IPC 2223 Design Standard For Flex and Rigid Flex Circuits
IPC 2223 Design Standard For Flex and Rigid Flex Circuits
IPC 2223 Design Standard For Flex and Rigid Flex Circuits
IPC 2223 provides very wide and detailed information covering all elements
that can be incorporated into either a flexible or rigid-flex design. As with
any tool how effectively the requirements of this standard are applied is
dependent upon identifying the elements that pertain to a specific design
and applying those elements. Attempting to apply all of 2223 would be
unnecessary as not all items apply to every design, would significantly
complicate the design process and negatively impact the finished part cost.
Within this Ebook we will review some of the more important elements of
IPC 2223 and their impact on the performance and reliability of a finished
rigid-flex circuit.
Important Element
#1
Rigid-Flex Transition Via Keep Out Areas
A key element, impacting the reliability of rigid-flex circuits, is the location of
any plated vias or holes in relation to the transition from a rigid section to a
flexible section. This is covered in Sec. 5.2.2.3. This area of a design has
the unique requirement that the polyimide coverlays, which encapsulate
the flexible areas, must engage into the rigid areas by a small distance to
ensure that they are captured by the rigid area lamination process. The
coverlays are laminated to the flex surface with an adhesive, either acrylic
or epoxy based. These adhesives have a very high coefficient of thermal
expansion. If vias are drilled through the adhesive they are subjected to
stresses caused by the thermal expansion and contraction of the adhesive.
This creates a significant reliability concern as the plating within the via
can crack when subjected to assembly reflow temperatures and in the field
temperature fluctuations. IST, interconnect stress testing, has proven this
can occur.
“
VIA AND PTH SPACING TO THE RIGID/FLEX
TRANSITION IS CRITICAL TO FINISHED PART
RELIABILITY
Important Element
#2
Rigid-Flex Selective Coverlay Construction
Evolving technology and design complexity, smaller VIA holes and RoHS
assembly temperatures necessitated a change in the construction method
of the flex area coverlays. Previous methods applied the coverlays
throughout the entire design, including rigid areas. This old method resulted
in all vias and PTH holes being drilled through the coverlay adhesives. As
mentioned in the previous section, this exposes the vias to the thermal
expansion issue of the adhesive and incurs the associated reliability issues.
“
A SELECTIVE COVERLAY CONSTRUCTION IS
ALSO KNOWN AS A “BIKINI BUILD” SINCE THE
COVERLAYS COVER ONLY WHAT NEEDS TO BE
COVERED, THE FLEX SECTIONS.
Important Element
#3
Adhesiveless Flex Cores
The flex core materials used play an important part in meet IPC 2223
requirements. Flex cores are available in two configurations that differ in
how the copper is attached to the polyimide core. The original generation
flex cores utilize a flexible adhesive to bond the copper layer to the
polyimide. The latest generation has the copper directly attached to the
polyimide without the use of an adhesive. This material is referred to as
“adhesiveless” throughout the industry.
IPC 2223 specifically calls out the use of adhesiveless flex cores only.
As the flex cores exist throughout the entire part using adhesiveless flex
cores eliminates a source of adhesive from within the rigid areas and the
associated via hole reliability concerns defined earlier in this Ebook. An
added benefit is the reduced thickness, improved flexibility and improved
bend reliability of thinner adhesiveless flex cores.
Adhesive flex core (top), adhesiveless flex core (bottom).
“
SPECIFY ADHESIVELESS FLEX CORE BY THE
IPC SPECIFICATION IN THE DRAWING NOTES
AND GRAPHICALLY IN THE MATERIAL STACKUP
IN THE FABRICATION DRAWING
Important Element
#4
Rigid-Flex Air Gap
Some designs require higher flex layer counts to meet the circuit routing
requirements. Minimizing the flex layer count to 1 or 2 layers has the
multiple advantages of improved flexibility, tighter bend capabilities, and
reduced cost but is not always achievable in higher density designs. For 3
flex layers or more IPC recommends, whenever possible, configuring the
flex layers as independent pairs rather than laminating all the flex layers
together into one stack. This configuration is referred to as an “air gap”
construction due to the open space between flex layers. The recommended
air gap construction eliminates the all flex adhesives within the rigid
sections and the associated via hole reliability concerns.
IPC 2223 does allow laminating all flex layers together for designs with two
sided shielding or stripline impedance control requirements. This is with the
recommendation that the use of adhesive layers be minimized and is not to
exceed 10% of the total flex thickness.
“
DEFINE AIR GAP CONSTRUCTION
REQUIREMENTS IN THE FABRICATION
DRAWING NOTES AND MATERIAL STACKUP
Important Element
#5
Minimum Bend Radius Capabilities
A key element to a successful design is ensuring the flex construction
meets the bend requirements. The bend capability of a flex section is
dependent upon the materials and material thicknesses used and cannot
be impacted by the manufacturing process. IPC 2223 provides minimum
bend recommendations for both static “one-time” or “bend to fit” as well as
“dynamic” or “infinite bend” applications. These differ significantly in the
allowable layer count, minimum bend capability, and the allowable copper
type - either electrodeposited or rolled annealed. The minimum bend
radius can be calculated or is commonly defined as a multiplier of the flex
thickness. Bend to fit applications vary from 6x to 20x or greater depending
upon layer count. Dynamic applications are typically 100x with a maximum
of two layers.
IPC 2223 also allows, with specific guidelines, for a flex to be bent and
creased with a zero bend radius. This is limited to very thin one and two
layer constructions with the added stipulation that once the flex is creased
it cannot be unfolded. A PSA, pressure sensitive adhesive/doubled sided
tape, is often added in the fold area to permanently affix the flex and ensure
that it is not inadvertently unfolded.
Many designs call out for a specific number of bend cycles. For these
applications that fall between IPC’s guidelines, we recommend getting
material and construction input from the flex circuit supplier and cycle
testing the flex circuits as part of the design approval process.
Side view cutaway of a bent flex circuit and the impact on specific layers.
“
MEETING THE DESIGN BEND REQUIREMENTS
RELIABLY IS A KEY ELEMENT TO A
SUCCESSFUL DESIGN. EVEN IF THE PART IS
BEING BENT ONE TIME ONLY.
Important Element
#6
Strain Relief Fillets
A strain relief fillet is defined as a flexible bead, typically epoxy based,
applied to the transition line from a rigid area to a flex area. This forces the
flex to bend gradually and prevents it from being bent tightly against the
rigid area which could damage the part.
IPC calls out for a minimum 0.010” height difference between the rigid area
and the flex layers to allow enough space for the bead without it extending
above the surface level of the rigid area. Strain reliefs requirements are
defined in the fabrication drawing. A minimum and maximum horizontal
dimension need to be defined as is commonly 0.040” to 0.100” to allow
for manufacturing tolerances and the material flow properties. The most
commonly used material is Eccobond 45/15 mixed in the flexible formula
ratio. Others can be used but will need to be applied after assembly if they
cannot withstand assembly reflow temperatures.
“
EPOXY STRAIN RELIEFS ARE AN OPTIONAL
FEATURE THAT MAY BE REQUIRED TO ENSURE
BEND RELIABILITY
Important Element
#7
Pre-bake Requirements
The pre-baking of flex circuits, immediately prior to assembly, is an industry
standard requirement that is called out in IPC 2223 section 5.3.5, IPC-
FA-251 section 3.2.1.1.2 and by material suppliers (i.e. DuPont Pyralux
Technical Manual section 5.23). This applies to all polyimide based flex and
rigid-flex designs. Polyimide is hydroscopic and will adsorb approximately
2% by weight in moisture at 20°C and 50% relative humidity. The moisture
must be removed otherwise it will lead to delamination of the flex area
coverlays and/or rigid areas. If multiple assembly cycles are required,
additional pre-bakes may be required depending upon time between
cycles.
Pre-bake is performed at 120°C for 2-10 hours depending upon the specific
design. Parts need to be configured in the pre-bake oven to allow air flow
around all sides.
“
PRE-BAKING OF FLEX AND RIGID-FLEX
CIRCUITS PRIOR TO ASSEMBLY PREVENTS
COVERLAY, SITFFENER, AND LAYER TO LAYER
DELAMINATION
Final Thoughts
The collaborative effort between the IPC organization, material suppliers
and manufacturers, that resulted in the creation of IPC 2223, has allowed
flex and rigid-flex circuit designs to evolve dramatically.
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