling Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
XADC Analog-to-Digital Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Appendix A: Default Switch and Jumper Settings

Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Jumpers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Appendix B: VITA 57.1 FMC Connector Pinouts
Appendix C: Xilinx Design Constraints

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Appendix D: Board Specifications

Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Appendix E: Regulatory and Compliance Information

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
CE Directives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
CE Standards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Electromagnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

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Appendix F: Additional Resources
Xilinx Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Solution Centers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

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Chapter 1
ZC702 Evaluation Board Features
Overview
The ZC702 evaluation board for the XC7Z020 SoC provides a hardware environment for
developing atnd evaluating designs targeting the Zynq® XC7Z020-1CLG484C device. The
ZC702 board provides features common to many embedded processing systems, including
DDR3 component memory, a tri-mode Ethernet PHY, general purpose I/O, and two UART
interfaces. Other features can be supported using VITA-57 FPGA mezzanine cards (FMC)
attached to either of two low pin count (LPC) FMC connectors.
ZC702 Board Features

The ZC702 board features are listed in here. Detailed information for each feature is
provided in Feature Descriptions.
• Zynq XC7Z020-1CLG484C device

• 1 GB DDR3 component memory (four 256 Mb x 8 devices)
• 128 Mb Quad SPI flash memory
• USB 2.0 ULPI (UTMI+ low pin interface) transceiver
• Secure Digital (SD) connector
• USB JTAG interface using a Digilent module
• Clock sources:
° Fixed 200 MHz LVDS oscillator (differential)
° I2C programmable LVDS oscillator (differential)
° Fixed 33.33 MHz LVCMOS oscillator (single-ended)

• Ethernet PHY RGMII interface with RJ-45 connector
• USB-to-UART bridge
• HDMI codec
• I2C bus

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Overview
• I2C bus multiplexed to:
° Si570 user clock
° ADV7511 HDMI codec
° M24C08 EEPROM (1 kB)
° 1-To-16 TCA6416APWR port expander
° RTC-8564JE real time clock
° FMC1 LPC connector
° FMC2 LPC connector
° PMBUS data/clock
• Status LEDs:
° Ethernet status
° Power good
° FPGA INIT
° FPGA DONE
• User I/O:
° Two programmable logic (PL) user pushbuttons
° PL user DIP switch (2-pole)
° Eight PL user LEDs
° Two processing system (PS) pushbuttons shared with PS 2-pole DIP switch
° Two PS user LEDs
° Dual row Pmod GPIO header
° Single row Pmod GPIO header

• SoC PS Reset Pushbuttons:
° SRST_B PS reset button
° POR_B PS reset button

• Two VITA 57.1 FMC LPC connectors
• Power on/off slide switch
• Power management with PMBus voltage and current monitoring via TI power
controllers
• Dual 12-bit 1 MSPS XADC analog-to-digital front end
• Configuration options:

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Overview
° Quad SPI flash memory
° USB JTAG configuration port (Digilent module)
° Platform cable header JTAG configuration port
° 20-pin PL PJTAG header
° 20-pin PS JTAG header
Block Diagram
The ZC702 board block diagram is shown in Figure 1-1.
X-Ref Target - Figure 1-1
Quad SPI JTAG Module DDR3 Memory Clock and JTAG Header USB UART
Flash Memory and 4 x 256 Mb x 8 Reset/POR
Connector SDRAM Pushbuttons
Page 20 Page 15 Pages 16-19 Page 14 Page 15 Page 36
CAN Bus ARM PJTAG

Header
Processing
Page 21 System Page 35
SD Card Switches
Connector LEDs and
Pushbuttons
Page 22 U1 Page 34
Zynq-7000 SoC
FMC1 LPC I2C
Connector XC7Z020-1CLG484C Real Time
Clock
Page 23 Page 33
Programmable Logic
FMC2 LPC I2C Multiplexer
Connector and
I2C EEPROM
Page 24 Page 32
Mechanicals 10/100/1,000 USB 2.0 ULPI HDMI Codec Configurable XADC

Ethernet PHY Transceiver and Clocks Header
(RGMII only) and Connector Connector
Page 38 Page 26 Page 27 Page 28, 29 Page 30 Page 31
Note: Page numbers reference the page number of schematic 0381449. UG850_c1_01_062918
Figure 1-1: ZC702 Board Block Diagram

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Electrostatic Discharge Caution
Board Layout
Figure 1-2 shows the ZC702 board. Each numbered feature that is referenced in Figure 1-2
is described in Table 1-1 with a link to detailed information provided under Feature
Descriptions. Note that the image in Figure 1-2 is for reference only and might not reflect
the current revision of the board.

CAUTION! ESD can damage electronic components when they are improperly handled, and can result
in total or intermittent failures. Always follow ESD-prevention procedures when removing and
replacing components.
To prevent ESD damage:
• Use an ESD wrist or ankle strap and ensure that it makes skin contact. Connect the
equipment end of the strap to an unpainted metal surface on the chassis.
• Avoid touching the adapter against your clothing. The wrist strap protects components
from ESD on the body only.
• Handle the adapter by its bracket or edges only. Avoid touching the printed circuit
board or the connectors.
• Put the adapter down only on an antistatic surface such as the bag supplied in your kit.
• If you are returning the adapter to Xilinx Product Support, place it back in its antistatic
bag immediately.

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00
Round callout references a component 00
Square callout references a component
on the front side of the board on the back side of the board
24 24
27
26
29
3 17
5
18
19
18
30
31
1
25 25
23
20 7
14
15
2
22
13
9
10
21
12
11 4
6
28 16
UG850_c1_02_032013
Figure 1-2: ZC702 Board Component Locations
Table 1-1: ZC702 Board Component Descriptions

Schematic (1)
Reference
Callout Designator Component Description Notes 0381449 Page
Number
1 U1 Zynq-7000 XC7Z020 SoC Xilinx part number: XC7Z020-1CLG484C
2 4 each 256Mb X 8 SDRAM Micron

U66 – U69 DDR3 Component Memory, 1 GB 16 – 19
Technology Inc, MT41J256M8DA-107
3 U41 Quad-SPI Flash Memory, 128 Mb Micron N25Q128A11ESF40G 20
4 USB 2.0 ULPI Transceiver, USB Mini-B SMSC USB3320-EZK High-Speed USB
U9, J1 27
connector transceiver

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Table 1-1: ZC702 Board Component Descriptions (Cont’d)

Schematic (1)
Reference
Number
5 Molex 67840-8001 SDIO Memory card

J64 SD Card Interface connector 22
connector
6 Programmable Logic JTAG

U23 Programming Options with integrated Digilent USB JTAG Module 15
Micro-B connector
7 System Clock, 200 MHz, 2.5V LVDS

U43 SiTime SIT9102-243N25E200.0000 30
oscillator
8 Programmable User Clock and Silicon Labs SI570BAB0000544DG, default

U28, U65 30
Processing System Clock Source 156.250MHz, PS fixed 33 MHz clock
9 10/100/1000 MHz Tri-Speed Ethernet Marvell 88E1116RA0-NNC1C000, Halo

U35, P2 25 – 26
PHY, RJ45 w/magnetics HFJ11-1G01ERL
10 Ethernet PHY Clock Source,

X1 Epson MA-506-25.000m-CO:ROHS 25
25.000 MHz
11 DS6 – DS8 Ethernet PHY User LEDs Ethernet PHY User LEDs, GREEN 25
12 USB-to-UART Bridge, USB Mini-B

U36, J17 Silicon Labs CP2103GM, Molex 54819-0589 36
connector
13 Analog Devices ADV7511KSTZ-P HDMI

U40, P1 HDMI Video Output transmitter, Molex 500254-1927 HDMI 28 – 29
receptacle
14 U44 I2C Bus TI PCA9548ARGER 32

15 U16 Real-Time Clock Epson RTC-8564JE:3:ROHS 33
16 I/O Expansion Header driven from I2C

J54 2-row pin header 33
Expander U80
17 DS15–DS22 User LEDs GPIO LEDs, GREEN 0603 34
18 User Pushbuttons SW5 = Left, SW7 =

SW5, SW7 E-Switch TL3301EP100QG 34
Right
19 SW12 GPIO DIP Switch 2-pole C&K SDA02H1SBD 34
20 SW11 Power On/Off Slide Switch C and K 1201M2S3AQE2 47
21 U14 High Speed CAN Transceiver NXP TJA1040T/VM 21

22 SW4 Program_B Pushbutton E-Switch TL3301EP100QG 34
23 Programmable Logic JTAG Select 2-pole C and K SDA02H1SBD

SW10, J2 15
Switch, JTAG Cable Connector MOLEX 87832-1420
24 J3, J4 FPGA Mezzanine (FMC) Card Interface Samtec ASP_134486_01 23, 24
25 Power Management (bottom and top TI UCD9248PFC in conjunction with various

U32, U33, U34 39 – 47
of board) regulators
26 J40 XADC Analog-to-Digital Converter 2X10 0.-inch male header 31
27 PS Power-On and System Reset

SW1, SW2 Panasonic EVQ-11L07K 14 35, 36
Pushbuttons
28 J63 2 x 6 0.1 inch J63 1 x 6 0.1 inch male

J62, J63 User PMOD GPIO Headers 34, 35
headers
29 CTS 206-125. See Table 1-2 for switch
SW16 5-pole SPDT MIO DIP switch 14
settings.
30 2x5 shrouded PMBus connector

J59 ASSMAN HW10G-0202 47
(bottom of board)

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Feature Descriptions
Table 1-1: ZC702 Board Component Descriptions (Cont’d)

Schematic (1)
Reference
Number
31 J60 12V power input 2x6 connector MOLEX 39-30-1060 47
Notes:
1. The ZC702 board schematics are available for download. See ZC702 Evaluation Kit.
2. Jumper locations are shown in Figure A-1.
Detailed information for each feature shown in Figure 1-2 and listed in Table 1-1 is
provided in this section.
Zynq-7000 XC7Z020 SoC

[Figure 1-2, callout 1]
The ZC702 board is populated with the Zynq-7000 XC7Z020-1CLG484C SoC. The XC7Z020
SoC consists of an SoC-style integrated processing system (PS) and programmable logic
(PL) on a single die.
The high-level block diagram is shown in Figure 1-3.

Processing Memory Programmable

System Interfaces Logic
(PS) (PL)
Application
Input Output Processor Unit (APU) Common
Peripherals Peripherals
(IOP)
Interconnect Custom
High-Bandwidth Peripherals
AMBA® AXI Interfaces
Common Accelerators
Custom Accelerators
UG850_c1_03_081612
Figure 1-3: High-Level Block Diagram

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The PS integrates two Arm® Cortex™-A9 MPCore™ application processors, AMBA®

interconnect, internal memories, external memory interfaces, and peripherals including
USB, Ethernet, SPI, SD/SDIO, I2C, CAN, UART, and GPIO. The PS runs independently of the PL
and boots at power-up or reset.
A system level block diagram is shown in Figure 1-4.

Zynq-7000 SoC
I/O
Processing System
Peripherals Clock Application Processor Unit
Reset SWDT
USB Generation
FPU and NEON Engine FPU and NEON Engine
2x USB TTC
USB ARM Cortex-A9 ARM Cortex-A9
MMU MMU
GigE 2x GigE System- CPU CPU
GigE 2x SD Level 32 KB 32 KB 32 KB 32 KB
SD Control I-Cache D-Cache I-Cache D-Cache
SDIO Regs
IRQ
SD GIC Snoop Controller, AWDT, Timer
SDIO
GPIO DMA 8 512 KB L2 Cache and Controller
MIO
UART Channel
UART
CAN
OCM 256K
CAN
Interconnect SRAM
I2C
I2C
SPI Central Memory
SPI Interconnect Interfaces
CoreSight DDR2/3,
Memory
Interfaces Components LPDDR2
Controller
SRAM/
NOR
DAP
ONFI 1.0
NAND DevC Programmable Logic to
Q-SPI Memory Interconnect
CTRL
EMIO General-Purpose DMA IRQ Config High-Performance Ports ACP

XADC
Ports Sync AES/
12-Bit ADC Programmable Logic
SHA
SelectIO
Notes: Resources
1) Arrow direction shows control (master to slave)
2) Data flows in both directions: AXI 32-Bit/64-Bit, AXI 64-Bit, AXI 32-Bit, AHB 32-Bit, APB 32-Bit, Custom
UG850_c1_04_062918
Figure 1-4: Zynq-7000 SoC Block Diagram
For additional information on Zynq-7000 SoC devices, see the Zynq-7000 SoC Data Sheet:
Overview (DS190) [Ref 1] , and the Zynq-7000 SoC Technical Reference Manual (UG585)
[Ref 2] for more information about Zynq-7000 SoC configuration options.

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Device Configuration
Zynq-7000 XC7Z020 SoC uses a multi-stage boot process that supports both a non-secure
and a secure boot. The PS is the master of the boot and configuration process. For a secure
boot, the PL must be powered on to enable the use of the security block located within the
PL, which provides 256-bit AES and SHA decryption/authentication.
The ZC702 board supports these configuration options:
• PS Configuration: Quad SPI flash memory

• PS Configuration: Processor System Boot from SD Card (J64)
• PL Configuration: USB JTAG configuration port (Digilent module)
• PL Configuration: Platform cable header J2 and flying lead header J58 JTAG
configuration ports
TIP: Designs using serial configuration based on Quad-SPI flash memory can take advantage of
low-cost commodity SPI flash memory.
The JTAG configuration option is selected by setting SW16 as shown in Table 1-2 and SW10
as described in Programmable Logic JTAG Programming Options for PL configuration
details. SW10 is callout 23 in Figure 1-2.
Table 1-2: Switch SW16 Configuration Option Settings

Boot Mode SW16.1 SW16.2 SW16.3 SW16.4 SW16.5
JTAG mode (1) 0 0 0 0 0
Independent JTAG mode 1 0 0 0 0
Quad SPI mode 0 0 0 1 0
SD mode 0 0 1 1 0
MIO configuration pin MIO2 MIO3 MIO4 MIO5 MIO6
Notes:
1. Default switch setting
Note: For more information about Zynq-7000 SoC configuration settings, see the Zynq-7000 SoC
Technical Reference Manual (UG585) [Ref 2].

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Encryption Key Backup Circuit

The XC7Z020 SoC U1 implements bitstream encryption key technology. The ZC702 board
provides the encryption key backup battery circuit shown in Figure 1-5.
NC
1
VCCAUX
D8
40V
200 mW 3
BAS40-04
2
R2
To SoC 4.70K 1%
1/16Ω
U1 Pin G9
FPGA_VBATT
(VCCBATT)
1
B1
+
Lithium Battery
Seiko
TS518SE_FL35E
1.5V
2
GND
UG850_c1_05_0632719
Figure 1-5: Encryption Key Backup Circuit

The Seiko TS518FE rechargeable 1.5V lithium button-type battery B1 is soldered to the
board with the positive output connected to the XC7Z020 SoC U1 VCCBATT pin G9. The
battery supply current IBATT specification is 150 nA maximum when board power is off. B1
is charged from the VCCAUX 1.8V rail through a series diode with a typical forward voltage
drop of 0.38V and 4.7 KΩ current limit resistor. The nominal charging voltage is 1.42V.

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I/O Voltage Rails

There are four PL I/O banks available on the XC7Z020 SoC. The voltages applied to the
XC7Z020 SoC I/O banks used by the ZC702 board are listed in Table 1-3.
Table 1-3: I/O Voltage Rails

XC7Z020 (U1) Net Name Voltage Connected To
Bank
PL Bank 0 VCC2V5_PL 2.5V SoC Configuration Bank 0
PL Bank 13 FMC2, GPIO, PL_PJTAG, IIC_MAIN
PL Bank 33 FMC2, HDMI Codec
VADJ(1) 2.5V
PL Bank 34 FMC1, HDMI Codec
PL Bank 35 FMC1, HDMI Codec, XADC_GPIO, GPIO
PS Bank 500 Quad-SPI flash memory, misc
VCCMIO_PS 1.8V
PS Bank 501 Ethernet PHY, USB ULPI Transceiver, SDIO, CAN
PS Bank 502 VCC1V5_PS 1.5V PS_DDR3 MEM
Notes:
1. The ZC702 board is shipped with VADJ set to 2.5V.
DDR3 Component Memory

The 1 GB, 32-bit wide DDR3 memory system is comprised of four SDRAMs at U66–U69. This
memory system is connected to the XC7Z020 SoC processing system (PS) memory interface
bank 502.
Component Memory Details

• Part number: MT41J256M8HX-15E (Micron Technology)
• Configuration: 2Gb: 256 Mb x 8
• Supply voltage: 1.5V
• Datapath width: 32 bits
• Data rate: Up to 1,333 MT/s
The ZC702 XC7Z020 SoC PS DDR bank 502 interface performance is documented in the
Zynq-7000 SoC (Z-7007S, Z-7012S, Z-7014S, Z-7010, Z-7015, and Z-7020): DC and AC
Switching Characteristics (DS187) data sheet [Ref 3].
The DDR3 0.75V V TT termination voltage is sourced from linear regulator U22.
The connections between the DDR3 component memory and XC7Z045 SoC bank 502 are
listed in Table 1-4.

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Table 1-4: DDR3 Component Memory Connections to the XC7Z020 SoC

Component Memory
XC7Z020 (U1) Pin Net Name Reference
Pin Number Pin Name
Designator
E3 PS_DDR3_DQ0 B3 DQ0 U66
C3 PS_DDR3_DQ1 C7 DQ1 U66
F2 PS_DDR3_DQ2 C2 DQ2 U66
D1 PS_DDR3_DQ3 C8 DQ3 U66
F1 PS_DDR3_DQ4 E3 DQ4 U66
E1 PS_DDR3_DQ5 E8 DQ5 U66
B2 PS_DDR3_DQ6 D2 DQ6 U66
D3 PS_DDR3_DQ7 E7 DQ7 U66
G2 PS_DDR3_DQ8 B3 DQ8 U67
L1 PS_DDR3_DQ9 C7 DQ9 U67
G1 PS_DDR3_DQ10 C2 DQ10 U67
K1 PS_DDR3_DQ11 C8 DQ11 U67
L3 PS_DDR3_DQ12 E3 DQ12 U67
L2 PS_DDR3_DQ13 E8 DQ13 U67
J1 PS_DDR3_DQ14 D2 DQ14 U67
K3 PS_DDR3_DQ15 E7 DQ15 U67
M1 PS_DDR3_DQ16 B3 DQ16 U68
T3 PS_DDR3_DQ17 C7 DQ17 U68
N3 PS_DDR3_DQ18 C2 DQ18 U68
T1 PS_DDR3_DQ19 C8 DQ19 U68
R3 PS_DDR3_DQ20 E3 DQ20 U68
T2 PS_DDR3_DQ21 E8 DQ21 U68
M2 PS_DDR3_DQ22 D2 DQ22 U68
R1 PS_DDR3_DQ23 E7 DQ23 U68
U1 PS_DDR3_DQ24 B3 DQ24 U69
AA1 PS_DDR3_DQ25 C7 DQ25 U69
U2 PS_DDR3_DQ26 C2 DQ26 U69
AA3 PS_DDR3_DQ27 C8 DQ27 U69
W1 PS_DDR3_DQ28 E3 DQ28 U69
Y3 PS_DDR3_DQ29 E8 DQ29 U69
W3 PS_DDR3_DQ30 D2 DQ30 U69
Y1 PS_DDR3_DQ31 E7 DQ31 U69
B1 PS_DDR3_DM0 B7 DM0 U66

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Table 1-4: DDR3 Component Memory Connections to the XC7Z020 SoC (Cont’d)
Component Memory
Pin Number Pin Name
Designator
C2 PS_DDR3_DQS0_P C3 DQS0_P U66
D2 PS_DDR3_DQS0_N D3 DQS0_N U66
H3 PS_DDR3_DM1 B7 DM1 U67
H2 PS_DDR3_DQS1_P C3 DQS1_P U67
J2 PS_DDR3_DQS1_N D3 DQS1_N U67
P1 PS_DDR3_DM2 B7 DM2 U68
N2 PS_DDR3_DQS2_P C3 DQS2_P U68
P2 PS_DDR3_DQS2_N D3 DQS2_N U68
AA2 PS_DDR3_DM3 B7 DM3 U69
V2 PS_DDR3_DQS3_P C3 DQS3_P U69
W2 PS_DDR3_DQS3_N D3 DQS3_N U69
M4 PS_DDR3_A0 K3 A0 U66, U67, U68, U69
M5 PS_DDR3_A1 L7 A1 U66, U67, U68, U69
K4 PS_DDR3_A2 L3 A2 U66, U67, U68, U69
L4 PS_DDR3_A3 K2 A3 U66, U67, U68, U69
K6 PS_DDR3_A4 L8 A4 U66, U67, U68, U69
K5 PS_DDR3_A5 L2 A5 U66, U67, U68, U69
J7 PS_DDR3_A6 M8 A6 U66, U67, U68, U69
J6 PS_DDR3_A7 M2 A7 U66, U67, U68, U69
J5 PS_DDR3_A8 N8 A8 U66, U67, U68, U69
H5 PS_DDR3_A9 M3 A9 U66, U67, U68, U69
J3 PS_DDR3_A10 H7 A10 U66, U67, U68, U69
G5 PS_DDR3_A11 M7 A11 U66, U67, U68, U69
H4 PS_DDR3_A12 K7 A12 U66, U67, U68, U69
F4 PS_DDR3_A13 N3 A13 U66, U67, U68, U69
G4 PS_DDR3_A14 N7 A14 U66, U67, U68, U69
L7 PS_DDR3_BA0 J2 BA0 U66, U67, U68, U69
L6 PS_DDR3_BA1 K8 BA1 U66, U67, U68, U69
M6 PS_DDR3_BA2 J3 BA2 U66, U67, U68, U69
N4 PS_DDR3_CLK_P F7 CK U66, U67, U68, U69
N5 PS_DDR3_CLK_N G7 CK_B U66, U67, U68, U69
V3 PS_DDR3_CKE G9 CKE U66, U67, U68, U69
R4 PS_DDR3_WE_B H3 WE_B U66, U67, U68, U69

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Table 1-4: DDR3 Component Memory Connections to the XC7Z020 SoC (Cont’d)
Component Memory
Pin Number Pin Name
Designator
P3 PS_DDR3_CAS_B G3 CAS_B U66, U67, U68, U69
R5 PS_DDR3_RAS_B F3 RAS_B U66, U67, U68, U69
F3 PS_DDR3_RESET_B N2 RESET_B U66, U67, U68, U69
P6 PS_DDR3_CS_B H2 CS_B U66, U67, U68, U69
P5 PS_DDR3_ODT G1 ODT U66, U67, U68, U69
M7 PS_VRN
N7 PS_VRP
H7 VTTVREF_PS
P7 VTTVREF_PS
Note: The ZC702 DDR3 4x 8-bit component memory interface adheres to the constraints guidelines
documented in the DDR3 Design Guidelines section of the 7 Series FPGAs Memory Interface Solutions
v1.8 User Guide (UG586) [Ref 4]. The ZC702 DDR3 memory interface is a 40Ω impedance
implementation. Other memory interface details are available in UG586 and the 7 Series FPGAs
Memory Resources User Guide (UG473) [Ref 5]. For more details, see the Micron MT41J256M8HX-15E
data sheet at the Micron website [Ref 14].
Quad-SPI Flash Memory

The Quad-SPI flash memory located at U41 provides 128 Mb of non-volatile storage that
can be used for configuration and data storage.
• Part number: N25Q128A11ESF40G (Micron)

• Supply voltage: 1.8V
• Datapath width: 4 bits
• Data rate: Various depending on Single/Dual/Quad mode
The connections between the SPI flash memory and the XC7Z020 SoC are listed in
Table 1-5.
Table 1-5: Quad SPI Flash Memory Connections to the XC7Z020 SoC
XC7Z020 (U1) Schematic Quad-SPI Flash Memory (U41) MIO Select
Pin Name Bank Pin Number Net Name Pin Number Pin Name Header
PS_MIO6 500 A4 QSPI_CLK 16 C J26.2
PS_MIO5 500 A3 QSPI_IO3 1 DQ3_HOLD_B J25.2
PS_MIO4 500 E4 QSPI_IO2 9 WP_B J22.2

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Table 1-5: Quad SPI Flash Memory Connections to the XC7Z020 SoC (Cont’d)
XC7Z020 (U1) Schematic Quad-SPI Flash Memory (U41) MIO Select
Pin Name Bank Pin Number Net Name Pin Number Pin Name Header
PS_MIO3 500 F6 QSPI_IO1 8 DQ1 J20.2
PS_MIO2 500 A2 QSPI_IO0 15 DQ0 J21.2
PS_MIO1 500 A1 QSPI_CS_B 7 S_B NA
Notes:
Each three-pin MIO select header has pin 1 wired to VCCMIO and pin 3 wired to GND.
The configuration and Quad SPI section of the Zynq-7000 SoC Technical Reference Manual
(UG585) [Ref 2] provides details on using the Quad-SPI flash memory.
Figure 1-6 shows the connections of the linear Quad SPI flash memory on the ZC702 board.
For more details, see the Micron N25Q128A11ESF40G data sheet at the Micron website
[Ref 14].
VCCMIO
C23
U41
0.1μF 25V
R324 X5R N25Q128A11ESF40G
330Ω 5% 128 Mb Serial
GND
Flash Memory
QSPI_IO3 1 16 QSPI_CLK
HOLD_B/DQ3 C
2 15 QSPI_IO0
VCC DQ0
3 14
NC0 NC7
4 13
QSPI_CS_B NC1 NC6
5 12
NC2 NC5
6 11
NC3 NC4
7 10
SB VSS
QSPI_IO1 8 9 QSPI_IO2
DQ1 WB/VPP/DQ2
GND
UG850_c1_06_032719
Figure 1-6: 128 Mb Quad-SPI Flash Memory (U41)
USB 2.0 ULPI Transceiver

The ZC702 board uses a Standard Microsystems Corporation USB3320 USB 2.0 ULPI
Transceiver at U9 to support a USB connection to the host computer. A USB cable is
supplied in the ZC702 Evaluation Kit (Standard-A connector to host computer, Mini-B
connector to ZC702 board connector J1). The USB3320 is a high-speed USB 2.0 PHY
supporting the UTMI+ low pin interface (ULPI) interface standard. The ULPI standard
defines the interface between the USB controller IP and the PHY device which drives the
physical USB bus. Use of the ULPI standard reduces the interface pin count between the USB
controller IP and the PHY device.

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The USB3320 is clocked by a 24 MHz crystal. Consult the Standard Microsystems

Corporation (SMSC) USB3320 data sheet for clocking mode details [Ref 15].
The interface to the USB3320 transceiver is implemented through the IP in the XC7Z020 SoC
Processor System.
Table 1-6 describes the jumper settings for the USB 2.0 circuit. Bold text identifies the
default shunt positions for USB 2.0 high speed on-the-go (OTG) mode.
Table 1-6: USB Jumper Settings

Header Function Shunt Position Notes
J44 USB PHY reset Shunt ON = USB PHY reset Clean reset requires external
Shunt OFF = USB PHY normal operation debouncing
J7 VBUS 5V Shunt ON = Host or OTG mode

supply Shunt OFF = Device mode
J33 RVBUS select Position 1–2 = Device mode (10 kΩ ) Overvoltage protection
Position 2–3 = OTG mode (1 kΩ )
J35 CVBUS select Position 1-2 = OTG and Device mode (1 μ F) VBUS load capacitance
Position 2-3 = Host mode (120 μ F)
J34 Cable ID select Position 1-2 = A/B cable detect Used in OTG mode.
Position 2-3 = ID not used
J36 USB Micro-B Position 1-2 = Shield connected to GND
Position 2-3 = Shield floating
The connections between the USB Mini-B connector at J1 and the PHY at U9 are listed in
Table 1-7.
Table 1-7: USB Connector Pin Assignments and Signal Definitions Between J1 and U9
USB Connector
J1 Net Name Description USB3320 (U9)
Pin
Pin Name
1 VBUS USB_VBUS_SEL +5V from host system 22
2 D_N USB_D_N Bidirectional differential serial data (N-side) 19
3 D_P USB_D_P Bidirectional differential serial data (P-side) 18
5 GND GND Signal ground 33

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The connections between the USB 2.0 PHY at U9 and the XC7Z020 SoC are listed in
Table 1-8.
Table 1-8: USB 2.0 ULPI Transceiver Connections to the XC7Z020 SoC
XC7Z020 (U1)
Schematic Net Name USB3320 (U9) Pin
Pin Name Bank Pin Number
PS_MIO36 501 A9 USB_CLKOUT 1
PS_MIO31 501 F9 USB_NXT 2
PS_MIO32 501 C7 USB_DATA0 3
PS_MIO33 501 G13 USB_DATA1 4
PS_MIO34 501 B12 USB_DATA2 5
PS_MIO35 501 F14 USB_DATA3 6
PS_MIO28 501 A12 USB_DATA4 7
PS_MIO37 501 B14 USB_DATA5 9
PS_MIO38 501 F13 USB_DATA6 10
PS_MIO39 501 C13 USB_DATA7 13
PS_MIO30 501 A11 USB_STP 29
PS_MIO29 501 E8 USB_DIR 31
PS_MIO7 500 D5 USB_RESET_B_AND 27 (through AND gate U62)
Figure 1-7 shows the USB 2.0 ULPI Transceiver circuitry. Note that the shield for the USB
Mini-B connector (J1) can be tied to GND by a jumper on header J36 pins 1–2 (default). The
USB shield can optionally be connected through a capacitor to GND by installing a
capacitor (body size 0402) at location C202 and jumping pins 2-3 on header J36.

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UG850 (v1.7) March 27, 2019
27
8
8
USB_VBUS_SEL
USB_RESET_B
L10
USB_STP
USB_DIR
FERRITE-220 ZX62D_AB_5P8
2 PLACES 1
VCCMIO X2 1 2
VBUS
USB_D_N 2
27 D_N
C53 C334 1
1 2
1 C335 C270 1 1 C57 USB_D_P 3
24.000MHZ 5.6μF 0.1μF 27 D_P
C54 R295 1
18PF
50V 2 2
18PF
50V
10V 2 2 25V 4
C56 1 1 1 1.0M NPO NPO
1 2
ID
SHLD1
SHLD2
SHLD3
SHLD4
SHLD5
SHLD6
0.1μF 1/10Ω 5
2 GND
25V 2 2 2 5%
3 PLACES GND GND FERRITE-220
J1
6
7
8
9
10
11
GND
L11
GND
J34
R140
USB3320_QFN32
VDDIO_32 32
31
VDD18_30 30
STP_29 29
VDD18_28 28
RESETB_27 27
REFCLK_26 26
XO_25 25
1/10Ω
8.06K
1
1%
3
1
DIR_31
USB_CLKOUT 1 24 VCC5V0 C414 C303 2 USB_ID C202
3
8 CLKOUT_1 RBIAS_23 1 27
1 GND 2
2
1μF 120μF DNP
J35
USB_NXT 2 23 USB_ID 3 USB_VDD33
8 NXT_2 ID_23 27 2 16V 20V 27 J36
USB_DATA0 3 22
GND X5R 2 TANT
8 DATA0_3 VBUS_22 CVBUS Select:
1-2 = A/B CABLE DETECT GND
1-2: OTG Mode
USB_DATA1 4 DATA1_4 VBAT_21 21 2-3 = ID NOT USED
8 GND 2-3: Host Mode
GND
8
USB_DATA2 5 DATA2_5 VDD33_P 20 USB_VDD33
27 1 C413
0.1μF
USB_DATA3 6 DATA3_6 DM_19 19 USB_D_N
8 27 2 25V
8
USB_DATA4 7 DATA4_7 DP_18 18 USB_D_P
27
1 C137
2.2μF
8 REFSEL0_8 CPEN33_17 17 2 6.3V
GND
11 REFSEL1_11
14 REFSEL2_14
16 SPK_R_16
10 DATA6_10
13 DATA7_13
15 SPK_L_15
9 DATA5_9
USB_VBUS_SEL
12 NC_12
33 GND
CTR_GND_33
U9 USB3320_QFN32
VCCMIO GND R185 1 1
R249
10.0K 1.00K
NC
NC
NC
1/10Ω
2 2 1/16Ω
J33
3
J7
1
USB_DATA5
USB_DATA6
USB_DATA7
ON = HOST OR OTG MODE

1-2 = DEVICE MODE
2 OFF = DEVICE MODE
2-3 = HOST OR OTG MODE
VCC3V3
R280 1
USB HOST POWER
8
261
1/10Ω
2 MIC2025_SOP8 VCC5V0
DS5 1 EN OUT2 8
2 1 2 FLG IN 7
3 GND OUT1 6
LED-RED-SMT NC 4 NC1 NC2 5 NC 1 C58 1 C293
0.1μF 150μF
SOP127P500X600_8 2 25V 2 10V
U13 TANT
GND
GND GND
UG850_c1_07_032719
Figure 1-7: USB 2.0 ULPI Transceiver

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SD Card Interface
The ZC702 board includes a secure digital input/output (SDIO) interface to provide
user-logic access to general purpose nonvolatile SDIO memory cards and peripherals.
Information for the SD I/O card specification can be found at the SanDisk Corporation
[Ref 16] or SD Association [Ref 17] websites.
The SDIO signals are connected to XC7Z020 SoC PS bank 501 which has its VCCMIO set to
1.8V. A TXB02612 SDIO port expander with voltage-level translation (U61) is used between
the XC7Z020 SoC and the SD card connector (J64).
Figure 1-8 shows the connections of the SD card interface on the ZC702 board.
VCCMIO_PS VCC3V3
1 C27
1 R381 1 R380 1 R321 0.1μF
4.7K 4.7K 4.7K 2 25V
1/10Ω 1/10Ω 1/10Ω X5R
2 5% 2 5% 2 5%
GND
67840-8001
22 SDIO_CD_DAT3 1 CD_DAT3
22 SDIO_CMD 2 CMD
3 VSS1
4 VDD
22 SDIO_CLK 5 CLK
6 VSS2
22 SDIO_DAT0 7 DAT0
22 SDIO_DAT1 8 DAT1 IOGND2 18
22 SDIO_DAT2 9 DAT2 IOGND1 17
GNDTAB4 16
8 SDIO_SDDET 10 DETECT GNDTAB3 15
8 SDIO_SDWP 11 PROTECT GNDTAB2 14
12 DETECT_PROTECT GNDTAB1 13
J64
GND
GND
UG850_c1_08_032719
Figure 1-8: SD Card Interface

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Table 1-9 lists the SD card interface connections to the XC7Z020 SoC.
Table 1-9: SDIO Connections to the XC7Z020 SoC

XC7Z020 (U1) Pin Level Shifter (U61) SDIO Connector (J64)
Schematic
Pin Net Name (A) Pin (B) Pin Pin Pin
Pin Name Bank
Number Number Number Number Name
PS_MIO15 500 E6 SDIO_SDWP N/A N/A 11 PROTECT
PS_MIO0 500 G6 SDIO_SDDET N/A N/A 10 DETECT
PS_MIO41 501 C8 SDIO_CMD_LS 4 20 2 CMD
PS_MIO40 501 E14 SDIO_CLK_LS 9 19 5 CLK
PS_MIO42 501 D8 SDIO_DAT2_LS 1 23 9 DAT2
PS_MIO45 501 B9 SDIO_DAT1_LS 7 16 8 DAT1
PS_MIO44 501 E13 SDIO_DAT0_LS 6 18 7 DAT0
PS_MIO43 501 B11 SDIO_CD_DAT3_LS 3 22 1 CD_DAT3
Programmable Logic JTAG Programming Options

The ZC702 board JTAG chain is shown in Figure 1-9.

J2 SPST Bus Switch SPST Bus Switch

U25 U26
JTAG
Header
N.C. N.C. 3.3V 2.5V
TDO J3 J4 U1
TDI U75
FMC LPC FMC LPC U39 Zynq-7000
U76
U23 U77 Connector Connector XC7Z020
SN74AVC1T45
SoC
JTAG 3:1 Voltage
Module Analog Translator
Switch
TDO TDI TDO TDI TDO TDI TDO TDI
TDI
U38 TDO
J58
JTAG SN74AVC1T45
Header Voltage
Translator
TDO
TDI TDO TDI
UG850_c1_09_062918
Figure 1-9: JTAG Chain Block Diagram

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Programmable Logic JTAG Select Switch, JTAG Cable Connector

The JTAG chain can be programmed by three different methods made available through a
3-to-1 analog switch (U75, U76, and U77) controlled by a 2-position DIP switch at SW10.
Figure 1-10 shows the JTAG analog switches and DIP switch SW10.
VCC3V3
4 3
U75 VCC3V3 SW10
TS5A3359 SDA02H1SBD
SP3T
ANALOG SWITCH
6 JTAG_SEL_1 1 2
IN1
5 JTAG_SEL_2
IN2
14PIN_JTAG_TDI 1 NO0
2 NO1 COM 7 R376
To J2 4.7kΩ
Parallel Cable or 14PIN_JTAG_TMS 3 NO2 0.1 Ω
Platform Cable 4 8 5%
GND V+
(14 pins) 14PIN_JTAG_TCK R375
4.7kΩ
U76 0.1 Ω
5%
TS5A3359
SP3T
ANALOG SWITCH
6 GND
IN1
DIGILENT_TDI 5
IN2
1 NO0
To U23
USB-to-JTAG DIGILENT_TMS 2 NO1 COM 7
Digilent bridge 3 NO2
DIGILENT_TCK 4 8
GND V+
U77
TS5A3359
SP3T
ANALOG SWITCH JTAG_TDI
20PIN_JTAG_TDI 6
IN2
5 JTAG_TMS
IN1
To J58 20PIN_JTAG_TMS 1 NO0
Parallel Cable
2 NO1 COM 7 JTAG_TCK
(20 Pins)
20PIN_JTAG_TCK 3 NO2
4 8
GND V+
UG850_c1_10_032719
Figure 1-10: PL JTAG Programming Source Analog Switch

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UG850 (v1.7) March 27, 2019
DIP switch SW10[1:2] setting 10 selects the 14-pin header J2 for configuration using either
a Parallel Cable IV (PC4) or Platform Cable USB II. DIP switch SW10 setting 01 selects the
USB-to-JTAG Digilent bridge U23 for configuration over a Standard-A to Micro-B USB cable.
DIP switch SW10 setting 11 selects the JTAG 20-pin header at J58. The four JTAG signals TDI,
TDO, TCK, and TMS would be connected to J58 through flying leads from a JTAG cable. The
3-to-1 analog switch settings are shown in Table 1-10.
Table 1-10: Switch SW10 JTAG Configuration Option Settings

DIP Switch SW10[1:2]
Configuration Source
Switch 1(1) JTAG_SEL_1 Switch 2(1) JTAG_SEL_2
None 0 0
Digilent USB-to-JTAG interface U23 0 1
Cable connector J2 (2) 1 0
JTAG header J58 1 1
Notes:
1. 0 = open, 1 = closed
2. Default switch setting
FMC Connector JTAG Bypass

When an FPGA mezzanine card (FMC) is attached to J3 or J4 it is automatically added to the
JTAG chain through electronically controlled single-pole single-throw (SPST) switches U25
and U26. The SPST switches are normally closed and transition to an open state when an
FMC is attached. Switch U25 adds an attached FMC to the JTAG chain as determined by the
FMC1_HPC_PRSNT_M2C_B signal. Switch U26 adds an attached FMC to the JTAG chain as
determined by the FMC2_LPC_PRSNT_M2C_B signal The attached FMC card must
implement a TDI-to-TDO connection using a device or bypass jumper to ensure that the
JTAG chain connects to the XC7Z020 SoC.
Clock Generation
The ZC702 board provides three clock sources for the XC7Z020 SoC. Table 1-11 lists the
source devices for each clock.
Table 1-11: ZC702 Board Clock Sources

Clock
Clock Name Description
Source
SiT9102 2.5V LVDS 200 MHz fixed-frequency oscillator (SiTime). See System
System Clock U43
Clock.
Si570 3.3V LVDS I2C programmable oscillator, 156.250 MHz default (Silicon
User Clock U28
Labs). See Programmable User Clock.
SIT8103 1.8V single-ended CMOS 33.3333 MHz fixed frequency oscillator
PS Clock U65
(SiTime). See Processing System Clock Source.

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Table 1-12 lists the pin-to-pin connections from each clock source to the XC7Z020 SoC.
Table 1-12: Clock Connections, Source to XC7Z020 SoC

Clock Reference Pin Net Name I/O Standard XC7Z020 (U1) Pin
5 SYSCLK_N LVDS_25 C19
U43
4 SYSCLK_P LVDS_25 D18
5 USRCLK_N LVDS_25 Y8
U28
4 USRCLK_P LVDS_25 Y9
U65 3 PS_CLK NA F7 (Bank 500)
System Clock
The system clock source is an LVDS 200 MHz oscillator at U43. It is wired to a multi-region
clock capable (MRCC) input on programmable logic (PL) bank 35. The signal pair is named
SYSCLK_P and SYSCLK_N and each signal is connected to U1 pins D18 and C19 respectively
on the XC7Z020 SoC.
• Oscillator: SiTime SiT9102AI-243N25E200.00000 (200 MHz)

• Frequency Tolerance: 50 ppm
• Differential Output
For more details, see the SiTime SiT9102 data sheet [Ref 18]. The system clock circuit is
shown in Figure 1-11.
VCC2V5
U43
SIT9102
200 MHz
C71 Oscillator
0.1 μF 10V SYSCLK_N
X5R 1 6
OE VCC R168
2 5
NC OUT_B 100Ω 1%
3 4 SYSCLK_P
GND OUT
GND
UG850_c1_11_030513
Figure 1-11: System Clock Source

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Programmable User Clock

The ZC702 board has a programmable low-jitter 3.3V LVDS differential oscillator (U28)
connected to the MRCC inputs of bank 13. This USRCLK_P and USRCLK_N clock signal pair
is connected to XC7Z020 SoC U1 pins Y9 and Y8 respectively. On power-up the user clock
defaults to an output frequency of 156.250 MHz. User applications can change the output
frequency within the range of 10 MHz to 810 MHz through an I2C interface. Power cycling
the ZC702 board reverts the user clock to the default frequency of 156.250 MHz.
• Programmable Oscillator: Silicon Labs Si570BAB0000544DG (10 MHz–810 MHz)

• LVDS Differential Output
The user clock circuit is shown in Figure 1-12.

VCC3V3 VCC3V3
U28
R20
4.7KΩ 5% Si570 C216
Programmable 0.01 μF 25V
X7R
Oscillator
1 NC VDD 6 GND
2 OE
USRCLK N
USRCLK SDA 7 R417
SDA CLK- 5 100Ω 1%
USR CLK SCL 8
SCL CLK+ 4 USRCLK P
3
GND
GND
UG850_c1_12_030513
Figure 1-12: User Clock Source

The Silicon Labs Si570 data sheet is available on the Silicon Labs website [Ref 19].
Processing System Clock Source

The Processing System (PS) clock source is a 1.8V LVCMOS single-ended fixed
33.33333 MHz oscillator at U65. It is wired to PS bank 500, pin F7 (PS_CLK), on the XC7Z020
SoC.
• Oscillator: SiTime SiT8103AC-23-18E-33.33333 (33.3 MHz)

• Frequency Tolerance: 50 ppm
• Single-ended output

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UG850 (v1.7) March 27, 2019
For more details, see the SiTime SiT8103 data sheet [Ref 18].
The system clock circuit is shown in Figure 1-13.

U65
VCC1V8 VCC1V8
SiT8103
MEMS Clock
R322 C449
Oscillator
4.7KΩ 5% 0.01 μF 25V
33.33333 MHz X7R
1 OE 4
VDD GND
R403
24.9Ω 1%
2 3 PS CLK
GND OUT
GND
UG850_c1_13_030513
Figure 1-13: Processing System Clock Source
10/100/1000 MHz Tri-Speed Ethernet PHY

The ZC702 board uses the Marvell Alaska PHY device (88E1116R) at U35 for Ethernet
communications at 10 Mb/s, 100 Mb/s, or 1000 Mb/s. The board supports RGMII mode
only. The PHY connection to a user-provided Ethernet cable is through a Halo HFJ11-1G01E
RJ-45 connector (P2) with built-in magnetics.
On power-up, or on reset, the PHY is configured to operate in RGMII mode with PHY
address 0b00111 using the settings shown in Table 1-13. These settings can be overwritten
using software commands passed over the MDIO interface.
Table 1-13: Board Connections for PHY Configuration Pins

U35 Pin Setting Configuration
CONFIG0 VCCO_MIO1 PHYAD[1]=1 PHYAD[0]=1
CONFIG1 EPHY_LED0 PHYAD[3]=0 PHYAD[2]=1
GND ENA_XC=0 PHYAD[4]=0
CONFIG2 EPHY_LED0 ENA_XC=0 PHYAD[4]=1
VCCO_MIO1 ENA_XC=1 PHYAD[4]=1
GND RGMII_TX=0 RGMII_RX=0
EPHY_LED0 RGMII_TX=0 RGMII_RX=1
CONFIG3
EPHY_LED1 RGMII_TX=1 RGMII_RX=0
VCCO_MIO1 RGMII_TX=1 RGMII_RX=1

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The Ethernet connections from the XC7Z020 SoC at U1 to the 88E1116R PHY device at U35
are listed in Table 1-14.
Table 1-14: Ethernet Connections, XC7Z020 SoC to the PHY Device

XC7Z020 (U1) Pin M88E1116R PHY U35
Schematic
Pin Name Bank Pin Net Name Pin Name
Number
PS_MIO53 501 C12 PHY_MDIO 45 MDIO
PS_MIO52 501 D10 PHY_MDC 48 MDC
PS_MIO16 501 D6 PHY_TX_CLK 60 TX_CLK
PS_MIO21 501 F11 PHY_TX_CTRL 63 TX_CTRL
PS_MIO20 501 A8 PHY_TXD3 62 TXD3
PS_MIO19 501 E10 PHY_TXD2 61 TXD2
PS_MIO18 501 A7 PHY_TXD1 59 TXD1
PS_MIO17 501 E9 PHY_TXD0 58 TXD0
PS_MIO22 501 A14 PHY_RX_CLK 53 RX_CLK
PS_MIO27 501 D7 PHY_RX_CTRL 49 RX_CTRL
PS_MIO26 501 A13 PHY_RXD3 55 RXD3
PS_MIO25 501 F12 PHY_RXD2 54 RXD2
PS_MIO24 501 B7 PHY_RXD1 51 RXD1
PS_MIO23 501 E11 PHY_RXD0 50 RXD0
Ethernet PHY Clock Source

A 25.00 MHz 50 ppm crystal at X1 is the clock source for the 88E1116R PHY at U35.
Figure 1-14 shows the clock source.
C322
18pF 50V
NPO
X1
25.00 MHz
R246 3 4 PHY XTAL OUT

DNP
C333
2 1 PHY XTAL IN
18pF 50V
NPO
GND
UG850_c1_14_030513
Figure 1-14: Ethernet PHY Clock Source

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UG850 (v1.7) March 27, 2019
The data sheet can be obtained under NDA with Marvell. The Marvell site includes contact
information [Ref 20],
USB-to-UART Bridge
The ZC702 board contains a Silicon Labs CP2103GM USB-to-UART bridge device (U36)
which allows a connection to a host computer with a USB port. The USB cable is supplied in
the ZC702 Evaluation Kit (Standard-A end to host computer, Type Mini-B end to ZC702
board connector J17). The CP2103GM is powered by the USB 5V provided by the host PC
when the USB cable is plugged into the USB port on the ZC702 board.
The CP2013GM TX and RX pins are wired to the UART_1 IP block within the XC7Z020 SoC PS
I/O Peripherals set. The XC7Z020 SoC supports the USB-to-UART bridge using two signal
pins: Transmit (TX) and Receive (RX).
Silicon Labs provides royalty-free Virtual COM Port (VCP) drivers for the host computer.
These drivers permit the CP2103GM USB-to-UART bridge to appear as a COM port to
communications application software (for example, TeraTerm or HyperTerm) that runs on
the host computer.
IMPORTANT: The VCP device drivers must be installed on the host PC prior to establishing
communications with the ZC702 board.
The USB Connector pin assignments and signal definitions between J17 and U36 are listed
in Table 1-15.
Table 1-15: USB Connector J17 Pin Assignments and Signal Definitions
USB Connector (J17) CP2103GM (U36)
Net Name Description
Pin Name Pin Name
7 REGIN
1 VBUS USB_UART_VBUS +5V VBUS Powered
8 VBUS
2 D_N USB_UART_D_N Bidirectional differential serial data (N-side) 4 D–
3 D_P USB_UART_D_P Bidirectional differential serial data (P-side) 3 D+
2 GND1
5 GND USB_UART_GND Signal ground
29 CNR_GND

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Table 1-16 lists the USB connections between the XC7Z020 SoC PS Bank 501 and the
CP2103 UART bridge.
Table 1-16: XC7Z020 SoC to CP2103 Connections

XC7Z020 SoC (U1) Bank 500 CP2103GM Device (U36)
Net Name
Pin Name Pin Number Function Direction Pin Function Direction
PS_MIO48 D11 TX Data Out USB_UART_RX 24 RXD Data In
PS_MIO49 C14 RX Data In USB_UART_TX 25 TXD Data Out
Refer to the Silicon Labs website for technical information on the CP2103GM and the VCP
drivers [Ref 19].
HDMI Video Output

The ZC702 board provides a high-definition multimedia interface (HDMI®) video output
using an Analog Devices ADV7511KSTZ-P HDMI transmitter at U40. The HDMI output is
provided on a Molex 500254-1927 HDMI type-A receptacle at P1. The ADV7511 supports
1080P 60Hz, YCbCr 4:2:2 encoding via 16-bit input data mapping.
The ZC702 board supports the following HDMI device interfaces:
• 16 data lines
• Independent VSYNC, HSYNC
• Single-ended input CLK
• Interrupt Out pin to XC7Z020 SoC
• I2C
• SPDIF

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Figure 1-15 shows the HDMI codec circuit.

VCC3V3 VADJ VCC2V5
R109 R110 U31

2.43K 2.43K
1/10Ω 1 R105 1/10Ω2719 U40 SIT8102
1% 2.43K 1% 12.00000 MHz
50PPM
1/10Ω ADV7511
HDMI_INT 1% 45 R402 4 VCC OE 1
INT
38 PD 24.9
IIC_SCL_HDMI 55 SCL CEC_CLK 50 3 OUT GND 2
IIC_SDA_HDMI 56 SDA
SPDIF_OUT 46 HDMI_SPDIF_OUT
HDMI_VSYNC 2
HDMI_HSYNC 98 VSYNC C78
HSYNC 1 GND
0.1μF
HDMI_CLK 79 25V 2
CLK
X5R
HDMI_HEAC_C_N 30
HPD HDMI_PLVDD HDMI_AVDD
GND
57 D35
58 D34 PVDD1 21
59 D33 PVDD2 24
60 D32 PVDD3 25
61 D31
62 D30 HDMI_AVDD
63 D29
64 D28 AVDD1 29
65 D27 AVDD2 34
66 D26 AVDD3 41
67 D25
68 HDMI_DVDD
D24
HDMI_D15 69 D23
HDMI_D14 70 D22 DVDD1 76
HDMI_D10 74 1
D18 DVDD5
HDMI_D9 78 D17
HDMI_D8 80 HDMI_DVDD_3V
D16
HDMI_D7 81 D15
HDMI_D6 82 D14 DVDD_3V 47
HDMI_D5 83 D13 HDMI_PLVDD
HDMI_D4 84 D12
HDMI_D3 85 D11 BGVDD 26
HDMI_D2 86 D10
To U1 SoC HDMI_D1 87 D9
HDMI_D0 88 36 HDMI_D0_P
D8 TX0_P
89 35 HDMI_D0_N
D7 TX0_N
90 D6 40 HDMI_D1_P
91 TX1_P
D5 39 HDMI_D1_N
92 D4 TX1_N
93 43 HDMI_D2_P
D3 TX2_P
94 42 HDMI_D2_N
D2 TX2_N
95 D1 33 HDMI_CLK_P
96 TXC_P
D0
TXC_N
32 HDMI_CLK_N To HDMI
HDMI_DE 97 DE Connector
54 HDMI_DDCSDA
HDMI_SPDIF 10 DDCSDA 53
SPDIF HDMI_DDCSCL
DDCSCL
3 DSD0 52 HDMI_HEAC_P
4 HEAC_P
DSD1 51 HDMI_HEAC_N
5 HEAC_N
DSD2
6 DSD3 48 HDMI_CEC
7 CEC
DSD4
8 DSD5
9 DSD_CLK
11 MCLK 99
GND1
GND2 100
GND3 18
12 I2S0 20
13 GND4
I2S1 GND5 22
14 I2S2 23
15 GND6
I2S3 GND7 27
16 SCLK 31
17 GND8
LRCLK GND9 37
GND10 44
28 R_EXT 75
GND11
R107
887
GND
GND UG850_c1_15_032719
Figure 1-15: HDMI Codec Circuit

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Table 1-17 lists the connections between the codec and the XC7Z020 SoC.
Table 1-17: XC7Z020 SoC to HDMI Codec Connections (ADV7511)

ADV7511 (U40)
XC7Z020 (U1) Pin Net Name I/O Standard
Pin Name
AB21 HDMI_D0 LVCMOS25 88 D8
AA21 HDMI_D1 LVCMOS25 87 D9
AB22 HDMI_D2 LVCMOS25 86 D10
AA22 HDMI_D3 LVCMOS25 85 D11
V19 HDMI_D4 LVCMOS25 84 D12
U20 HDMI_D7 LVCMOS25 81 D15
W21 HDMI_D8 LVCMOS25 80 D16
T19 HDMI_D11 LVCMOS25 73 D19
U19 HDMI_D12 LVCMOS25 72 D20
R19 HDMI_D13 LVCMOS25 71 D21
T18 HDMI_DE LVCMOS25 97 DE
R15 HDMI_SPDIF LVCMOS25 10 SPDIF
L16 HDMI_CLK LVCMOS25 79 CLK
H15 HDMI_VSYNC LVCMOS25 2 VSYNC
R18 HDMI_HSYNC LVCMOS25 98 HSYNC
U14 HDMI_INT LVCMOS25 45 INT
H20 HDMI_SPDIF_OUT LVCMOS25 46 SPDIF_OUT
Table 1-18 lists the connections between the codec and the HDMI receptacle P1.
Table 1-18: ADV7511 to HDMI Receptacle Connections

ADV7511 (U40) Net Name HDMI Receptacle P1 Pin
36 HDMI_D0_P 7
35 HDMI_D0_N 9
40 HDMI_D1_P 4
39 HDMI_D1_N 6
43 HDMI_D2_P 1

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UG850 (v1.7) March 27, 2019
Table 1-18: ADV7511 to HDMI Receptacle Connections (Cont’d)

ADV7511 (U40) Net Name HDMI Receptacle P1 Pin
42 HDMI_D2_N 3
33 HDMI_CLK_P 10
32 HDMI_CLK_N 12
54 HDMI_DDCSDA 16
53 HDMI_DDCSCL 15
52 HDMI_HEAC_P 14
51 HDMI_HEAC_N 19
48 HDMI_CEC 13
Information about the ADV7511KSTZ-P is available on the Analog Devices website [Ref 21].
I2C Bus
The ZC702 board implements a single I2C port on the XC7Z020 SoC (IIC_SDA_MAIN,
IIC_SDA_SCL), which is routed through an TI Semiconductor PCA9548 1-to-8 channel I2C
bus switch (U44). The bus switch can operate at speeds up to 400 kHz.
The bus switch I2C address is 0x74 ( 0b1110100) and must be addressed and configured to
select the desired downstream device.
The ZC702 board I2C bus topology is shown in Figure 1-16.

VADJ 2.5V 3.3 V

U1
U56 U44
XC7Z020
PCA9517 PCA9548
SoC
I2C 12C 1-to-8
PL Bank 13 Bus Switch
(2.5V) Level Shifter CH0 - USER_CLK_SDL/SCL
IIC_SCL/SDA_MAIN A B IIC_SDA/SCL_MAIN CH1 - IIC_SDA/SCL_HDMI
CH2 - EEPROM_IIC_SDA/SCL
VCCMIO_PS 1.8V 3.3 V CH3 - PORT_EXPANDER_SDA/SCL
U1 CH4 - IIC_RTC_SDA/SCL
U57
XC7Z020 CH5 - FMC1_LPC_IIC_SDA/SCL
PCA9517
SoC CH6 - FMC2_LPC_IIC_SDA/SCL
PS Bank 501
I2C
Level Shifter CH7 - PMBUS_DATA/CLK
(VCCMIO_PS 1.8V)
PS_SDA/SCL_MAIN A B
UG850_C1_16_062918
Figure 1-16: I2C Bus Topology

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UG850 (v1.7) March 27, 2019
User applications that communicate with devices on one of the downstream I2C buses must
first set up a path to the desired bus through the U44 bus switch at I2C address 0x74
(0b1110100). Table 1-19 lists the address for each bus.
Table 1-19: I2C Bus Addresses

I2C Device I2C Switch Position I2C Address
PCA9548 8-channel bus switch NA 0b1110100
Si570 clock 0 0b1011101
ADV7511 HDMI 1 0b0111001
I2C EEPROM 2 0b1010100
I2C port expander 3 0b0100001
I2C real time clock 4 0b1010001
FMC LPC J3 5 0bxxxxx00
FMC LPC J4 6 0bxxxxx00
UCD9248 controller PMBUS 7 0b01101[ADDR] (1)
Notes:
1. This I2C address is the binary equivalent of the TI Power Controller PMBus decimal address 52, 53,
or 54 which corresponds to b00, b01 and b10 in the lower 2 bits.
IMPORTANT: The PCA9548 I2C bus switch U44 pin 24 net IIC_MUX_RESET_B is level-shifted by U81 and
is connected to the XCZ020 SoC U1 bank 500 pin A6. This is an active-Low signal and must be driven
High to enable I2C bus transactions between the U1 and the other components on the I2C bus.
Information about the PCA9548 is available on the TI Semiconductor website at [Ref 25].
Real-Time Clock
The Epson RTC-8564JE is an 1 2C bus interface real-time clock that has a built-in 32.768 KHz
oscillator with these features
• Frequency output options: 32.768 KHz, 1024 Hz, 32 Hz or 1 Hz

• Calendar output functions: Year, month, day, weekday, hour, minute and second
• Clock counter, alarm and fixed-cycle timer interrupt functions
Programming information for the RTC-8564JE is available in the RTC-8564JE/NB Application

Manual at the Epson Electronics America website [Ref 22].

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UG850 (v1.7) March 27, 2019
Figure 1-17 shows the real-time clock circuit.

VADJ VCC3V3 VCC2V5
U16
R187 D5 D6
RTC-8564JE 1 J39 BAT54T1G BAT54T1G
10.0K YELLOW
0.1Ω Real Time Clock 30V 400 mW 30V 400 mW
Module
IIC_RTC_SDA 7 16
SDA VCC
IIC_RTC_SCL 6 15 D7
SCL CLKOE
IIC_RTC_IRQ_1_B 10 14 BAT54T1G
INT CLKOUT R249
30V 400 mW
13 4.7K
GND
2V
C217
0.01μF B2
25V NBL-621/N9D
X7R
GND GND GND

UG850_c1_17_032719
Figure 1-17: Real Time Clock Circuit

Real-time clock connections to the XC7Z020 SoC and the PCA9548 8-Channel bus switch
are listed in Table 1-20.
Table 1-20: Real Time Clock Connections

RTC-8564JE (U16) Pin Net Name Connects To
6 IIC_RTC_SCL U44.11 (PCA9548 SC4)
7 IIC_RTC_SDA U44.10 (PCA9548 SD4)
10 IIC_RTC_IRQ_1_B (1) U1.U7 (XC7Z020 SoC PL BANK 13)
Notes:
1. I/O standard = LVCMOS_25.
Information about the RTC-8564JE is available at the Epson Electronics America website
[Ref 22].
I/O Expansion Header

The 2 x 6 I/O expansion header J54 supports Digilent Pmod Peripheral Modules. 8 pins
(IIC_PMOD[0:7]) are connected to the TI TCA6416APWR I2C expansion port device U80. See
the Digilent website for information on Digilent Pmod Peripheral Modules [Ref 23].

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UG850 (v1.7) March 27, 2019
The expansion header circuit is shown in Figure 1-18.

VCC3V3
U80
I/O Expansion
C521 C502 TCA641APWR Header
0.1μF 0.1μF 16-Bit I2C and SMBus
10V 10V I/O Expander J54
X5R X5R 24 4 IIC_PMOD_0 1 2 IIC_PMOD_4
VCCP P00
GND GND 2 5 IIC_PMOD_1 3 4 IIC_PMOD_5
VCCI P01
6 IIC_PMOD_2 5 5 IIC_PMOD_6
VCC3V3 P02
R408 7 IIC_PMOD_3 7 8 IIC_PMOD_7
4.7kΩ P03
R363 8 9 10
0.1W P04
0 3 9 11 12
0.1W RESET_B P05
21 10
ADDR P06
R360 1 11
INT_B P07 VCC3V3
DNP
13 GND GND
P10
GND 14
P11
15
P12
16
To U44 P13
IIC_PORT_EXPANDER_SDA 23 17
PCA95498A SDA P14
8-Channel I2C IIC_PORT_EXPANDER_SCL 22 18
SCL P15
Switch 19
P16
12 20
GND P17
GND
UG850_c1_18_030513
Figure 1-18: I/O Expansion Header Circuit
Information about the TCA641APWR is available at the Texas Instruments website [Ref 25].
High Speed CAN Transceiver

The TJA1040 (U14) is an advanced high speed Controller Area Network (CAN) transceiver for
use in automotive and general industrial applications. It supports the differential bus signal
representation described in the international standard for in-vehicle high speed CAN
applications (ISO 11898).

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UG850 (v1.7) March 27, 2019
Figure 1-19 shows the controller area network (CAN) bus interface.
VCC5V0 VCCMIO CAN Interface

C25 C520 Connector
0.1μF C24 47 μF J52
25V 0.1μF 10V 1 2
X5R 25V X5R 3 4
X5R
GND GND GND 5 5
GND
VCCMIO CAN_CANH 7 8
U3 U14 2 1 9 10
C26
0.1μF TXS0104E R282 C330 J53
TJA1040
25V Bidirectional 60.4Ω 18 pF
CAN
X5R Voltage-Level 5% 50V
Transceiver
1 Translator 14 3 7 NPO
GND
VCCA VCCB VCC CANH GND
CAN_TXD_LS 2 13 CAN TXD 1 6 CAN_CANL
A1 B1 TXD CANL
CAN_RXD_LS 3 12 CAN RXD 4 5 1 2
A2 B2 RXD SPLIT
CAN_STB_B_LS 4 B3
11 CAN STB B 8
GND
2 R281 J15
A3 STB C304 C331
5 10 60.4Ω
A4 B4 4700 pF 5% 18 pF
6 9 25V 50V
NC1 NC2
7 8 NPO NPO
GND OE
GND GND GND
GND UG850_c1_19_031913
Figure 1-19: CAN Bus Interface
Information about the TXS0104E is available at the Texas Instruments website [Ref 25]. Data
sheets and application notes for the TJA01040 CAN transceiver are available at the NXP
Semiconductors website [Ref 24]. Table 1-21 shows the U14 CAN transceiver to U1 XC7Z020
interface connections through level shifter U3.
Table 1-21: CAN Transceiver SoC Connections

TJA1040 (U14) TXS0104E Level Shifter (U3) XC7Z020 SoC (U1)
Pin Net Name Net Name Low Side Net Bank Pin
1 CAN_TXD CAN_TXD_LS PS_MIO47 501 B10
4 CAN_RXD CAN_RXD_LS PS_MIO46 501 D12
8 CAN_STB_B CAN_STB_B_LS PS_MIO9 500 C4

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UG850 (v1.7) March 27, 2019
Status LEDs
Table 1-22 defines the status LEDs. For user-controlled LEDs see User I/O.
Table 1-22: Status LEDs

Reference
Designator Net Name LED Color Description
DS1 POR Red Power on reset is active

Green: FPGA initialization was successful
DS2 FPGA_INIT_B Green/Red
Red: FPGA initialization is in progress
DS3 DONE Green FPGA bit file download is complete
DS4 PWRCTL_VCC1B_FLKT_LINEAR_PG Green DDR3 VTT OK
DS5 U13_FLG Red USB Power Error
DS6 PHY_LED2 Green Ethernet PHY (U35) User LED2
DS14 VCC12_P_IN Green 12V DC Power ON
UCD9248 Power Controllers U32, U33, U34
DS13 PWRCTL_PWRGOOD Green Power Good (board supply voltages > minimum
operating voltage)
DS24 PWRCTL1_VCC4A_PG Green FMC1, FMC2 Power Good

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UG850 (v1.7) March 27, 2019
Ethernet PHY User LEDs

The three Ethernet PHY user LEDs shown in Figure 1-20 are located near the RJ45 Ethernet
jack P2. The on/off state for each LED is software dependent and has no specific meaning at
Ethernet PHY power on.
Refer to the Marvell 88E1116R Alaska Gigabit Ethernet transceiver data sheet for details
concerning the use of the Ethernet PHY user LEDs. They are referred in the data sheet as
LED0, LED1, and LED2. The data sheet and other product information for the Marvell
88E1116R Alaska Gigabit Ethernet Transceiver is available at the Marvell website [Ref 20].
VCC3V3 VCC3V3 VCC3V3
318 317 316

261 261 261
0.1Ω 0.1Ω 0.1Ω
DS8 DS7 DS6
3 3 3
Q9 Q8 Q7
NDS331N NDS331N NDS331N
PHY LED 0 1 PHY LED1 1 PHY LED 2 1
460 mW 460 mW 460 mW
2 2 2
GND GND GND

UG850_c1_20_032719
Figure 1-20: Ethernet PHY User LEDs
User I/O
[Figure 1-2, callout 17–28]
The ZC702 board provides the following user and general purpose I/O capabilities:
• Ten user LEDs (callout 17)
° PMOD0 0–PMOD0 3 and PMOD1 0–PMOD1 3: DS15–DS22
° PS_LED1: DS23 and PS_MIO8_LED0: DS12

• Two user pushbuttons and reset switch (callout 18)
° GPIO_SW_N and GPIO_SW_S: SW5 and SW7

• 2-position user DIP switch (callout 24)
° GPIO_DIP_SW1 and GPIO_DIP_SW0: SW12

• User PS switches (near callout 18)

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UG850 (v1.7) March 27, 2019
° Pushbutton SW13 wired in parallel to DIP switch SW15 switch 1
° Pushbutton SW14 wired in parallel to DIP switch SW15 switch 2

• PS Power-On and System Reset pushbuttons (Switches)
° SW1 (PS_POR_B)
° SW2 (PS_SRST_B)
• Two user GPIO male pin headers (callout 28)
• 2 x 6 0.1 inch pitch PMOD1 J63
• 1 x 6 0.1 inch pitch PMOD2 J62
User LEDs
The ZC702 board supports eight user LEDs connected to XC7Z020 SoC Banks 13, 33, 34, and
35 through level-shifters. Note that the LEDs are wired in parallel with headers J63 (PMOD1)
and J62 (PMOD2). These headers are described in User PMOD GPIO Headers.

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UG850 (v1.7) March 27, 2019
Figure 1-21 shows the user LED circuits.

VCC3V3 VCC3V3 VCC3V3 VCC3V3
DS19 DS20 DS21 DS22
R409 R410 R411 R412

261 261 261 261
0.1Ω 0.1Ω 0.1Ω 0.1Ω
3 3 3 3
Q20 Q17 Q18 Q19
NDS331N NDS331N NDS331N NDS331N
PMOD1 0 1 PMOD1 1 1 PMOD1 2 1 PMOD1 3 1
460 mW 460 mW 460 mW 460 mW
2 2 2 2
GND GND GND GND

VCC3V3 VCC3V3 VCC3V3 VCC3V3
DS18 DS17 DS16 DS15
R407 R406 R405 R404

261 261 261 261
0.1Ω 0.1Ω 0.1Ω 0.1Ω
3 3 3 3
Q16 Q15 Q14 Q12
NDS331N NDS331N NDS331N NDS331N
PMOD2 0 1 PMOD2 1 1 PMOD2 2 1 PMOD2 3 1
460 mW 460 mW 460 mW 460 mW
2 2 2 2
GND GND GND GND

VCC3V3 VCC3V3
DS23 DS12
VCCMIO (1.8V)
R416 R85 R393

261 20.5K 261
0.1Ω 0.1W 0.1Ω
3 3
Q21 Q11
NDS331N NDS331N
PS_LED1 1 PS_MIO8_LED0 1
460 mW 460 mW
2 2
GND GND
UG850_c1_21_032719
Figure 1-21: User LEDs

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UG850 (v1.7) March 27, 2019
Table 1-23 lists the user LED connections to XC7Z020 SoC U1.
Table 1-23: User LED Connections to XC7Z020 SoC U1

XC7Z020 (U1) Pin Net Name I/O Standard LED Reference Designator
E15 PMOD1_0 LVCMOS25 DS19
D15 PMOD1_1 LVCMOS25 DS20
W17 PMOD1_2 LVCMOS25 DS21
V7 PMOD2_0 LVCMOS25 DS18
P18 PMOD2_2 LVCMOS25 DS16
P17 PMOD2_3 LVCMOS25 DS15
Bank 501 G7 PS_LED1 N/A DS23
Bank 500 E5 PS_MIO8_LED0 N/A DS12
User Pushbuttons
Figure 1-22 shows the user pushbutton circuits.

VADJ VADJ
SW5 Left SW7 Right
GPIO SW N 4 1 GPIO SW S 4 1
3 2 3 2
R352 R354
4.7kΩ 4.7kΩ
0.1 Ω 0.1 Ω
5% 5%
GND GND
UG850_c1_22_032719
Figure 1-22: User Pushbuttons

Table 1-24 lists the user pushbutton connections to XC7Z020 SoC U1.
Table 1-24: User Pushbutton Connections to XC7Z020 SoC U1

XC7Z020 SoC (U1) Pin Net Name I/O Standard Pushbutton and Pin Reference
G19 GPIO_SW_N LVCMOS25 SW5.3 (Left switch)
F19 GPIO_SW_S LVCMOS25 SW7.3 (Right switch)

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UG850 (v1.7) March 27, 2019
GPIO DIP Switch

Figure 1-23 shows the GPIO DIP switch circuit.

VADJ
SW12
GPIO_DIP_SW1 1 4
GPIO_DIP_SW0 2 3
R50 SDA02H1SBD
4.7kΩ
0.1 Ω
5%
R51
4.7kΩ
0.1 Ω
5%
GND
UG850_c1_23_032719
Figure 1-23: GPIO DIP Switch

Table 1-25 lists the GPIO DIP switch connections to XC7Z020 SoC U1.
Table 1-25: GPIO DIP Switch Connections to XC7Z020 SoC at U1

XC7Z020 (U1) Pin Net Name I/O Standard DIP Switch SW12 Pin
W6 GPIO_DIP_SW0 LVCMOS25 2
W7 GPIO_DIP_SW1 LVCMOS25 1

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UG850 (v1.7) March 27, 2019
User PS Switches
[Figure 1-2, near callout 18]
Figure 1-25 shows the user PS pushbutton and DIP switch circuit.
VCCMIO_PS (1.8V) VCCMIO_PS (1.8V)

SW13 SW14
4 1 4 1
3 2 3 2
R413 R414
4.7 kΩ 4.7 kΩ
0.1 Ω 0.1 Ω
5% 5%2719
GND GND
VCCMIO_PS (1.8V)
SW15
PS_DIP_SW0 1 4
PS_DIP_SW1 2 3
SDA02H1SBD
UG850_c1_24_032719
Figure 1-24: User PS Pushbutton and DIP Switch Circuit

Table 1-26 lists the user PS-side pushbutton and DIP switch connections to XC7Z020 SoC
U1 Bank 500.
Table 1-26: User PS Switch Connections to XC7Z020 SoC U1

XC7Z020 SoC (U1) Pin Net Name Switch and Pin Reference
B6 PS_DIP_SW0 SW13.4 and SW15.1
C5 PS_DIP_SW1 SW14.4 and SW15.2
User PMOD GPIO Headers

The ZC702 board supports two GPIO headers J62 and J63. The PMOD nets connected to
these headers are dual-purpose, with the User LEDs wired in parallel to the header pins.
J63 has a second dual-purpose function. The even numbered pins are wired in parallel to
the Arm PJTAG header J41 pins TDI, TIMS, TCK, and TDO. The J41 PJTAG signals are
connected to SoC Bank 13 GPIO pins which simultaneously drive J41 and J63. When J41 is
used for Arm PJTAG functionality, the J63 even numbered pin should not be used. When J63
even numbered pins are used as GPIO, connector J41 should not be used.

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UG850 (v1.7) March 27, 2019
PMOD connectors J62 and J63 are wired to the U1 XC7Z020 SoC via TXS0108E 3.3V-to-VADJ
(typically 1.8V) level-shifters.
Figure 1-25 shows the user GPIO male pin header circuits.
VCC3V3 VCC3V3 VCC3V3
J62 J63
1 PMOD2 0 PMOD1 0 1 2 PL PJTAG TDI LS
2 PMOD2 1 PMOD1 1 3 4 PL PJTAG TMS LS
3 PMOD2 2 PMOD1 2 5 6 PL PJTAG TCK LS
4 PMOD2 3 PMOD1 3 7 8 PL PJTAG TDO LS
5 9 10
6 11 12
GND GND GND

UG850_c1_25_030513
Figure 1-25: User GPIO Headers

When using the PMOD headers on the Zynq-7000 SoC ZC702 evaluation kit, the voltage
level output might appear normal at steady state; however, the rise and fall times on the
other side of the TXS0108E level shifters can be several microseconds. The paralleled LED
driver NDS331N FET has a gate capacitance of ~200 pF. The 200 pF load affects maximum
toggle rate, which is ~100 kHz. There are no speed requirements for PMOD or GPIOs. The
recommendation for a specific high-speed access with GPIO is to use the FMC interface.
Table 1-27 lists the GPIO Header connections to XC7Z020 SoC U1.
Table 1-27: GPIO Header Connections to XC7Z020 SoC at U1

XC7Z020 (U1) Pin Net Name I/O Standard GPIO Header and Pin
E15 PMOD1_0 LVCMOS25 J63.1
D15 PMOD1_1 LVCMOS25 J63.3
W17 PMOD1_2 LVCMOS25 J63.5
V7 PMOD2_0 LVCMOS25 J62.1
P18 PMOD2_2 LVCMOS25 J62.3
P17 PMOD2_3 LVCMOS25 J62.4
Refer to the Zynq-7000 SoC Technical Reference Manual (UG585) [Ref 2] for information
about the PS PJTAG functionality.

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UG850 (v1.7) March 27, 2019
Switches
[Figure 1-2, callout 22–26]
The ZC702 board includes a power and a configuration switch:
• Power On/Off slide switch SW11 (callout 26)

• SW4 (FPGA_PROG_B), active-Low pushbutton (callout 22)
Power On/Off Slide Switch

The ZC702 board power switch is SW11. Sliding the switch actuator from the Off to On
position applies 12V power from J60, a 6-pin mini-fit connector. Green LED DS14
illuminates when the ZC702 board power is on. See Power Management for details on the
onboard power system.
CAUTION! Do NOT plug a PC ATX power supply 6-pin connector into J60 on the ZC702 board. The ATX
6-pin connector has a different pinout than J60. Connecting an ATX 6-pin connector into J60 damages
the ZC702 board and voids the board warranty.
Figure 1-26 shows the power connector J60, power switch SW11 and indicator LED DS14.
VCC12_P
J60 SW11 U78
1
1 VCC12_P_IN 2
12V
4 3 1 8
12V
2 C517 R387
N/C
5 4 330μF 1kΩ
N/C
3 5 25V 1%
COM
6 6
COM
C512
INPUT_GND 1μF 7
25V 6 DS14
3 5
GND GND
INPUT_GND
UG850_c1_26_030513
Figure 1-26: Power On/Off Switch SW11

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UG850 (v1.7) March 27, 2019
Program_B Pushbutton
Switch SW4 grounds the XC7Z020 SoC PROG_B pin when pressed. This action clears
programmable logic configuration, which the PS software can then act on. The
FPGA_PROG_B signal is connected to XC7Z020 SoC U1 pin T11.
See the 7 Series FPGAs Configuration User Guide (UG470) [Ref 8] for further details on
configuring the 7 series FPGAs.
Figure 1-27 shows SW4.

VCC2V5
R51
4.7kΩ
0.1 Ω
5%
To XC7Z020 SoC SW4

FPGA PROG B 2 4
PROGRAM_B_0
(U1.T11) 1 3
GND
UG850_c1_27_032719
Figure 1-27: PROG_B Pushbutton SW4

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UG850 (v1.7) March 27, 2019
PS Power-On and System Reset Pushbuttons

Figure 1-28 shows the reset circuitry for the processing system.
VCC3V3 VCCMIO VCCMIO
R184
VCC3V3 VCCMIO 10.0 K
U2 DS1 0.1Ω
MAX16025 R183 1%
R179 R180 R181 R138 R139 Dual Voltage Monitor 10.0 K
10.0 K 10.0 K 10.0 K 8.06 K 8.06 K R92
and Sequencer 249 0.1Ω
0.1Ω 0.1Ω 0.1Ω 0.1Ω 0.1Ω 1 1% PS_POR_B
1% 1% 1% 1% 1% VCC 0.1Ω
2 12 1% PS_SRST_B
IN1 RST_B
3 11 PS_POR_B_SW 1J28 2 3
IN2 OUT1
6 10 PS_SRST_B_SW 2
1 3
EN1 OUT2
SW1 2 7 16 J27
EN2 CDLY1
13 15 GND
MR_B CDLY2 C3
4 14 0.1 µf
J6 TOL CRESET
9 17 25V
PS_POR_B 1 TH0 EPAD X5R
C5
SW2 2 8 5 0.1 µf
R178 R182 TH1 GND
25V
10.0 K 10.0 K X5R
C4
0.1Ω 0.1Ω 0.1 µf
1% 1% 25V
PS_SRST_B 1 X5R
GND GND
UG850_c1_28_032719
Figure 1-28: PS Power On and System Reset Circuitry
Depressing and then releasing pushbutton SW1 causes PS_POR_B_SW to strobe Low.
PS_POR_B: This reset is used to hold the PS in reset until all PS power supplies are at the
required voltage levels. It must be held Low through PS power-up. PS_POR_B should be
generated by the power supply power-good signal.
Depressing and then releasing pushbutton SW2 causes PS_SRST_B_SW to strobe Low.
This reset is used to force a system reset. It can be tied or pulled High, and can be
PS_SRST_B:
High during the PS supply power ramps.
Refer to the Zynq-7000 SoC Technical Reference Manual (UG585) [Ref 2] for information
concerning the resets.

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UG850 (v1.7) March 27, 2019
FPGA Mezzanine (FMC) Card Interface

The ZC702 board supports the VITA 57.1 FPGA Mezzanine Card (FMC) specification [Ref 6]
by providing subset implementations of low pin count (LPC) connectors at J3 and J4. Both
connectors use a 10 x 40 form factor that is partially populated with 160 pins. The
connectors are keyed so that a the mezzanine card faces away from the ZC702 board when
connected.
Connector Type:
• Samtec SEAF series, 1.27 mm (0.050 in) pitch. Mates with SEAM series connector.
For more information about SEAF series connectors, go to the Samtec website [Ref 28].
LPC Connectors J3 and J4

The 160-pin FMC LPC connector is shown in Figure B-1.
The LPC connections between FMC1 (J3) and XC7Z020 SoC U1 (Table 1-28) and between
FMC2 (J4) and XC7Z020 SoC U1 (Table 1-29) both implement a subset of this connectivity
(GTX is not supported):
• 68 single-ended or 34 differential user-defined signals (34 LA pairs, LA00–LA33)

• 0 GTX transceivers
• 0 GTX clocks
• 2 differential clocks
• 61 ground and 9 power connections
Note: FMC1 (J3) and FMC2 (J4) GA0 = GA1 = 0 (GND).
Table 1-28 shows the LPC connections between J3 and XC7Z020 SoC U1.
Table 1-28: LPC Connections, FMC1 (J3) to XC7Z020 SoC U1

FMC1 Net Name I/O XC7Z020 FMC1 Net Name I/O XC7Z020
J3 Pin Standard (U1) Pin J3 Pin Standard (U1) Pin
C2 NC D1 PWRCTL2_VCC4A_PG
C3 NC D4 NC
C6 NC D5 NC
C7 NC D8 FMC1_LPC_LA01_CC_P LVCMOS25 N19
C10 FMC1_LPC_LA06_P LVCMOS25 J18 D9 FMC1_LPC_LA01_CC_N LVCMOS25 N20
C11 FMC1_LPC_LA06_N LVCMOS25 K18 D11 FMC1_LPC_LA05_P LVCMOS25 N17

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UG850 (v1.7) March 27, 2019
Table 1-28: LPC Connections, FMC1 (J3) to XC7Z020 SoC U1 (Cont’d)

C14 FMC1_LPC_LA10_P LVCMOS25 L17 D12 FMC1_LPC_LA05_N LVCMOS25 N18
C15 FMC1_LPC_LA10_N LVCMOS25 M17 D14 FMC1_LPC_LA09_P LVCMOS25 M15
C18 FMC1_LPC_LA14_P LVCMOS25 J16 D15 FMC1_LPC_LA09_N LVCMOS25 M16
C19 FMC1_LPC_LA14_N LVCMOS25 J17 D17 FMC1_LPC_LA13_P LVCMOS25 P16
C22 FMC1_LPC_LA18_CC_P LVCMOS25 D20 D18 FMC1_LPC_LA13_N LVCMOS25 R16
C23 FMC1_LPC_LA18_CC_N LVCMOS25 C20 D20 FMC1_LPC_LA17_CC_P LVCMOS25 B19
C26 FMC1_LPC_LA27_P LVCMOS25 C17 D21 FMC1_LPC_LA17_CC_N LVCMOS25 B20
C27 FMC1_LPC_LA27_N LVCMOS25 C18 D23 FMC1_LPC_LA23_P LVCMOS25 G15
C30 FMC1_LPC_IIC_SCL D24 FMC1_LPC_LA23_N LVCMOS25 G16
C31 FMC1_LPC_IIC_SDA D26 FMC1_LPC_LA26_P LVCMOS25 F18
C34 GA0 = 0 = GND D27 FMC1_LPC_LA26_N LVCMOS25 E18
C35 VCC12_P D29 FMC1_LPC_TCK_BUF
C37 VCC12_P D30 FMC_TDI_BUF
FMC1_LPC_TDO_FMC2_L
C39 VCC3V3 D31
PC_TDI
D32 VCC3V3
D33 FMC1_LPC_TMS_BUF
D34 NC
D35 GA0 = 0 = GND
D36 VCC3V3
D38 VCC3V3
D40 VCC3V3
FMC1_LPC_CLK1_M2C_
G2 LVCMOS25 M19 H1 NC
P
FMC1_LPC_CLK1_M2C_ FMC1_LPC_PRSNT_M2C_
G3 LVCMOS25 M20 H2
N B
G6 FMC1_LPC_LA00_CC_P LVCMOS25 K19 H4 FMC1_LPC_CLK0_M2C_P LVCMOS25 L18
G7 FMC1_LPC_LA00_CC_N LVCMOS25 K20 H5 FMC1_LPC_CLK0_M2C_N LVCMOS25 L19
G9 FMC1_LPC_LA03_P LVCMOS25 J20 H7 FMC1_LPC_LA02_P LVCMOS25 L21
G10 FMC1_LPC_LA03_N LVCMOS25 K21 H8 FMC1_LPC_LA02_N LVCMOS25 L22
G12 FMC1_LPC_LA08_P LVCMOS25 J21 H10 FMC1_LPC_LA04_P LVCMOS25 M21
G13 FMC1_LPC_LA08_N LVCMOS25 J22 H11 FMC1_LPC_LA04_N LVCMOS25 M22
G15 FMC1_LPC_LA12_P LVCMOS25 N22 H13 FMC1_LPC_LA07_P LVCMOS25 J15
G16 FMC1_LPC_LA12_N LVCMOS25 P22 H14 FMC1_LPC_LA07_N LVCMOS25 K15
G18 FMC1_LPC_LA16_P LVCMOS25 N15 H16 FMC1_LPC_LA11_P LVCMOS25 R20

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UG850 (v1.7) March 27, 2019
Table 1-28: LPC Connections, FMC1 (J3) to XC7Z020 SoC U1 (Cont’d)

G19 FMC1_LPC_LA16_N LVCMOS25 P15 H17 FMC1_LPC_LA11_N LVCMOS25 R21
G21 FMC1_LPC_LA20_P LVCMOS25 G20 H19 FMC1_LPC_LA15_P LVCMOS25 P20
G22 FMC1_LPC_LA20_N LVCMOS25 G21 H20 FMC1_LPC_LA15_N LVCMOS25 P21
G24 FMC1_LPC_LA22_P LVCMOS25 G17 H22 FMC1_LPC_LA19_P LVCMOS25 E19
G25 FMC1_LPC_LA22_N LVCMOS25 F17 H23 FMC1_LPC_LA19_N LVCMOS25 E20
G27 FMC1_LPC_LA25_P LVCMOS25 C15 H25 FMC1_LPC_LA21_P LVCMOS25 F21
G28 FMC1_LPC_LA25_N LVCMOS25 B15 H26 FMC1_LPC_LA21_N LVCMOS25 F22
G30 FMC1_LPC_LA29_P LVCMOS25 B16 H28 FMC1_LPC_LA24_P LVCMOS25 A21
G31 FMC1_LPC_LA29_N LVCMOS25 B17 H29 FMC1_LPC_LA24_N LVCMOS25 A22
G33 FMC1_LPC_LA31_P LVCMOS25 A16 H31 FMC1_LPC_LA28_P LVCMOS25 D22
G34 FMC1_LPC_LA31_N LVCMOS25 A17 H32 FMC1_LPC_LA28_N LVCMOS25 C22
G36 FMC1_LPC_LA33_P LVCMOS25 A18 H34 FMC1_LPC_LA30_P LVCMOS25 E21
G37 FMC1_LPC_LA33_N LVCMOS25 A19 H35 FMC1_LPC_LA30_N LVCMOS25 D21
G39 VADJ H37 FMC1_LPC_LA32_P LVCMOS25 B21
H38 FMC1_LPC_LA32_N LVCMOS25 B22
H40 VADJ

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UG850 (v1.7) March 27, 2019
Table 1-29 shows the LPC connections between FMC2 (J4) and SoC U1.
Table 1-29: LPC Connections, FMC2 (J4) to SoC U1

C2 NC D1 PWRCTL2_VCC4A_PG
C3 NC D4 NC
C6 NC D5 NC
C7 NC D8 FMC2_LPC_LA01_CC_ LVCMOS25 W16
P
C10 FMC2_LPC_LA06_P LVCMOS25 U17 D9 FMC2_LPC_LA01_CC_ LVCMOS25 Y16
N
C11 FMC2_LPC_LA06_N LVCMOS25 V17 D11 FMC2_LPC_LA05_P LVCMOS25 AB19
C14 FMC2_LPC_LA10_P LVCMOS25 Y20 D12 FMC2_LPC_LA05_N LVCMOS25 AB20
C15 FMC2_LPC_LA10_N LVCMOS25 Y21 D14 FMC2_LPC_LA09_P LVCMOS25 U15
C18 FMC2_LPC_LA14_P LVCMOS25 T22 D15 FMC2_LPC_LA09_N LVCMOS25 U16
C19 FMC2_LPC_LA14_N LVCMOS25 U22 D17 FMC2_LPC_LA13_P LVCMOS25 V22
C22 FMC2_LPC_LA18_CC_P LVCMOS25 AA9 D18 FMC2_LPC_LA13_N LVCMOS25 W22
C23 FMC2_LPC_LA18_CC_N LVCMOS25 AA8 D20 FMC2_LPC_LA17_CC_ LVCMOS25 AA7
P
C26 FMC2_LPC_LA27_P LVCMOS25 AB2 D21 FMC2_LPC_LA17_CC_ LVCMOS25 AA6
N
C27 FMC2_LPC_LA27_N LVCMOS25 AB1 D23 FMC2_LPC_LA23_P LVCMOS25 V12
C30 FMC2_LPC_IIC_SCL D24 FMC2_LPC_LA23_N LVCMOS25 W12
C31 FMC2_LPC_IIC_SDA D26 FMC2_LPC_LA26_P LVCMOS25 U12
C34 GA0 = 0 = GND D27 FMC2_LPC_LA26_N LVCMOS25 U11
C35 VCC12_P D29 FMC2_LPC_TCK_BUF
C37 VCC12_P D30 FMC1_LPC_TDO_FMC
2_LPC_TDI
C39 VCC3V3 D31 FMC2_LPC_TDO_FPG
A_TDI
D32 VCC3V3
D33 FMC2_LPC_TMS_BUF
D34 NC
D35 GA0 = 0 = GND
D36 VCC3V3
D38 VCC3V3
D40 VCC3V3
G2 FMC2_LPC_CLK1_M2C_P LVCMOS25 Y6 H1 NC

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UG850 (v1.7) March 27, 2019
Table 1-29: LPC Connections, FMC2 (J4) to SoC U1 (Cont’d)

G3 FMC2_LPC_CLK1_M2C_N LVCMOS25 Y5 H2 FMC2_LPC_PRSNT_M
2C_B
G6 FMC2_LPC_LA00_CC_P LVCMOS25 Y19 H4 FMC2_LPC_CLK0_M2 LVCMOS25 Y18
C_P
G7 FMC2_LPC_LA00_CC_N LVCMOS25 AA19 H5 FMC2_LPC_CLK0_M2 LVCMOS25 AA18
C_N
G9 FMC2_LPC_LA03_P LVCMOS25 AA16 H7 FMC2_LPC_LA02_P LVCMOS25 V14
G10 FMC2_LPC_LA03_N LVCMOS25 AB16 H8 FMC2_LPC_LA02_N LVCMOS25 V15
G13 FMC2_LPC_LA08_N LVCMOS25 AB17 H11 FMC2_LPC_LA04_N LVCMOS25 W13
G15 FMC2_LPC_LA12_P LVCMOS25 W15 H13 FMC2_LPC_LA07_P LVCMOS25 T21
G16 FMC2_LPC_LA12_N LVCMOS25 Y15 H14 FMC2_LPC_LA07_N LVCMOS25 U21
G18 FMC2_LPC_LA16_P LVCMOS25 AB14 H16 FMC2_LPC_LA11_P LVCMOS25 Y14
G19 FMC2_LPC_LA16_N LVCMOS25 AB15 H17 FMC2_LPC_LA11_N LVCMOS25 AA14
G21 FMC2_LPC_LA20_P LVCMOS25 T4 H19 FMC2_LPC_LA15_P LVCMOS25 Y13
G22 FMC2_LPC_LA20_N LVCMOS25 U4 H20 FMC2_LPC_LA15_N LVCMOS25 AA13
G24 FMC2_LPC_LA22_P LVCMOS25 U10 H22 FMC2_LPC_LA19_P LVCMOS25 R6
G25 FMC2_LPC_LA22_N LVCMOS25 U9 H23 FMC2_LPC_LA19_N LVCMOS25 T6
G28 FMC2_LPC_LA25_N LVCMOS25 AB12 H26 FMC2_LPC_LA21_N LVCMOS25 V4
G30 FMC2_LPC_LA29_P LVCMOS25 AA11 H28 FMC2_LPC_LA24_P LVCMOS25 U6
G31 FMC2_LPC_LA29_N LVCMOS25 AB11 H29 FMC2_LPC_LA24_N LVCMOS25 U5
G33 FMC2_LPC_LA31_P LVCMOS25 AB10 H31 FMC2_LPC_LA28_P LVCMOS25 AB5
G34 FMC2_LPC_LA31_N LVCMOS25 AB9 H32 FMC2_LPC_LA28_N LVCMOS25 AB4
G36 FMC2_LPC_LA33_P LVCMOS25 Y11 H34 FMC2_LPC_LA30_P LVCMOS25 AB7
G37 FMC2_LPC_LA33_N LVCMOS25 Y10 H35 FMC2_LPC_LA30_N LVCMOS25 AB6
G39 VADJ H37 FMC2_LPC_LA32_P LVCMOS25 Y4
H38 FMC2_LPC_LA32_N LVCMOS25 AA4
H40 VADJ

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UG850 (v1.7) March 27, 2019
Power Management
TheZC702 PCB layout and power system design meets the recommended criteria described
in the Zynq-7000 SoC PCB Design Guide (UG933) [Ref 13].
The ZC702 board power distribution diagram is shown in Figure 1-29.

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UG850 (v1.7) March 27, 2019
J60
12 V
Power Controller 1 (Core) U32
PMBus Addr 0b0110100
Switching Regulator VCCINT

1.0V at 10A
Switching Regulator VCCPINT

1.0V at 10A U17
Switching Regulator VCCAUX

1.8V at 10A
Switching Regulator VCCPAUX

1.8V at 10A U18
Power Controller 2 (Aux) U33

Switching Regulator VCCADJ

2.5V at 10A
Switching Regulator VCC1V5

1.5V at 10A U19
Switching Regulator VCCMIO

1.8V at 10A
Switching Regulator VCCBRAM

1.0V at 10A U20
Power Controller 3 U34


3.3V at 10A

2.5V at 10A U21
Linear Regulator
0.75V at 3A U22 VTTDDR
VREF
UG850_c1_29_090215
Figure 1-29: Onboard Power Regulators

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UG850 (v1.7) March 27, 2019
The ZC702 board uses power regulators and a PMBus compliant system controller from
Texas Instruments to supply core and auxiliary voltages as listed in Table 1-30. The Texas
Instruments Fusion Digital Power graphical user interface is used to monitor the voltage
and current levels of the board power modules.
Table 1-30: Onboard Power System Devices

Reference Power Rail Power Rail Schematic
Device Type Description
Designator Net Name Voltage Page
Core voltage controller and regulators
UCD9248PFC PMBus Controller – Core

U32 39
Addr = 52 dec., 0b0110100)
PTD08D210W—VoutA Dual 10A 0.6V– 3.6V Adj. Switching

VCCINT 1.00V 40
Regulator
U17
PTD08D210W — VoutB Dual 10A 0.6V– 3.6V Adj. Switching
VCCPINT 1.00V 40
Regulator
PTD08D210W — VoutA Dual 10A 0.6V– 3.6V Adj. Switching

VCCAUX 1.80V 41
Regulator
U18
VCCPAUX 1.80V 41
Regulator
Auxiliary voltage controller and regulators
UCD9248PFC PMBus Controller – Aux

U33 42
Addr = 53 dec., 0b0110101)

Regulator VADJ 2.50V 43
U19 (set to 1.8V, 2.5V or 3.3V)

VCC1V5 1.50V 43
Regulator

VCCMIO_PS 1.80V 44
Regulator
U20
VCCBRAM 1.00V 44
Regulator
UCD9248PFC PMBus Controller – Aux

U34 45
Addr = 54 dec., 0b0110110)

VCC3V3 3.30V 46
Regulator
U21
PTD08D210W — VoutB Dual 10A 0.6V– 3.6V Adj. Switching VCC2V5/
2.50V 46
Regulator VCC2V5_PL
Linear regulator
TPS51200DR U22 3A Tracking Regulator VTTDDR_PS 0.75V 37

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UG850 (v1.7) March 27, 2019
VADJ Voltage Control

The VADJ rail is set to 2.5V. When the ZC702 board is powered on, the state of the
FMC_VADJ_ON_B signal wired to header J12 is sampled by the TI UCD9248 controller U33.
If a jumper is installed on J12 signal FMC_VADJ_ON_B is held Low, and the TI controller U33
energizes the VADJ rail at power on.
Because the rail turn on decision is made at power on time based on the presence of the J12
jumper, removing the jumper at J12 after the board is powered up does not affect the 2.5V
power delivered to the VADJ rail and it remains on.
A jumper installed at J12 is the default setting.
If a jumper is not installed on J12, signal FMC_VADJ_ON_B is High, and the ZC702 board
does not energize the VADJ 2.5V at power on. In this mode you can control when to turn on
VADJ and to what voltage level (1.8V, 2.5V or 3.3V only). With VADJ off, the XC7Z020 SoC
still configures and has access to the TI controller PMBUS along with the FMC_VADJ_ON_B
signal. The combination of these allows the user to develop code to command the VADJ rail
to be set to something other than the default setting of 2.5V. After the new VADJ voltage
level has been programmed into TI controller U33, the FMC_VADJ_ON_B signal can be
driven Low by the user logic and the VADJ rail comes up at the new VADJ voltage level.
Installing a jumper at J12 after a ZC702 board powers up in this mode turns on the VADJ rail.
The FMC_VADJ_ON_B signal is sourced by the TCA6416APWR I2C port expander U80 pin 13
(see Figure 1-18).
The I2C port expander IIC_PORT_EXPANDER SDA/SCL bus is wired to the PCA9548ARGER
I2C bus switch (see I2C Bus).
Documentation describing PMBUS programming for the UCD9248 digital power controller
is available at TI [Ref 25].
Monitoring Voltage and Current

Voltage and current monitoring and control are available for selected power rails through
Texas Instruments' Fusion Digital Power graphical user interface. The three onboard TI
power controllers (U32 at address 52 decimal, U33 at address 53 decimal, and U34 at
address 54 decimal) are wired to the same PMBus. The PMBus connector, J59, is provided
for use with the TI USB Interface Adapter PMBus pod (TI part number EVM USB-TO-GPIO,
which can be ordered from the Texas Instruments website [Ref 26] and associated TI Fusion
Digital Power Designer GUI [Ref 27]. This is the simplest and most convenient way to
monitor the voltage and current values for the power rail listed in Table 1-31, Table 1-32,
and Table 1-33.
In each of these the three tables (one per controller), the Power Good (PG) On Threshold is
the setpoint at or above which the particular rail is deemed “good”. The PG Off Threshold is
the setpoint at or below which the particular rail is no longer deemed “good”. The controller

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UG850 (v1.7) March 27, 2019
internally OR's these PG conditions together and drives an output PG pin High only if all
active rail PG states are “good”. The On and Off Delay and rise and fall times are relative to
when the board power on-off slide switch SW12 is turned on and off.
Table 1-31 defines the voltage and current values for each power rail controlled by the
UCD9248 PMBus controller at address 52 decimal (U32).
Table 1-31: Power Rail Specifications for UCD9248 PMBus Controller at Address 52 Decimal
Shutdown Threshold (1)
Temp Over Fault (°C)

VOUT Over Fault (V)
IOUT Over Fault (A)

Nominal VOUT (V)
Off Threshold (V)

On Threshold (V)
Rise Time (ms)
Off Delay (ms)

On Delay (ms)
Fall Time (ms)

Rail Rail
Number Name Rail Name
PG
PG
1 Rail #1 VCCINT 1 0.9 0.85 0 5 10 1 1.15 20 90
2 Rail #2 VCCPINT 1 0.9 0.85 0 5 10 1 1.15 20 90
3 Rail #3 VCCAUX 1.8 1.62 1.53 0 5 5 1 2.07 10.41 90
4 Rail #4 VCCPAUX 1.8 1.62 1.53 0 5 5 1 2.07 10.41 90
Notes:
1. The values defined in these columns are the voltage, current, and temperature thresholds that causes the regulator to shut
down if the value is exceeded.

VOUT Over Fault (V)
IOUT Over Fault (A)

Nominal VOUT (V)
Off Threshold (V)

On Threshold (V)
Rise Time (ms)
Off Delay (ms)

On Delay (ms)
Fall Time (ms)
Rail Rail Schematic

PG
PG
1 Rail #1 VADJ 2.5 2.25 2.125 0 5 1 1 2.875 10.41 90
2 Rail #2 VCC1V5 1.5 1.35 1.275 0 5 0 1 1.725 10.41 90
3 Rail #3 VCCMIO_PS 1.8 1.62 1.53 0 5 5 1 2.07 10.41 90
4 Rail #4 VCCBRAM 1 0.9 0.85 0 5 10 1 1.15 20 90
Notes:

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UG850 (v1.7) March 27, 2019

VOUT Over Fault (V)
IOUT Over Fault (A)

Nominal VOUT (V)
Off Threshold (V)

On Threshold (V)
Rise Time (ms)
Off Delay (ms)

On Delay (ms)
Fall Time (ms)

Rail Rail Schematic
PG
PG
1 Rail #1 VCC3V3 3.3 2.97 2.805 0 5 4 1 3.795 10.41 90
2 Rail #2 VCC2V5 2.5 2.25 2.125 0 5 1 1 2.875 10.41 90
Notes:
Cooling Fan
The XC7Z020 SoC cooling fan connector J61 is wired directly to 12VDC as shown in
Figure 1-30.
VCC12_P
J61
3
NC
2
GND
UG850_c1_30_030513
Figure 1-30: Cooling Fan Circuit

More information about the power system components used by the ZC702 board are
available from the Texas Instruments digital power website [Ref 25].

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UG850 (v1.7) March 27, 2019
XADC Analog-to-Digital Converter

The XC7Z020 SoC provides an Analog Front End XADC block. The XADC block includes a
dual 12-bit, 1 MSPS Analog-to-Digital Converter (ADC) and on-chip sensors. See the
7 Series FPGAs XADC Dual 12-Bit 1MSPS Analog-to-Digital Converter User Guide (UG480)
[Ref 9] for details on the capabilities of the analog front end. Figure 1-31 shows the XADC
block diagram.
U1 VCCAUX
XC7Z020 Ferrite Bead
SoC
1 J38
To J70.3
XADC_VCC Header J40
XADC_VCC 2 VCC5V0 To Header J40 VCC5V0
VCCADC 1.8V 150 mV max
U10 Ferrite Bead
100 nF
3 ADP123
Close to J65
Package Pins Out In
Gnd 10 μF
10 μF
XADC_AGND
GNDADC
XADC_AGND
XADC_AGND
Filter 5V Supply
Locate Components on Board
To Header J40 U29 1 J70

REF3012
VREF (1.25V) 2
Out In
1 J37 Gnd
VREFP 2 10 μF 3
VREFP XADC_VCC
Internal
Reference
100 nF
3
Close to Ferrite Bead
Dual Use IO XADC_AGND
(Analog/Digital)
Package Pins J9
VREFN
100Ω 100Ω
VAUX0P GND
VP XADC_AGND
1 nF 1 nF Star Grid
Connection
J8
VAUX0N VN
To 100Ω 100Ω To
Header Header
J49 100Ω DXP J40
VAUX8P
1 nF
VAUX8N DXN
100Ω
UG850_c1_31_031819
Figure 1-31: XADC Block Diagram
The ZC702 board supports both the internal XC7Z020 SoC sensor measurements and the
external measurement capabilities of the XADC. Internal measurements of the die
temperature, VCCINT, VCCAUX, and VCCBRAM are available.

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UG850 (v1.7) March 27, 2019
Jumper J37 can be used to select either an external voltage reference (VREF) or on-chip
voltage reference for the analog-to-digital converter.
For external measurements an XADC header (J19) is provided. This header can be used to
provide analog inputs to the XC7Z020 SoC dedicated VP/VN channel, and to the
VAUXP[0]/VAUXN[0], VAUXP[8]/VAUXN[8] auxiliary analog input channels. Simultaneous
sampling of Channel 0 and Channel 8 is supported.
A user-provided analog signal multiplexer card can be used to sample additional external
analog inputs using the 4 GPIO pins available on the XADC header as multiplexer address
lines. Figure 1-32 shows the XADC header connections.
J40
XADC_VN 1 2 XADC_VP
XADC_VAUX0P 3 4
5 6 XADC_VAUX0N
XADC_VCC5V0 XADC_VAUX8N 7 8 XADC_VAUX8P
VADJ XADC_DXP 9 10
XADC_VREF 11 12 XADC_DXN
13 14 XADC_VCC_HEADER
15 16
XADC_GPIO_1 17 18 XADC_GPIO_0
XADC_GPIO_3 19 20 XADC_GPIO_2
GND
XADC_AGND XADC_AGND
UG850_c1_32_030513
Figure 1-32: XADC Header (J40)

Table 1-34 describes the XADC header J40 pin functions.
Table 1-34: XADC Header J40 Pinout

J19 Pin
Net Name Number Description
VN, VP 1, 2 Dedicated analog input channel for the XADC.

Auxiliary analog input channel 0. Also supports use as I/O inputs when
XADC_VAUX0P, N 3, 6
anti alias capacitor is not present.
Auxiliary analog input channel 8. Also supports use as I/O inputs when
XADC_VAUX8N, P 7, 8
anti alias capacitor is not present.
DXP, DXN 9, 12 Access to thermal diode.
XADC_AGND 4, 5, 10 Analog ground reference.
XADC_VREF 11 1.25V reference from the board.
XADC_VCC5V0 13 Filtered 5V supply from board.
XADC_VCC_HEADER 14 Analog 1.8V supply for XADC.
VADJ 15 VCCO supply for bank which is the source of DIO pins.
GND 16 Digital Ground (board) Reference
Digital I/O. These pins should come from the same bank. These I/Os
XADC_GPIO_3, 2, 1, 0 19, 20, 17, 18 should not be shared with other functions because they are required to
support 3-state operation.

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UG850 (v1.7) March 27, 2019
Appendix A
Default Switch and Jumper Settings
Switches
Default switch settings are listed in Table A-1.
Table A-1: Default Switch Settings
Switch Position Setting Figure 1-2

Callout
SW10 1 Off
23
(JTAG chain input select two-position DIP switch) 2 On
SW12 1 Off
19
(two-position DIP switch) 2 Off
SW15 1 Off
19
(two-position DIP switch) 2 Off
1 Right
2 Right
SW16
3 Right 29
(five-position DIP switch)
4 Right
5 Right

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UG850 (v1.7) March 27, 2019
Jumpers
Jumpers
Default jumper positions are listed in Table A-2. Jumper locations are shown in Figure A-1.
Table A-2: Default Jumper Settings

Callout Jumper Function Default Position
HDR_1 X 2
1 J5 CFGBVS short to GND OFF
ZC702 configuration bank 0 is operated at
2.5V, therefore the CFGBVS pin is pulled high
with a resistor. Jumper J5 should be never
installed.
2 J6 POR Master Reset OFF
3 J7 USB 2.0 USB_VBUS_SEL 1-2
4 J8 XADC GND L3 BYPASS OFF
5 J9 XADC GND ON
6 J10 ARM HDR J41 PIN 2 TO VADJ OFF
7 J11 UCD9248 U32 ADDR52 RESET_B OFF
8 J12 FMC VADJ OFF ON
11 J15 CAN BUS COMMON-MODE CANH HDR 1-2
12 J43 ETHERNET PHY HDR 1-2
13 J44 USB 2.0 USB_RESET_B OFF
14 J53 CAN BUS COMMON-MODE CANL HDR 1-2
15 J56 JTAG HDR J58 PIN 2 3.3V SEL OFF
16 J65 XADC_VCC5V0 = VCC5V0 ON
HDR_1 X 3
17 J20 MIO3/QSPI_IO1 OFF
21 J26 MIO6/QSPI_CLK OFF
22 J27 PS_SRST_B 1-2
23 J28 PS_POR_B 1-2
24 J30 ETHERNET PHY HDR 1-2

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Jumpers
Table A-2: Default Jumper Settings (Cont’d)

Callout Jumper Function Default Position
25 J31 ETHERNET PHY HDR NONE
26 J32 ETHERNET PHY HDR NONE
27 J33 USB 2.0 MODE 2-3
28 J34 USB 2.0 J1 ID SEL 1-2
29 J35 USB 2.0 J1 VBUS CAP SEL 1-2
30 J36 USB 2.0 J1 GND SEL 1-2
31 J37 XADC_VREP SEL 1-2
32 J38 XADC_VCC SEL 2-3
33 J70 XADC_VREF SOURCE SEL 2-3

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Jumpers
Figure A-1 shows jumper locations described in this table.

X-Ref Target - Figure A-1
21
22 23 18 17 19 20
5 4
9
16
32 33
31
15
11
14
3
13 27 10
29
25
28
24 26
12 30
UG850_a1_01_011415
Figure A-1: Jumper Locations

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Appendix B
VITA 57.1 FMC Connector Pinouts

Figure B-1 shows the pinout of the FPGA mezzanine card (FMC) low pin count (LPC)
connector defined by the VITA 57.1 FMC specification. For a description of how the ZC702
board implements the FMC specification, see FPGA Mezzanine (FMC) Card Interface and
LPC Connectors J3 and J4.
X-Ref Target - Figure B-1
K J H G F E D C B A
1 NC NC VREF_A_M2C GND NC NC PG_C2M GND NC NC
2 NC NC PRSNT_M2C_L CLK1_M2C_P NC NC GND DP0_C2M_P NC NC
3 NC NC GND CLK1_M2C_N NC NC GND DP0_C2M_N NC NC
4 NC NC CLK0_M2C_P GND NC NC GBTCLK0_M2C_P GND NC NC
5 NC NC CLK0_M2C_N GND NC NC GBTCLK0_M2C_N GND NC NC
6 NC NC GND LA00_P_CC NC NC GND DP0_M2C_P NC NC
7 NC NC LA02_P LA00_N_CC NC NC GND DP0_M2C_N NC NC
8 NC NC LA02_N GND NC NC LA01_P_CC GND NC NC
9 NC NC GND LA03_P NC NC LA01_N_CC GND NC NC
10 NC NC LA04_P LA03_N NC NC GND LA06_P NC NC
11 NC NC LA04_N GND NC NC LA05_P LA06_N NC NC
12 NC NC GND LA08_P NC NC LA05_N GND NC NC
13 NC NC LA07_P LA08_N NC NC GND GND NC NC
14 NC NC LA07_N GND NC NC LA09_P LA10_P NC NC
15 NC NC GND LA12_P NC NC LA09_N LA10_N NC NC
17 NC NC LA11_N GND NC NC LA13_P GND NC NC
18 NC NC GND LA16_P NC NC LA13_N LA14_P NC NC
19 NC NC LA15_P LA16_N NC NC GND LA14_N NC NC
20 NC NC LA15_N GND NC NC LA17_P_CC GND NC NC
21 NC NC GND LA20_P NC NC LA17_N_CC GND NC NC
22 NC NC LA19_P LA20_N NC NC GND LA18_P_CC NC NC
23 NC NC LA19_N GND NC NC LA23_P LA18_N_CC NC NC
24 NC NC GND LA22_P NC NC LA23_N GND NC NC
26 NC NC LA21_N GND NC NC LA26_P LA27_P NC NC
27 NC NC GND LA25_P NC NC LA26_N LA27_N NC NC
29 NC NC LA24_N GND NC NC TCK GND NC NC
30 NC NC GND LA29_P NC NC TDI SCL NC NC
31 NC NC LA28_P LA29_N NC NC TDO SDA NC NC
32 NC NC LA28_N GND NC NC 3P3VAUX GND NC NC
33 NC NC GND LA31_P NC NC TMS GND NC NC
34 NC NC LA30_P LA31_N NC NC TRST_L GA0 NC NC
35 NC NC LA30_N GND NC NC GA1 12P0V NC NC
36 NC NC GND LA33_P NC NC 3P3V GND NC NC
37 NC NC LA32_P LA33_N NC NC GND 12P0V NC NC
38 NC NC LA32_N GND NC NC 3P3V GND NC NC
39 NC NC GND VADJ NC NC GND 3P3V NC NC
40 NC NC VADJ GND NC NC 3P3V GND NC NC
UG850_aB_01_081612
Figure B-1: FMC LPC Connector Pinout

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Appendix C
Xilinx Design Constraints
Overview
The ZC702 Xilinx® Design Constraints (XDC) template provides for designs targeting the
ZC702 board. Net names in the constraints correlate with net names on the latest ZC702
board schematic. You must identify the appropriate pins and replace the net names below
with net names in your RTL.
See the Vivado Design Suite User Guide: Using Constraints (UG903) [Ref 12] for more
information.
The FMC LPC connectors J3 and J4 are connected to 2.5V VADJ banks. Because different
FMC cards implement different circuitry, the FMC bank I/O standards must be uniquely
defined by each customer.
Note: The ZC702 ucf/xdc files are under the Documentation tab of the Zynq-7000 SoC ZC702
Evaluation Kit product page. Click the Board Files check box, find the XTP185 ZC702 Schematics
entry, and expand the Associated File(s) list.

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Appendix D
Board Specifications
Dimensions
Width: 7.750 in. (19.685 cm)
Length: 7.150 in. (18.161 cm)
Environmental
Temperature
Operating: 0°C to +45°C
Storage: –25°C to +60°C
Humidity
10% to 90% non-condensing
Operating Voltage
+12 VDC

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Appendix E
Regulatory and Compliance Information
Overview
This product is designed and tested to conform to the European Union directives and
standards described in this section.
Refer to the ZC702 board master answer record concerning the CE requirements for the PC
Test Environment: ZC702 Evaluation Kit – Master Answer Record 47864
The Zynq-7000 ZC702 Declaration of Conformity is online.
CE Directives
2006/95/EC, Low Voltage Directive (LVD)
2004/108/EC, Electromagnetic Compatibility (EMC) Directive
CE Standards
EN standards are maintained by the European Committee for Electrotechnical
Standardization (CENELEC). IEC standards are maintained by the International
Electrotechnical Commission (IEC).
Electromagnetic Compatibility
EN 55022:2010, Information Technology Equipment Radio Disturbance Characteristics –
Limits and Methods of Measurement
EN 55024:2010, Information Technology Equipment Immunity Characteristics – Limits and

Methods of Measurement

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Markings
IMPORTANT: This is a Class A product. In a domestic environment, this product can cause radio
interference, in which case the user might be required to take adequate measures.
Safety
IEC 60950-1:2005, Information technology equipment – Safety, Part 1: General requirements
EN 60950-1:2006, Information technology equipment – Safety, Part 1: General requirements
Markings
In August of 2005, the European Union (EU) implemented the EU
WEEE Directive 2002/96/EC and later the WEEE Recast Directive
2012/19/EU requiring Producers of electronic and electrical
equipment (EEE) to manage and finance the collection, reuse,
recycling and to appropriately treat WEEE that the Producer places
on the EU market after August 13, 2005. The goal of this directive is
to minimize the volume of electrical and electronic waste disposal
and to encourage re-use and recycling at the end of life.
Xilinx has met its national obligations to the EU WEEE Directive by

registering in those countries to which Xilinx is an importer. Xilinx
has also elected to join WEEE Compliance Schemes in some
countries to help manage customer returns at end-of-life.
If you have purchased Xilinx-branded electrical or electronic

products in the EU and are intending to discard these products at
the end of their useful life, please do not dispose of them with your
other household or municipal waste. Xilinx has labeled its branded
electronic products with the WEEE Symbol to alert our customers
that products bearing this label should not be disposed of in a
landfill or with municipal or household waste in the EU.
This product complies with Directive 2002/95/EC on the restriction

of hazardous substances (RoHS) in electrical and electronic
equipment.
This product complies with CE Directives 2006/95/EC, Low Voltage

Directive (LVD) and 2004/108/EC, Electromagnetic Compatibility
(EMC) Directive.

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Appendix F
Additional Resources
Xilinx Resources
For support resources such as Answers, Documentation, Downloads, and Forums, see the
Xilinx Support website.
For continual updates, add the Answer Record to your myAlerts.
Solution Centers
See the Xilinx Solution Centers for support on devices, software tools, and intellectual
property at all stages of the design cycle. Topics include design assistance, advisories, and
troubleshooting tips.
References
The most up to date information related to the ZC702 board and its documentation is
available on the following websites.
ZC702 Evaluation Kit
ZC702 Evaluation Kit – Master Answer Record 47864
These Xilinx documents provide supplemental material useful with this guide:
1. Zynq-7000 SoC Data Sheet: Overview (DS190)

2. Zynq-7000 SoC Technical Reference Manual (UG585)
3. Zynq-7000 SoC (Z-7007S, Z-7012S, Z-7014S, Z-7010, Z-7015, and Z-7020): DC and AC
Switching Characteristics (DS187)
4. 7 Series FPGAs Memory Interface Solutions v1.8 User Guide (UG586)
5. 7 Series FPGAs Memory Resources User Guide (UG473)

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References
6. VITA FMC Marketing Alliance - VITA 57.1 base standard: www.vita.com/standards

7. Tri-Mode Ethernet MAC LogiCORE IP Product Guide (PG051)
8. 7 Series FPGAs Configuration User Guide (UG470)
9. 7 Series FPGAs XADC Dual 12-Bit 1MSPS Analog-to-Digital Converter User Guide
(UG480)
10. Zynq-7000 SoC Packaging and Pinout Product Specification (UG865)
11. AMS101 Evaluation Card User Guide (UG886)
12. Vivado Design Suite User Guide: Using Constraints (UG903)
13. Zynq-7000 SoC PCB Design Guide (UG933)
The following websites provide supplemental material useful with this guide:
14. Micron Technology: www.micron.com

(N25Q128A11ESF40G, MT41J256M8HX-15E)
15. Standard Microsystems Corporation: www.smsc.com/
(USB3320)
16. SanDisk Corporation: www.sandisk.com
17. SD Association: www.sdcard.org
18. SiTime: www.sitime.com
(SiT8103, SiT9102)
19. Silicon Labs: www.silabs.com
(Si570, Si5324C)
20. Marvell Semiconductor: www.marvell.com
(88E1116R)
21. Analog Devices: www.analog.com/en/index.html
(ADV7511KSTZ-P, ADP123)
22. Epson Electronics America: www.eea.epson.com and
www.eea.epson.com/portal/pls/portal/docs/1/1413485.PDF
(RTC-8564JE)
23. Digilent: www.digilentinc.com and
www.digilentinc.com/Products/Catalog.cfm?NavPath=2,401&Cat=9
(Pmod Peripheral Modules)
24. NXP Semiconductors: ics.nxp.com
(TJA01040)
25. Texas Instruments: www.ti.com, www.ti.com/fusiondocs,
www.ti.com/ww/en/analog/digital-power/index.html and (UCD9248PFC, PTD08A010W,
PTD08A020W, PTD08D210W, LMZ12002, TL1962ADC, TPS51200DR, PCA9548)

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References
26. Texas Instruments EVM USB-TO-GPIO: www.ti.com/xilinx_usb.

27. Texas Instruments TI Fusion Digital Power Designer GUI, downloadable from:
http://www.ti.com/fusion-gui
28. Samtec: www.samtec.com.
(SEAF series connectors)
29. Integrated Device Technology: www.idt.com
(ICS844021I)

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ZC702 Evaluation Board

for the Zynq-7000

UG850 (v1.7) March 27, 2019

Date Version Revision

ZC702 Board User Guide www.xilinx.com 2

ZC702 Board User Guide www.xilinx.com 3

ZC702 Board User Guide www.xilinx.com 4

Chapter 1: ZC702 Evaluation Board Features

ZC702 Board User Guide www.xilinx.com 5

Appendix A: Default Switch and Jumper Settings

Appendix B: VITA 57.1 FMC Connector Pinouts

Appendix C: Xilinx Design Constraints

Appendix D: Board Specifications

Appendix E: Regulatory and Compliance Information

ZC702 Board User Guide www.xilinx.com 6

ZC702 Board User Guide www.xilinx.com 7

ZC702 Evaluation Board Features

ZC702 Board Features

• Zynq XC7Z020-1CLG484C device

° Fixed 200 MHz LVDS oscillator (differential)

° I2C programmable LVDS oscillator (differential)

° Fixed 33.33 MHz LVCMOS oscillator (single-ended)

ZC702 Board User Guide www.xilinx.com 8

• I2C bus multiplexed to:

° Si570 user clock

° ADV7511 HDMI codec

° M24C08 EEPROM (1 kB)

° 1-To-16 TCA6416APWR port expander

° RTC-8564JE real time clock

° FMC1 LPC connector

° FMC2 LPC connector

° Two programmable logic (PL) user pushbuttons

° PL user DIP switch (2-pole)

° Eight PL user LEDs

° Two PS user LEDs

° Dual row Pmod GPIO header

° Single row Pmod GPIO header

° SRST_B PS reset button

° POR_B PS reset button

ZC702 Board User Guide www.xilinx.com 9

° Quad SPI flash memory

° USB JTAG configuration port (Digilent module)

° Platform cable header JTAG configuration port

° 20-pin PL PJTAG header

° 20-pin PS JTAG header

CAN Bus ARM PJTAG

Mechanicals 10/100/1,000 USB 2.0 ULPI HDMI Codec Configurable XADC

Figure 1-1: ZC702 Board Block Diagram

ZC702 Board User Guide www.xilinx.com 10

Electrostatic Discharge Caution

To prevent ESD damage:

ZC702 Board User Guide www.xilinx.com 11

X-Ref Target - Figure 1-2

Figure 1-2: ZC702 Board Component Locations

Table 1-1: ZC702 Board Component Descriptions

1 U1 Zynq-7000 XC7Z020 SoC Xilinx part number: XC7Z020-1CLG484C

2 4 each 256Mb X 8 SDRAM Micron

3 U41 Quad-SPI Flash Memory, 128 Mb Micron N25Q128A11ESF40G 20

ZC702 Board User Guide www.xilinx.com 12