LM 2586
LM 2586
LM 2586
LM2586
SNVS121E – MAY 1996 – REVISED MAY 2019
Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2586
SNVS121E – MAY 1996 – REVISED MAY 2019 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 13
2 Typical Applications .............................................. 1 8 Application and Implementation ........................ 20
3 Description ............................................................. 1 8.1 Application Information............................................ 20
4 Revision History..................................................... 2 8.2 Typical Applications ............................................... 20
8.3 System Examples ................................................... 31
5 Pin Configurations................................................. 3
6 Specifications......................................................... 4 9 Layout ................................................................... 33
9.1 Layout Guidelines ................................................... 33
6.1 Absolute Maximum Ratings ..................................... 4
9.2 Layout Example ...................................................... 33
6.2 ESD Ratings.............................................................. 4
9.3 Heat Sink/Thermal Considerations ......................... 33
6.3 Recommended Operating Ratings............................ 4
6.4 Thermal Information .................................................. 5 10 Device and Documentation Support ................. 35
6.5 Electrical Characteristics: 3.3 V ................................ 5 10.1 Device Support...................................................... 35
6.6 Electrical Characteristics: 5 V ................................... 6 10.2 Receiving Notification of Documentation Updates 35
6.7 Electrical Characteristics: 12 V ................................. 7 10.3 Community Resources.......................................... 35
6.8 Electrical Characteristics: Adjustable ........................ 8 10.4 Trademarks ........................................................... 35
6.9 Typical Characteristics ............................................ 10 10.5 Electrostatic Discharge Caution ............................ 36
10.6 Glossary ................................................................ 36
7 Detailed Description ............................................ 13
7.1 Overview ................................................................. 13 11 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 13
Information ........................................................... 36
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
5 Pin Configurations
NDZ Package
7-Pin TO-220
Top View, Bent, Staggered Leads
KTW Package
7-Pin DDPAK/TO-263
Top View
NDZ Package
7-Pin TO-220
Side View; Bent, Staggered Leads
KTW Package
7-Pin DDPAK/TO-263
Side View
6 Specifications
(1) (2)
6.1 Absolute Maximum Ratings
Input Voltage −0.4V ≤ VIN ≤ 45V
Switch Voltage −0.4V ≤ VSW ≤ 65V
(3)
Switch Current Internally Limited
Compensation Pin Voltage −0.4V ≤ VCOMP ≤ 2.4V
Feedback Pin Voltage −0.4V ≤ VFB ≤ 2 VOUT
ON /OFF Pin Voltage −0.4V ≤ VSH ≤ 6V
Sync Pin Voltage −0.4V ≤ VSYNC ≤ 2V
(4)
Power Dissipation Internally Limited
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C
(4)
Maximum Junction Temperature 150°C
(1) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. These ratings apply when the current is
limited to less than 1.2 mA for pins 1, 2, 3, and 6. Operating ratings indicate conditions for which the device is intended to be functional,
but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the
Electrical Characteristics.
(3) Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the
LM2586 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 3A. However,
output current is internally limited when the LM2586 is used as a flyback regulator (see the section for more information).
(4) The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance
(θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction
temperature of the device: PD × θJA + TA(MAX) ≥ TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the
device is less than: PD ≤ [TJ(MAX) − TA(MAX)]/θJA. When calculating the maximum allowable power dissipation, derate the maximum
junction temperature—this ensures a margin of safety in the thermal design.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
(2) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the
same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(3) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(4) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(5) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(6) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal
resistance further.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(4) To measure this parameter, the feedback voltage is set to a high value, depending on the output version of the device, to force the error
amplifier output low and the switch off.
(5) To measure this parameter, the feedback voltage is set to a low value, depending on the output version of the device, to force the error
amplifier output high and the switch on.
(6) To measure the worst-case error amplifier output current, the LM2586 is tested with the feedback voltage set to its low value (Note 4)
and at its high value (Note 5).
8 Submit Documentation Feedback Copyright © 1996–2019, Texas Instruments Incorporated
(7) When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency
adjust circuit will begin operation (Figure 25).
Figure 3. Δreference Voltage vs Supply Voltage Figure 4. Supply Current vs Switch Current
Figure 5. Current Limit vs Temperature Figure 6. Feedback Pin Bias Current vs Temperature
Figure 9. Oscillator Frequency vs Temperature Figure 10. Error Amp Transconductance vs Temperature
Figure 11. Error Amp Voltage Gain vs Temperature Figure 12. Short Circuit Frequency vs Temperature
Figure 13. Shutdown Supply Current vs Temperature Figure 14. ON/Off Pin Current vs Voltage
7 Detailed Description
7.1 Overview
The LM2586 series of regulators are monolithic integrated circuits specifically designed for flyback, step-up
(boost), and forward converter applications. The device is available in 4 different output voltage versions: 3.3 V,
5 V, 12 V, and adjustable. Requiring a minimum number of external components, these regulators are cost
effective, and simple to use. Included in the datasheet are typical circuits of boost and flyback regulators. Also
listed are selector guides for diodes and capacitors and a family of standard inductors and flyback transformers
designed to work with these switching regulators.
As shown in Figure 16, the LM2586 can be used as a flyback regulator by using a minimum number of external
components. The switching waveforms of this regulator are shown in . Typical performance characteristics observed
during the operation of this circuit are shown in .
(1) As shown in Figure 17, the LM2585 can be used as a flyback regulator by using a minimum number of external
components. The switching waveforms of this regulator are shown in Figure 18. Typical characteristics observed
during the operation of this circuit are shown in Figure 19.
By adding a small number of external components (as shown in Figure 20), the LM2586 can be used to produce
a regulated output voltage that is greater than the applied input voltage. The switching waveforms observed
during the operation of this circuit are shown in Figure 21. Typical performance of this regulator is shown in
Figure 22.
A: Switch Voltage,10V/div
B: Switch Current, 2A/div
C: Inductor Current, 2A/div
D: Output Ripple Voltage,100 mV/div, AC-Coupled Figure 22. VOUT Response To Load Current Step
Figure 21. Switching Waveforms
The scope photo in Figure 25 shows a LM2586 12-V boost regulator synchronized to a 200-kHz signal. There is
a 700-ns delay between the falling edge of the sync signal and the turning on of the switch.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Figure 35. Coilcraft Q4437-B (Surface Mount) (Top View) Figure 36. Coilcraft Q4338-B (Top View)
In addition, a small bypass capacitor is required due to the noise generated by the input current pulses. To
eliminate the noise, insert a 1-μF ceramic capacitor between VIN and ground as close as possible to the device.
(5)
Theoretically, the maximum output voltage can be as large as desired—just keep increasing the turns ratio of the
transformer. However, there exists some physical limitations that prevent the turns ratio, and thus the output
voltage, from increasing to infinity. The physical limitations are capacitances and inductances in the LM2586
switch, the output diode(s), and the transformer—such as reverse recovery time of the output diode (mentioned
above).
8.2.1.2.6 Stability
All current-mode controlled regulators can suffer from an instability, known as subharmonic oscillation, if they
operate with a duty cycle above 50%. To eliminate subharmonic oscillations, a minimum value of inductance is
required to ensure stability for all boost and flyback regulators. The minimum inductance is given by:
where
• VSAT is the switch saturation voltage and can be found in the Characteristic Curves (6)
Figure 50. 5-V to 12-V Boost Regulator Figure 51. 12-V to 24-V Boost Regulator
The LM2586 requires a heat sink in this application. The size of the The LM2586 requires a heat sink in this application. The size of the
heat sink depends on the maximum ambient temperature. To heat sink depends on the maximum ambient temperature. To
calculate the thermal resistance of the IC and the size of the heat calculate the thermal resistance of the IC and the size of the heat
sink needed, see Heat Sink/Thermal Considerations. sink needed, see Heat Sink/Thermal Considerations.
Figure 52. 24-V to 36-V Boost Regulator Figure 53. 24-V to 48-V Boost Regulator
9 Layout
where
• VIN is the minimum input voltage
• VOUT is the output voltage
• N is the transformer turns ratio, D is the duty cycle
• ILOAD is the maximum load current (and ∑ILOAD is the sum of the maximum load currents for multiple-output
flyback regulators) (7)
The duty cycle is given by:
where
• VF is the forward biased voltage of the diode and is typically 0.5 V for Schottky diodes and 0.8 V for fast
recovery diodes
• VSAT is the switch saturation voltage and can be found in the Characteristic Curves (8)
When no heat sink is used, the junction temperature rise is:
ΔTJ = PD • θJA. (9)
Adding the junction temperature rise to the maximum ambient temperature gives the actual operating junction
temperature:
TJ = ΔTJ + TA. (10)
If the operating junction temperature exceeds the maximum junction temperature in item 3 above, then a heat
sink is required. When using a heat sink, the junction temperature rise can be determined by the following:
ΔTJ = PD • (θJC + θInterface + θHeat Sink) (11)
Again, the operating junction temperature will be:
TJ = ΔTJ + TA (12)
As before, if the maximum junction temperature is exceeded, a larger heat sink is required (one that has a lower
thermal resistance).
Included in the Switchers Made Simple® design software is a more precise (non-linear) thermal model that can
be used to determine junction temperature with different input-output parameters or different component values.
It can also calculate the heat sink thermal resistance required to maintain the regulator junction temperature
below the maximum operating temperature.
To further simplify the flyback regulator design procedure, Texas Instruments is making available computer
design software to be used with the Simple Switcher ® line of switching regulators. Switchers Made Simple is
available on a 3½″ diskette for IBM compatible computers from a Texas Instruments sales office in your area or
the Texas Instruments Customer Response Center ((800) 477-8924).
10.4 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
Switchers Made Simple, Simple Switcher are registered trademarks of dcl_owner.
All other trademarks are the property of their respective owners.
10.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 9-Jun-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2586S-12/NOPB ACTIVE DDPAK/ KTW 7 45 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -12 P+
LM2586S-3.3/NOPB ACTIVE DDPAK/ KTW 7 45 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -3.3 P+
LM2586S-5.0/NOPB ACTIVE DDPAK/ KTW 7 45 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -5.0 P+
LM2586S-ADJ/NOPB ACTIVE DDPAK/ KTW 7 45 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -ADJ P+
LM2586SX-3.3/NOPB ACTIVE DDPAK/ KTW 7 500 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -3.3 P+
LM2586SX-5.0/NOPB ACTIVE DDPAK/ KTW 7 500 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -5.0 P+
LM2586SX-ADJ/NOPB ACTIVE DDPAK/ KTW 7 500 Green (RoHS SN Level-3-245C-168 HR -40 to 125 LM2586S
TO-263 & no Sb/Br) -ADJ P+
LM2586T-3.3/NOPB ACTIVE TO-220 NDZ 7 45 Green (RoHS SN Level-1-NA-UNLIM -40 to 125 LM2586T
& no Sb/Br) -3.3 P+
LM2586T-5.0/NOPB ACTIVE TO-220 NDZ 7 45 Green (RoHS SN Level-1-NA-UNLIM -40 to 125 LM2586T
& no Sb/Br) -5.0 P+
LM2586T-ADJ NRND TO-220 NDZ 7 45 TBD Call TI Call TI -40 to 125 LM2586T
-ADJ P+
LM2586T-ADJ/NOPB ACTIVE TO-220 NDZ 7 45 Green (RoHS SN Level-1-NA-UNLIM -40 to 125 LM2586T
& no Sb/Br) -ADJ P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2020
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-May-2019
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-May-2019
Pack Materials-Page 2
MECHANICAL DATA
NDZ0007B
TA07B (Rev E)
www.ti.com
MECHANICAL DATA
KTW0007B
TS7B (Rev E)
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