This document lists over 80 standards documents related to electronics assembly from organizations like IPC and J-STD. The standards cover topics like soldering, cleaning, packaging of components, process control, and testing of printed circuit boards and electronics assemblies.
This document lists over 80 standards documents related to electronics assembly from organizations like IPC and J-STD. The standards cover topics like soldering, cleaning, packaging of components, process control, and testing of printed circuit boards and electronics assemblies.
This document lists over 80 standards documents related to electronics assembly from organizations like IPC and J-STD. The standards cover topics like soldering, cleaning, packaging of components, process control, and testing of printed circuit boards and electronics assemblies.
This document lists over 80 standards documents related to electronics assembly from organizations like IPC and J-STD. The standards cover topics like soldering, cleaning, packaging of components, process control, and testing of printed circuit boards and electronics assemblies.
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Product ID Document Name
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK- Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies 001 J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003 Solderability Tests for Printed Boards SMEMA 3.1 Fiducial Mark Standard J-STD-004 Requirements for Soldering Fluxes SMEMA 4 Reflow Terms and Definitions J-STD-005 Requirements for Soldering Pastes SMC-WP-005 PWB Surface Finishes IPC-HDBK- Guide to Solder Paste Assessment 005 5 SMEMA Screen Printing Terms and Definitions J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices J-STD-033 Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-DRM-53 Introduction to Electronics Assembly IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes IPC-PC-90 General Requirements for Implementation of Statistical Process Control IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems IPC-D-300 Printed Board Dimensions and Tolerances IPC-PD-335 Electronic Packaging Handbook IPC-A-610 Acceptability of Electronic Assemblies IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses IPC/WHMA-A- Acceptability of Electronic Wire Harnesses and Cables 620 IPC-A-630 Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures IPC-AI-641 User’s Guidelines for Automated Solder Joint Inspection IPC-OI-645 Standard for Visual Optical Inspection Aids IPC-TM-650 Test Methods Manual IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material IPC-MI-660 Incoming Inspection of Raw Materials Manual IPC-R-700 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies IPC-S-804 Solderability Test Methods for Printed Wiring Boards IPC-S-805 Solderability Tests for Component Leads and Terminations IPC-S-815 General Requirements for Soldering Electronic Interconnections IPC-S-816 SMT Process Guideline and Checklist IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-SF-818 General Requirement for Electronic Soldering Fluxes IPC-SP-819 General Requirements and Test Methods for Electronic Grade Solder Paste IPC-AJ-820 Assembly and Joining Handbook IPC-HDBK- Guidelines for Design, Selection and Application of Conformal Coatings 830 IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines IPC-HDBK- Solder Mask Handbook 840 IPC-1066 Labeling of PCBs and Assemblies IPC-1601 Printed Board Handling and Storage Guidelines IPC-1710 OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP) IPC-1720 Assembly Qualification Profile (AQP) IPC-1730 Laminator Qualification Profile (LQP) IPC-1731 Strategic Raw Materials Supplier Qualification Profile IPC-1751 Generic Requirements for Declaration Process Management IPC-1752 Materials Declaration Management IPC-1756 Manufacturing Process Data Management IPC-1758 Declaration Requirements for Shipping, Pack and Packing Materials IPC-1782 Standard for Manufacturing and Supply Chain Traceability of Electronic Products IPC-1791 Trusted Electronic Designer, Manufacturer, and Assembler Requirements IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design IPC-2224 Sectional Standard for Design of PWBs for PC Cards IPC-2541 Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication IPC-2546 Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment IPC-2611 Communication Generic Requirements for Electronic Product Documentation IPC-2615 Printed Board Dimensions and Tolerances IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4921 Requirements for Printed Electronics Base Materials IPC/JPCA- Application Categories for Printed Electronics 6901 IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard IPC-7525 Guidelines for Stencil Design IPC-7526 Stencil and Misprinted Board Cleaning Handbook IPC-7527 Requirements for Solder Paste Printing IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Wave and Reflow) IPC-7535 Solder Dross Reduction in Wave Soldering Process IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies IPC-7801 Reflow Oven Process Control Standard IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies IPC-9111 Troubleshooting for Printed Board Assembly Processes IPC-9121 Troubleshooting for Printed Board Fabrication Processes IPC-9151 Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database IPC-9191 General Guideline for implementation of Statistical Process Control (SPC) IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly IPC-9199 Manufacture Guideline SPC Quality Rating IPC-9201 Surface Insulation Resistance Handbook IPC-9261 In-Process DPMO and Estimated Yield for PWAs IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components IPC-9502 PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components IPC-9503 Moisture Sensitivity Classification for Non-IC Components IPC-DRM-PTH Through-Hole Solder Joint Evaluation Desk Reference Manual IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual IPC-DRM- Wire Preparation & Crimping WHA