Technical Information: Range-Free Controller FA-M3 System Upgrade Guide

Technical Range-free Controller FA-M3
Information System Upgrade Guide

TI 34M06Z42-01E
www.yokogawa.com/itc/
TI 34M06Z42-01E
2018.06 2nd Edition (YK)
Yokogawa Electric Corporation
１. Introduction 1
1. Introduction
The FA-M3 has been used in many systems since its debut in December 1992.
Early systems now require replacement of parts with service life for preventive
maintenance or system upgrade.
The operational economy of a system declines as it ages due to more frequent

aged deterioration related failures, obsolete functions and higher system
maintenance cost. Customers need to carry out appropriate upgrade to lower
cost and increase future corporate competitiveness.
This document focuses on the description of system upgrade to the latest product
models.
■ NOTE
・ Information in this document is current as of May 2018 and subject to
change without notice. Contact Yokogawa’s sales representative for the
latest information.
・ For engineering support, contact Yokogawa’s sales representative:
Refer to Yokogawa’s website:

https://www.yokogawa.com/ioc /w-locations/ioc-w-locations-index-en.htm
・ Proper nouns such as product and company names contained herein are
registered trademarks or trademarks of their respective owners.
All Rights Reserved. Copyright © 2018, Yokogawa Electric Corporation TI 34M06Z42-01E 2018.06-00
１. Introduction 2
1.1 Merits of System Upgrade

■ Benefit from the latest technologies
● Technologies that were not well established when existing systems
were introduced can be put into practical use, and applied to system
control to greatly enhance efficiency.
■ Benefit from improved basic performance

● Much faster controllers and the latest control equipment such as FA
servo and general-purpose inverters greatly improve system
productivity and economy.
■ Benefit from networking

● Remote monitoring/control systems enable operation status of
devices to be monitored and maintained remotely over the Internet
and intranets. Adoption of an open network as represented by FL-
net allows flexible selection of equipment from different vendors.
Figure 1.1 Merits of system upgrade
２. System degradation and recommended replacement cycle 3
2. System Degradation and

Recommended Replacement Cycle
2.1 Aged deterioration of system
■ The failure rate of a system can be taken as the total failure
rates of its component parts. It has been shown empirically
that the deterioration of component parts is greatly affected by
installation environmental conditions as described below:
● Temperature: Failure rate doubles when temperature is 10°C higher
● Humidity: Corrosion of contacts accelerate when humidity exceeds

60%
● Corrosive gas: Causes corrosion of contacts
● Dust: Causes short circuit failures and corrosion
Figure 2.1. Aged deterioration of systems (Bathtub curve)
2.2 Recommended replacement cycle for

FA-M3
■ Recommended replacement cycle: 10 years
However, modules that use parts with service life have the
following cycles.
● Modules that use aluminium electrolytic capacitors: 8 years
● Modules that use relays
Electrical life: 100 thousand cycles,

mechanical life: 20 million operations
● Modules that use photocouplers: 5 years
When used in high temperatures (about 45°C or higher)
IMPORTANT
・ Recommended replacement cycle is a time period for preventive
maintenance of parts with service life, but is not a guarantee against random
failures.
・ Recommended replacement cycle is a guide, and varies with operating
conditions.
2.3 Examples of failure of parts with

service life
■ Aluminium electrolytic capacitor
● Generally, electrostatic capacitance drops, and electrolyte leakage
appears after 8 and 15 years respectively, and may cause power output
interruptions, changes in signal characteristics at power on/off and
circuit malfunction, etc.
■ Relays
● Small relays have a mechanical life due to mechanical wear.
● Prolonged use may result in insulation degradation due to formation of

products of corrosion or conductive dust deposit, or poor contact due
to entry of dust and foreign substances at contact points or corrosive
film build-up on contact surfaces. Replacement at the recommended
replacement cycle is advisable.
■ Photocoupler
● Generally, the light-emitting element of a photocoupler has an
expected life, and in some FA-M3 modules, wearout failures appear
after about 5 to 6 years depending on temperature and other
environment conditions.
Figure2.2 Electrolyte leakage Figure 2.3 Corrosion of contacts
2.4 Modules that use parts with service life

■ Modules that use aluminium electrolytic capacitors
Recommended replacement cycle: 8 years
Table 2.1 Modules that use aluminium electrolytic capacitors
Category Model name

Power supply module F3PU□□-□N F3PU□□-□S
CPU/power supply module for Value set F3SP05-0P F3SP08-□P
F3AD04-0N F3AD04-0R F3AD04-0V
Analog input module F3AD08-1N F3AD08-1V F3AD08-4V
F3AD08-1R
Analog output module F3DA02-0N F3DA04-1N F3DA08-5N
Temperature control/monitoring module F3CT04-□N F3CR04-□N
PID control module F3CV04-1N
Positioning module F3NC5□-0N F3NC61-0N
■ Modules that use relays

Electrical service life: 100 thousand times or more
Mechanical service life: 20 million times or more
Table 2.2 Modules that use relays
Category Model name

Power supply module F3PU□□-□N F3PU□□-□S
CPU/power supply module for Value set F3SP05-0P F3SP08-□P
Relay output module F3YC08-0N F3YC08-0C F3YC16-0N
IMPORTANT
・ The CPU module uses a large capacity lithium battery, which has continuous
backup capacity beyond its service life (10 years) but replacement (for each
module) at end of service life is recommended.
■ Modules that use photocouplers (with recommended
replacement cycle below 10 years)
Recommended replacement cycle: 5 years (When used in
high temperature environment (about 45°C or higher))
Table 2.3 Modules that use photocouplers
Category Model name

FA link module F3LP01-0N
FA link H module F3LP02-0N
High-speed counter module F3XP01-0H F3XP02-0H
F3AD04-0N F3AD04-0R F3AD04-0V
Analog input module F3AD08-1N F3AD08-1V F3AD08-4V
F3AD08-1R
Temperature control/PID module F3CU04-0N F3CU04-1N
Temperature monitoring module F3CX04-0N
３. System upgrade procedure 8
3. System Upgrade Procedure

3.1 Upgrading FA-M3
■ Evolution of FA-M3
● The evolution of FA-M3 since its debut in 1992 has always considered
upward compatibility so an existing FA-M3 system can be easily
migrated to the latest FA-M3V.
■ Upgrade procedure
● STEP 1: Select replacement module
Select a replacement module by referring to replacement product
table.
● STEP 2: Convert ladder programs

Ladder programs are upward compatible so existing programs
developed using earlier programming tools can be converted for new
programming environment.
● STEP 3: Other changes

・Adjust for higher processing speed
The faster processor in the latest sequence CPU module allows a much shorter
scan time. Timing adjustment might be necessary for scan-time dependent
processing.
・Modify ladder program after upgrading special module

Some special module models are software incompatible with replacement
products. Replacement guides are available for these.
3.2 Sequence CPU module evolution

Figure 3.1 Sequence CPU module evolution
3.3 Select replacement module (STEP1)

3.3.1 Replacement product table: Sequence CPU
module
Table 3.1 Replacement products for discontinued sequence CPU modules
Discontinued Replacement Programming

Item Compatible Main changes
product product tool
F3SP20-0N F3SP22-0S ✓ High-speed/larger memory WideField3
F3SP30-0N F3SP71-4S ✓ High-speed/larger memory/built-in Ethernet WideField3
F3SP21-0N F3SP22-0S ✓ High-speed/larger memory WideField3
F3SP28-3S F3SP71-4S ✓ High-speed/larger memory/built-in Ethernet WideField3
Sequence F3SP38-6N F3SP76-7S ✓ High-speed/larger memory/built-in Ethernet WideField3
CPU F3SP38-6S F3SP76-7S ✓ High-speed/larger memory/built-in Ethernet WideField3
F3SP53-4H F3SP71-4S ✓ High-speed/larger memory/built-in Ethernet WideField3
F3SP58-6H F3SP76-7S ✓ High-speed/larger memory/built-in Ethernet WideField3
High-speed/larger memory/no SIO port/USB1.1
F3SP66-4S*1 F3SP71-4S ✓ WideField3
→2.0
High-speed/larger memory/no SIO port/USB1.1
F3SP67-6S*1 F3SP76-7S ✓ WideField3
→2.0
*1: Scheduled to be discontinued on 31 March 2019.
■ Compatibility
● Ladder programs running on discontinued sequence CPU
modules can run on replacement CPU models by updating the
ladder programming tool.
■ Precautions
● Programming tool
Latest programming tool WideField3 is required for using the latest F3SP7□-□S
CPU module. WideField3 is downward compatible with earlier CADM3, WideField
and WideField2.
● About F3SP7□-□N
F3SP7□-□N has been changed to F3SP7□-□S since January 2012 along with
functional upgrade. F3SP7□-□S should be used in future system upgrade.
● About multi-CPU configuration

F3SP7□-□□ cannot be used with AT compatible CPU modules and some old
sequence CPU module types in a multi-CPU configuration.
See reference "5.2 Restrictions on CPU module installation" for more details.
3.3.2 Communication interfaces of sequence CPU
■ Changes
● The replacement sequence CPU module has an Ethernet port.
● F3SP7□-□S has no RS-232C port. If a touch panel etc. was

connected via RS-232C, it is necessary to switch to Ethernet or
go via a PC link module.
● Dedicated ROM pack for program backup has been substituted by

a general-purpose SD card, which can also be used to store
device data.
Figure 3.2 Interface of sequence CPU
Table 3.2 Interfaces of F3SP2□/3□/5□
Item Media Purpose

Communication RS-232C Programming and connection of display
Memory Dedicated ROM pack Program backup
Table 3.3 Interfaces of F3SP7□
Item Media Purpose

Ethernet Connection of PC and display
Communication
USB Programming
Memory SD (SDHC) Data storage and program backup
3.3.3 Migrating from ROM packs
■ When upgrading to F3SP7□-□S

● F3SP7□-□S uses general-purpose SD card for backing up ladder
programs but does not support ROM pack.
● Use SD card to back up ladder programs.
● The SD card supports various functions including backing up

ladder programs, saving device data and “PC-less” maintenance.
■ When upgrading to F3SP22-0S

● F3SP22-0S supports ROM packs.
● F3SP22-0S supports the following ROM packs:
・RK33-0N RK73-0N
3.3.4 Replacement product table: Power supply/basic

I/O modules
Table 3.4 Replacement products for power supply/basic I/O modules
Item Discontinued product Replacement product Compatible Changes

Supports AC100-240V/Consolidated
F3PU01-0N F3PU10-0S ✓
with F3PU10-0S
AC power
F3PU10-0N F3PU10-0S ✓ Terminal screws M3.5→M4
supply
*1
DC power *1
supply
DI F3XD□□-□N F3XD□□-□F ✓ Input response time selectable
F3YD32-1A F3YD32-1P ✓ Short-circuit protector added
F3YD32-1B F3YD32-1R ✓ Short-circuit protector added
DO
F3YD64-1A
F3YD64-1P ✓ Short-circuit protector added
F3YD64-1F
F3WD□□-□N F3WD□□-□P ✓ Input response time selectable
DI/O
F3WD□□-□F F3WD□□-□P ✓ Short-circuit protector added
*1 Scheduled to be discontinued on 31 March 2019
3.3.5 Replacement product table: Value/Valueー2

Table 3.5 Replacement products for discontinued Value sets
Discontinued Replacement
Item Compatible Changes
product product
F3BU04-0N
F3PU10-0S
F3SC21-1N ✓
F3SP22-0S
F3WD64-3P
F3SC22-1F F3BU04-0N
F3PU10-0S
✓ ① About Value/Value-2
F3SC23-1F F3SP22-0S
・Sale of Value/Value-2 sets has ended.
F3WD32-3F
・Individual modules need to be purchased
F3SC22-1A F3BU04-0N
henceforth.
F3PU10-0S
Value set F3SP22-0S ✓
F3SC23-1A ②Replacement precautions
F3XD16-3F
・Requires Programming Tool WideField3.
F3YD14-5A
・As the CPU module has higher processing
F3SC22-2F F3BU04-0N
speed, verify system operation after
F3SC23-2P F3PU10-0S
✓ replacement.
F3SP22-0S
F3SC23-2F ・The power supply module uses M4 instead of
F3WD64-3P
M3 terminal screws.
F3BU04-0N
(applicable only when replacing F3SC21-1N)
F3PU10-0S
F3SC23-6P ✓
F3SP22-0S
F3WD64-4P
Service F3SP05-0P
F3PU10-0S
items for ✓
F3SP08-□P F3SP22-0S
Value set
3.3.6 Compatibility of basic I/O modules
■ Hardware
● Replacement models use the same terminal block, connector, and
pin arrangement as discontinued products so are usable once
replaced.
● Latest output modules have built-in short-circuit protector.
■ Configuration
● Replacement input module has wider range of input response
speed options.
・ Old product (model suffix N): Input response time: 16 ms, 1 ms
・ Latest product (model suffix F): input response time: Always, 62.5 μs,
250 μs, 1 ms, 16 ms
Note: 64-point module has no 16 ms option.
■ Programs
● No ladder program change needed for upgrading to replacement
product.
Figure 3.3 Appearance of basic I/O modules
Figure 3.4 Reusing terminal block
3.3.7 Replacement product table: Special modules

Table 3.6 Replacement products for discontinued special modules
product product
Terminal arrangement changed (common
F3DA02-0N △ terminals independent of output type)
Output type set by software (-10 to 10 V range by
F3DA04-6R default).
Analog output F3DA04-1N △ Output behavior at startup differs (no output until
setting is written)
High impedance.
Output behavior at startup differs (no output until
F3DA08-5N F3DA08-5R △ setting is written)
F3AD04-0V F3AD04-5V ✓ Upward compatible. Wiring and terminal block
cannot be reused.
F3AD04-0N ✓
F3AD04-5R Different external dimensions (depth); terminal
F3AD04-0R ✓ block mounting position is in front.
Analog input F3AD08-1V F3AD08-5V ✓
Upward compatible. Wiring and terminal block
F3AD08-1N ✓ can be reused.
F3AD08-5R External dimensions (depth) differs; terminal
F3AD08-1R ✓
block mounting position is in front.
F3AD08-4V F3AD08-4W ✓
No or minor modification of application programs
needed after replacement if module is used as a
F3HA06-1R △
high-speed AD conversion module, which refers
High-speed data only to constantly updated data without using its
F3HA08-0N
acquisition data acquisition function.
Application is incompatible and needs
F3HA12-1R △ modification if the data acquisition function or
acquisition-related filter function etc. is used.
F3CV04-1N F3CU04-1S × Software modification is needed.
F3CR04-0N F3CU04-0S × Software modification is needed.
PID/Temperatur
F3CR04-1N F3CU04-1S × Software modification is needed.
e control
F3CT04-0N F3CU04-0S × Software modification is needed.
F3CT04-1N F3CU04-1S × Software modification is needed.
F3YP04-0N F3YP24-0P × Software modification is needed.
F3YP08-0N F3YP28-0P × Software modification is needed.
F3YP14-0N F3YP24-0P × Software compatible. However, the number of
Positioning
installable modules changed from 36 (288 axes)
to 16 (128 axes). Hardware incompatible. Need
F3YP18-0N F3YP28-0P × to review external wiring such as changing from
5VDC to 24VDC.
F3LC11-2N F3LC11-2F △ Upward-compatible. Beware of position of rotary
Personal switch.
computer link F3LC11-1N F3LC11-1F △ Software modification is needed only if using
events.
F3RZ81-0F × Software modification is needed. For 1 channel.
Ladder F3RZ81-0N
F3RZ82-0F × Software modification is needed. For 2 channels.
communication
F3RZ91-0N F3RZ91-0F × Software modification is needed.
Software compatible but has no AUI port and has
F3LE01-5T F3LE01-1T ✓
different look (e.g. connector location.)
Software compatible but has different look (e.g.
F3LE01-0T F3LE01-1T ✓
connector location.)
Ethernet
Software compatible but has different look (e.g.
F3LE11-0T F3LE11-1T ✓
connector location.)
F3LE12-0T F3LE12-1T ✓
Software compatible. Beware of FL-net version.
F3LX01-0N F3LX02-2N ✓ F3LX01 (Ver.1) and F3LX02 (Ver.2) cannot be
FL-net mixed.
F3LX02-1N F3LX02-2N ✓
product product
NX autonomous F3NX01-0N F3NX01-2N ✓
distributed F3NX01-1N F3NX01-2N ✓
F3LP02-0N*2
(Software compatible but hardware incompatible.
F3LP01-0N （F3LP□□-□ ✓
New and old products cannot be mixed)
FA link H N*3）
（F3LP□□-□ (Software compatible but hardware incompatible.
F3LP02-0N*2 ✓
N*3） New and old products cannot be mixed)
Fiber-optic FA F3LP12-0N Replace with combination of FL-net and optical

*2
None -
link H cable converter.
μ bus F3LU01-0N None - Need to replace with YHLS etc.

Replace with combination of F3LC11-1F and
Modem F3LM01-1N F3LC11-1F -
external analog modem.
*1 F3DA04-6R/DCR with default current (4 to 20 mA) output type is available for customers using current output. Contact
Yokogawa's sales representative for details.
*2 Scheduled to be discontinued on 31 March 2019

*3 New product scheduled for sale in December 2018.
3.3.8 Application compatibility of special modules
■ As replacement models become more powerful, application

modification is needed for some special modules.
■ Even with application compatibility, processing timing may

change due to faster processing speed so you should always
verify system operation after module upgrade.
3.4 Convert ladder programs (STEP2)

3.4.1 Ladder programming tools table
■ Sequence CPU modules versus programming tools

● WideField3 is required for using the latest F3SP7□/F3SP22 CPU
modules.
Table 3.7 Sequence CPU modules versus programming tools
1995 1999 2002 2011

Release
Programming tool CADM3 WideField WideField2 WideField3
year CPU model
Availability for sale SF511 SF610 SF620 SF630
1993 F3SP20-0N Discontinued ✓
1993 F3SP30-0N Discontinued ✓
1995 F3SP21-0N Discontinued ✓ ✓ ✓ ✓
1999 F3SP28-3N Discontinued ✓ ✓ ✓
1999 F3SP38-6N Discontinued ✓ ✓ ✓
1999 F3SP53-4H Discontinued ✓ ✓ ✓
1999 F3SP58-6H Discontinued ✓ ✓ ✓
2002 F3SP28-3S Discontinued ✓ ✓
To be
2006 F3SP66-4S*1 ✓ ✓
discontinued
To be
2006 F3SP67-6S*1 ✓ ✓
discontinued
2011 F3SP22-0S Available ✓
*1 Scheduled to be discontinued on 31st March 2019.
3.4.2 Ladder program conversion and compatibility
■ WideField3’s conversion feature

● CADM3, WideField and WideField2 projects can be converted to
WideField3 format by loading them into WideField3.
Figure 3.5 Conversion illustration
■ Upward and downward compatibility

● A project converted to WideField3 can also be saved in the old
format.
Figure 3.6 Upward and downward compatibility
3.4.3 Converting ladder programs (CADM3)
■ Converting from CADM3 to WideField3

● CADM3 will not run under the latest Windows so you need to port
files including the executable from the PC running CADM3 to the
PC running WideField3.
● Files to be ported
Executable program file: extension ＝ .PRG
Block files: extensions ＝ .BLK .OBT .CMT
Macro blocks: extensions ＝ .MBL .MOB .MCM
Table 3.8 Programming tool versus supported OS
OS CADM3 WdeField WideField2 WideFiled3

MS-DOS ✓
Windows95 ✓ ✓
Windows98 ✓ ✓
WindowsNT ✓ ✓
Windows2000 ✓
WindowsME ✓
WindowsXP ✓
WindowsVista ✓
Windows7 ✓
Windows8,8.1 ✓
Windows10 ✓
IMPORTANT
・ In CADM3, project (executable program) and blocks are stored in a folder
(directory) with a name defined by a user using CAM3’s initial design menu.
Normally, programs to be ported are stored near individually defined
directories. (In CADM 3, folder name and project name do not match.)
■ Converting files
● Opening an executable by selecting [Open File in other formats]
automatically converts it to WideField3 format.
Figure 3.7 Conversion window
①
②
3.4.4 Converting ladder program

(WideField/WideField2)
■ Converting from WideField/WideField2 to WideField3

● In WideField3, select [Open Project] and specify a WideField/
WideField2 project to automatically convert it to WideField3
format.
Figure 3.8 Conversion Window
● A ladder program edited in WideField3 can also be converted and

saved in an earlier (WideField/WideField2) format.
Figure 3.9 Downgrade and Save window
3.4.5 Modifying Configuration after conversion
■ Redefine configuration
● Configuration revert to factory settings if the CPU model name is
changed.
● Need to redefine configuration values after changing CPU type.
● Redefine configuration such as run operation setup, input/output

setup, device setup etc.
Figure 3.10 Configuration window (Latch Range Setup example)
3.4.6 Configuration precautions
CAUTION
① Simultaneity of shared devices
For F3SP28 and newer sequence CPU modules, shared device data can
be specified as Simultaneous or Non-simultaneous in the configuration.
If compatibility with the old CPU is required when upgrading
F3SP20/30/21/25/35, specify as Non-simultaneous (default setting is
Simultaneous).
② Direct Refresh (DREF) instruction related precaution

For CPU F3SP28 or later, set terminal usage of output relays (Y) to be
refreshed by a DREF instruction in a program as “Not Used“ in the
configuration. If specified as “Use” or “Use with SCB,” the values one
scan earlier may be overwritten with the values output by the DREF
instruction as output refreshing is executed concurrently with
instructions.
Figure 3.11 Configuration (shared memory setup)
Figure 3.12 Configuration (Input/output setup)
3.5 Other changes (STEP3)

3.5.1 Tuning for improved basic performance
■ Verify application execution on faster replacement module

● Processing timing may change due to faster processing speed.
After module upgrade, verify system operation, especially:
・ Processing dependent on the scan time of the sequence CPU

・ Refresh processing of sequence CPU
・ Response time of Ethernet and other communications
・ Replacement of HRD/HWR instructions with READ/WRITE instructions
If the replacement pose difficulties due to scan time or other
circumstances, consider switching to F3SP71-4S/F3SP76-7S.
3.5.2 Basic operation of sequence CPU
■ Replacement model F3SP7□ operation at power on

● When a battery error occurs, CPU behaves similarly as when
using a ROM pack of F3SP2□/3□/5□; the ERR LED turns on, and
then immediately goes off, the RUN LED turns on, and operation
starts. Devices specified to be latched when a power failure
occurs are cleared before operation starts. If you wish to prevent
starting the operation when devices specified to be latched are
cleared, add a program that suppresses the start of the operation
if the special relay M194 (battery error) is on.
3.5.3 When replacing special modules
■ Replacement guides for ladder program migration

● As described in 3.3.7 “Replacement product table: Special
modules”, ladder programs may be incompatible between a
discontinued special module and its replacement product.
● Various migration guides are available for download from the PLC
(FA-M3)/RTOS Controller (e-RT3) web page on the following FA-
M3 partner portal (member registration and login is required).
https://partner.yokogawa.com/global/itc /index.htm
Table 3.9 Technical Information (TI)
Document Title Document No.

Range-free Controller FA-M3
TI 34M06Z41-01E
Migration Guide for Obsoleted Models
BASIC CPU Module Replacement Guide
TI 34M06Z41-02E
(BASIC CPU → Sequence CPU)
FA-M3 System Upgrade Guide
TI 34M06H33-01E
(AS-interface → DeviceNet)
FA-M3 System Upgrade Guide
TI 34M06H34-01E
(PROFIBUS-DP → DeviceNet)
FA Link H Module → FL-net Interface Module
TI 34M06H43-01E
Replacement Guide
Contact Yokogawa’s sales
Temperature Module Replacement Guide
representative.
４. Upgrading related equipment 25
4. Upgrading related equipment

4.1 Upgrading SCADA
■ VDS/ASTMAC version upgrade
For VDS, which is used as an FA-M3 operation monitoring package,
update it to the latest release (R7.20 for F3SPV9) to tap on new
features and the latest personal computer operating system.
・ Latest VDS release: R8

・ “Update kit" is available for easy, economical version update
・ Release of update summary:
VDS R8 Migration Guide (Doc#: TI 34P02V07-01E)
Note: ASTMAC is scheduled for end-of-sale in March 2018.

Custom orders including update kits will no longer be
available then.
5. Reference Information 26
5. Reference information
5.1 Sequence CPU specifications
comparison
Table 5.1 Specifications comparison of sequence CPU V series and R series
Item F3SP71-4S F3SP76-7S F3SP66-4S F3SP67-6S F3SP22-0S
Program size 60Kstep 260Kstep 56Kstep 120Kstep
10Kstep
Project size 120KStep 520Kstep 112Kstep 240Kstep
Ethernet ✓ ✓ ×
SD card ✓ (SDHC compatible) ✓ ×
Interface
RS-232C × ✓ ✓
USB ✓ ✓ ×
45ns min.
Basic instructions 3.75ns min. per instruction 17.5ns min. per instruction
per instruction
180ns min.
Application instructions 7.5ns min. per instruction 70ns min. per instruction
per instruction
200μs-
Cycle 100μs-25.0ms 200μs-25.0ms
Sensor control 25.0ms
Resolution 10μs 100μs 100μs
Input/output 4,096 8,192 4,096 8,192 4,096
Internal relays 16,384 65,535 16,384 32,768 16,384
Data registers 16,384 65,535 16,384 32,768 16,384
Device/ File registers 32,768 262,144 32,768 262,144 32,768
memory size
Cache registers 131,072 524,288 × ×
Constant definition
16384 words 32768 words 16384 words 32768 words ×
area
RAMDISK 4MB 4MB ×
Login control ✓ × ×
Security Operation log ✓ × ×
Password ✓ ✓ ✓
Download tag definitions ✓ ✓ ✓
Programming tool WideField3 WideField2 or later WideField3

Current consumption 460mA 850mA 450mA
Table 5.2 Specifications comparison of sequence CPU R series

(F3SP28/F3SP38)
Item F3SP28-3N F3SP28-3S F3SP38-6N F3SP38-6S
Program size
30Kstep 120Kstep
Project size
Ethernet × ×
SD card × ×
Interface
RS-232C ✓ ✓
USB × ×
Basic instructions 45ns min. per instruction 45ns min. per instruction
Application instructions 180ns min. per instruction 180ns min. per instruction
Sensor control
Resolution 100μs 100μs
Input/output 4,096 8,192
Internal relays 16,384 32,768
Data registers 16,384 32,768
Device/memory File registers 32,768 262,144
size
Cache registers × ×
Constant
× ×
definition area
RAMDISK × ×
Login control × ×
Security Operation log × ×
Password ✓ ✓
Download tag definitions × ✓ × ✓

WideField or
Programming tool WideField or later WideField2 or later WideField2 or later
later
Current consumption 450mA 450mA
Table 5.3 Specifications comparison of sequence CPU R series

(F3SP53/F3SP58/F3SP59)
Item F3SP53-4H F3SP53-4S F3SP58-6H F3SP58-6S F3SP59-7S

Program size 254Kstep
56Kstep 120Kstep
Project size 360Kstep
Ethernet × × ×
SD card × × ×
Interface
RS-232C ✓ ✓ ✓
USB × × ×
17.5ns min. per 17.5ns min.
Basic instructions 17.5ns min. per instruction
instruction per instruction
70ns min “per
Application instructions 70ns min. per instruction 70ns min. per instruction
instruction
200μs-
Sensor control 25.0ms
Resolution 100μs 100μs 100μs
Input/output 4,096 8,192 8,192
Internal relays 16,384 32,768 65,535
Data registers 16,384 32,768 65,535
Device/memory
File registers 32,768 262,144 262,144
size
Cache registers × × ×
Constant definition
× × ×
area
RAMDISK × × ×
Login control × × ×
Security Operation log × × ×
Password ✓ ✓ ✓
Download tag definitions × ✓ × ✓ ✓

WideField or WideField2 WideField or WideField2 or WideField2 or
Programming tool
later or later later later later
Current consumption 890mA 890mA 920mA
Table 5.4 Sequence CPU specifications comparison

Item F3SP21-0N F3SP25-2N F3SP35-5N F3SP20-0N F3SP30-0N
Program size
10Kstep 20Kstep 100Kstep 10Kstep 20Kstep
Project size
Ethernet × × × × ×
SD card × × × × ×
Interface
RS-232C ✓ ✓ ✓ ✓ ✓
USB × × × × ×
180ns min. 120ns min. 90ns min. 180ns min. 90ns min.
Basic instructions
per instruction per instruction per instruction per instruction per instruction
360ns min. 240ns min. 180ns min. 360ns min. 180ns min.
Application instructions
per instruction per instruction per instruction per instruction per instruction
Cycle × × × × ×
Sensor control
Resolution × × × × ×
Input/output 2,048 4,096 8,192 2,048 2,048
Internal relays 4,096 8,192 16,384 4,096 8,192
Data registers 5,120 8,192 8,192 5,120 8,192
Device/memory
File registers × 32,768 32,768 × ×
size
Cache registers × × × × ×
Constant
× × × × ×
definition area
RAMDISK × × × × ×
Login control × × × × ×
Security Operation log × × × × ×
Password ✓ ✓ ✓ ✓ ✓
Download tag definitions ✓ ✓ ✓ ✓ ✓
CADM3 or CADM3 or
Programming tool CADM3 or later CADM3 or later CADM3 or later
later later
Current consumption 350mA 420mA 560mA 325mA 405mA
5.2 Restrictions on CPU module

installation
Table 5.5 Combinations of main CPU modules with add-on CPU modules
*1
Add-on CPU Module
F3SP21-0N
F3SP22-0S
F3SP25-2N
F3SP35-5N
F3SP28-3□
F3SP38-6□
F3SP53-4□
F3SP58-6□
F3SP59-7S
F3SP6□-□S
F3SP7□-□N
F3SP7□-□S
F3BP20-0N
F3BP30-0N
Max. quantity
F3SP21-0N 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓*2 ✓ ✓ ✓
F3SP22-0S 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
F3SP25-2N 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ *2 ✓ ✓ ✓
F3SP35-5N 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ *2 ✓ ✓ ✓
F3SP28-3□ 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
Main CPU Module
F3SP38-6□ 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
F3SP53-4□ 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
F3SP58-6□ 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
F3SP59-7S 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
F3SP6□-□S 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
F3SP7□-□N 4 ✓*2 ✓ ✓*2 ✓*2 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓*3 ✓*2 ✓*2
F3SP7□-□S 4 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓*3 ✓ ✓ ✓
F3BP20-0N 1 ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ *2 ✓ × ×
✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ *2 ✓
F3BP30-0N 1 ✓ × ×
*1: Indicates the maximum number of modules that can be used in total including the main CPU module when CPU modules with the same
model name as the main CPU module are used as add-on CPU modules.
*2: Up to two modules can be installed in this combination.
*3: The combination of F3SP7- N + F3SP7-N + F3SP21 (F3SP25, F3SP35/ F3BP20, F3BP30) is not possible.
The combination of F3SP7-  N + F3SP7-S + F3SP21 (F3SP25, F3SP35/ F3BP20, F3BP30) is not possible.
The combination of F3SP7- S + F3SP7-S + F3SP21 (F3SP25, F3SP35/ F3BP20, F3BP30) is not possible.
The combination of F3SP7- N + F3SP7-S is possible.
5.3 List of end-of-sale (EOS) products

For product availability, refer to the following list of end-of-sale
products, which is downloadable from the FA-M3 website.
◆ List of end-of-sale products for FA-M3/e-RT3

https://web-material3.yokogawa.com/TI34M06Z40-01E.pdf
Rev-1
Revision Information
Title : FA-M3 System Upgrade Guide
Document No. : TI 34M06Z42-01E
June, 2017/ 1st Edition

New publication
June, 2018/ 2nd Edition

Format change, content added and revised
■ For Questions and More Information

If you have any questions, you can send an E-mail to the following address.
E-mail: plc_message@csv.yokogawa.co.jp
■ Written by
■ Published by
2-9-32 Nakacho, Musashino-shi, Tokyo, 180-8750, JAPAN
All Rights Reserved. Copyright © 2018, Yokogawa Electric Corporation TI 34M06Z42-01E 2018.06.30-00

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Technical Range-free Controller FA-M3

Information System Upgrade Guide

The operational economy of a system declines as it ages due to more frequent

・ For engineering support, contact Yokogawa’s sales representative:

Refer to Yokogawa’s website:

1.1 Merits of System Upgrade

■ Benefit from improved basic performance

■ Benefit from networking

Figure 1.1 Merits of system upgrade

2. System Degradation and

● Humidity: Corrosion of contacts accelerate when humidity exceeds

● Corrosive gas: Causes corrosion of contacts

● Dust: Causes short circuit failures and corrosion

Figure 2.1. Aged deterioration of systems (Bathtub curve)

2.2 Recommended replacement cycle for

● Modules that use relays

Electrical life: 100 thousand cycles,

● Modules that use photocouplers: 5 years

When used in high temperatures (about 45°C or higher)

2.3 Examples of failure of parts with

● Prolonged use may result in insulation degradation due to formation of

Figure2.2 Electrolyte leakage Figure 2.3 Corrosion of contacts

2.4 Modules that use parts with service life

Table 2.1 Modules that use aluminium electrolytic capacitors

Category Model name

■ Modules that use relays

Table 2.2 Modules that use relays

Category Model name

Table 2.3 Modules that use photocouplers

Category Model name

3. System Upgrade Procedure

● STEP 2: Convert ladder programs

● STEP 3: Other changes

・Modify ladder program after upgrading special module

3.2 Sequence CPU module evolution

3.3 Select replacement module (STEP1)

Discontinued Replacement Programming

*1: Scheduled to be discontinued on 31 March 2019.

● About multi-CPU configuration

3.3.2 Communication interfaces of sequence CPU

● F3SP7□-□S has no RS-232C port. If a touch panel etc. was

● Dedicated ROM pack for program backup has been substituted by

Figure 3.2 Interface of sequence CPU

Table 3.2 Interfaces of F3SP2□/3□/5□

Item Media Purpose

Table 3.3 Interfaces of F3SP7□

Item Media Purpose

3.3.3 Migrating from ROM packs

■ When upgrading to F3SP7□-□S

● Use SD card to back up ladder programs.

● The SD card supports various functions including backing up

■ When upgrading to F3SP22-0S

● F3SP22-0S supports the following ROM packs:

3.3.4 Replacement product table: Power supply/basic

Item Discontinued product Replacement product Compatible Changes

3.3.5 Replacement product table: Value/Valueー2

3.3.6 Compatibility of basic I/O modules

● Latest output modules have built-in short-circuit protector.

Figure 3.3 Appearance of basic I/O modules