Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

LM285-1.2, LM385-1.2, LM385B-1.2

SLVS075J – APRIL 1989 – REVISED JANUARY 2015

LMx85-1.2, LM385B-1.2 Micropower Voltage References

1 Features 3 Description
1• Operating Current Range These micropower, two-terminal, band-gap voltage
references operate over a 10-μA to 20-mA current
– LM285-1.2: 10 μA to 20 mA range and feature exceptionally low dynamic
– LM385-1.2: 15 μA to 20 mA impedance and good temperature stability. On-chip
– LM385B-1.2: 15 μA to 20 mA trimming provides tight voltage tolerance. The band-
gap reference for these devices has low noise and
• 1% and 2% Initial Voltage Tolerance
long-term stability.
• Reference Impedance
The design makes these devices exceptionally
– LM385-1.2: 1 Ω MAX at 25°C tolerant of capacitive loading and, thus, easier to use
– All devices: 1.5 Ω MAX over Full in most reference applications. The wide dynamic
Temperature Range operating temperature range accommodates varying
• Very Low Power Consumption current supplies, with excellent regulation.
• Interchangeable with Industry Standard The extremely low power drain of this series makes
LM285-1.2 and LM385-1.2 them useful for micropower circuitry. These voltage
references can be used to make portable meters,
2 Applications regulators, or general-purpose analog circuitry, with
battery life approaching shelf life. The wide operating
• Portable Meter References current range allows them to replace older references
• Portable Test Instruments with tighter-tolerance parts.
• Battery-Operated Systems
Device Information(1)
• Current-Loop Instrumentation
PART NUMBER PACKAGE (PIN) BODY SIZE (NOM)
• Panel Meters
SOIC (8) 4.90 mm × 3.91 mm
SOP (8) 6.20 mm × 5.30 mm
LMx85-1.2
TSSOP (8) 3.00 mm × 4.40 mm
TO-226 (3) 4.30 mm × 4.30 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.

4 Simplified Schematic

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM285-1.2, LM385-1.2, LM385B-1.2
SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com

Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................... 7
2 Applications ........................................................... 1 8.4 Device Functional Modes.......................................... 7
3 Description ............................................................. 1 9 Application and Implementation .......................... 8
4 Simplified Schematic............................................. 1 9.1 Application Information.............................................. 8
9.2 Typical Application ................................................... 8
5 Revision History..................................................... 2
9.3 System Examples ................................................... 10
6 Pin Configuration and Functions ......................... 3
10 Power Supply Recommendations ..................... 11
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 11
11.1 Layout Guidelines ................................................. 11
7.2 ESD Ratings.............................................................. 4
11.2 Layout Example .................................................... 11
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 12
7.5 Electrical Characteristics........................................... 5 12.1 Related Links ........................................................ 12
7.6 Typical Characteristics .............................................. 5 12.2 Trademarks ........................................................... 12
12.3 Electrostatic Discharge Caution ............................ 12
8 Detailed Description .............................................. 7
12.4 Glossary ................................................................ 12
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7 13 Mechanical, Packaging, and Orderable
Information ........................................................... 12

5 Revision History
Changes from Revision I (December 2005) to Revision J Page

• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Deleted Ordering Information table. ....................................................................................................................................... 1

2 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2

 LM285-1.2, LM385-1.2, LM385B-1.2
www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015

6 Pin Configuration and Functions

Pin Functions
PIN
TYPE DESCRIPTION
NAME LP D, PS or PW
ANODE 1 4 I Shunt Current/Voltage input
CATHODE 2 8 O Common pin, normally connected to ground
NC 3 1, 2, 3, 5, 6, 7 — No internal connection

Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2
LM285-1.2, LM385-1.2, LM385B-1.2
SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com

7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
IR Reverse Current 30 mA
IF Forward Current 10 mA
TJ Operating virtual junction temperature 150 °C
Tstg Storage temeprature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000
V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101, V
±1000
all pins (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
IZZ Reference current 0.01 20 mA
LM285-1.2 –40 85
TA Operating free-air temperature °C
LM385-1.2, LM385B-1.2 0 70

7.4 Thermal Information

LMx85-1.2
THERMAL METRIC (1) D LP PS PW UNIT
8 PINS 3 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 97 140 95 149 °C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2

 LM285-1.2, LM385-1.2, LM385B-1.2
www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
LM285-1.2 LM385-1.2 LM385B-1.2
PARAMETER TEST CONDITIONS TA (1) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
VZ Reference voltage IZ = I(min) to 20 mA (2) 25°C 1.223 1.235 1.247 1.21 1.235 1.26 1.223 1.235 1.247 V
Average temperature
Full ppm/°
αVZ coefficient of reference IZ = I(min) to 20 mA (2) ±20 ±20 ±20
Range C
voltage (3)
25°C 1 1 1
IZ = I(min) to 1 mA (2) Full
1.5 1.5 1.5
Change in reference Range
ΔVZ mV
voltage with current 25°C 12 20 20
IZ = I(min) to 20 mA Full
30 30 30
Range
Long-term change in ppm/k
ΔVZ/Δt IZ = 100 µA 25°C ±20 ±20 ±20
reference voltage hr
Minimum reference Full
IZ(min) 8 10 8 15 8 15 µA
current Range
25°C 0.2 0.6 0.4 1 0.4 1
ZZ Reference impedance IZ = 100 µA, f = 25 Hz Full Ω
1.5 1.5 1.5
Range
Broadband noise IZ = 100 µA, f = 10 Hz to
Vn 25°C 60 60 60 µV
voltage 10 kHz

(1) Full range is −40°C to 85°C for the LM285-1.2 and 0°C to 70°C for the LM385-1.2 and LM385B-1.2.
(2) I(min) = 10 μA for the LM285-1.2 and 15 μA for the LM385-1.2 and LM385B-1.2
(3) The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified
temperature range.

7.6 Typical Characteristics

Figure 1. Reverse Current vs Reverse Voltage Figure 2. Reference Voltage Change vs Reverse Current

Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2
LM285-1.2, LM385-1.2, LM385B-1.2
SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com

Typical Characteristics (continued)

Figure 3. Forward Voltage vs Forward Current Figure 4. Reference Voltage vs Free-Air Temperature

Figure 5. Reference Impedance vs Reference Current Figure 6. Noise Voltage vs Frequency

Figure 7. Output Noise Voltage vs Cutoff Frequency

6 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2

 LM285-1.2, LM385-1.2, LM385B-1.2
www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015

8 Detailed Description

8.1 Overview
The LM285-1.2, LM385-1.2, and LM385-1.2 devices are micropower, two-terminal, band-gap voltage references
which operate over a 10-μA to 20-mA current range. On-chip trimming provides tight voltage tolerance. The
band-gap reference for these devices has low noise and long-term stability.
The design makes these devices exceptionally tolerant of capacitive loading and, thus, easier to use in most
reference applications. The wide dynamic operating temperature range accommodates varying current supplies,
with excellent regulation.
The extremely low power drain of this series makes them useful for micropower circuitry. These voltage
references can be used to make portable meters, regulators, or general-purpose analog circuitry, with battery life
approaching shelf life.

8.2 Functional Block Diagram

A. Component values shown are nominal.

8.3 Feature Description

A band gap voltage reference controls high gain amplifier and shunt pass element to maintain a nearly constant
voltage between cathode and anode. Regulation occurs after a minimum current is provided to power the voltage
divider and amplifier. Internal frequency compensation provides a stable loop for all capacitor loads. Floating
shunt design is useful for both positive and negative regulation applications.

8.4 Device Functional Modes

LM285-1.2, LM385-1.2, and LM385-1.2 devices will operate in one mode, which is as a fixed voltage reference
that cannot be adjusted.
In order for a proper Reverse Voltage to be developed, current must be sourced into the cathode of LM285. The
minimum current needed for proper regulation is denoted in Electrical Characteristics as IZ,min.

Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2
LM285-1.2, LM385-1.2, LM385B-1.2
SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com

9 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information

The The LM285-1.2, LM385-1.2, and LM385-1.2 devices create a voltage reference for to be used for a variety of
applications including amplifiers, power supplies, and current-sensing circuits. The following application shows
how to use these devices to establish a voltage reference.

9.2 Typical Application

5V

36 k

1.2 V

LM385-1.2

Figure 8. Generating Reference Voltage with a Resistive Current Source

9.2.1 Design Requirements

The key design requirement when using this device as a voltage reference is to supply the LM385 with a
minimum Cathode Current (IZ), as indicated in Electrical Characteristics.

9.2.2 Detailed Design Procedure

In order to generate a constant and stable reference voltage, a current greater than IZ(MIN) must be sourced into
the cathode of this device. This can be accomplished using a current regulating device such as LM334 or a
simple resistor. For a resistor, its value should be equal to or greater than (Vsupply - Vreference) ÷ IZ(MIN) .

8 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2

 LM285-1.2, LM385-1.2, LM385B-1.2
www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015

Typical Application (continued)

9.2.3 Application Curves

Figure 9. Transient Response

Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2
LM285-1.2, LM385-1.2, LM385B-1.2
SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com

9.3 System Examples

9.3.1 Thermocouple Cold-Junction Compensator

Figure 10. Thermocouple Cold-Junction Compensator

9.3.2 Generating Reference Voltage with a Constant Current Source

Figure 11. Generating Reference Voltage with a Constant Current Source Device

10 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2

 LM285-1.2, LM385-1.2, LM385B-1.2
www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015

10 Power Supply Recommendations

In order to not exceed the maximum cathode current, be sure that the supply voltage is current limited.
For applications shunting high currents (30 mA max), pay attention to the cathode and anode trace lengths,
adjusting the width of the traces to have the proper current density.

11 Layout

11.1 Layout Guidelines

Figure 12 shows an example of a PCB layout of LMx85x-1.2. Some key Vref niose considerations are:
• Connect a low-ESR, 0.1-μF (CL) ceramic bypass capacitor on the cathode pin node.
• Decouple other active devices in the system per the device specifications.
• Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup.
• Place the external components as close to the device as possible. This configuration prevents parasitic errors
(such as the Seebeck effect) from occurring.
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible and only make perpendicular crossings when absolutely necessary.

11.2 Layout Example

Rsup

NC 1 8 CATHODE Vsup
NC 2 7 NC
NC 3 6 NC CL
ANODE 4 5 NC
GND GND

Figure 12. Layout Diagram

Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2
LM285-1.2, LM385-1.2, LM385B-1.2
SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com

12 Device and Documentation Support

12.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
LM285-1.2 Click here Click here Click here Click here Click here
LM385-1.2 Click here Click here Click here Click here Click here
LM385B-1.2 Click here Click here Click here Click here Click here

12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated

Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2

 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM285D-1-2 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 285-12

LM285DG4-1-2 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 285-12

LM285DR-1-2 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 285-12

LM285DRE4-1-2 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 285-12

LM285DRG4-1-2 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 285-12

LM285LP-1-2 ACTIVE TO-92 LP 3 1000 RoHS & SN N / A for Pkg Type -40 to 85 285-12
Non-Green
LM285LPE3-1-2 ACTIVE TO-92 LP 3 1000 RoHS & SN N / A for Pkg Type -40 to 85 285-12
Non-Green
LM285LPRE3-1-2 ACTIVE TO-92 LP 3 2000 RoHS & SN N / A for Pkg Type -40 to 85 285-12
Non-Green
LM385BD-1-2 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385B12

LM385BDG4-1-2 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385B12

LM385BDR-1-2 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385B12

LM385BDRG4-1-2 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385B12

LM385BLP-1-2 ACTIVE TO-92 LP 3 1000 RoHS & SN N / A for Pkg Type 0 to 70 385B12
Non-Green
LM385BLPE3-1-2 ACTIVE TO-92 LP 3 1000 RoHS & SN N / A for Pkg Type 0 to 70 385B12
Non-Green
LM385BLPR-1-2 ACTIVE TO-92 LP 3 2000 RoHS & SN N / A for Pkg Type 0 to 70 385B12
Non-Green
LM385BLPRE3-1-2 ACTIVE TO-92 LP 3 2000 RoHS & SN N / A for Pkg Type 0 to 70 385B12
Non-Green
LM385BPW-1-2 ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385B12

LM385BPWR-1-2 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385B12

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM385D-1-2 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

LM385DG4-1-2 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

LM385DR-1-2 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

LM385LP-1-2 ACTIVE TO-92 LP 3 1000 RoHS & SN N / A for Pkg Type 0 to 70 385-12
Non-Green
LM385LPR-1-2 ACTIVE TO-92 LP 3 2000 RoHS & SN N / A for Pkg Type 0 to 70 385-12
Non-Green
LM385LPRE3-1-2 ACTIVE TO-92 LP 3 2000 RoHS & SN N / A for Pkg Type 0 to 70 385-12
Non-Green
LM385PW-1-2 ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

LM385PWE4-1-2 ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

LM385PWR-1-2 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

LM385PWRE4-1-2 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 385-12

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 15-Feb-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM285DR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM385BDR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM385BPWR-1-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM385DR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM385PWR-1-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 15-Feb-2016

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM285DR-1-2 SOIC D 8 2500 340.5 338.1 20.6
LM385BDR-1-2 SOIC D 8 2500 340.5 338.1 20.6
LM385BPWR-1-2 TSSOP PW 8 2000 367.0 367.0 35.0
LM385DR-1-2 SOIC D 8 2500 340.5 338.1 20.6
LM385PWR-1-2 TSSOP PW 8 2000 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
PW0008A SCALE 2.800
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

C
6.6 SEATING PLANE
TYP
6.2

A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1

3.1 2X
2.9
NOTE 3 1.95

4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE

0.75 0.15
0 -8 0.05
0.50

DETAIL A
TYPICAL

4221848/A 02/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8

SYMM

6X (0.65)
5
4

(5.8)

LAND PATTERN EXAMPLE

SCALE:10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

4221848/A 02/2015
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8

SYMM

6X (0.65)
5
4

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:10X

4221848/A 02/2015
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92

5.21
4.44

EJECTOR PIN
OPTIONAL
5.34
4.32

(1.5) TYP

(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN

0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION

2.67
3X
2.03 4.19
3.17
3 2 1

3.43 MIN

4215214/B 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.

www.ti.com
 EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92

FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP

2X
METAL
(1.5) 2X (1.5)

2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X

0.05 MAX ( 1.4) 2X ( 1.4)

ALL AROUND METAL
TYP 3X ( 0.9) HOLE

METAL

2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)

LAND PATTERN EXAMPLE

FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X

4215214/B 04/2017

www.ti.com
 TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92

13.7
11.7

32
23

(2.5) TYP 0.5 MIN

16.5
15.5

11.0 9.75
8.5 8.50

19.0
17.5

2.9 6.75 3.7-4.3 TYP

TYP
2.4 5.95
13.0
12.4

FOR FORMED LEAD OPTION PACKAGE

4215214/B 04/2017

www.ti.com
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated